K4F170811D-FL60 [SAMSUNG]

Fast Page DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, TSOP2-28;
K4F170811D-FL60
型号: K4F170811D-FL60
厂家: SAMSUNG    SAMSUNG
描述:

Fast Page DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, TSOP2-28

动态存储器 光电二极管 内存集成电路
文件: 总20页 (文件大小:226K)
中文:  中文翻译
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K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
2M x 8Bit CMOS Dynamic RAM with Fast Page Mode  
DESCRIPTION  
This is a family of 2,097,152 x 8 bit Fast Page Mode CMOS DRAMs. Fast Page Mode offers high speed random access of memory cells  
within the same row. Power supply voltage (+5.0V or +3.3V), refresh cycle (2K Ref. or 4K Ref.), access time (-50 or -60), power con-  
sumption(Normal or Low power) and package type(SOJ or TSOP-II) are optional features of this family. All of this family have CAS-  
before-RAS refresh, RAS-only refresh and Hidden refresh capabilities. Furthermore, Self-refresh operation is available in L-version.  
This 2Mx8 Fast Page Mode DRAM family is fabricated using Samsung¢s advanced CMOS process to realize high band-width, low power  
consumption and high reliability. It may be used as graphic memory unit for microcomputer, personal computer and portable machines.  
FEATURES  
• Fast Page Mode operation  
• Part Identification  
• CAS-before-RAS refresh capability  
• RAS-only and Hidden refresh capability  
• Self-refresh capability (L-ver only)  
- K4F170811D-B(F) (5V, 4K Ref.)  
- K4F160811D-B(F) (5V, 2K Ref.)  
- K4F170812D-B(F) (3.3V, 4K Ref.)  
- K4F160812D-B(F) (3.3V, 2K Ref.)  
• Fast parallel test mode capability  
• TTL(5V)/LVTTL(3.3V) compatible inputs and outputs  
• Early Write or output enable controlled write  
• JEDEC Standard pinout  
Active Power Dissipation  
• Available in Plastic SOJ and TSOP(II) packages  
• Single +5V±10% power supply (5V product)  
• Single +3.3V±0.3V power supply (3.3V product)  
Unit : mW  
5V  
3.3V  
Speed  
4K  
324  
288  
2K  
4K  
2K  
-50  
-60  
396  
360  
495  
440  
605  
550  
FUNCTIONAL BLOCK DIAGRAM  
Refresh Cycles  
Part  
NO.  
Refresh Refresh period  
cycle  
RAS  
CAS  
W
VCC  
Vcc  
Vss  
Control  
Clocks  
Normal  
64ms  
L-ver  
VBB Generator  
K4F170811D  
5V  
4K  
2K  
Data in  
K4F170812D 3.3V  
K4F160811D 5V  
128ms  
Buffer  
Row Decoder  
Refresh Timer  
Refresh Control  
Refresh Counter  
32ms  
K4F160812D 3.3V  
DQ0  
to  
DQ7  
Memory Array  
2,097,152 x 8  
Cells  
Performance Range  
A0-A11  
(A0 - A10)*1  
A0 - A8  
Row Address Buffer  
Col. Address Buffer  
Speed  
-50  
Remark  
