CL10C080DB8NNNC [SAMSUNG]
General Multilayer Ceramic Capacitors; 一般多层陶瓷电容器
| 型号： | CL10C080DB8NNNC |
| 厂家： | 
SAMSUNG |
| 描述： | General Multilayer Ceramic Capacitors |
| 文件： | 总21页 (文件大小：370K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
General Multilayer Ceramic Capacitors
MLCC is an electronic part that temporarily stores an electrical charge and the
most prevalent type of capacitor today. New technologies have enabled the
MLCC manufacturers to follow the trend dictated by smaller and
smaller electronic devices such as Cellular telephones, Computers, DSC, DVC
General Features
- Miniature Size
- Wide Capacitance and Voltage Range
- Tape & Reel for Surface Mount Assembly
- Low ESR
Applications
- General Electronic Circuit
Part Numbering
CL 10
B
3
●
104
4
●
K
B
8
N
N
9
●
N
10
●
C
11
●
1
●
2
●
5
6
7
● ● ● ●
8
1
7
● Samsung Multilayer Ceramic Capacitor
● Thickness Option
8
2
● Size(mm)
● Product & Plating Method
9
3
● Capacitance Temperature Characteristic
● Samsung Control Code
108
4
● Nominal Capacitance
● Reserved For Future Use
5
118
● Packaging Type
● Capacitance Tolerance
6
● Rated Voltage
1
● Samsung Multilayer Ceramic Capacitor
2
● SIZE(mm)
Code
EIA CODE
Size(mm)
×
×
×
0201
0402
0603
0805
1206
1210
1812
2220
0.6
1.0
1.6
2.0
3.2
3.2
4.5
5.7
0.3
0.5
0.8
1.25
1.6
2.5
3.2
5.0
03
05
10
21
31
32
43
55
×
×
×
×
×
3
● CAPACITANCE TEMPERATURE CHARACTERISTIC
Temperature
Range
Code
Temperature Characteristics
△
△
△
△
±
℃
COG
P2H
R2H
S2H
T2H
U2J
S2L
X5R
C
P
R
S
0
30(ppm/ )
C
P
R
S
T
±
-150 60
±
-220 60
Ⅰ
±
-330 60
℃
-55 ~ +125
Class
△
±
-470 60
T
U
S
△
△
±
-750 60
U
L
+350 ~ -1000
±
15%
℃
X5R
-55 ~ +85
A
±
℃
℃
X7R
X6S
X7R
X6S
15%
22%
-55 ~ +125
B
X
Ⅱ
Class
±
-55 ~ +105
℃
-30 ~ +85
Y5V
Y5V
+22 ~ -82%
F
※ Temperature Characteristic
Temperature
Characteristics
Below 2.0pF
2.2 ~ 3.9pF
Above 4.0pF
Above 10pF
Δ
C0G
C0G
P2J
R2J
S2J
T2J
U2J
C0G
P2H
R2H
S2H
T2H
U2J
C0G
P2H
R2H
S2H
T2H
U2J
C
Δ
-
-
-
-
-
P
Δ
R
Δ
S
Δ
T
Δ
U
J : ±120PPM/℃, H : ±60PPM/℃, G : ±30PPM/℃
4
● NOMINAL CAPACITANCE
Nominal capacitance is identified by 3 digits.
The first and second digits identify the first and second significant figures of the capacitance.
The third digit identifies the multiplier. 'R' identifies a decimal point.
