ENA2159 [SANYO]
For Car Audio Systems Multi-Power Supply IC; 对于汽车音响系统的多电源IC
| 型号： | ENA2159 |
| 厂家： | 
SANYO SEMICON DEVICE |
| 描述： | For Car Audio Systems Multi-Power Supply IC |
| 文件： | 总14页 (文件大小：190K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Ordering number : ENA2159
Bi-CMOS LSI
For Car Audio Systems
Multi-Power Supply IC
LV5696P
Overview
LV5696P is a multiple voltage regulator for car audio system. This IC has 6 system of voltage regulators,
3.3/5.0Voutput for a microcontroller, 8.0V output for CD driver, 3V-8V (Adjustable) output for illuminations, 8.5V
output for audio control, 5V output for SYS control, 3.3V output for DSP control and 1 high side switch output for
ANT output.
About protection circuits, it has Over-current-protection, Over-voltage-protection and Thermal-shut-down.
Features
• Low current consumption : typ 50μA
• 6 system of regulators
V
(Micon) : V
: V
3.3/5.0V, I
MAX 200mA
DD
CD
OUT
OUT
OUT
OUT
OUT
OUT
OUT
MAX 1000mA
8.0V, I
OUT
3.0V to 8.0V (Adjustable external resistors), I
Illumination : V
MAX 200mA
OUT
Audio
SYS
DSP
: V
: V
: V
8.5V, I
5.0V, I
3.3V, I
MAX 300mA
MAX 500mA
MAX 800mA
OUT
OUT
OUT
• 1 high-side switch coupled V
CC
MAX 200mA, V -V
ANT
: I
= 0.5V
CC OUT
OUT
• Over current protection
• Over voltage protection typ 21V (All outputs except for V
• Thermal shut down circuit typ 175°C
are turned off)
DD
• Applied P-LDMOS to output stage
(Warning) The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the
conditions out of safety range or ratings. Use of the IC such as use under overcurrent protection range, thermal shutdown state may
degrade the IC’s reliability and eventually damage the IC.
Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to
"standard application", intended for the use as general electronics equipment. The products mentioned herein
shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life,
aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system,
safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives
in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any
guarantee thereof. If you should intend to use our products for new introduction or other application different
from current conditions on the usage of automotive device, communication device, office equipment, industrial
equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the
intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely
responsible for the use.
Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate
the performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer
's products or
equipment.
D1212NKPC 20121105-S00005 No.A2159-1/14
LV5696P
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Maximum supply voltage
Power dissipation
Symbol
Conditions
Ratings
Unit
V
V
max
36
1.5
CC
Pd max
IC Unit
W
W
W
V
At using Al heat sink of (50×50×1.5mm3)
5.6
Infinite large heat sink
32.5
