LA4422 [SANYO]

5.8W typ AF Power Amplifier for Car Stereos, Car Radios; 5.8W典型值AF功率放大器汽车音响,汽车音响
LA4422
型号: LA4422
厂家: SANYO SEMICON DEVICE    SANYO SEMICON DEVICE
描述:

5.8W typ AF Power Amplifier for Car Stereos, Car Radios
5.8W典型值AF功率放大器汽车音响,汽车音响

放大器 功率放大器 汽车音响
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中文:  中文翻译
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Ordering number:ENN556F  
Monolithic Linear IC  
LA4422  
5.8W typ AF Power Amplifier for  
Car Stereos, Car Radios  
Features  
Package Dimensions  
unit:mm  
• High gain (53dB typ.) and high output (5.8W typ).  
• Soft clip.  
3018A-SIP10FD  
• Small number of external parts (4 pcs).  
• Bridge construction usable (P =18W/R =4).  
[LA4422]  
O
L
25.5  
3.6  
• Built-in thermal shutdown circuit against load short, over-  
load.  
24.0  
12.0  
3.6  
• Built-in circuit to prevent pop noise at the time of power  
supply ON.  
• SIP package (single ended pins) facilitating easy mount-  
ing.  
1
10  
0.45  
1.6  
1.32  
0.5  
1.3  
2.54  
SANYO : SIP10FD  
Specifications  
Absolute Maximum Ratings at Ta = 25˚C  
Parameter  
Maximum supply voltage  
Symbol  
Conditions  
Ratings  
Unit  
V
max  
18  
4.5  
40  
7
V
A
CC  
I
Maximum output current  
Surge supply voltage  
Pin 1 flow-in, pin 8 flow-out, Pin 10 flow-out *  
O
Vsurge  
Pd max  
Topr  
t0.2s  
V
Allowable power dissipation  
Operating temperature  
Storage temperature  
W
˚C  
˚C  
–20 to +75  
Tstg  
–40 to +150  
3
* : 100×100×1.5mm Al heat sink used.  
Operating Conditions at Ta = 25˚C  
Parameter  
Recommended supply voltage  
Recommended load resistance  
Symbol  
Conditions  
Ratings  
Unit  
V
V
13.2  
4
CC  
R
L
3
Operating Characteristics at Ta = 25˚C, V =13.2V, R =4, f=1kHz, 100×100×1.5mm Al heat sink.  
CC  
L
Ratings  
Parameter  
Symbol  
Conditions  
Unit  
min  
typ  
max  
Quiescent current  
Voltage gain  
I
35  
80  
55  
mA  
dB  
dB  
W
CCO  
Closed loop  
51  
53  
VG  
Open loop based on specified circuit  
70  
P
P
1
2
THD=10%, R =4Ω  
5.0  
5.8  
O
O
L
Output power  
THD=10%, R =2Ω  
9.0  
W
L
Continued on next page  
Any and all SANYO products described or contained herein do not have specifications that can handle  
applications that require extremely high levels of reliability, such as life-support systems, aircraft’s  
control systems, or other applications whose failure can be reasonably expected to result in serious  
physical and/or material damage. Consult with your SANYO representative nearest you before using  
any SANYO products described or contained herein in such applications.  
SANYO assumes no responsibility for equipment failures that result from using products at values that  
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges,or other  
parameters) listed in products specifications of any and all SANYO products described or contained  
herein.  
SANYO Electric Co.,Ltd. Semiconductor Company  
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN  
21500TH (KT)/O281TS/D177KI/5085MW/6250KI, TS No.556–1/10  
LA4422  
Continued from preceding page.  
Ratings  
typ  
Parameter  
Symbol  
Conditions  
Unit  
min  
max  
2.0  
Total harmonic distortion  
Input resistance  
THD  
ri  
P
=1W  
0.7  
%
O
30  
kΩ  
mV  
Output noise voltage  
V
Rg=10k, no filter  
1.2  
2.5  
NO  
Equivalent Circuit Block Diagram  
Proper Cares in Using IC  
1. Maximum ratings  
Extreme caution should be excrcised when using the IC in the vicinity of the maximum ratings as a slight factor may  
cause the maximum ratings to be exceeded, thereby leading to a breakdown accident.  
2. Pin-to-pin short  
If the power supply is truned ON with pin-to-pin short, a breakdown or de-gradation may occur. When installing the IC  
on the board, be sure to check that pin-to-pin area is not shorted with solder, etc. and turn ON the power supply.  
