SC1175 [SEMTECH]

Low Power Dual Synchronous DC/DC Controller With Current Sharing Circuitry; 低功耗双同步DC / DC控制器均流电路
SC1175
型号: SC1175
厂家: SEMTECH CORPORATION    SEMTECH CORPORATION
描述:

Low Power Dual Synchronous DC/DC Controller With Current Sharing Circuitry
低功耗双同步DC / DC控制器均流电路

控制器
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中文:  中文翻译
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SC1175  
Low Power Dual Synchronous DC/DC  
Controller With Current Sharing Circuitry  
POWER MANAGEMENT  
Features  
Description  
The SC1175 is a versatile 2 phase, synchronous, voltage mode  
PWM controller that may be used in two distinct ways. First, the  
SC1175 is ideal for applications where point of use output power  
exceeds any single input power budget. Alternatively, the SC1175  
can be used as a dual switcher. The SC1175 features a tempera-  
ture compensated voltage reference, over current protection with  
50% fold-back and internal level-shifted, high-side drive circuitry.  
u 300kHz fixed frequency operation  
u Soft Start and Enable function  
u Power Good output provided  
u Over current protection with 50% fold-back  
u Phase-shifted switchers minimize ripple  
u High efficiency operation, >90%  
u Programmable output(s) as low as 1.25V  
u Industrial temperature range  
In current sharing configuration, the SC1175 can produce a single  
output voltage from two separate voltage sources (which can be  
different voltage levels) while maintaining current sharing between  
the channels. Current sharing is programmable to allow loading  
each input supply as required by the application.  
u SOIC 20 pin package  
Two Phase, Current Sharing Controller  
In dual switcher configuration, two feedback paths are provided  
for independent control of the separate outputs. The device will  
provide a regulated output from flexibly configured inputs (3.3V,  
5V, 12V), provided 5V is present for VCC. The two switchers are  
180° out of phase to minimize input and output ripple.  
u Flexible, same or separate VIN  
u Programmable current sharing  
u Combined current limit with fold-back  
u 2 phases operating opposed for ripple reduction  
u Thermal distribution via multi-phase output  
Applications  
Two Independent PWM Controllers  
u Graphics cards  
u DDR Memory  
u Peripheral add-in card  
u SSTL Termination  
u Dual-Phase power supply  
u Power supplies requiring two outputs  
u Flexible, same or separate VIN  
u Independent control for each channel  
u Independent and separate current limit  
u 2 phases operating opposed for ripple reduction (if same  
VIN used)  
Typical Application Circuit  
2 Channels with Current Sharing  
1
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Revision 7/31/2000  
SC1175  
POWER MANAGEMENT  
Absolute Maximum Rating  
Parameter  
VCC to GND  
Symbol  
Limits  
-0.3 to 15  
± 1  
Units  
V
VIN  
PGND to GND  
V
BST to GND  
-0.3 to 26  
30  
V
q
Thermal Resistance Junction to Case  
Thermal Resistance Junction to Ambient  
Operating Ambient Temperature Range  
Operating Junction Temperature Range  
Storage Temperature Range  
Lead Temperature (Soldering) 10 sec  
°C/W  
JC  
q
90  
°C/W  
°C  
JA  
TA  
TJ  
0 to 85  
0 to 125  
-65 to +150  
300  
°C  
TSTG  
TLEAD  
°C  
°C  
Electrical Characteristics  
Unless Specified: VCC = 4.75 to 5.25V, GND = PGND = 0V, FB = VO, 0mV < (CS(+) - CS(-)) < 60mV , TJ = 25°C  
PARAMETER  
CONDITIONS  
MIN  
TYP MAX UNITS  
Output Voltage  
Supply Voltage  
Supply Current  
IO = 2A(1), VOUT set to 2.75V  
VCC  
2.65  
4.2  
2.75  
2.85  
15  
V
V
V
CC = 5.0  
10  
1.25  
1
mA  
1.2375-  
± 1  
1.2625-  
± 1  
Reference  
V
Load Regulation  
IO = 0.3A to 15A (1)  
5V < VCC < 15V  
5V < VIN < 15V  
VOSENSE to VO  
%
%
Reference Line Regulation  
Output Line Regulation  
Gain (AOL)  
.5  
.5  
%
35  
70  
dB  
mV  
kHz  
%
Current Limit Voltage  
Oscillator Frequency  
Oscillator Max Duty Cycle  
DH Sink Current  
60  
270  
90  
1
80  
300  
95  
330  
DH - PGND = 3.5V  
DH - PGND = 1.75V  
BSTH - DH = 5.0V  
BSTH - DH = 2.5V  
A
DH Sink Current  
.5  
A
DH Source Current  
DH Source Current  
1
A
.5  
A
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SC1175  
POWER MANAGEMENT  
Electrical Characteristics (Cont.)  