● Example
Code
1R5
103
Nominal Capacitance
1.5pF
μ
10,000pF, 10nF, 0.01
F
μ
104
100,000pF, 100nF, 0.1
F
5
● CAPACITANCE TOLERANCE
Code
Tolerance
Nominal Capacitance
±
0.05pF
A
B
C
D
F
±
0.1pF
Less than 10pF
(Including 10pF)
±
0.25pF
±
0.5pF
±
1pF
±
1%
2%
5%
F
±
G
J
±
More than 10pF
±
10%
20%
K
M
Z
±
+80, -20%
6
● RATED VOLTAGE
Code
Rated Voltage
Code
Rated Voltage
4.0V
6.3V
200V
250V
R
Q
D
E
10V
16V
25V
35V
50V
100V
500V
630V
P
O
A
L
G
H
I
1,000V
2,000V
3,000V
J
K
B
C
7
● THICKNESS OPTION
Size
Code
Thickness(T)
Size
Code
Thickness(T)
±
±
1.25 0.20
0201(0603)
0402(1005)
0603(1608)
0.30 0.03
3
5
F
H
I
±
±
1.6 0.20
0.50 0.05
±
±
2.0 0.20
0.80 0.10
1812(4532)
8
±
±
2.5 0.20
0.65 0.10
A
C
F
Q
Y
C
F
H
F
H
I
J
L
F
H
I
±
±
3.2 0.30
0.85 0.10
±
±
1.25 0.20
0805(2012)
1206(3216)
1210(3225)
1.25 0.10
±
±
1.6 0.20
1.25 0.15
±
±
2.0 0.20
1.25 0.20
2220(5750)
±
±
2.5 0.20
0.85 0.15
J
L
±
±
3.2 0.30
1.25 0.15
±
1.6 0.20
±
1.25 0.20
±
1.6 0.20
±
2.0 0.20
±
2.5 0.20
J
±
2.5 0.30
V
8
● PRODUCT & PLATING METHOD
Code
Electrode
Termination
Plating Type
Pd
Ni
Ag
Cu
Cu
Sn_100%
Sn_100%
Sn_100%
A
N
G
Cu
9
● SAMSUNG CONTROL CODE
Code
Description of the code
Code
Description of the code
Array (2-element)
Array (4-element)
High - Q
Normal
Automotive
LICC
A
B
C
N
P
L
10
● RESERVED FOR FUTURE USE
6
Code
Description of the code
N
Reserved for future use
11
● PACKAGING TYPE
Code
Packaging Type
Bulk
Code
Packaging Type
B
P
C
D
E
F
L
O
S
Embossing 13" (10,000EA)
Paper 13" (15,000EA)
Paper 10"
Bulk Case
Paper 7"
Paper 13" (10,000EA)
Embossing 7"
Embossing 10"
APPEARANCE AND DIMENSION
L
T
W
BW
DIMENSION ( mm )
CODE
EIA CODE
L
W
T (MAX)
BW
±
±
±
0.05
0201
0402
0603
0805
0.6
1.0
1.6
2.0
0.03
0.05
0.1
0.3
0.5
0.03
0.05
0.1
0.33
0.55
0.9
0.15
03
05
10
21
±
±
±
±
±
±
0.2 +0.15/-0.1
±
0.2
0.8
0.3
0.1
1.25
0.1
1.35
0.5 +0.2/-0.3
0.5 +0.2/-0.3
0.5 +0.3/-0.3
±
±
±
±
±
±
±
±
3.2
3.2
3.2
3.2
0.15
0.2
1.6
1.6
2.5
2.5
0.15
0.2
1.40
1.8
1206
1210
31
32
0.3
0.2
2.7
±
0.6
0.3
0.4
0.3
2.8
±
±
±
±
±
0.8 0.3
1812
2220
4.5
5.7
0.4
0.4
3.2
5.0
0.3
0.4
3.5
3.5
43
55
±
1.0
0.3
RELIABILTY TEST CONDITION
NO
1
ITEM
PERFORMANCE
TEST CONDITION
Through Microscope(×10)
Appearance
No Abnormal Exterior Appearance
㏁
10,000
㏁ ㎌
· whichever is smaller
or 500
Insulation
2
3
Apply the Rated Voltage For 60 ~ 120 Sec.
Resistance
Rated Voltage is below 16V
;
㏁
10,000
㏁ ㎌
· whichever is smaller
or 100
ClassⅠ : 300 % of the Rated Voltage for 1~5 sec.