Peak voltage
V
peak
See below about Pulse wave
50
CC
Operating temperature
Storage temperature
Junction maximum temperature
Topr
-40 to +85
-55 to +150
150
°C
°C
°C
Tstg
Tj max
Recommended Operating Conditions at Ta = 25°C
Parameter
Conditions
Ratings
Unit
V
Power supply voltage rating 1
Power supply voltage rating 2
Power supply voltage rating 3
V
output, ANT output
7.5 to 16
10.5 to 16
10 to 16
DD
AUDIO output
CD output, ILM output, SYS output, DSP output
- 0.7V
V
V
*Make sure that V 1 is as follows: V 1 > V
CC CC CC
Electrical Characteristics at Ta = 25°C, V
CC
= V 1 = 14.4V
CC
Ratings
typ
Parameter
Symbol
Conditions
Unit
min
max
100
Quiescent current
I
V
No Load, CTRL1/2/3 = ⎡L/L/L⎦
50
μA
CC
DD
CTRL1 (ANT)
Low input voltage
High input voltage
Input impedance
CTRL2 (ILM)
V
V
1
ANT: OFF
0
0.3
5.5
V
V
IL
1
ANT: ON
2.7
3.3
IH
R
1
input voltage ≤ 3.3V
280
400
520
kΩ
IN
Low input voltage
High input voltage
Input impedance
CTRL3
V
2
ILM: OFF
0
2.7
0.3
5.5
V
V
IL
V
2
ILM: ON
3.3
IH
R
2
3
input voltage ≤ 3.3V
280
400
520
kΩ
IN
Low input voltage
Middle input voltage
V
3
CD, AUDIO, SYS5V, DSP: OFF
0
0.3
2.0
V
V
IL
V
CD, DSP:OFF
1.3
1.65
IM
SYS5V, AUDIO: ON
CD, AUDIO, SYS5V, DSP: ON
High input voltage
Input impedance
V
3
2.7
3.3
5.5
V
IH
R
3
input voltage ≤ 3.3V
280
400
520
kΩ
IN
V
V
V
V
output 5.0V/3.3V -ON ; IKV
DD
= V 1 : V
= 5V/IKV
= GND : V
= 3.3V
DD
DD
DD
DD
CC DD
DD
DD
= V
output voltage 1
output voltage 2
output current
V
1
I
I
1 = 200mA, IKV
1
4.75
3.13
200
5.0
3.3
5.25
3.47
V
V
O
O
DD
CC
V
1’
1 = 200mA, IKV
= GND
O
O
DD
I
1
mA
mV
mV
V
O
Line regulation
ΔV
ΔV
V
1
1
7.5V < V
CC
< 16V, I 1 = 200mA
30
70
100
150
1.5
OLN
O
Load regulation
1mA < I 1 < 200mA
O
OLD
Dropout voltage 1
Dropout voltage 2
Ripple rejection
1
I
I
1 = 200mA
1.0
0.5
50
DROP
O
O
V
1’
1 = 100mA
0.75
V
DROP
R
1
f = 120Hz, I 1 = 200mA
40
dB
REJ
2
O
CD output 8.0V-ON ; CTRL3 = ⎡H⎦
CD output voltage
CD output current
Line regulation
V
I
2 = 1000mA
O
7.6
8.0
8.4
V
mA
mV
mV
V
O
I
2
1000
O
ΔV
ΔV
V
2
10.5V < V
CC
< 16V, I 3 = 1000mA
50
100
1.0
0.5
50
100
200
1.5
OLN
O
Load regulation
2
10mA < I 2 < 1000mA
O
OLD
Dropout voltage 1
Dropout voltage 2
Ripple rejection
2
I
I
2 = 1000mA
2 = 500mA
DROP
O
V
2’
0.75
V
DROP
O
R
2
f = 120Hz, I 2 = 1000mA
40
dB
REJ
O
Continued on next page.
No.A2159-2/14
LV5696P
Continued from preceding page.
Ratings
typ
Parameter
Symbol
Conditions
Unit
min
max
ILM output 3.0 to 8.0V-ON ; CTRL2 = ⎡H⎦
ILM_ADJ voltage
ILM_ADJ current
ILM output voltage1
ILM output voltage2
ILM output current
Line regulation
V 3
1.222
1.260
1.298
V
μA
V
I
I
3
-1
7.65
2.86
200
1
8.35
3.14
IN
V
V
3
I
I
3 = 200mA, R1 = 300kΩ, R2 = 56kΩ
3 = 200mA, R1 = 51kΩ, R2 = 36kΩ
8.0
3.0
O
O
3’
V
O
O
I
3
R1 = 300kΩ, R2 = 56kΩ
10.5V < V < 16V, I 4 = 200mA
mA
mV
mV
V
O
ΔV
ΔV
V
3
3
30
70
90
150
OLN
CC
1mA < I 3 < 200mA
O
Load regulation
OLD
O
Dropout voltage 1
Dropout voltage 2
