SG-210SCB3.6864MC [SEIKO]
CRYSTAL OSCILLATOR, CLOCK, 3.6864 MHz, CMOS OUTPUT, ROHS COMPLIANT, SMD, 4 PIN;型号: | SG-210SCB3.6864MC |
厂家: | SEIKO EPSON CORPORATION |
描述: | CRYSTAL OSCILLATOR, CLOCK, 3.6864 MHz, CMOS OUTPUT, ROHS COMPLIANT, SMD, 4 PIN 机械 输出元件 振荡器 |
文件: | 总2页 (文件大小:223K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Crystal oscillator
Epson Toyocom
Product Number (please contact us)
Q33210Bx0xxxx00
CRYSTAL OSCILLATOR
SPXO
SG-210S*B
•Frequency range
•Supply voltage
:
:
2 MHz to 60 MHz
1.5 V Typ. / 1.8 V Typ. / 2.5 V Typ. / 3.3 V Typ.
•Current consumption : 0.9 mA Typ.
(SEB: 1.8 V No load condition 48 MHz)
Standby( ST
2.5 × 2.0 × 0.8 mm
Actual size
•Function
•External dimensions
:
:
)
•Operation temperature : +105 °C / +125 °C
Specifications (characteristics)
Specifications
SG-210SEB SG-210SDB SG-210SCB
Item
Output frequency range
Supply voltage
Symbol
f0
Remarks
SG-210SGB
2 MHz to
32 MHz
1.5 V Typ.
1.3 V to 1.7 V
2 MHz to 60 MHz
1.8 V Typ.
2.5 V Typ.
3.3 V Typ.
2.7 V to 3.6 V
VCC
1.6 V to 2.2 V
2.2 V to 3.0 V
Storage
Temperature temperature
T_stg
T_use
-40 °C to +125 °C
Store as bare product after unpacking
range
Operating
temperature
-40 °C to +85 °C / -40 °C to +105 °C / -40 °C to +125 °C
F: ±20 × 10-6
-10 °C to +60 °C, f0 ≤ 32 MHz,
VCC ±10%, except reflow drift.
-20 °C to +70 °C
-40 °C to +85 °C
-40 °C to +105 °C
-40 °C to +125 °C
6
B: ±50 × 10-6, C: ±100 × 10-
L:±50 × 10-6,M:±100 × 10-6
Frequency tolerance
f_tol
–
–
Y:±50 × 10-6,W:±100 × 10-6
Z:±100 × 10-6,X:±150 × 10-6
1.6 mA Max. 2.4 mA Max. 3.0 mA Max. No load condition
2.0 mA Max 3.0 mA Max. 4.0 mA Max. No load condition +105 °C,+125 °C
1.0 mA Max.
Current consumption
Stand-by current
ICC
–
ST =GND
0.3 µA Max.
0.5 µA Max. 1.0 µA Max. 1.0 µA Max.
1.6 µA Max. 2.4 µA Max. 3.0 µA Max.
I_std
ST =GND +105 °C,+125 °C
2 MHz≤f0≤16 MHz
–
45 % to 55 %
40 % to 60 %
45 % to 55 % 45 % to 55 %
45 % to 55 % 16 MHz<f0≤32 MHz
50 % VCC level
L_CMOS ≤ 15 pF
Symmetry
SYM
–
–
40 % to 60 % 40 % to 60 %
40 % to 60 %
32 MHz<f0≤60 MHz
+105 °C,+125 °C
IOH=-1 mA
High output voltage
Low output voltage
Output load condition
(CMOS)
VOH
VOL
90 % VCC Min.
10 % VCC Max.
IOL= 1 mA
L_CMOS
15 pF Max.
VIH
VIL
80 % VCC Min.
20 % VCC Max.
Output enable /
disable input voltage
ST terminal
5 ns Max.
–
4 ns Max.
3 ns Max.
7 ns Max
3 ms Max.
+85 °C
+105 °C,+125 °C
t=0 at 90 % VCC (+105 °C,+125 °C : 5 ms Max.)
20 % VCC to 80 % VCC
level,L_CMOS=15 pF
Rise time and Fall time
Start-up time
tr/ tf
t_str
+25 °C, First year,
VCC=1.5 V,1.8 V, 2.5 V, 3.3 V
Frequency aging
f_aging
±3 × 10-6 / year Max.
External dimensions
(Unit:mm)
Footprint (Recommended)
(Unit:mm)
C
(ex. 0.01 µF)
2.5±0.15
#4
#3
#4
#3
#2
Resist
1.1
27.00B
#3
#4
B631A
#1
#1
0.9
#2
0.8
Pin map
Pin
1
Connection
ST
2
GND
#2
#1
3
OUT
1.7
4
VCC
Note.