tRAC  
50ns  
60ns  
tCAC  
tRC  
90ns  
tPC  
Data out  
Buffer  
13ns  
35ns 5V/3.3V  
Column Decoder  
OE  
(A0 - A9)*1  
-60  
15ns 110ns 40ns 5V/3.3V  
Note) *1 : 2K Refresh  
SAMSUNG ELECTRONICS CO., LTD. reserves the right to  
change products and specifications without notice.  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
PIN CONFIGURATION (Top Views)  
• K4F17(6)0811(2)D-F  
• K4F17(6)0811(2)D-B  
VCC  
DQ0  
DQ1  
DQ2  
DQ3  
W
1
2
3
4
5
6
7
8
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
VSS  
VCC  
DQ0  
DQ1  
DQ2  
DQ3  
1
2
3
4
5
6
7
8
9
28 VSS  
27 DQ7  
26 DQ6  
25 DQ5  
24 DQ4  
23 CAS  
22 OE  
21 A9  
20 A8  
19 A7  
18 A6  
17 A5  
DQ7  
DQ6  
DQ5  
DQ4  
CAS  
OE  
A9  
A8  
A7  
A6  
W
RAS  
RAS  
*A11(N.C)  
A10  
*A11(N.C)  
A10  
9
A0  
A1  
A2  
A3  
10  
11  
12  
13  
14  
A0 10  
A1 11  
A2 12  
A3 13  
VCC 14  
A5  
A4  
VSS  
16 A4  
15 VSS  
VCC  
*A11 is N.C for K160811(2)D(5V/3.3V, 2K Ref. product)  
B : 300mil 28 SOJ  
F : 300mil 28 TSOP II  
Pin Name  
A0 - A11  
A0 - A10  
DQ0 - 7  
VSS  
Pin Function  
Address Inputs (4K Product)  
Address Inputs (2K Product)  
Data In/Out  
Ground  
RAS  
Row Address Strobe  
Column Address Strobe  
Read/Write Input  
CAS  
W
OE  
Data Output Enable  
Power(+5V)  
VCC  
N.C  
Power(+3.3V)  
No Connection (2K Ref. product)  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
ABSOLUTE MAXIMUM RATINGS  
Rating  
Parameter  
Symbol  
Units  
3.3V  
-0.5 to +4.6  
-0.5 to +4.6  
-55 to +150  
1
5V  
Voltage on any pin relative to VSS  
Voltage on VCC supply relative to VSS  
Storage Temperature  
VIN,VOUT  
VCC  
-1.0 to +7.0  
-1.0 to +7.0  
-55 to +150  
1
V
V
Tstg  
°C  
W
Power Dissipation  
PD  
Short Circuit Output Current  
IOS Address  
50  
50  
mA  
* Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted  
to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for  
extended periods may affect device reliability.  
RECOMMENDED OPERATING CONDITIONS (Voltage referenced to Vss, TA= 0 to 70°C)  
3.3V  
5V  
Typ  
5.0  
0
Parameter  
Symbol  
Units  
Min  
3.0  
0
Typ  
Max  
3.6  
0
Min  
4.5  
0
Max  
5.5  
0
Supply Voltage  
VCC  
VSS  
VIH  
VIL  
3.3  
V
V
V
V
Ground  
0
-
*1  
*1  
Input High Voltage  
Input Low Voltage  
2.0  
2.4  
-
VCC+0.3  
0.8  
VCC+1.0  
0.8  
*2  
*2  
-
-
-0.3  
-1.0  
*1 : VCC+1.3V/15ns(3.3V), VCC+2.0V/20ns(5V), Pulse width is measured at VCC  
*2 : -1.3V/15ns(3.3V), -2.0V/20ns(5V), Pulse width is measured at VSS  
DC AND OPERATING CHARACTERISTICS (Recommended operating conditions unless otherwise noted.)  