ClassⅡ :250% of the Rated Voltage for 1~5 sec. is applied
with less than 50㎃ current
Withstanding
Voltage
No Dielectric Breakdown or
Mechanical Breakdown
Capacitance
Frequency
Voltage
Class
≤
㎊
㎒
Within the specified tolerance
Within the specified tolerance
1,000
1
1
±10%
±10%
Ⅰ
0.5 ~ 5 Vrms
㎊
㎑
>1,000
Capacita
nce
4
5
Capacitance
Frequency
Voltage
1.0±0.2Vrms
0.5±0.1Vrms
Voltage
Class
≤
㎌
㎑
1 ±10%
10
Ⅱ
㎌
㎐
>10
120 ±20%
Capacitance
Frequency
≥
㎊
≥
1,000
Capacitance
30
< 30 : Q
( C : Capacitance
: Q
Class
㎊
≥
≤
㎊
㎒
㎑
Q
400 +20C
1,000
1
±10%
±10%
Ⅰ
0.5 ~ 5 Vrms
)
㎊
>1,000
Capacitance
1
Frequency
Voltage
1.0±0.2Vrms
0.5±0.1Vrms
1. Characteristic : A(X5R), B(X7R), X(X6S)
≤
㎌
㎑
1 ±10%
10
Rated Voltage
Spec
0.025 max
㎌
㎐
120 ±20%
>10
≥
25V
16V
0.035 max
10V
0.05 max
≥
≥
≥
C
*1. 0201
C
0.022uF, 0402 C 0.22uF, 0603
2.2uF,
≥
C 22uF,
6.3V
0.05 max/ 0.10max*1
≥
≥
0805 C 4.7uF, 1206
C
10uF, 1210
≥
≥
100uF,
1812 C 47uF, 2220
C
2. Characteristic : F(Y5V)
Rated Voltage
All Low Profile Capacitors (P.16).
≥
≥
*2.. 0603
*3. 0402
C
0.47uF, 0805
C
1uF
Class
Spec
δ
Tan
6
≥
C
0.033uF, 0603 C>0.1uF
0.05 max, 0.07max*2
0.07 max
Ⅱ
50V
35V
≤
All 0805, 1206 size, 1210 C
*4.. 1210 C>6.8uF
6.8uF
0.05 max/
≥
C 0.22uF
*5.. 0402
25V
0.07 max*3/ 0.09max*4
*6.. All 1812 size
16V
10V
6.3V
0.09 max/ 0.125max*5
0.125 max/ 0.16max*6
0.16max
RELIABILTY TEST CONDITION
NO
ITEM
PERFORMANCE
TEST CONDITION
Capacitance shall be measured by the steps
shown in the following table.
Temp. Coefficient
Characteristics
℃
(PPM/
Step
Temp.(℃)
)
±
30
C0G
PH
RH
SH
TH
0
-150
-220
-330
-470
-750
±
2
1
2
3
4
25
±
±
±
±
±
60
60
60
60
120
±
±
Min. operating temp.
2
2
Class
±
25
2
Ⅰ
Max. operating temp
±
2
5
25
UL
Ⅰ
(1) Class
SL
+350 ~ -1000
Temperature Coefficient shall be calculated from
the formula as below.
Temperature
7
Characteristics
of Capacitance
C2 - C1
×△
× 106 [ppm/℃]
Temp, Coefficient
=
C1
T
C1; Capacitance at step 3
℃
C2: Capacitance at 85
Capacitance Change
with No Bias
Characteristics
△
℃
℃
℃
T: 60 (=85 -25 )
A(X5R)/
B(X7R)
Class
±
±
15%
22%
Ⅱ
(2) CLASS
Ⅱ
Capacitance Change shall be calculated from the
X(X6S)
F(Y5V)
formula as below.
C2 - C1
+22% ~ -82%
△
× 100(%)
C =
C1
C1; Capacitance at step 3
C2: Capacitance at step 2 or 4
±
Apply 500g.f * Pressure for 10 1 sec.
* 200g.f for 0201 case size.
Adhesive Strength
of Termination
No Indication Of Peeling Shall Occur On The
Terminal Electrode.
8
500g.f
Bending limit ; 1mm
Apperance
No mechanical damage shall occur.
Test speed ; 1.0mm/SEC.
Keep the test board at the limit point in 5 sec.,
Then measure capacitance.
Characteristics
Class I
Capacitance Change
±
±
0.
Within
5% or
5 pF whichever is
larger
20
R=230
Bending
Strength
50
9
A(X5R)/
Capacitance
±
±
B(X7R)/ Within
X(X6S)
12.5%
30%
○
○
Bending limit
±
1
Class II
45
±
45
1
F(Y5V) Within
RELIABILTY TEST CONDITION
NO
ITEM
PERFORMANCE
TEST CONDITION
Sn-3Ag-0.5Cu 63Sn-37Pb
More Than 75% of the terminal surface is to
be soldered newly, So metal part does not
come out or dissolve
Solder
Solder
Temp.