Unless Specified: VCC = 4.75 to 5.25V, GND = PGND = 0V, FB = VO, 0mV < (CS(+) - CS(-)) < 60mV , TJ = 25°C  
PARAMETER  
CONDITIONS  
MIN  
TYP MAX UNITS  
DL Sink Current  
DL - PGND = 3.5V  
DL - PGND = 1.75V  
BSTL - DL = 5V  
1
.5  
1
A
A
A
A
DL Sink Current  
DL Source Current  
DL Source Current  
Dead Time  
BSTL - DL = 2.5V  
.5  
50  
100  
25  
ns  
µA  
V
Soft Start Charge Current(2)  
Soft Start Enable  
0% duty cycle  
100% duty cycle  
Synchronous mode  
1.4  
Soft Start End  
2.5  
V
Soft Start Transition(2)  
Power Good Window(3)  
Fold Back Current  
Fold Back Voltage Knee  
Input Bias Current  
3.3  
V
+10  
50%  
%VOUT  
ILIM  
V
VOUT = 0V  
I = ILIM  
1.25  
VOUT  
1
-IN1, +IN2, -IN2  
µA  
NOTES:  
(1) Specification refers to application circuit.  
(2) The soft start pin sources 25µAto an external capacitor. The converter operates in synchronous mode above the soft  
start transition threshold and in asynchronous mode below it.  
(3) Power good is an open collector pulled low when the output voltage is outside the ±10% window.  
(4) This device is ESD sensitive. Use of standard ESD handling precautions is required.  
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SC1175  
POWER MANAGEMENT  
Pin Configuration  
Ordering Information  
DEVICE(1)  
PACKAGE  
SC1175CSW.TR  
SO-20  
CURRENT SHARE  
VERSION EVALUATION  
BOARD  
SC1175EVB-1  
DUAL CHANNEL  
VERSION EVALUATION  
BOARD  
SC1175EVB-2  
Notes:  
(1) Only available in tape and reel packaging. A reel  
contains 1000 devices  
Marking Information  
Pin Descriptions  
EXPANDED PIN DESCRIPTION  
Pin 1: (VREF)  
Internal 1.25V reference  
Connected to the + input of the master channel error  
amplifier.  
Pin 2: (+IN)  
TOP  
+ Input of slave channel error amplifier.  
Connected to 1.25V reference (Pin 1) for the two  
independent channel configuration.  
Pin 3, 18: (-IN2, -IN1)  
yyww = Datecode (Example: 9908)  
xxxx = Semtech Lot # (Example: 90101)  
- Inputs of close loop error amplifiers.  
Works as a feedback inputs (For both modes).  
Pin 4: (VCC)  
VCC chip supply voltage.  
15V maximum, 10mA typical.  
Pin 9, 12: (DL2, DL1)  
DL signal (Drive Low).  
Gate drive for bottom MOSFETs.  
Requires a small series resistor.  
Pin 10: (PGND)  
Power GND. Return of gate drive currents.  
Pin 11: (BSTC)  
Supply for bottom MOSFETs gate drive.  
Pin 17: (SS/ENA)  
Soft start pin. Internal current source connected to  
external capacitor.  
Inhibits the chip if pulled down.  
Pin 19: (PWRGD)  
Power good signal.  
Open collector signal .  
Turns to 0 if output voltage is outside the power good  
window.  
Pin 20: (GND)  
Analog GND.  
Return of analog signals and bias of chip.  
Needs a 1µF ceramic multilayer decoupling capaci-  
tor to GND (Pin 20).  
Pin 5, 6,15, 16: (CL2-, CL2+, CL1+, CL1-)  
Pins (-) and (+) of the current limit amplifiers for both  
channels.  
Connected to output current sense resistors. Com-  
pares that sense voltage to internal 75mV reference.  
Needs RC filter for noise rejection.  
Pin 7, 14: (BST2, BST1)  
BST signal. Supply for high side driver.  
Can be connected to a high enough voltage source.  
Usually connected to bootstrap circuit.  
Pin 8, 13: (DH2, DH1)  
DH signal (Drive High).  
Gate drive for top MOSFETs.  
Requires a small series resistor.  