Max  
Parameter  
Symbol  
Min  
Max  
Units  
Input Leakage Current (Any input 0£VIN£VIN+0.3V,  
all other input pins not under test=0 Volt)  
II(L)  
-5  
5
uA  
Output Leakage Current  
(Data out is disabled, 0V£VOUT£VCC)  
IO(L)  
-5  
5
uA  
3.3V  
Output High Voltage Level(IOH=-2mA)  
Output Low Voltage Level(IOL=2mA)  
VOH  
VOL  
2.4  
-
-
V
V
0.4  
Input Leakage Current (Any input 0£VIN£VIN+0.5V,  
all other input pins not under test=0 Volt)  
II(L)  
-5  
-5  
5
5
uA  
uA  
Output Leakage Current  
(Data out is disabled, 0V£VOUT£VCC)  
IO(L)  
5V  
Output High Voltage Level(IOH=-5mA)  
Output Low Voltage Level(IOL=4.2mA)  
VOH  
VOL  
2.4  
-
-
V
V
0.4  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
DC AND OPERATING CHARACTERISTICS (Continued)  
Max  
Symbol  
Power  
Speed  
Units  
K4F170812D  
K4F160812D  
K4F170811D  
K4F160811D  
-50  
-60  
90  
80  
110  
100  
90  
80  
110  
100  
mA  
mA  
ICC1  
ICC2  
ICC3  
ICC4  
ICC5  
ICC6  
Don¢t care  
Normal  
L
1
1
1
1
2
1
2
1
mA  
mA  
Don¢t care  
-50  
-60  
90  
80  
110  
100  
90  
80  
110  
100  
mA  
mA  
Don¢t care  
Don¢t care  
-50  
-60  
80  
70  
90  
80  
80  
70  
90  
80  
mA  
mA  
Normal  
L
0.5  
200  
0.5  
200  
1
250  
1
250  
mA  
uA  
Don¢t care  
-50  
-60  
90  
80  
110  
100  
90  
80  
110  
100  
mA  
mA  
Don¢t care  
ICC7  
ICCS  
L
L
Don¢t care  
Don¢t care  
250  
200  
250  
200  
300  
250  
300  
250  
uA  
uA  
ICC1* : Operating Current (RAS and CAS cycling @tRC=min.)  
ICC2 : Standby Current (RAS=CAS=W=VIH)  
ICC3* : RAS-only Refresh Current (CAS=VIH, RAS cycling @tRC=min.)  
ICC4* : Fast Page Mode Current (RAS=VIL, CAS, Address cycling @tPC=min.)  
ICC5 : Standby Current (RAS=CAS=W=VCC-0.2V)  
ICC6* : CAS-Before-RAS Refresh Current (RAS and CAS cycling @tRC=min.)  
ICC7 : Battery back-up current, Average power supply current, Battery back-up mode  
Input high voltage(VIH)=VCC-0.2V, Input low voltage(VIL)=0.2V, CAS=0.2V,  
DQ=Don¢t care, TRC=31.25us(4K/L-ver), 62.5us(2K/L-ver),  
TRAS=TRASmin~300ns  
ICCS : Self Refresh Current  
RAS=CAS=VIL, W=OE=A0 ~ A11=VCC-0.2V or 0.2V,  
DQ0 ~ DQ7=VCC-0.2V, 0.2V or Open  
*Note :  
ICC1, ICC3, ICC4 and ICC6 are dependent on output loading and cycle rates. Specified values are obtained with the output open.  
ICC is specified as an average current. In ICC1, ICC3 and ICC6 address can be changed maximum once while RAS=VIL. In ICC4,  
address can be changed maximum once within one fast page mode cycle time, tPC.  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
CAPACITANCE (TA=25°C, VCC=5V or 3.3V, f=1MHz)  
Parameter  
Input capacitance [A0 ~ A11]  
Symbol  
Min  
Max  
Units  
pF  
CIN1  
CIN2  
CDQ  
-
-
-
5
7
7
Input capacitance [RAS, CAS, W, OE]  
Output capacitance [DQ0 - DQ7]  
pF  
pF  
AC CHARACTERISTICS (0°C£TA£70°C, See note 1,2)  
Test condition (5V device) : VCC=5.0V±10%, Vih/Vil=2.4/0.8V, Voh/Vol=2.4/0.4V  
Test condition (3.3V device) : VCC=3.3V±0.3V, Vih/Vil=2.0/0.8V, Voh/Vol=2.0/0.8V  
-50  
-60  
Parameter  
Symbol  
Units  
Notes  
Min  
90  
Max  
Min  
110  
155  
Max  
Random read or write cycle time  
Read-modify-write cycle time  
Access time from RAS  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tRC  
133  
tRWC  
tRAC  
tCAC  
tAA  
50  
13  
25  
60  
15  
30  
3,4,10  