3. Printed Circuit Board  
When designing the printed circuit board, make the power supply and ground lines thicker and shorter so that no  
feedback loop of input/output is formed. When using under the condition where the signal source impedance (Rg) is  
large, a stable operation against distortion is obtained by separating the input /output ground line at the root of GND pin  
[pin (8)]. The heat sink fin must be reliably connected to the external line of the same potential as pin (8) (GND).  
No.556–2/10  
LA4422  
Functions of External Parts  
The recommended number of external parts of the LA4422 is 4 pcs. as follows.  
· Feedback capacitor from pin (5) C  
.
NF  
· Pin (7) to (10) bootstrap capacitor C  
.
BS  
· Output capacitor from pin (10) C  
.
OUT  
· High frequency parasitic oscillation compensating capacitor C .  
X
The fixed values of these parts are C =100µF, C =100µF, C  
=1000µF, C =0.15µF. We now consider what will occur  
OUT X  
NF  
BS  
when these values are changed.  
(a) Feedback capacitor C  
NF  
If C is made smaller, the combined series impedance with R at a low frequency is increased, the amplification  
NF  
NF  
degree A is decreased, and the low cutoff frequency is made higher as seen from the following equation.  
vf  
Rf  
Avf=  
1
(R  
+
)
NF  
jωC  
NF  
VG=20log Avf (dB)  
The ripple rejection is also lowered. It is possible, however, to make the starting time earlier at the time of the power  
supply switch ON. If C is made larger, these are reversed.  
NF  
(b) Bootstrap capacitor C  
BS  
The low cutoff frequency may be somewhat influenced, but the drive at a low frequency is more influenced. If C is  
BS  
made smaller, power at a low frequency may be reduced. Therefore, C should be more than 47µF.  
BS  
(c) Output capacitor C  
OUT  
The low cutoff frequency may be somewhat influenced, but the most influence is that power is reduced as the imped-  
ance at a low frequency is increased. Therefore, C  
required.  
should be determined by the power band width. 470µF min. is  
OUT  
(d) High frequency parasitic oscillation compensating capacitor C .  
X
C should be a polyester film capacitor of good frequency characteristic. If a ceramic capacitor is used, oscillation may  
X
occur.  
Features of IC System and Functions of Remaining Pins  
· Since the input circuit uses pnp and the input potential is designed to be 0 bias, no input coupling capacitor is needed and  
the direct coupling is available.  
· The thermal shutdouwn protection circuit is built in to prevent breakdown or degradation attributable to generation of heat  
at the time of load short or overload.  
· The overvoltage protection circuit is built in to protect the IC from breaking down when a surge is applied to the power  
supply line.  
· The prevention circuit is provided to prevent pop noise which occures when the power supply is turned ON.  
· The voltage gain of open loop is lowered and the nagative feedback is made smaller to obtain a soft clip. Radiation to the  
high frequency circuit and stability are considered.  
· The feedback resistor R is set up at such a large value as 40kand the cutoff frequency point f is considered so that the  
f
L
frequency characteristic is fully externded to a low frequency even if the capacity of capacitor C is small.  
NF  
· The high frequency parasitic oscillation compensating capacitor is built in as a means to reduce the number of external  
parts. Therefore, the high cutoff frequency point f is fixed.  
H
· The feedback resistor R is built in and the voltage gain is fixed to be 53dB in order to reduce the number of external  
NF  
parts and to minimize the variations of voltage gain.  
Pins (5) and (6) are provided to control the voltage gain externally. The voltage gain is lowered by inserting a resistor in  
series with pin (5). The voltage gain is increased by inserting a resistor between pin (5) and (6). If CR are connected to  
pin (6), the voltage gain is freely controlled through pin (6) alone.  
· Pin (4) is provided as a decoupling pin.  
Even if the power suppy is turned ON/OFF in succession, pop noise is minimized by connecting a capacitor to this pin,  
provided that a condition C C is recommended. C is related to the starting time. The ripple rejection is improved  
D
NF  
NF  
by connecting the decoupling capacitor C .  