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SC1175  
POWER MANAGEMENT  
Block Diagram  
NOTES  
(1) Block 1 (top) is the Master and Block 2 (bottom) is the Slave in current sharing configuration.  
(2) For independant operation there is no Master or Slave.  
Applications Information  
Theory of Operation  
Main Loop(s)  
output. In this mode, the positive input of error  
amplifier 2 is connected externally to Vref. If the  
application uses a common input voltage, the  
sawtooth phase shift between the channels  
provides some measure of input ripple current  
cancellation.  
The SC1175 is a dual, voltage mode synchronous  
Buck controller, the two separate channels are  
identical and share only IC supply pins (Vcc and  
GND), output driver ground (PGND) and pre-driver  
supply voltage (BSTC). They also share a common  
oscillator generating a sawtooth waveform for chan-  
nel 1 and an inverted sawtooth for channel 2. Each  
channel has its own current limit comparator. Chan-  
nel 1 has the positive input of the error amplifier  
internally connected to Vref. Channel 2 has both  
inputs of the error amplifier uncommitted and avail-  
able externally. This allows the SC1175 to operate in  
two distinct modes.  
b) Two channels operating in current sharing  
mode with common output voltage and either  
common input voltage or different input voltages.  
In this mode, channel 1 operates as a voltage  
mode Buck controller, as before, but error amp 2  
monitors and amplifies the difference in voltage  
across the output current sense resistors of  
channel 1 and channel 2 (Master and Slave) and  
adjusts the Slave duty cycle to match output  
currents. Because of finite gain and offsets in the  
loop, the resistor ratio for perfect current match-  
a) Two independent channels with either com-  
mon or different input voltages and different  
output voltages. The two channels each have  
their own voltage feedback path from their own  
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SC1175  
POWER MANAGEMENT  
Theory of Operation (Cont.)  
The formula is:  
ing is not 1:1. The Master and Slave channels still  
have their own current limits, identical to the  
independent channel case.  
VOUT + .1  
R (pull up) = 100 X 762 X .5 −  
VSLAVE IN  
Power Good  
The controller provides a power good signal. This is  
an open collector output, which is pulled low if the  
output voltage is outside of the power good window.  
100W being the value of the resistors connecting the  
pins 2 and 3 to the two output sense resistors.  
The estimated voltage drop across the MOSFETs is  
0.1V.  
Positive values go to pin 3, negative to pin 2.  
If R (pull-up) = +20KW then place a 20WK resistor on  
pin 3.  
If R (pull-up) = -20KW then place a 20KW on pin 2.  
Now that the offset resistor has been fixed, we need  
to set up the maximum current for each channel.  
Selection of RSENSE 1 for the master channel:  
(mohms)  
RSENSE 1 = 72mV / I max master  
Selection of RSENSE 2 for the slave channel: (mohms)  
RSENSE 1 = 48mV / I max master  
The errors will be minimized if the power compo-  
nents have been sized proportionately to the maxi-  
mum currents.  
Soft Start/Enable  
The Soft Start/Enable (SS/ENA) pin serves several  
functions. If held below the Soft Start Enable thresh-  
old, both channels are inhibited. DH1 and DH2 will be  
low, turning off the top FETs. Between the Soft Start  
Enable threshold and the Soft Start End threshold,  
the duty cycle is allowed to increase. At the Soft Start  
End threshold, maximum duty cycle is reached. In  
practical applications the error amplifier will be  
controlling the duty cycle before the Soft Start End  
threshold is reached. To avoid boost problems during  
startup in current share mode, both channels start  
up in asynchronous mode, and the bottom FET body  
diode is used for recirculating current during the FET  
off time. When the SS/ENA pin reaches the Soft Start  
Transition threshold, the channels begin operating in  
synchronous mode for improved efficiency. The soft  
start pin sources approximately 25uA and soft start  
timing can be set by selection of an appropriate soft  
start capacitor value.  
Independent Channels  
Calculation of the two current limiting resistors.  
There is no need for an offset resistor in the indepen-  
dent channels mode, only the two sense resistors  
are used:  
Selection of RSENSE 1 for the channel 1: (mohms)  
RSENSE 1 = 72mV / I max ch 1  
SENSE RESISTOR SELECTION  
Selection of RSENSE 2 for the channel 2: (mohms)  
Current Sharing Mode  
R
SENSE 1 = 72mV / I max ch 2  
Calculation of the three programming resistors to  
achieve sharing.  
Three resistors will determine the current sharing  
load line.  