3,4,5  
3,10  
3
Access time from CAS  
Access time from column address  
CAS to output in Low-Z  
0
0
0
0
tCLZ  
tOFF  
tT  
Output buffer turn-off delay  
Transition time (rise and fall)  
RAS precharge time  
13  
50  
15  
50  
6
3
3
2
30  
50  
13  
50  
13  
20  
15  
5
40  
60  
15  
60  
15  
20  
15  
5
tRP  
RAS pulse width  
10K  
10K  
tRAS  
tRSH  
tCSH  
tCAS  
tRCD  
tRAD  
tCRP  
tASR  
tRAH  
tASC  
tCAH  
tRAL  
tRCS  
tRCH  
tRRH  
tWCH  
tWP  
RAS hold time  
CAS hold time  
CAS pulse width  
10K  
37  
10K  
45  
RAS to CAS delay time  
4
RAS to column address delay time  
CAS to RAS precharge time  
Row address set-up time  
Row address hold time  
25  
30  
10  
0
0
10  
0
10  
0
Column address set-up time  
Column address hold time  
Column address to RAS lead time  
Read command set-up time  
Read command hold time referenced to CAS  
Read command hold time referenced to RAS  
Write command hold time  
Write command pulse width  
Write command to RAS lead time  
Write command to CAS lead time  
10  
25  
0
10  
30  
0
0
0
8
8
0
0
10  
10  
13  
13  
10  
10  
15  
15  
tRWL  
tCWL  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
AC CHARACTERISTICS (Continued)  
-50  
-60  
Parameter  
Symbol  
Units  
Note  
Min  
0
Max  
Min  
0
Max  
Data set-up time  
Data hold time  
ns  
9
9
tDS  
10  
10  
ns  
ms  
ms  
ms  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
us  
ns  
ns  
tDH  
Refresh period (2K, Normal)  
32  
64  
32  
64  
tREF  
tREF  
tREF  
tWCS  
tCWD  
tRWD  
tAWD  
tCPWD  
tCSR  
tCHR  
tRPC  
tCPA  
tPC  
Refresh period (4K, Normal)  
Refresh period (L-ver)  
128  
128  
Write command set-up time  
0
0
7
7
7
7
CAS to W delay time  
36  
73  
48  
53  
5
40  
85  
55  
60  
5
RAS to W delay time  
Column address to W delay time  
CAS precharge to W delay time  
CAS set-up time (CAS -before-RAS refresh)  
CAS hold time (CAS -before-RAS refresh)  
RAS to CAS precharge time  
10  
5
10  
5
Access time from CAS precharge  
Fast Page cycle time  
30  
35  
3
35  
76  
10  
50  
30  
40  
85  
10  
60  
35  
Fast Page read-modify-write cycle time  
CAS precharge time (Fast Page cycle)  
RAS pulse width (Fast Page cycle)  
RAS hold time from CAS precharge  
OE access time  
tPRWC  
tCP  
200K  
13  
200K  
15  
tRASP  
tRHCP  
tOEA  
tOED  
tOEZ  
tOEH  
tWTS  
tWTH  
tWRP  
tWRH  
tRASS  
tRPS  
tCHS  
OE to data delay  
13  
0
15  
0
Output buffer turn off delay time from OE  
OE command hold time  
13  
15  
6
13  
10  
10  
10  
10  
100  
90  
-50  
15  
Write command set-up time (Test mode in)  
Write command hold time (Test mode in)  
W to RAS precharge time(C-B-R refresh)  
W to RAS hold time(C-B-R refresh)  
RAS pulse width (C-B-R self refresh)  
RAS precharge time (C-B-R self refresh)  
CAS hold time (C-B-R self refresh)  
10  
11  
11  
10  
10  
10  
100  
110  
-50  
13,14,15  
13,14,15  
13,14,15  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
TEST MODE CYCLE  
( Note 11 )  
-50  
-60  
Parameter  
Symbol  
Units  
Notes  
Min  
95  
Max  
Min  
115  
160  
Max  
Random read or write cycle time  
ns  
tRC  
Read-modify-write cycle time  
Access time from RAS  
Access time from CAS  
Access time from column address  
RAS pulse width  
138  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tRWC  
