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CIB21J260 [SAMSUNG]

MULTILAYER CHIP COMPONENTS; 多层片式元器件

CIB21J260


型号：	CIB21J260
厂家：	SAMSUNG
描述：	MULTILAYER CHIP COMPONENTS 多层片式元器件
文件：	总31页 (文件大小：4869K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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