First the offset resistor will ensure that the load line  
crosses the origin (0 Amp on each channel) for  
sharing at light current. A pull up resistor from the 5V  
bias (VCC of the chip) will be used. For low duty cycle  
on the slave channel (below 50%), the pull up will be  
on pin 3. For high duty cycle on the slave channel  
(above 50%), the pull up will be on pin 2.  
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6
SC1175  
POWER MANAGEMENT  
Typical Characteristics - 2 Channels with Current Sharing  
Figure 1: VOUT vs IIN(5V) and IIN(12V) with VCC applied and 4A load. Soft start capacitor = 10nF.  
PIN D
Ch1: VOUT  
Ch2: IIN(5V) (1A/Div)  
Ch4: IIN(12V) (1A/Div)  
IOUT: 4.004 Amps  
Figure 2: VOUT vs IIN(5V) and IIN(12V) with VCC removed and 4A load. Soft start capacitor = 10nF.  
Ch1: VOUT  
Ch2: IIN(5V) (1A/Div)  
Ch4: IIN(12V) (1A/Div)  
IOUT: 4.004Amps  
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SC1175  
POWER MANAGEMENT  
Typical Characteristics - 2 Channels with Current Sharing (Cont.)  
Figure 3: VOUT vs IIN(5V) and IIN(12V) with VCC applied and 12A load. Soft start capacitor = 10nF.  
Ch1: VOUT  
Ch2: IIN(5V) (2A/Div)  
Ch4: IIN(12V) (2A/Div)  
IOUT: 12Amps  
Figure 4: VOUT vs IIN(5V) and IIN(12V) with VCC removed and 12A load. Soft start capacitor = 10nF.  
Ch1: VOUT  
Ch2: IIN(5V) (2A/Div)  
Ch4: IIN(12V) (2A/Div)  
IOUT: 12Amps  
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SC1175  
POWER MANAGEMENT  
Typical Characteristics - 2 Channels with Current Sharing (Cont.)  
Figure 5: Efficiency data - current sharing mode.  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
VIN(MASTER) = 12V  
VIN(SLAVE) = 5V  
VOUT = 2.75V  
0.2  
0.1  
0.0  
0
2
4
6
8
10  
12  
14  
Current (A)  
The Current Sharing Evaluation Board is not intended for a specific application. The power components are not  
optimized for minimum cost and size. This evaluation board should be used to understand the operation of the  
SC1175.  
To design with the SC1175 for specific current sharing applications. Please refer to: Application note AN00-3.  
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9
SC1175  
POWER MANAGEMENT  
Evaluation Board Schematic - 2 Channel with Current Sharing  
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10  
SC1175  
POWER MANAGEMENT  
Evaluation Board Bill of Materials - 2 Channels with Current Sharing  
Item  
1
Quantity  
Reference  
Part  
2
3
3
1
3
6
2
1
1
2
2
1
7
2
1
1
1
1
C1,C7  
.22uF, 50V  
1uF, 50V  
2
C2,C3,C4  
C5,C15,C16  
C8  
3
10nF, 50V  
4
1nF, 50V  
100uF, 6V  
150uF, 16V  
DL4148  
5
C9,C10,C14  
6
C11,C12,C13,C17,C18,C19  
7
D1,D2  
8
L1  
7.5uH, 8A  
4.7uH, 8A  
9
L2  
10  
11  
12  
13  
14  
15  
16  
17  
18  
M1,M3  
IRF7809 or FDB7030  
M2,M4  
IRF7811 or FDB7030  
R1  
124  
R2,R3,R4,R5,R6,R7,R8  
2.2  
R9,R10  
R12  
100  
150  
R13  
.006  
.003  
SC1175  
R14  
U1  
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SC1175  
POWER MANAGEMENT  
Evaluation Board Gerber Plots - 2 Channels with Current Sharing  
Top Side Traces  
Bottom Side Traces  
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SC1175  
POWER MANAGEMENT  
Typical Characteristics - 2 Independent Channels  
Figure 6:  
Figure 7: Output Current  
Input Voltage = 12V @ 5Amps. 2A/DIV.  
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SC1175  
POWER MANAGEMENT  
Typical Characteristics - 2 Independent Channels (Cont.)  
Figure 8: Peak - Peak Output Ripple @ 5A  
Input Voltage = 12V.  
Output Voltage = 2.0V  
Figure 9: Phase Node 12V Input @ 5A (without  
snubber and RC network.  
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SC1175  
POWER MANAGEMENT  
Typical Characteristics - 2 Independent Channels (Cont.)  