tRAC  
tCAC  
tAA  
55  
18  
65  
20  
3,4,10,12  
3,4,5,12  
3,10,12  
30  
35  
55  
18  
18  
55  
30  
41  
78  
53  
58  
40  
81  
55  
10K  
10K  
65  
20  
20  
65  
35  
45  
90  
60  
65  
45  
90  
65  
10K  
10K  
tRAS  
tCAS  
tRSH  
tCSH  
tRAL  
CAS pulse width  
RAS hold time  
CAS hold time  
Column address to RAS lead time  
CAS to W delay time  
7
7
7
tCWD  
tRWD  
tAWD  
tCPWD  
tPC  
RAS to W delay time  
Column address to W delay time  
CAS precharge to W delay time  
Fast Page cycle time  
Fast Page read-modify-write cycle time  
RAS pulse width (Fast Page cycle)  
Access time from CAS precharge  
OE access time  
tPRWC  
tRASP  
tCPA  
tOEA  
tOED  
tOEH  
200K  
35  
200K  
40  
3
18  
20  
OE to data delay  
18  
18  
20  
20  
OE command hold time  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
NOTES  
1. An initial pause of 200us is required after power-up followed by any 8 RAS-only refresh or CAS-before-RAS refresh cycles  
before proper device operation is achieved.  
VIH(min) and VIL(max) are reference levels for measuring timing of input signals. Transition times are measured between  
VIH(min) and VIL(max) and are assumed to be 5ns for all inputs.  
2.  
Measured with a load equivalent to 2 TTL(5V)/1 TTL(3.3V) loads and 100pF.  
3.  
4.  
Operation within the tRCD(max) limit insures that tRAC(max) can be met. tRCD(max) is specified as a reference point only.  
If tRCD is greater than the specified tRCD(max) limit, then access time is controlled exclusively by tCAC.  
Assumes that tRCD³ tRCD(max).  
5.  
6.  
tOFF(min)and tOEZ(max) define the time at which the output achieves the open circuit condition and are not referenced Voh or  
Vol.  
tWCS, tRWD, tCWD and tAWD are non restrictive operating parameters. They are included in the data sheet as electrical charac-  
teristics only. If tWCS³ tWCS(min), the cycle is an early write cycle and the data output will remain high impedance for the dura-  
tion of the cycle. If tCWD³ tCWD(min), tRWD³ tRWD(min) and tAWD³ tAWD(min), then the cycle is a read-modify-write cycle and the  
data output will contain the data read from the selected address. If neither of the above conditions is satisfied, the condition  
of the data out is indeterminate.  
7.  
Either tRCH or tRRH must be satisfied for a read cycle.  
8.  
9.  
These parameters are referenced to CAS falling edge in early write cycles and to W falling edge in read-modify-write cycles.  
Operation within the tRAD(max) limit insures that tRAC(max) can be met. tRAD(max) is specified as a reference point only.  
If tRAD is greater than the specified tRAD(max) limit, then access time is controlled by tAA.  
These specifications are applied in the test mode.  
10.  
11.  
12.  
In test mode read cycle, the value of tRAC, tAA, tCAC is delayed by 2ns to 5ns for the specified values. These parameters  
should be specified in test mode cycles by adding the above value to the specified value in this data sheet.  
If tRASS³ 100us, then RAS precharge time must use tRPS instead of tRP.  
13.  
14. For RAS-only refresh and burst CAS-before-RAS refresh mode, 4096(4K)/2048(2K) cycles of burst refresh must be exe-  
cuted within 64ms/32ms before and after self refresh, in order to meet refresh specification.  
15.  
