SMS24.TC [SEMTECH]
TVS Diode Array For ESD and Latch-Up Protection; TVS二极管阵列用于ESD和闩锁保护
| 型号： | SMS24.TC |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | TVS Diode Array For ESD and Latch-Up Protection |
| 文件： | 总7页 (文件大小：160K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMS05 through SMS24
TVS Diode Array
For ESD and Latch-Up Protection
PROTECTION PRODUCTS
Features
Description
The SMS series of TVS arrays are designed to protect
sensitive electronics from damage or latch-up due to
ESD and other voltage-induced transient events. Each
device will protect up to four lines. They are available
with operating voltages of 5V, 12V, 15V and 24V. They
are unidirectional devices and may be used on lines
where the signal polarities are above ground.
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 24A (8/20µs)
Small package for use in portable electronics
Protects four I/O lines
Working voltages: 5V, 12V, 15V and 24V
Low leakage current
Low operating and clamping voltages
Solid-state silicon avalanche technology
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-
sectional area junctions for conducting high transient
currents. They offer desirable characteristics for board
level protection including fast response time, low
operating and clamping voltage and no device degrada-
tion.
Mechanical Characteristics
EIAJ SOT23-6L package
Molding compound flammability rating: UL 94V-0
Marking : Marking Code
The SMS series devices may be used to meet the
immunity requirements of IEC 61000-4-2, level 4. The
low cost SOT23-6L package makes them ideal for use
in portable electronics such as cell phones, PDA’s, and
notebook computers.
Packaging : Tape and Reel per EIA 481
Applications
Cell phone Handsets and Accessories
Microprocessor Based Equipment
Personal Digital Assistants (PDA’s) and Pagers
Desktops PC and Servers
Notebook, Laptop, and Palmtop Computers
Portable Instrumentation
Peripherals
MP3 Players
Cordless Phones
Circuit Diagram
Schematic & PIN Configuration
SOT23-6L (Top View)
www.semtech.com
Revision 08/11/04
1
SMS05 through SMS24
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Peak Pulse Power (tp = 8/20µs)
ESD Voltage (HBM per IEC 61000-4-2)
Lead Soldering Temperature
Operating Temperature
Symbol
Ppk
Value
350
Units
Watts
kV
VESD
TL
>25
260 (10 sec.)
-55 to +125
-55 to +150
°C
TJ
°C
Storage Temperature
TSTG
°C
Electrical Characteristics
SMS05
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Symbol
Conditions
Minimum
Typical
Maximum
Units
VRWM
VBR
IR
5
V
V
It = 1mA
6
VRWM = 5V, T=25°C
IPP = 5A, tp = 8/20µs
IPP = 24A, tp = 8/20µs
tp = 8/20µs
20
9.8
14.5
24
µA
V
VC
Clamping Voltage
VC
V
Peak Pulse Current
IPP
A
Junction Capacitance
Cj
Between I/O Pins and
Ground
325
400
pF
VR = 0V, f = 1MHz
SMS12
Parameter
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
V
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Peak Pulse Current
Junction Capacitance
12
It = 1mA
13.3
V
VRWM = 12V, T=25°C
IPP = 5A, tp = 8/20µs
IPP = 15A, tp = 8/20µs
tp = 8/20µs
1
19
23
15
150
µA
V
VC
VC
V
IPP
A
Cj
Between I/O Pins and
Ground
135
pF
VR = 0V, f = 1MHz
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2004 Semtech Corp.
2
SMS05 through SMS24
PROTECTION PRODUCTS
Electrical Characteristics (Continued)
