SMF12TG [SEMTECH]
TVS Diode Array For ESD and Latch-Up Protection; TVS二极管阵列用于ESD和闩锁保护
| 型号： | SMF12TG |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | TVS Diode Array For ESD and Latch-Up Protection |
| 文件： | 总7页 (文件大小：161K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMF05 AND SMF12
TVS Diode Array
For ESD and Latch-Up Protection
PROTECTION PRODUCTS
Features
Description
The SMF series TVS arrays are designed to protect sen-
sitive electronics from damage or latch-up due to ESD
and other voltage-induced transient events. They are
designed for use in applications where board space is at
a premium. Each device will protect up to four lines.
They are unidirectional devices and may be used on lines
where the signal polarities are above ground.
u Transient protection for data lines to
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
u Small package for use in portable electronics
u Protects four I/O lines
u Working voltage: 5V & 12V
u Low leakage current
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-sec-
tional area junctions for conducting high transient cur-
rents. They offer desirable characteristics for board level
protection including fast response time, low operating
and clamping voltage, and no device degradation.
u Low operating and clamping voltages
u Solid-state silicon-avalanche technology
Mechanical Characteristics
u EIAJ SC70-5L package
u Molding compound flammability rating: UL 94V-0
u Marking : Marking Code
The SMF series devices may be used to meet the immu-
nity requirements of IEC 61000-4-2, level 4. The small
SC70 package makes them ideal for use in portable elec-
tronics such as cell phones, PDAs, notebook comput-
ers, and digital cameras.
u Packaging : Tape and Reel per EIA 481
Applications
u Cellular Handsets & Accessories
u Cordless Phones
u Personal Digital Assistants (PDAs)
u Notebooks & Handhelds
u Portable Instrumentation
u Digital Cameras
u Peripherals
u MP3 Players
Circuit Diagram
Schematic & PIN Configuration
1
3
4
5
1
2
3
5
4
2
SC70-5L (Top View)
www.semtech.com
Revision 9/2000
1
SMF05 & SMF12
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Peak Pulse Power (tp = 8/20ms)
Peak Pulse Current (tp = 8/20ms)
Peak Forward Voltage (IF = 1A, tp=8/20ms)
Symbol
Ppk
Value
Units
Watts
A
200
12
IPP
VFP
1.5
V
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
20
15
VESD
kV
Lead Soldering Temperature
Operating Temperature
Storage Temperature
TL
TJ
260 (10 seconds)
-55 to +125
oC
oC
oC
TSTG
-55 to +150
Electrical Characteristics
SMF05
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Symbol
Conditions
Minimum
Typical
Maximum
Units
VRWM
VBR
IR
5
V
V
It = 1mA
6
VRWM = 5V, T=25°C
IPP = 1A, tp = 8/20µs
IPP = 12A, tp = 8/20µs
10
9.5
µA
V
VC
Clamping Voltage
VC
12.5
175
V
Junction Capacitance
Cj
Between I/O pins and
Gnd
150
pF
VR = 0V, f = 1MHz
SMF12
Parameter
Symbol
VRWM
VBR
IR
Conditions
Minimum
Typical
Maximum
Units
V
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Junction Capacitance
12
It = 1mA
13.3
V
VRWM = 12V, T=25°C
IPP = 1A, tp = 8/20µs
IPP = 8A, tp = 8/20µs
1
µA
V
VC
19
25
75
VC
V
Cj
Between I/O pins and
Gnd
60
pF
VR = 0V, f = 1MHz
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ã 2000 Semtech Corp.
2
SMF05 & SMF12
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
100
90
80
70
60
50
40
30
20
10
0
10
1
0.1
0.01
0
25
50
75
100
125
150
0.1
1
10
100
1000
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
Pulse Waveform
Clamping Voltage vs. Peak Pulse Current
110
100
90
80
70
60
50
40
30
20
10
0
30
Waveform
Parameters:
tr = 8µs
25
20
15
10
5
td = 20µs
SMF12
e-t
SMF05
td = IPP/2
Waveform
Parameters:
tr = 8 s
µ
td = 20 s
µ
0
0
2
4
6
8
10
12
14
16
0
5
10
15
20
25
30
Peak Pulse Current - IPP (A)
Time (µs)
SMF05 ESD Clamping
(8kV Contact per IEC 61000-4-2)
SMF12 ESD Clamping
(8kV Contact per IEC 61000-4-2)
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ã 2000 Semtech Corp.
3
SMF05 & SMF12
PROTECTION PRODUCTS
Applications Information
SMF Circuit Diagram
Device Connection for Protection of Four Data Lines
The SMFxx is designed to protect up to four unidirec-
tional data lines. The device is connected as follows:
1
3
4
5
1. Unidirectional protection of four I/O lines is
achieved by connecting pins 1, 3, 4, and 5 to the
data lines. Pin 2 is connected to ground. The
ground connection should be made directly to the
ground plane for best results. The path length is
kept as short as possible to reduce the effects of
parasitic inductance in the board traces.
2
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Protection of Four Unidirectional Lines
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
l
l
l
l
Place the SMFxx near the input terminals or con-
nectors to restrict transient coupling.
Minimize the path length between the SMSxx and
the protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
l
l
Never run critical signals near board edges.
Use ground planes whenever possible.
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ã 2000 Semtech Corp.
4
SMF05 & SMF12
PROTECTION PRODUCTS
Typical Applications
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ã 2000 Semtech Corp.
5
SMF05 & SMF12
PROTECTION PRODUCTS
Outline Drawing - SC70-5L
Land Pattern - SC70-5L
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ã 2000 Semtech Corp.
6
SMF05 & SMF12
PROTECTION PRODUCTS
Marking Codes
Marking
Part Number
Code
SMF05
SMF12
F05
F12
Note:
(1) Pin 1 Identified with a dot
Ordering Information
Working
Part Number
Qty per Reel
Reel Size
Voltage
SMF05.TC
SMF05.TG
SMF12.TC
SMF12.TG
5V
5V
3,000
10,000
3,000
7 Inch
13 Inch
7 Inch
12V
12V
10,000
13 Inch
Contact Information
Semtech Corporation
Protection Products Division
652 Mitchell Rd., Newbury Park, CA 91320
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
ã 2000 Semtech Corp.
7
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