To maintain stable operation, provide a 0.01uF to 0.1uF by-pass
capacitor at a location as near as possible to the power source
terminal of the crystal product (between Vcc - GND).
ST pin = HIGH or "open" : Specified frequency output.
ST pin = LOW : Output is high impedance, oscillation stops.
http://www.epsontoyocom.co.jp
“QMEMS” EPSON TOYOCOM
In order to meet customer needs in a rapidly advancing digital,
and where various types of terminals can transfer information almost
immediately via LAN and WAN on a global scale. Epson Toyocom
Corporation addresses every single aspect within a network environment.
The new corporation offers “Digital Convergence” solutions to problems
arising with products for consumer use, such as, core network systems
and automotive systems.
broadband and ubiquitous society, we are committed to offering products
that are one step ahead of the market and a rank above the rest in quality.
To achieve our goals, we follow a “3D (three device) strategy” designed to
drive both horizontal and vertical growth. We will to grow our three device
categories of “Timing Devices”, ”Sensing Devices” and “Optical Devices”,
and expand vertical growth through a combination of products from these
categories.
A Quartz MEMS is any high added value quartz device that exploits the
characteristics of quartz crystal material but that is produced using MEMS
(micro-electro-mechanical system) processing technology.
Market needs are advancing faster than previously imagined toward
smaller, more stable crystal products, but we will stay ahead of the curve
by rolling out products that exceed market speed and quality
requirements. We want to further accelerate the 3D strategy by QMEMS.
Quartz devices have become crucial in the network environment where
products are increasingly intended for broadband, ubiquitous applications
QMEMS and its logos are registered trademarks or trademarks of Epson
Toyocom Corporation in Japan and other countries.
PROMOTION OF ENVIRONMENTAL MANAGEMENT SYSTEM
CONFORMING TO INTERNATIONAL STANDARDS
At Epson Toyocom, all environmental initiatives operate under the
ISO 14000 is an international standard for environmental management
Plan-Do-Check-Action(PDCA) cycle designed to achieve continuous
improvements. The environmental management system (EMS) operates
under the ISO 14001 environmental management standard.
that was established by the International Standards Organization in 1996
against the background of growing concern regarding global warming,
destruction of the ozone layer, and global deforestation.
All of our major manufacturing and non-manufacturing sites,in Japan
and overseas, completed the acquisition of ISO 14001 certification.
WORKING FOR HIGH QUALITY
In order provide high quality and reliable products and services than
meet customer needs,
ISO/TS16949 is the international standard that added the sector-specific
supplemental requirements for automotive industry based on ISO9001.
Epson Toyocom made early efforts towards obtaining ISO9000 series
certification and has acquired ISO9001 for all business establishments in
Japan and abroad. We have also acquired ISO/TS 16949 certification
that is requested strongly by major automotive manufacturers as
standard.
►Explanation of the mark that are using it for the catalog
►Pb free.
►Complies with EU RoHS directive.
*About the products without the Pb-free mark.
Contains Pb in products exempted by EU RoHS directive.
(Contains Pb in sealing glass, high melting temperature type solder or other.)
►The products have been designed for high reliability applications such as Automotive.
Notice
•
•
•
This material is subject to change without notice.
Any part of this material may not be reproduced or duplicated in any form or any means without the written permission of Epson Toyocom.
The information, applied circuitry, programming, usage, etc., written in this material is intended for reference only. Epson Toyocom does not
assume any liability for the occurrence of infringing on any patent or copyright of a third party. This material does not authorize the licensing for
any patent or intellectual copyrights.
•
•
•
Any product described in this material may contain technology or the subject relating to strategic products under the control of the Foreign
Exchange and Foreign Trade Law of Japan and may require an export license from the Ministry of International Trade and Industry or other
approval from another government agency.
You are requested not to use the products (and any technical information furnished, if any) for the development and/or manufacture of weapon
of mass destruction or for other military purposes. You are also requested that you would not make the products available to any third party
who may use the products for such prohibited purposes.
These products are intended for general use in electronic equipment. When using them in specific applications that require extremely high
reliability, such as the applications stated below, you must obtain permission from Epson Toyocom in advance.
/ Space equipment (artificial satellites, rockets, etc.) / Transportation vehicles and related (automobiles, aircraft, trains, vessels, etc.) /
Medical instruments to sustain life / Submarine transmitters / Power stations and related / Fire work equipment and security
equipment / traffic control equipment / and others requiring equivalent reliability.
•
•
In this document, product codes and markings will remain as previously identified prior to the merger. Due to the on-going strategy of gradual
unification of part numbers, please review product codes and markings.
All brands or product names mentioned herein are trademarks and/or registered trademarks of their respective companies.
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