SMS15
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
V
15
It = 1mA
16.7
V
VRWM = 15V, T=25°C
IPP = 5A, tp = 8/20µs
IPP = 12A, tp = 8/20µs
tp = 8/20µs
1
24
µA
V
VC
Clamping Voltage
VC
29
12
125
V
Peak Pulse Current
IPP
A
Junction Capacitance
Cj
Between I/O Pins and
Ground
100
pF
VR = 0V, f = 1MHz
SMS24
Parameter
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
V
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Peak Pulse Current
Junction Capacitance
24
It = 1mA
26.7
V
VRWM = 24V, T=25°C
IPP = 5A, tp = 8/20µs
IPP = 8A, tp = 8/20µs
tp = 8/20µs
1
40
44
8
µA
V
VC
VC
V
IPP
A
Cj
Between I/O Pins and
Ground
60
75
pF
VR = 0V, f = 1MHz
www.semtech.com
2004 Semtech Corp.
3
SMS05 through SMS24
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
100
90
80
70
60
50
40
30
20
10
0
10
1
0.1
0.01
0
25
50
75
100
125
150
0.1
1
10
100
1000
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
Pulse Waveform
Clamping Voltage vs. Peak Pulse Current
110
45
40
35
30
25
20
15
10
5
Waveform
Waveform
100
90
80
70
60
50
40
30
20
10
0
Parameters:
Parameters:
tr = 8µs
SMS24
tr = 8µs
td = 20µs
td = 20µs
e-t
SMS15
SMS12
td = IPP/2
SMS05
0
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Peak Pulse Current - IPP (A)
Time (µs)
Forward Voltage vs. Forward Current
5
4.5
4
3.5
3
2.5
2
1.5
1
Waveform
Parameters:
tr = 8µs
0.5
0
td = 20µs
0
5
10
15
20
25
30
35
40
45
Forward Current - IF (A)
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2004 Semtech Corp.
4
SMS05 through SMS24
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Four Data Lines
SMSxx Circuit Diagram
The SMSxx is designed to protect up to four unidirec-
tional data lines. The device is connected as follows:
1. Unidirectional protection of four I/O lines is
achieved by connecting pins 1, 3, 4 and 6 to the
data lines. Pin 2 and 5 are connected to ground.
The ground connections should be made directly to
the ground plane for best results. The path length
is kept as short as possible to reduce the effects
of parasitic inductance in the board traces.
Circuit Board Layout Recommendations for Suppres-
sion of ESD
Protection of Four Unidirectional Lines
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z
z
z
z
Place the SMSxx near the input terminals or con-
nectors to restrict transient coupling.
Minimize the path length between the SMSxx and
the protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
z
z
Never run critical signals near board edges.
Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
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2004 Semtech Corp.
5
SMS05 through SMS24
PROTECTION PRODUCTS
Outline Drawing -SOT23 6L
A
DIMENSIONS
e1
D
E
INCHES
MILLIMETERS
DIM
A
MIN NOM MAX MIN NOM MAX
H
N
1
-
-
-
-
H
.057
.006 0.00
1.45
0.15
0.90
.035
2X E/2
A1 .000
EI
c
A2 .035 .045 .051 .90 1.15 1.30
GAGE
-
-
-
-
b
.010
.003
.020 0.25
.009 0.08
0.50
0.22
PLANE
2
c
ccc C
D
.110 .114 .118 2.80 2.90 3.00
.060 .063 .069 1.50 1.60 1.75
0.25
L
E1
2X N/2 TIPS
01
e
E
.110 BSC
.037 BSC
.075 BSC
2.80 BSC
0.95 BSC
1.90 BSC
(L1)
e
B
e1
L
DETAIL A
.012 .018 .024 0.30 0.45 0.60
(.024)
6
(0.60)
6
L1
N
D
-
-
01
0°
10°
0°
10°
aaa C
aaa
.004
.008
.008
0.10
0.20
0.20
bbb
ccc
A2
A
SEATING
PLANE
SEE DETAIL A
A1
C
SIDE VIEW
bxN
bbb
C A-B D
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE-H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
Land Pattern -SOT23 6L
X
DIMENSIONS
DIM
INCHES
MILLIMETERS
(.098)
.055
.037
.024
.043
.141
(2.50)
1.40
0.95
0.60
1.10
3.60
C
G
P
X
Y
Z
(C)
G
Z
Y
P
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
www.semtech.com
2004 Semtech Corp.
6
SMS05 through SMS24
PROTECTION PRODUCTS
Marking Codes
Marking
Part Number
Code
SMS05
SMS12
SMS15
SMS24
Ordering Information
Lead
Part Number
Qty per
Reel
Reel Size
Finish
SMS05.TC
SMS12.TC
SMS15.TC
SMS24.TC
SMS05.TCT
SMS12.TCT
SMS15.TCT
SMS24.TCT
SnPb
SnPb
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
7 Inch
7 Inch
7 Inch
7 Inch
7 Inch
7 Inch
7 Inch
7 Inch
SnPb
SnPb
Pb Free
Pb Free
Pb Free
Pb Free
Note:
(1) No suffix indicates tube pack.
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2004 Semtech Corp.
7
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