HDLSP-035-2000 [SAMTEC]
Interconnection Device;
| 型号： | HDLSP-035-2000 |
| 厂家： | 
SAMTEC |
| 描述： | Interconnection Device 连接器 |
| 文件： | 总1页 (文件大小：1914K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
F-213
®
(0,635 mm) .025"
HDLSP SERIES
I/O SYSTEM
HDLSP–035–1000
HIGH DENSITY/HIGH SPEED CABLE SYSTEM
32 AWG low skew
pair cable
Mates with:
HDI6
SPECIFICATIONSi
Industry’s densest
For complete specifications and
recommended PCB layouts see
www.samtec.com?HDLSP
I/O cable system
Cable:
32 AWG low skew
pair cable
APPLICATION
Insulator Material:
LCP
For HT3.1 see
Terminal Material:
Phosphor Bronze
Jacket Material:
PVC
www.samtec.com/ht3
and specify part number
HDR-149112-XXXX.
Insulator:
Dielectric
Designed
for heavy
duty handling
Conductors:
Copper
Braid:
Tinned Copper
Covers:
Diecast Zinc Alloy
48 pairs in 28 mm x 14 mm
panel opening
12 pairs
per side
NO. OF
POSITIONS
LENGTH
TYPE
–035
(Per Row)
= 12 Pairs per side
–“XXXX”
= Length in millimeters
–1000, –2000
(Contact Samtec for
other lengths)
HDLSP
Low Skew Pair Cable
= High Density
(35,13) 1.383
A1
B1
(25,50) (22,85)
1.004
.900
B35
A35
(6,10)
.240
Supplied with
dust caps
(4,58)
.180
LENGTH
Note: Some lengths, styles
and options are non-standard,
non-returnable.
WWW.SAMTEC.COM
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