For distributed CAS-before-RAS with 15.6us interval CAS-before-RAS refresh should be executed with in 15.6us immedi-  
ately before and after self refresh in order to meet refresh specification.  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
READ CYCLE  
tRC  
tRAS  
tRP  
VIH -  
RAS  
VIL -  
tCSH  
tCRP  
tCRP  
tRCD  
tRSH  
tCAS  
VIH -  
CAS  
VIL -  
tRAD  
tRAL  
tASR  
tRAH  
tASC  
tRCS  
tCAH  
VIH -  
VIL -  
COLUMN  
ADDRESS  
ROW  
ADDRESS  
A
W
tRCH  
tRRH  
VIH -  
VIL -  
tOFF  
tOEZ  
tAA  
VIH -  
VIL -  
tOEA  
OE  
tCAC  
tCLZ  
DQ0 ~ DQ3(7)  
VOH -  
VOL -  
tRAC  
DATA-OUT  
OPEN  
Don¢t care  
Undefined  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
WRITE CYCLE ( EARLY WRITE )  
NOTE : DOUT = OPEN  
tRC  
tRAS  
tRP  
VIH -  
RAS  
VIL -  
tCSH  
tCRP  
tCRP  
tRCD  
tRSH  
tCAS  
VIH -  
CAS  
VIL -  
tRAD  
tRAL  
tASR  
tRAH  
tASC  
tCAH  
VIH -  
VIL -  
ROW  
ADDRESS  
COLUMN  
ADDRESS  
A
tCWL  
tRWL  
tWCS  
tWCH  
tWP  
VIH -  
VIL -  
W
VIH -  
VIL -  
OE  
DQ0 ~ DQ3(7)  
VIH -  
tDS  
tDH  
DATA-IN  
VIL -  
Don¢t care  
Undefined  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
WRITE CYCLE ( OE CONTROLLED WRITE )  
NOTE : DOUT = OPEN  
tRC  
tRP  
tRAS  
VIH -  
RAS  
VIL -  
tCSH  
tCRP  
tCRP  
tRCD  
tRSH  
tCAS  
VIH -  
VIL -  
CAS  
tRAD  
tRAL  
tASR  
tRAH  
tASC  
tCAH  
COLUMN  
ADDRESS  
VIH -  
VIL -  
ROW  
ADDRESS  
A
W
tCWL  
tRWL  
VIH -  
VIL -  
tWP  
VIH -  
VIL -  
OE  
tOED  
tOEH  
tDS  
DQ0 ~ DQ3(7)  
VIH -  
tDH  
DATA-IN  
VIL -  
Don¢t care  
Undefined  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
READ - MODIFY - WRTIE CYCLE  
tRWC  
tRP  
tRAS  
VIH -  
RAS  
VIL -  
tCRP  
tRCD  
tRSH  
tCAS  
VIH -  
CAS  
VIL -  
tRAD  
tRAH  
tASR  
tASC  
tCAH  
tCSH  
VIH -  
VIL -  
ROW  
ADDR  
COLUMN  
ADDRESS  
A
tRWL  
tCWL  
tAWD  
tCWD  
VIH -  
VIL -  
tWP  
W
tRWD  
tOEA  
VIH -  
VIL -  
OE  
tCLZ  
tCAC  
tOED  
tAA  
tDS  
tDH  
DQ0 ~ DQ3(7)  
VI/OH -  
tOEZ  
tRAC  
VALID  
DATA-OUT  
VALID  
DATA-IN  
VI/OL -  
Don¢t care  
Undefined  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
FAST PAGE READ CYCLE  
tRP  
tRASP  
¡ó  
VIH -  
RAS  
VIL -  
tRHCP  
tPC  
tCRP  
tRCD  
tCP  
tCP  
tRSH  
tCAS  
tCAS  
¡ó  
VIH -  
CAS  
tCAS  
VIL -  
tRAD  
tASC  
tCSH  