Ripple rejection
3
I
I
3 = 200mA
3 = 100mA
0.7
0.35
50
1.05
0.53
DROP
O
V
3’
V
DROP
O
R
3
f = 120Hz, I 4 = 200mA
40
dB
REJ
O
AUDIO output 8.5V-ON ; CTRL3 = ⎡M or H⎦
AUDIO output voltage
AUDIO output current
Line regulation
V
4
I
4 = 300mA
O
8.07
300
8.5
8.93
V
mA
mV
mV
V
O
I
4
O
ΔV
ΔV
V
4
4
10.5V < V
CC
< 16V, I 4 = 300mA
30
70
90
150
OLN
O
Load regulation
1mA < I 4 < 300mA
O
OLD
Dropout voltage 1
Dropout voltage 2
Ripple rejection
4
I
I
4 = 200mA
4 = 100mA
0.7
0.35
50
1.05
0.53
DROP
O
O
V
4’
V
DROP
R
4
f = 120Hz, I 4 = 300mA
40
dB
REJ
O
SYS output 5.0V-ON ; CTRL3 = ⎡M or H⎦
SYS output voltage
SYS output current
Line regulation
V
I
5
I
5 = 500mA
O
4.75
500
5.0
5.25
V
O
5
mA
mV
mV
V
O
ΔV
ΔV
V
5
10.5V < V
CC
< 16V, I 5 = 500mA
30
70
90
150
2.5
OLN
O
Load regulation
5
1mA < I 5 < 500mA
O
OLD
Dropout voltage
5
I
5 = 500mA
O
1.3
50
DROP
Ripple rejection
R
5
f = 120Hz, I 5 = 500mA
40
dB
REJ
O
DSP output 3.3V-ON ; CTRL3 = ⎡H⎦
DSP output voltage
DSP output current
Line regulation
V
6
I
6 = 800mA
O
3.13
800
3.3
3.47
V
O
I
6
mA
mV
mV
V
O
ΔV
ΔV
V
6
10.5V < V
CC
< 16V, I 6 = 800mA
30
70
90
150
3.0
OLN
O
Load regulation
6
1mA < I 6 < 800mA
O
OLD
Dropout voltage
6
I
6 = 800mA
O
1.5
50
DROP
Ripple rejection
R
6
f = 120Hz, I 6 = 800mA
40
dB
REJ
O
ANT Remote-ON ; CTRL1 = ⎡H⎦
Output voltage
V
7
I
7 = 200mA
V -1.0
CC
V
-0.5
V
O
O
CC
Output current
I
7
V
7 ≥ V -1.0
200
mA
O
O CC
No.A2159-3/14
LV5696P
Package Dimensions
unit : mm (typ)
• Allowable power dissipation derating curve
3395A
Pd max -- Ta
Aluminum heat sink mounting conditions
8
tightening torque : 39N⋅cm, using silicone grease
21.6
7
(20.0)
HEAT SINK
(16.2)
Aluminum heat sink (50 × 50 × 1.5mm3) when using
3.0
6
5.6
(R1.75)
5
4
3
2
Independent IC
1.5
1
0.4
1
15
2.54 2.54
(1.91)
1.27
0.7
0
--40 --20
0
20
40
60
80
100 120 140150160
Ambient temperature, Ta -- °C
SANYO : HZIP15J
• Peak Voltage testing pulse wave
50V
90%
10%
16V
5msec
100msec
CTRL logic truth table
CTRL1
ANT
CTRL2
ILM
CTRL3
AUDIO
SYS
CD
DSP
L
OFF
ON
L
OFF
ON
L
M
H
OFF
ON
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
H
H
ON
ON
No.A2159-4/14
LV5696P
Block Diagram
V
CC
+B
15
+
ANT
ANT (V -0.5V)
CC
9
7
+
200mA
-
+
SYS 5.0V
+
500mA
800mA
Over
Voltage
Protection
Start
up
-
+
Vref
DSP 3.3V
+
5
-
+
ILM 3.0V to 8.0V
+
11
10
CTRL1
CTRL2
4
6
OUTPUT
ILM ADJ
Control
-
+
CTRL3
8
CD 8.0V
+
1000mA
300mA
3
1
-
+
Thermal
AUDIO 8.5V
+
Shut Down
GND
V
1
2
CC
+
14
13
+B
-
+
V
OUT(3.3V/5.0V)
200mA
DD
+
12 IKV :V SEL
DD DD
No.A2159-5/14
LV5696P
Pin Function
Pin No.
Pin name
Description
Equivalent Circuit
1
AUDIO
AUDIO output pin
CTRL3 = M, H-ON
8.5V/0.3A
V
15
1
CC
260kΩ
1kΩ
45kΩ
2
GND
2
3
GND
CD
GND pin
CD output pin
CTRL3 = H-ON
8.0V/1.0A
V
15
CC
3
240kΩ
45kΩ
1kΩ
2
GND
4
CTRL1
CTRL1 input pin
15
V
CC
Input of two values
10kΩ
4
2
400kΩ
GND
V
5
DSP
DSP output pin
CTRL3 = H-ON
3.3V/0.8A
15
5
CC
73kΩ
45kΩ
1kΩ
2
GND
Continued on next page.
