DPAF-23-03.0-S-3-2-A-K [SAMTEC]
Board Connector, 69 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, ROHS COMPLIANT;
| 型号： | DPAF-23-03.0-S-3-2-A-K |
| 厂家： | 
SAMTEC |
| 描述： | Board Connector, 69 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, ROHS COMPLIANT 连接器 |
| 文件： | 总1页 (文件大小：914K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
F-213
DPAM–23–07.0–S–8–2–A
DPAF–23–03.0–S–8–2–A
(2,16 mm) .085"
DPAM, DPAF SERIES
®
HIGH DENSITY DIFFERENTIAL PAIR ARRAY
DPAM Mates with:
PAIRS
PER ROW
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
DPAF
OPTION
DPAM
07.0
A
DPAF Mates with:
DPAM
–8
=Eight
Pair
SPECIFICATIONS
–2
–K
–S
–04, –06
–08, –15, –23
= Lead-Free
Tin Alloy
=(20,00 mm) 0.80"
DIA Polyimide
film Pick &
=30µ" (0,76 µm)
Gold on contact area,
Tin on solder tail
For complete specifications and
recommended PCB layouts see
www.samtec.com?DPAM or
www.samtec.com?DPAF
Rows
96.5% Sn/
3% Ag/.5% Cu
Solder Crimp
Place Pad
–3
=Three
Pair
Insulator Material:
Black LCP
–TR
NO OF
ROWS
Rows
Contact Material:
Copper Alloy
=Tape & Reel
Perimeter
Grounds (TYP)
A
G1
Plating:
(2,54)
.100
(24,59) .968
(11,89) .468
–8
–3
–GP
=Guide Post
(–23 only)
Au over 50µ" (1,27 µm) Ni
Current Rating (2x3):
2.9A per contact
@ 30°C Temperature Rise
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
10.4mΩ
A
(2,54)
.100
02 01 G2 03 04
Signal Pairs (TYP)
DPAM/DPAF
10 mm Stack Height
Rated @ 3dB Insertion Loss*
No. of positions x (2,16) .085 + (4,34) .171
Working Voltage:
300 VAC
®
Single-Ended Signaling
Differential Pair Signaling
*Performance data includes effects of a non-optimized PCB.
8 GHz / 16 Gbps
7 GHz / 14 Gbps
Mated Cycles:
100 Cycles
(6,66)
.262
(0,13)
.005
RoHS Compliant:
Yes
(1,27)
.050
DIA
(2,16) .085
Lead-Free Solderable:
Yes
Complete test data available at www.samtec.com?DPAM,
www.samtec.com?DPAF or contact sig@samtec.com
PATENT PENDING
(1,27)
.050
(1,08) .0425
No. of positions x (2,16) .085 + (2,95) .116
PAIRS
PER ROW
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
OPTION
DPAF
03.0
A
–8
Pair Rows
–K
=(20,00 mm)
0.80" DIA
Polyimide
film
Pick &
Place Pad
=Eight
–S
–2
=30µ" (0,76 µm)
Gold on contact area,
Tin on solder tail
= Lead-Free Tin Alloy
96.5% Sn/ 3%Ag/
.5% Cu
–04, –06, –08,
–15, –23
–3
Solder Crimp
=Three
Pair Rows
No. of positions x (2,16) .085 + (4,34) .171
Signal
Pairs
G1
–TR
=Tape
& Reel
USABLE PAIRS
SIZE
NO OF
ROWS
(TYP)
ALSO
AVAILABLE
Tin-Lead Solder Charge.
Call Samtec.
A
PER ARRAY*
6 Pairs
–04 x –3
–06 x –3
–04 x –8
–06 x –8
–08 x –8
–15 x –8
–23 x –8
–08 x –3
–15 x –3
–23 x –3
A
(23,32)
.918
(10,62)
.418
04
–8
–3
12 Pairs
16 Pairs
32 Pairs
48 Pairs
(2,54)
.100
02
01
(1,52)
.060
G2
03
(1,27) .050
Perimeter Grounds (TYP)
Solder crimped on tail
DPAF
DPAM
104 Pairs
168 Pairs
18 Pairs
39 Pairs
63 Pairs
MATED
LEAD
HEIGHT*
(6,45)
.254
(0,13)
.005
Note: Other Gold plating
options available.
Contact Samtec.
STYLE
–03.0
10 mm
–07.0
(2,16) .085
(1,08) .0425
(1,27)
.050
DIA
*Processing
conditions will
affect mated height.
(1,27)
.050
Note: Some sizes, styles and
options are non-standard,
non-returnable.
*Assumes first and last pair in
each row are grounded
No. of positions x (2,16) .085 + (2,95) .116
WWW.SAMTEC.COM
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