Figure 10: Start-up Power On  
Chan. 1 = Output Current. 2A/DIV.  
Chan. 2 = 5V Bias Voltage  
Figure 11: Power Off  
Chan. 1 = Output Current. 2A/DIV.  
Chan. 2 = 5V Bias Voltage  
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SC1175  
POWER MANAGEMENT  
Typical Characteristics - 2 Independent Channels Efficiency Test  
Figure 12:  
100  
95  
Vin = 12V Vout =  
2.0V  
90  
85  
80  
75  
70  
Vin = 5V Vout =  
1.25V  
0
1
2
3
4
5
6
OUTPUT CURRENT  
The Independent Channels Evaluation Board is not intended for a specific application. The power components  
are not optimized for minimum cost and size. This evaluation board should be used to understand the opera-  
tion of the SC1175.  
To design with the SC1175 for specific independent channels applications. Please refer to: Application note  
AN00-4.  
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SC1175  
POWER MANAGEMENT  
Evaluation Board Schematic - 2 Independent Channels  
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17  
SC1175  
POWER MANAGEMENT  
Evaluation Board Bill of Materials - 2 Independent Channels  
Item  
1
Quantity  
Reference  
Part  
3
3
1
4
9
3
2
1
1
2
2
7
3
1
1
1
2
1
C1,C2,C3  
C4,C6,C11  
C5  
1uF, 50V  
.22uF, 50V  
1nF, 50V  
10nF, 50V  
2
3
4
C7,C8,C9,C10  
5
C12,C13,C14,C15,C16,C17,C18,C19,C20 150uF, 6V  
6
C21,C22,C23  
100uF, 16V  
DL4148  
7
D1,D2  
8
L1  
7.5uH, 8A  
4.7uH, 8A  
9
L2  
10  
11  
12  
13  
14  
15  
16  
17  
18  
M1,M3  
IRF7809 or FDB7030  
M2,M4  
IRF7811 or FDB7030  
R1,R2,R3,R4,R5,R6,R7  
2.2  
R8,R9,R13  
R10  
100  
.006  
220  
R11  
R12  
.003  
124  
R14,R15  
U1  
SC1175  
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SC1175  
POWER MANAGEMENT  
Evaluation Board Gerber Plots - 2 Independent Channels  
Top Side Traces  
Bottom Side Traces  
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SC1175  
POWER MANAGEMENT  
PCB Layout  
Analog ground (GND) should be returned to the  
Power and signal traces must be kept separated for  
noise considerations. Feedback, current sense traces  
and analog ground should not cross any traces or  
planes carrying high switching currents, such as the  
input loop or the phase node.  
ground side of the output capacitors so that the analog  
circuitry in the controller has an electrically quiet  
reference and to provide the greatest feedback accu-  
racy. The problem is that the differential voltage  
capability of the two IC grounds is limited to about 1V  
for proper operation and so the physical separation  
between the two grounds must also be minimized. If  
the grounds are too far apart, fast current transitions in  
the connection can generate voltage spikes exceeding  
the 1V capability, resulting in unstable and erratic  
behavior.  
The feedback divider must be close to the IC and be  
returned to analog ground. Current sense traces must  
be run parallel and close to each other and to analog  
ground.  
The IC must have a ceramic decoupling capacitor  
across its supply pins, mounted as close to the device  
as possible. The small ceramic, noise-filtering capaci-  
tors on the current sense lines should also be placed  
as close to the IC as possible.  
The input loop, consisting of the input capacitors and  
both MOSFETs must be kept as small as possible. All  
of the high switching currents occur in this loop. The  
enclosed loop area must be kept small to minimize  
inductance and radiated and conducted emissions.  
Designing for minimum trace length is not always the  
best approach, often a more optimum layout can be  
achieved by keeping loop area constraints in mind.  
It is important to keep gate lengths short, the IC must  
be close to the power switches. This is more difficult  
in a dual channel device than a single and requires  
that the two power paths run on either side of a cen-  
trally located controller.  
Grounding requirements are always conflicting in a  
buck converter, especially at high power, and the trick  
is to achieve the best compromise. Power ground  
(PGND) should be returned to the bottom MOSFET  
source to provide the best gate current return path.  
Outline Drawing - SO-20  
Contact Information  
Ref. MS-013AC  
Contact Information  
Semtech Corporation  
Power Management Products Division  
652 Mitchell Rd., Newbury Park, CA 91320  
Phone: (805)498-2111 FAX (805)498-3804  
ECN00-1204  
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20  

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