tASR  
ROW  
tASC  
tCAH  
tASC  
tCAH  
tRAH  
tCAH  
tRCH  
¡ó  
¡ó  
VIH -  
VIL -  
COLUMN  
COLUMN  
ADDRESS  
COLUMN  
A
W
ADDRESS  
ADDR  
ADDRESS  
tRCS  
tRAL  
tRCS  
tRRH  
tRCS  
tRCH  
¡ó  
VIH -  
VIL -  
tCAC  
tOEA  
tCAC  
tOEA  
tCAC  
tOEA  
¡ó  
¡ó  
VIH -  
VIL -  
OE  
tAA  
tOFF  
tAA  
tOFF  
tCLZ  
tAA  
tOFF  
tOEZ  
tRAC  
tCLZ  
tCLZ  
DQ0 ~ DQ3(7)  
VOH -  
VOL -  
tOEZ  
VALID  
tOEZ  
VALID  
VALID  
DATA-OUT  
DATA-OUT  
DATA-OUT  
Don¢t care  
Undefined  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
FAST PAGE WRITE CYCLE ( EARLY WRITE )  
NOTE : DOUT = OPEN  
tRP  
tRASP  
¡ó  
VIH -  
RAS  
VIL -  
tRHCP  
tPC  
tPC  
tCRP  
tCP  
tRCD  
tCP  
tRSH  
tCAS  
tCAS  
¡ó  
VIH -  
VIL -  
tCAS  
CAS  
tRAD  
tASC  
tRAH  
ROW  
tRAL  
tCAH  
tCStHCAH  
tASC  
tCAH  
tASC  
tASR  
¡ó  
¡ó  
VIH -  
VIL -  
COLUMN  
ADDRESS  
COLUMN  
ADDRESS  
COLUMN  
ADDRESS  
A
ADDR  
tWCS  
tWCS  
tWCH  
tWP  
tWCS  
tWCH  
¡ó  
tWCH  
VIH -  
VIL -  
tWP  
tWP  
W
tCWL  
tCWL  
tRWL  
tCWL  
¡ó  
VIH -  
VIL -  
OE  
¡ó  
tDS  
tDH  
tDS  
tDH  
tDS  
tDH  
DQ0 ~ DQ3(7)  
VIH -  
VIL -  
¡ó  
¡ó  
VALID  
DATA-IN  
VALID  
DATA-IN  
VALID  
DATA-IN  
Don¢t care  
Undefined  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
FAST PAGE READ - MODIFY - WRITE CYCLE  
tRP  
tRASP  
tCP  
VIH -  
VIL -  
tCSH  
RAS  
CAS  
tRSH  
tCAS  
tPRWC  
tRCD  
tRAD  
tCRP  
VIH -  
VIL -  
tCAS  
tRAH  
tRAL  
tCAH  
tASR  
ROW  
tCAH  
tASC  
tASC  
VIH -  
VIL -  
COL.  
ADDR  
COL.  
ADDR  
A
ADDR  
tRWL  
tWP  
tRCS  
tCWL  
tCWL  
VIH -  
VIL -  
tWP  
W
tCWD  
tAWD  
tRWD  
tCWD  
tAWD  
tCPWD  
tOEA  
VIH -  
VIL -  
tOEA  
OE  
tOED  
tCAC  
tOED  
tCAC  
tDH  
tDH  
tAA  
tAA  
tDS  
tOEZ  
tDS  
DQ0 ~ DQ3(7)  
tOEZ  
tRAC  
VI/OH -  
VI/OL -  
tCLZ  
tCLZ  
VALID  
VALID  
DATA-IN  
VALID  
VALID  
DATA-OUT  
DATA-IN  
DATA-OUT  
Don¢t care  
Undefined  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
RAS - ONLY REFRESH CYCLE  
NOTE : W, OE, DIN = Don¢t care  
DOUT = OPEN  
tRC  
tRP  
tRAS  
VIH -  
RAS  
VIL -  
tRPC  
tCRP  
tCRP  
VIH -  
CAS  
VIL -  
tASR  
tRAH  
VIH -  
VIL -  
ROW  
ADDR  
A
CAS - BEFORE - RAS REFRESH CYCLE  
NOTE : OE, A = Don¢t care  
tRC  
tRP  
tRAS  
tRP  
VIH -  
RAS  
tRPC  
tCP  
VIL -  
tRPC  
