K4Y50164UC-JC [SAMSUNG]

XDRTM DRAM Product Guide; XDRTM DRAM产品指南
K4Y50164UC-JC
型号: K4Y50164UC-JC
厂家: SAMSUNG    SAMSUNG
描述:

XDRTM DRAM Product Guide
XDRTM DRAM产品指南

动态存储器
文件: 总3页 (文件大小:36K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
General Information  
XDRTM DRAM  
XDRTM DRAM Product Guide  
Revision 0.5  
Mar. 2006  
Change History  
Revision 0.1 (August 03)  
- First Copy  
Revision 0.2 (Dec 04)  
- Add C-die, D-bin  
Revision 0.3 (Mar 05)  
- Add 512Mb XDR DRAM  
Revision 0.4 (Dec 05)  
- Delete code 17 in organization  
Revision 0.5 (Mar. 06)  
- Add E-die  
XDR is a trade mark of Rambus Inc.  
General Information  
XDRTM DRAM  
A. XDR DRAM Ordering Information  
1
2
3
4
5
6
7
8
9
10  
11  
K 4 Y X X X X X X X - X X X X  
Speed  
SAMSUNG Memory  
DRAM  
Temperature & Power  
Package Type  
Revision  
Product  
Density & Refresh  
Organization  
Interface (VDD)  
Bank  
1. SAMSUNG Memory : K  
2. DRAM : 4  
8. Revision  
M : 1st Gen.  
C : 4th Gen.  
E : 6th Gen.  
F : 7th Gen.  
3. Product  
Y : XDR DRAM  
9. Package Type  
J
: BOC lead free  
4. Density & Refresh  
54 : 256M, 16K/16ms(0.98us)  
50 : 512M, 32K/16ms(0.49us)  
10. Temperature & Power  
5. Organization  
C : Commercial, Normal Power  
02 : x2  
04 : x4  
08 : x8  
16 : x16  
11. Speed (Data frequency, tRAC, tRC  
)
DS : for Daisy chain Sample  
A2 : 2.4Gbps, 36ns, 16cycles  
6. Bank  
B3 : 3.2Gbps, 35ns, 20cycles  
C3 : 3.2Gbps, 35ns, 24cycles  
4 : 8 Banks  
C4 : 4.0Gbps, 28ns , 24cycles  
7. Interface ( VDD, VDDQ)  
U : DRSL(1.8V,1.2V )  
General Information  
XDRTM DRAM  
B. XDR DRAM Component Product Guide  
Speed*2  
Density  
Banks  
Part Number  
Org.  
Power(V) Refresh Package Type Availability  
K4Y54044UF-J*1C  
K4Y54084UF-JC  
K4Y54164UF-JC  
K4Y50024UC-JC  
K4Y50044UC-JC  
K4Y50084UC-JC  
K4Y50164UC-JC  
K4Y50024UE-JC  
K4Y50044UE-JC  
K4Y50084UE-JC  
K4Y50164UE-JC  
64Mx4  
32Mx8  
A2/  
B3/  
C4  
256Mb(F-die) 8 Banks  
512Mb(C-die) 8 Banks  
1.8V± 0.09 16K/16ms 104ball BOC  
1.8V± 0.09 32K/16ms 104ball BOC  
EOL  
Now  
16Mx16  
256Mx2  
128Mx4  
64Mx8  
A2/  
B3/  
C4  
32Mx16  
256Mx2  
128Mx4  
64Mx8  
A2/  
B3/  
C4  
512Mb(E-die) 8 Banks  
1.8V± 0.09 32K/16ms 100ball BOC  
Q4’06  
32Mx16  
*1 Package Type  
*2 Speed ( tRAC & Freq.)  
Code  
Code  
Description  
BOC lead free  
Description  
(Data frequency. tRAC, tRC  
)
J
C4  
B3  
C3  
A2  
4000Mbps, -28, 24clks  
3200Mbps, -35, 20clks  
3200Mbps, -35, 24clks  
2400Mbps, -36, 16clks  

相关型号:

K4Y50164UC-JCA2

512Mbit XDR TM DRAM(C-die)
SAMSUNG

K4Y50164UC-JCB3

512Mbit XDR TM DRAM(C-die)
SAMSUNG

K4Y50164UC-JCB3T

Rambus DRAM, 32MX16, 35ns, CMOS, PBGA104, ROHS COMPLIANT, FBGA-104
SAMSUNG

K4Y50164UC-JCC4

512Mbit XDR TM DRAM(C-die)
SAMSUNG

K4Y50164UE-JC

XDRTM DRAM Product Guide
SAMSUNG

K4Y50164UE-JCA2

Rambus DRAM, 32MX16, 36ns, CMOS, PBGA100
SAMSUNG

K4Y50164UE-JCA20

Rambus DRAM, 32MX16, 36ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100
SAMSUNG

K4Y50164UE-JCA2T

Rambus DRAM, 32MX16, 36ns, CMOS, PBGA100
SAMSUNG

K4Y50164UE-JCB3

Rambus DRAM, 32MX16, 35ns, CMOS, PBGA100
SAMSUNG

K4Y50164UE-JCB3T

Rambus DRAM, 32MX16, 35ns, CMOS, PBGA100
SAMSUNG

K4Y50164UE-JCC4

Rambus DRAM, 32MX16, 28ns, CMOS, PBGA100
SAMSUNG

K4Y50164UE-JCC40

Rambus DRAM, 32MX16, 28ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100
SAMSUNG