No.A2159-6/14
LV5696P
Continued from preceding page.
Pin No.
6
Pin name
CTRL2
Description
Equivalent Circuit
CTRL2 input pin
15
V
CC
Input of two values
10kΩ
6
2
400kΩ
GND
V
7
8
9
SYS
SYS output pin
CTRL3 = M, H-ON
5.0V/0.5A
15
7
CC
134kΩ
45kΩ
1kΩ
2
GND
CTRL3
CTRL3 input pin
V
15
CC
Input of three values
10kΩ
8
400kΩ
2
GND
ANT
ANT output pin
CTRL1 = H-ON
VCC-0.5V/0.2A
V
15
CC
9
2
GND
Continued on next page.
No.A2159-7/14
LV5696P
Continued from preceding page.
Pin No.
10
Pin name
ILM ADJ
Description
Equivalent Circuit
ILM feedback pin
V
15
CC
11
10
11
ILM
ILM output pin
CTRL2 = H-ON
3.0 to 8.0V/0.2A
1kΩ
2
GND
1
12
IKV
DD
V
V
Voltage switch control input pin
1/GND
DD
CC
V
CC
14
12
5V
4.75MΩ
65kΩ
2
GND
13
V
V
output pin
DD
DD
V
1
CC
14
13
5.0V/0.2A (IKV
= V 1)
CC
DD
3.3V/0.2A (IKCD = GND)
225kΩ
190kΩ
1kΩ
140kΩ
2
GND
1
14
15
V
V
1
V
power supply pin
CC
DD
V
CC
15
2
V
CC
14
Power supply pin
CC
GND
Continued on next page.
No.A2159-8/14
LV5696P
Timing Chart
21V
21V
V
CC
(15PIN)
V
1
CC
(14PIN)
5.5V
V
output
DD
(13PIN)
H
CTRL1 input
(4PIN)
L
H
CTRL2 input
(6PIN)
L
L
H
M
CTRL3 input
(8PIN)
ANT output
(9PIN)
ILM output
(11PIN)
AUDIO
(1PIN)
SYS output
(7PIN)
CD output
(3PIN)
DSP output
(5PIN)
No.A2159-9/14
LV5696P
Application circuit example
LV5696P
2
4
6
8
10
12
14
1
3
5
7
9
11
13
15
+
+
+
+
+
+
+
+
+
C9
C2 C1
C4 C3
C6 C5
C8 C7
C11 C10
C13 C12 C15 C14 C17 C16
C18
R3
D2
D3
R1
R2
V
DD
D1
ILM
AUDIO
CD
DSP
SYS
CTRL1
CTRL2
CTRL3
ANT
V
CC
External Parts Lineup
Part name
Description
Recommended value
Note
C2, C4, C6, C8,
C11, C13
Output stabilization capacitor
10μF or more (*1)
Electrolytic capacitor
Ceramic capacitor
Ceramic capacitor
C1, C3, C5, C7,
C10, C12
Output stabilization capacitor
0.22μF or more (*1)
C18
Output stabilization capacitor
Bypass capacitor
20pF
C15, C17
C14, C16
C9
100μF or more
0.22μF or more
2.2μF or more
Connect a capacitor as close as
possible to V pin and GND pin.
CC
Prevent oscillation capacitor
Output stabilization capacitor
ILM output voltage
R1/R2: 300kΩ/56kΩ = 8.0V
R1/R2: 51kΩ/36kΩ = 3.0V
10 to 100kΩ
A resistor with resistance
accuracy as low as less
1% must be used.
R1, R2
Feedback resister
R3
D1
Protective resister
Backflow prevention diode
Internal element Protection diode
D2, D3
SANYO SB1003M3
(*1) Make sure that output capacitors is 10μF or more and ESR 10Ω or less in total, in which voltage and temperature fluctuation and unit differences are taken
into consideration. Moreover, high frequency characteristics of electrolytic capacitor should be sufficient.
Furthermore, the values listed above do not guarantee stabilization during the over current protection operations of the regulator, so oscillation may occur
during an over current protection operation.
No.A2159-10/14
LV5696P
ILM output voltage setting method
ILM calculating formula
1.26[V ]
ILM =
× R1 +1.26[V ]
R2
ILM
11
R1
R2
(
ILM −1.26
)
=
1.26
R1
Please design so that the ratio of R1 and R2 may fill the
above-mentioned expression for the set ILM voltage.