VIH -  
VIL -  
tCSR  
tWRP  
CAS  
W
tCHR  
tWRH  
VIH -  
VIL -  
tOFF  
DQ0 ~ DQ3(7)  
VOH -  
VOL -  
OPEN  
Don¢t care  
Undefined  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
HIDDEN REFRESH CYCLE ( READ )  
tRC  
tRC  
tRP  
tRP  
tRAS  
tRAS  
VIH -  
RAS  
VIL -  
tCRP  
tRCD  
tRSH  
tCHR  
VIH -  
VIL -  
CAS  
tRAD  
tASR  
tRAH  
tASC  
tRCS  
tCAH  
COLUMN  
VIH -  
VIL -  
ROW  
ADDRESS  
A
ADDRESS  
tWRH  
tRAL  
VIH -  
VIL -  
W
tAA  
VIH -  
VIL -  
OE  
tOEA  
tOFF  
tCAC  
tCLZ  
DQ0 ~ DQ3(7)  
VOH -  
VOL -  
tRAC  
tOEZ  
DATA-OUT  
OPEN  
Don¢t care  
Undefined  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
HIDDEN REFRESH CYCLE ( WRITE )  
NOTE : DOUT = OPEN  
tRC  
tRC  
tRP  
tRP  
tRAS  
tRAS  
VIH -  
RAS  
VIL -  
tCRP  
tRCD  
tRSH  
tCHR  
VIH -  
CAS  
VIL -  
tRAD  
tASR  
tRAH  
tASC  
tCAH  
VIH -  
VIL -  
COLUMN  
ADDRESS  
ROW  
ADDRESS  
A
tWRH  
tWRP  
tRAL  
tWCS  
tWCH  
VIH -  
VIL -  
W
tWP  
VIH -  
VIL -  
OE  
tDS  
tDH  
DQ0 ~ DQ3(7)  
VIH -  
VIL -  
DATA-IN  
Don¢t care  
Undefined  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
CAS - BEFORE - RAS SELF REFRESH CYCLE  
NOTE : OE, A = Don¢t care  
tRP  
tRASS  
tRPS  
VIH -  
RAS  
tRPC  
tCP  
VIL -  
tRPC  
tCHS  
VIH -  
VIL -  
tCSR  
CAS  
DQ0 ~ DQ3(7)  
VOH -  
tOFF  
OPEN  
VOL -  
tWRP  
tWRH  
VIH -  
W
VIL -  
TEST MODE IN CYCLE  
NOTE : OE, A = Don¢t care  
tRC  
tRP  
tRAS  
tRP  
VIH -  
RAS  
tRPC  
tCP  
VIL -  
tRPC  
VIH -  
CAS  
VIL -  
tCSR  
tWTS  
tCHR  
tWTH  
VIH -  
W
VIL -  
DQ0 ~ DQ3(7)  
VOH -  
tOFF  
OPEN  
VOL -  
Don¢t care  
Undefined  
K4F170811D, K4F160811D  
K4F170812D, K4F160812D  
CMOS DRAM  
PACKAGE DIMENSION  
28 SOJ 300mil  
Units : Inches (millimeters)  
#28  
0.006 (0.15)  
0.012 (0.30)  
#1  
0.027 (0.69)  
MIN  
0.741 (18.82)  
MAX  
0.720 (18.30)  
0.730 (18.54)  
0.0375 (0.95)  
0.050 (1.27)  
0.026 (0.66)  
0.032 (0.81)  
0.015 (0.38)  
0.021 (0.53)  
28 TSOP(II) 300mil  
Units : Inches (millimeters)  
0.004 (0.10)  
0.010 (0.25)  
0.741 (18.81)  
MAX  
0.721 (18.31)  
0.729 (18.51)  
0.047 (1.20)  
MAX  
0.010 (0.25)  
TYP  
O
0~8  
0.002 (0.05)  
0.037 (0.95)  
0.050 (1.27)  
0.018 (0.45)  
0.030 (0.75)  
MIN  
0.012 (0.30)  
0.020 (0.50)  

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