D
No.556–3/10  
LA4422  
Sample Application Circuit 1. Power amplifier for 5.8W typ. car radio, car stereo  
No.556–4/10  
LA4422  
No.556–5/10  
LA4422  
No.556–6/10  
LA4422  
Output wave form (pop noise) influenced by C /V =13.2V, R =4, f=1kHz, V =1V  
D
CC  
L
O
(1) C ==100µF, perfect discharge  
(2) C =100µF, C =100µF  
NF D  
NF  
No.556–7/10  
LA4422  
Sample Application Circuit 2. 18W typ. (V =13.2V, R =4) BTL amplifier  
CC  
L
No.556–8/10  
LA4422  
The heat sink design of this circuit is so  
important that it is requested that you  
should consult us beforehand.  
Sample Application Circuit 3. Pre-power amplifier for car stereo (4.75cm/s. cassette).  
No.556–9/10  
LA4422  
Proper Cares in Bridge Amplifier Application  
For bridge amplifier design, take the following into consideration and consult our sales department.  
· The LA4422 contains the thermal shutdown circuit which senses generation of abnormal heat attributable to load short,  
etc. and stops the internal circuit operation. Thus, breakdown attributable to generatin of abnormal heat is prevented.  
· This function operates normally for single IC operation, but the following extraordinary phenomena appear for bridge  
operation.  
a) Generation of heat of non-inverting, inverting amplifier ICs at the time of output non-clip depends on the radiation  
condition of each IC.  
b) Generation of heat at the time of output clip is always larger for inverting amplifier IC, which cannot be compensated  
even if there is slight difference of radiation condition between two ICs. This is because the output of non-inverter  
amplifier IC is clipped and enters completely into the saturation region and Pd (power dissipation) is reduced, while  
the output clip of inverting amplifier IC is a mere amplification of output (clip waveform) of non-inverter amplifier  
and does not enter into the saturation region and Pd (power dissipation) is held somewhere at the max. level.  
c) For this reason, the inverting amplifier IC always generates more heat at the time of output clip. If the radiation  
condition is not designed correctly, the thermal shutdouwn circuit of inverting amplifier starts operating earlier.  
d) For single IC operation, as above-mentioned, when the thermal shutdown circuit operates, not only the output signal  
but also Pd (power dissipation) is reduced so as to minimize generation of heat.  
For bridge operation also, if the thermal shutdown circuit of non-inverting amplifier IC operates earlier than the  
inverting amplifier IC, generation of heat is minimized similarly to the single IC operation. This is because reduction  
of output of input side amplifier (inverting IC) causes reduction of the total output. (It is almost impossible to realize  
this state with the normal radiation design.) To the contrary, if the thermal shutdown circuit of inverting amplifier IC  
operates earlier, the output of this inverting amplifier IC is reduced, but Pd (power dissipation) is not reduced due to  
the drive from the output pin because of bridge connection and operation outside the ASO (area of safety operation)  
may occur.  
e) Therefore, if the thermal shutdown circuit operates (inverting side) at the time of bridge operation, the above phe-  
nomena occur, and if the applied voltage is high, breakdown of the IC beyond the ASO (area of safety operation) may  
result.  
f) As seen from the above, it is one of the most important factors in the bridge operation circuit design that the radiation  
design should be made to prevent the thermal circuit from operating.  
Specifications of any and all SANYO products described or contained herein stipulate the performance,  
characteristics, and functions of the described products in the independent state, and are not guarantees  
of the performance, characteristics, and functions of the described products as mounted in the customer's  
products or equipment. To verify symptoms and states that cannot be evaluated in an independent device,  
the customer should always evaluate and test devices mounted in the customer's products or equipment.  
SANYO Electric Co., Ltd. strives to supply high-quality high-reliability products. However, any and all  
semiconductor products fail with some probability. It is possible that these probabilistic failures could  
give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire,  
or that could cause damage to other property. When designing equipment, adopt safety measures so  
that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective  
circuits and error prevention circuits for safe design, redundant design, and structural design.  
In the event that any or all SANYO products(including technical data,services) described or  
contained herein are controlled under any of applicable local export control laws and regulations,  
such products must not be exported without obtaining the export license from the authorities  
concerned in accordance with the above law.  
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or  
mechanical, including photocopying and recording, or any information storage or retrieval system,  
or otherwise, without the prior written permission of SANYO Electric Co., Ltd.  
Any and all information described or contained herein are subject to change without notice due to  
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification"  
for the SANYO product that you intend to use.  
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not  
guaranteed for volume production. SANYO believes information herein is accurate and reliable, but  
no guarantees are made or implied regarding its use or any infringements of intellectual property rights  
or other rights of third parties.  
This catalog provides information as of February, 2000. Specifications and information herein are subject  
to change without notice.  
PS No.556–10/10  

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