ILM_ADJ
10
1.26V
(Ex.) Setup to ILM = 8.0V
R2
R1
R2
(
8.0 −1.26
1.26
)
≅ 5.349
=
ILM_ADJ is equal to bandqap reference
voltage (typ = 1.26V).
R1 300kΩ
=
≅ 5.357
R2
56kΩ
ILM = 1.26V × 5.357 +1.26V ≅ 8.010V
Note : The above-mentioned are all the values at the typical. The error margin of output voltage is caused by the influence
of the manufacturing variations of IC and external resistance.
CTRL3 Application Circuit
Input 3.3V : R1 = R2 = 47kΩ
A
B
CTRL3
R1
R2
A
B
0V
0V
0V
3.3V
0V
0V
CTRL3
1.56V
1.56V
3.12V
8
3.3V
3.3V
3.3V
400kΩ
No.A2159-11/14
LV5696P
Warning: Implementing LV5696P to the set board
The package of LV5696P is HZIP15J which has some metal exposures other than connection pins and heatsink as shown
in the diagram below. The electrical potentials of (2) and (3) are the same as those of pin15 and pin1, respectively.
(2) (= pin15) is the V
pin and (3) (= pin1) is the AUDIO (regulator) output pin. When you implement the IC to the set
CC
board, make sure that the bolts and the heatsink are out of touch from (2) and (3). If the metal exposures touch the bolts
which has the same electrical potential with GND, GND short occurs in AUDIO output and V . The exposures of (1)
CC
are connected to heatsink which has the same electrical potential with substrate of the IC chip (GND). Therefore, (1) and
GND electrical potential of the set board can contact each other.
HZIP15J outline
The same node w/ heatsink
(1)
The same node w/ pin15
(2)
The same node w/ heatsink
(1)
The same node w/ pin1
(3)
Heatsink
The same
w/ heatsink
(1)
Heatsink
: metal exposure
*the same applies to the
other side.
: metal exposure
<Top view of HZIP15J>
<Side view of HZIP15J>
Frame diagram (HZIP15J)
Metal exposure 1
Metal exposure 3
Metal exposure 2 Metal exposure 1
LV5696
Metal exposure 1
Metal exposure 1
1PIN
15PIN
(Front view)
No.A2159-12/14
LV5696P
HZIP15J Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b. Heat sink attachment
• Use flat-head screws to attach heat sinks.
• Use also washer to protect the package.
• Use tightening torques in the ranges 39-59Ncm (4-6kgcm) .
• If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
Binding head
machine screw
Countersunk head
mashine screw
• Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
Heat sink
• Take care a position of via hole .
gap
• Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
• Verify that there are no press burrs or screw-hole burrs on the heat sink.
• Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
• Twisting must be limited to under 0.05 mm.
• Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
Via hole
• The speed of these torque wrenches should never exceed 700 rpm,
and should typically be about 400 rpm.
c. Silicone grease
• Spread the silicone grease evenly when mounting heat sinks.
• Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC)
d. Mount
• First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
• When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e. When mounting the semiconductor device to the heat sink using jigs, etc.,
• Take care not to allow the device to ride onto the jig or positioning dowel.
• Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f. Heat sink screw holes
• Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
• When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
• When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
No.A2159-13/14
LV5696P
SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using
products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition
ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd.
products described or contained herein.
Regarding monolithic semiconductors, if you should intend to use this IC continuously under high temperature,
high current, high voltage, or drastic temperature change, even if it is used within the range of absolute
maximum ratings or operating conditions, there is a possibility of decrease reliability. Please contact us for a
confirmation.
SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all
semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or
malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise
to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt
safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not
limited to protective circuits and error prevention circuits for safe design, redundant design, and structural
design.
In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are
controlled under any of applicable local export control laws and regulations, such products may require the
export license from the authorities concerned in accordance with the above law.
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written consent of SANYO Semiconductor Co.,Ltd.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the
SANYO Semiconductor Co.,Ltd. product that you intend to use.
Upon using the technical information or products described herein, neither warranty nor license shall be granted
with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third
party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's
intellectual property rights which has resulted from the use of the technical information and products mentioned
above.
This catalog provides information as of December, 2012. Specifications and information herein are subject
to change without notice.
PS No.A2159-14/14
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