CB2012UA121 [SAMWHA]
Ultra Power Line Series; 超低电源线系列
| 型号： | CB2012UA121 |
| 厂家： | 
SAMWHA ELECTRIC |
| 描述： | Ultra Power Line Series |
| 文件： | 总8页 (文件大小：364K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DPS-081104
CHIP BEADS
Ultra Power Line Series
v Features
v Dimensions
B
(unit : mm)
• High Current characteristics
• Low Rdc characteristics
• Good reliability (Monolithic structure)
• Magnetically shielded
T
L
W
• Fast mounting speed
• RoHS compliant
Size
1005
1608
2012
3216
4516
4532
L
W
T
B
v Applications
1.0±0.10
1.6±0.15
2.0±0.20
3.2±0.20
4.5±0.25
4.5±0.25
0.5±0.10
0.8±0.15
1.25±0.2
1.6±0.20
1.6±0.20
3.2±0.25
0.5±0.10
0.8±0.15
0.85±0.2
1.1±0.20
1.3±0.20
1.5±0.25
0.25±0.1
0.3±0.2
0.5±0.3
0.5±0.3
0.5±0.3
0.5±0.3
• PDP/LCD Monitor, Digital TV/VCR etc.
v General Code
A
CB
2012
U
300
T
1
2
3
4
5
6
v Temperature Range
1
2
Series Code
CB : Chip Ferrite Beads
Dimension Code
• Operating Temp. -55 ~ +125℃
• Storage Temp. -10 ~ +40 ℃
The first two digits : length(mm)
The last two digits : width(mm)
3 Application Code
v Typical Material Characteristics
G : Signal Line
P : High Current Line
U : Ultra High Current Line
Material Code
High μ
(Low RXCP)
Low μ
(High RXCP)
4
A: General Frequency
K,J: Medium Frequency
M: High Frequency
V
V: Very High Frequency
Impedance Value Code
5
6
M
The first two digits represents significant
The last digit is the number of zeros following
ex) 300 = 30 (Ω)
J,K
A
Packaging Code
T : Reel paper packaging
E : Reel embossed tape packaging
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Ultra Power Line
v 1608~4532 SIZE
Impedance
DC Resistance
Rated Current
(mA) max.
Test Frequency
(MHz)
Samwha P/N
(Ω) ±25%
(Ω) max.
CB1608UA101
CB1608UK500
CB1608UK600
CB2012UA300
CB2012UA600
CB2012UA101
CB2012UA121
CB2012UK121
CB2012UJ121
CB2012UM121
CB3216UA121
CB3216UM600
CB3216UM121
CB4516UM600
CB4532UK121
CB4532UK401
100
50
0.030
0.025
0.030
0.010
0.015
0.020
0.030
0.030
0.030
0.030
0.020
0.010
0.200
0.010
0.030
0.045
4000
4000
4000
5000
5000
4000
4000
4000
4000
4000
6000
6000
6000
6000
6000
4000
60
30
60
100
120
120
120
120
120
60
100
120
60
120
400
※ Measuring Equipment
-. Z : HP4291B / E4991A
-. Rdc : HP4338B
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Ultra Power Line
v 1608~4532 SIZE
CB 1608 UK 500
CB 1608 UK 600
100
75
50
25
0
100
75
50
25
0
Z
Z
R
R
X
X
1
10
100
1000
1
10
100
1000
Frequency [MHz]
Frequency [MHz]
CB 2012 UA 300
CB 2012 UA 101
CB 2012 UK 121
200
150
100
50
60
45
30
15
0
120
90
60
30
0
Z
R
Z
Z
R
R
X
X
X
0
1
10
100
1000
1
10
100
1000
1
10
100
1000
Frequency [MHz]
Frequency [MHz]
Frequency [MHz]
CB 2012 UJ 121
CB 2012 UM 121
200
160
120
80
40
0
Z
Z
150
100
50
R
X
R
X
0
1
10
100
1000
1
10
100
1000
Frequency [MHz]
Frequency[MHz]
CB 4532 UK 121
CB 3216 UM 121
CB 3216 UA 121
180
135
90
280
160
120
80
Z
Z
Z
R
210
140
70
R
R
X
40
45
X
X
0
0
0
1
10
100
1000
1
10
100
1000
1
10
100
1000
Frequency [MHz]
Frequency [MHz]
Frequency[MHz]
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Reliability & Test Condition
Item
Operating
Requirements
Test Conditions
- 55 ℃ ~ + 125 ℃
-
temperature range
Storage
40 ℃ max., 70% RH max.
at packing condition
temperature range
Preheat temperature : 100 ~ 150 ℃
Preheat time : 60 sec.
