2N7002T-C [SECOS]
N-Channel Plastic- Encapsulate MOSFETS;型号: | 2N7002T-C |
厂家: | SECOS HALBLEITERTECHNOLOGIE GMBH |
描述: | N-Channel Plastic- Encapsulate MOSFETS 开关 光电二极管 晶体管 |
文件: | 总3页 (文件大小:121K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
2N7002T
115 mAMPS, 60VOLTS, R
=7.5 W
DS(on)
Elektronische Bauelemente
Small Signal MOSFET
RoHS Compliant Product
Small Signal MOSFET
115 mAmps, 60 Volts
N–Channel SOT–523
MAXIMUM RATINGS
Rating
Drain–Source Voltage
Symbol
Value
60
Unit
Vdc
Vdc
N–Channel
V
DSS
3
Drain–Gate Voltage (R
= 1.0 MΩ)
V
DGR
60
GS
Gate–Source Voltage
– Continuous
V
ā20
ā40
Vdc
Vpk
GS
– Non–repetitive (t ≤ 50 µs)
V
GSM
p
1
2
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
3
Total Device Dissipation FR–5 Board
P
D
150
1.8
mW
mW/°C
(Note 3.) T = 25°C
A
1
Derate above 25°C
2
Thermal Resistance, Junction to Ambient
R
833
°C/W
°C
θJA
SOT–523
–ā55 to
+150
Junction and Storage Temperature
T , T
J
stg
MARKING DIAGRAM
& PIN ASSIGNMENT
Drain
3
1. The Power Dissipation of the package may result in a lower continuous drain
current.
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%.
3. FR–5 = 1.0 x 0.75 x 0.062 in.
4. Alumina = 0.4 x 0.3 x 0.025 in 99.5% alumina.
72
1
Gate
2
Source
72 = Device Code
SOT-523
Dim
A
B
C
D
G
H
J
Min
1.500 1.700
0.750 0.850
Max
A
0.600 0.900
0.150 0.300
0.900 1.100
0.000 0.100
0.100 0.200
0.100 0.300
0.400 0.600
1.450 1.750
0.250 0.350
L
3
S
C
B
1
2
V
G
K
L
S
H
J
D
V
K
All Dimension in mm
http://www.SeCoSGmbH.com
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 1 of 3
2N7002T
115 mAMPS, 60VOLTS, RDS(on)=7.5 W
Elektronische Bauelemente
Small Signal MOSFET
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
V
60
–
–
Vdc
(BR)DSS
(V
GS
= 0, I = 10 µAdc)
D
Zero Gate Voltage Drain Current
(V = 0, V = 60 Vdc)
T
T
= 25°C
= 125°C
I
–
–
–
–
1.0
500
µAdc
nAdc
nAdc
J
J
DSS
GS DS
Gate–Body Leakage Current, Forward
(V = 20 Vdc)
I
–
–
10
GSSF
GS
Gate–Body Leakage Current, Reverse
(V = –ā20 Vdc)
I
–
–
–10
GSSR
GS
ON CHARACTERISTICS (Note 2.)
Gate Threshold Voltage
V
I
1.0
0.5
–
1
2.0
–
Vdc
GS(th)
(V
DS
= V , I = 250 µAdc)
GS
D
On–State Drain Current
(V ≥ 2.0 V , V
A
D(on)
= 10 Vdc)
DS DS(on) GS
Static Drain–Source On–State Resistance
(V
Ohms
–
–
–
–
–
13.5
7.5
R
GS = 10 V, ID = 500 mAdc)
TC = 25°C
DS(on)
(V
GS = 5.0 Vdc, ID = 50 mAdc) TC = 25°C
Forward Transconductance
(V = 10 V, I = 200 mAdc)
g
FS
80
–
ms
DS
D
DYNAMIC CHARACTERISTICS
Input Capacitance
C
–
–
–
–
–
–
50
25
pF
pF
pF
iss
(V
DS
= 25 Vdc, V
= 0, f = 1.0 MHz)
GS
Output Capacitance
(V = 25 Vdc, V
C
oss
= 0, f = 1.0 MHz)
DS
GS
Reverse Transfer Capacitance
(V = 25 Vdc, V = 0, f = 1.0 MHz)
C
5.0
rss
DS
GS
SWITCHING CHARACTERISTICS (Note 2.)
Turn–On Delay Time
t
t
–
–
–
–
20
20
ns
ns
d(on)
(V
DD
G
= 30 Vdc, I ^ 200 mAdc,
D
R
= 25 Ω, R = 150 Ω, V
= 10 V)
L
gen
Turn–Off Delay Time
d(off)
http://www.SeCoSGmbH.com
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 2 of 3
2N7002T
115 mAMPS, 60VOLTS, R
=7.5 W
DS(on)
Elektronische Bauelemente
Small Signal MOSFET
TYPICAL ELECTRICAL CHARACTERISTICS
1
0.9
0.8
0.7
0.6
VGS = 5V
VGS = 4V
VGS = 10,7,6V
2.2
1.8
1.4
VGS = 3V
0.5
0.4
0.3
0.2
0.1
0
VGS = 4V
VGS = 3V
1
VGS = 5, 6, 7, 10V
0.8
0.6
0
0.2
0.4
0.6
1.0
0
1
2
3
4
5
ID, DRAIN-SOURCE CURRENT (A)
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 On-Region Characteristics
Fig. 2 On-Resistance Variation with Gate Voltage and Drain-Source Current
1.2
2.2
VGS = 10V
ID = 500mA
2
1.8
1.6
1.1
1
1.4
1.2
0.9
1
0.8
0.6
0.4
0.8
0.7
0
-50
-25
25
100
125
50
75
150
75
-50
-25
0
25
50
100
125
150
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Fig. 3 Gate Threshold Variation with Temperature
Fig. 4 On-Resistance Variation with Temperature
60
50
5.0
4.5
4.0
3.5
40
30
20
10
0
3.0
2.5
2.0
1.5
ID = 50mA
Ciss
1.0
0.5
0.0
Coss
Crss
10
0
2
4
6
8
0
5
10
20
25
15
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 6 On-Resistance vs. Gate-Source Voltage
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 5 Typical Capacitance
http://www.SeCoSGmbH.com
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 3 of 3
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