More than 90% of the terminal electrode shall be
covered with new solder
Solderability
Solder temperature : 245 ± 5 ℃
Soldering time : 10 ± 1 sec.
1. No damage such as cracks should be
caused in chip element
Preheat temperature : 100 ~ 150 ℃
Preheat time : 60 sec.
2. More than 75% of the terminal electrode
shall be covered with new solder
3. Impedance shall not change
more than ±30 %
Resistance to
soldering heat
Solder temperature : 270 ± 10 ℃
Soldering time : 10 ± 0.5 sec.
More than 50% of the terminal electrode
shall be covered with new solder
Preheat temperature : 150 ℃
Preheat time : 60 sec.
1
ST ≥
CT
Solder temperature : 245 ± 5 ℃
Soldering time : 10 sec. max.
(Reflow soldering profile)
Reflow soldering
2
CT
ST
Temperature : 125 ± 3 ℃
Time : 500 ± 12 hours
High temperature
resistance
Measurement at room ambient
temperature after placing for 24 hours
Temperature : 125 ± 3 ℃
Applied current : rated current
Time : 1000 ± 12 hours
High temperature
load resistance
1. No mechanical damage
2. Impedance shall not change more than ±30 %
Measurement at room ambient
temperature after placing for 24 hours
Temperature : 40 ± 2 ℃
Humidity : 90 ± 2 % RH
Humidity
resistance
Time : 500 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Reliability & Test Condition
Item
Requirements
Test Conditions
Temperature : 40 ± 2 ℃
Humidity : 90 ± 2 % RH
Applied current : rated current
Time : 500 ± 12 hours
Humidity load
resistance
Measurement at room ambient
temperature after placing for 24 hours
Temperature : -55 ± 3 ℃
Low temperature
resistance
Time : 1000 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
1. No mechanical damage
2. Impedance shall not change more than ±30 %
1. -55 ± 3℃ for 30 minutes
2.125 ± 3 ℃ for 30 minutes
3. repeat 100 cycle
Thermal shock
Frequency : 10 ~ 55 Hz
Amplitude : 1.5 mm
Vibration
Drop
Direction : X, Y, Z
Sweep time : 2 hours for each axis
Drop 10 times on a concrete floor
from a height of 100 cm
W
No mechanical damage
1005
1608
2012
3216
4516
4532
ITEM
R0.5
A
0.7
1.0
1.0
1.3
1.5
1.5
(mm)
Flexure strength
C
B
0.5
0.7
0.7
0.8
1.3
2.0
1.0
1.3
4.0
1.5
3.0
5.0
3.6
3.0
5.0
3.6
3.8
5.0
(mm)
C
(mm)
A
B
A
W
(kgf)
20
50
W
R340
The terminal electrode shall be neither break off
nor the chip damage
Bending strength
2 mm
Resistance meter
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Packaging
v Standard Quantity
Size
1005
1608
2012
3216
4516
4532
Q’TY(PCS)
10,000
4,000
Remarks
4,000
0.85 T size
3,000
2,000
1,000
v Reel Dimension
(Unit:mm)
A
Φ178±2
D
B
Φ50 min.
E
C
Φ13±0.5
W
4±0.8
2±0.2
9±1.5
v Leader & Blank Portion
(Unit:mm)
Blank
Chips
Blank
Leader
350±50 mm
350±50 mm
150 min
60 Pitch
60 Pitch
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Packaging
v Taping Dimensions (Paper tape)
T
A
P
S
B
(Unit:mm)
A
±0.1
B
±0.1
P
S
T
Type
±0.1
±0.1
(Max.)
1005
1608
2012
1.15
1.80
2.30
0.65
1.00
1.55
2.0
4.0
4.0
1.0
2.0
2.0
0.8
1.1
1.1
v Taping Dimensions (Emboss tape)
(Unit:mm)
A
±0.1
B
C
D
±0.1
Type
±0.1
1.45
1.85
1.90
3.60
±0.1
1.50
1.25
1.35
1.40
2012
3216
4516
4532
2.25
3.50
4.90
4.85
0.23
0.23
0.30
0.30
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Soldering Profile
v Reflow Soldering
Pre - heating
Soldering
Cooling
245±5℃
230
180
150
10 sec. max.
30~60 sec.
60~120 sec.
60 sec. min.
v Flow Soldering
Pre - heating
Soldering
Cooling
250±5℃
250
180
150
10 sec. max.
60 sec. min.
60 sec. min.
v Manual Soldering
300
Tc
Soldering Iron : 30W max.
Diameter of soldering iron : 1.2 mm max.
2 sec. max.
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
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