℃
℃
245±5
235±5
10
Solderability
Flux
RMA Type
Dip Time
Pre-heating
3±0.3 sec.
5±0.5 sec.
℃
at 80~120
for 10~30 sec.
℃
Apperance
No mechanical damage shall occur.
Solder Temperature : 270±5
Dip Time : 10±1 sec.
Characteristics
Capacitance Change
Within ±2.5% or
Each termination shall be fully immersed and
preheated as below :
Ⅰ
㎊
whichever is
Class
±0.25
larger
Capacitance
℃
STEP
TEMP.(
)
TIME(SEC.)
A(X5R)/
B(X7R)
Within ±7.5%
1
2
80~100
60
60
Ⅱ
Class
150~180
X(X6S) Within ±15%
Within ±20%
F
Resistance to
Soldering heat
Leave the capacitor in ambient condition for
specified time* before measurement
11
≥
㎊
30
≥
: Q 1000
Capacitance
Q
Ⅰ
* 24 ± 2 hours (Class
24 ± 2 hours (Class
)
㎊
≥
400+20×C
<30
: Q
Ⅰ
Ⅱ
(Class
)
)
Ⅱ
)
(C: Capacitance)
δ
Tan
Within the specified initial value
Within the specified initial value
Within the specified initial value
No mechanical damage shall occur.
(Class
Insulation
Resistance
Withstanding
Voltage
Appearance
Characteristics
Capacitance Change
Within ±2.5% or
The capacitor shall be subjected to a
Harmonic Motion having a total amplitude of
1.5mm changing frequency from 10Hz to 55Hz
and back to 10Hz In 1 min.
Ⅰ
㎊
whichever is
Class
±0.25
larger
Capacitance
A(X5R)/
B(X7R)
Within ±5%
Class
Vibration
Test
Repeat this for 2hours each in 3 mutually
perpendicular directions
12
Ⅱ
X(X6S) Within ±10%
F(Y5V) Within ±20%
Q
Within the specified initial value
Within the specified initial value
Ⅰ
Ⅱ
(Class
)
)
δ
Tan
(Class
Insulation
Within the specified initial value
Resistance
RELIABILTY TEST CONDITION
NO
ITEM
PERFORMANCE
TEST CONDITION
℃
: 40±2
Appearance No mechanical damage shall occur.
Temperature
Relative humidity : 90~95 %RH
Duration time : 500 +12/-0 hr.
Characteristics
Capacitance Change
㎊
Within ±5.0% or ±0.5
Ⅰ
Class
whichever is larger
Leave the capacitor in ambient
condition for specified time* before
measurement.
Capacitance
A(X5R)/
B(X7R)/
X(X6S)
Within ±12.5%
Within ±30%
Class
Ⅱ
Ⅰ
CLASS
: 24±2 Hr.
: 24±2 Hr.
F(Y5V)
Ⅱ
CLASS
≥
㎊
≥
Capacitance
30
: Q
350
Q
Humidity
(Steady
State)
≤
10
㎊
≥
: Q 275 + 2.5×C
Capacitance <30
Ⅰ
CLASS
13
≥
Capacitance < 10pF : Q
200 + 10×C (C: Capacitance)
2. Characteristic : F(Y5V)
1. Characteristic : A(X5R),
B(X7R)
0.05max (16V and over)
0.075max (10V)
0.075max
0.075max (25V and over)
㎌
0.1max (16V, C<1.0
)
δ
Tan
≥
㎌
0.125max(16V, C 1.0
)
Ⅱ
CLASS
(6.3V except Table 1)
0.125max*
0.15max (10V)
0.195max (6.3V)
(refer to Table 1)
Insulation
㏁
㏁ ㎌
or 50 whichever is smaller.
1,000
·
Resistance
Applied Voltage : rated voltage
Appearance No mechanical damage shall occur.
Characteristics Capacitance Change
℃
Temperature : 40±2
Humidity : :90~95%RH
㎊
Within ±5.0% or ±0.5
Duration Time : 500 +12/-0 Hr.
Ⅰ
Class
whichever is larger
㎃
Charge/Discharge Current : 50
max.
Within ±12.5%
Within ±12.5%
Within ±30%
A(X5R)/
Perform the initial measurement according to
Note1.
B(X7R)/
X(X6S)
Capacitance
Ⅱ
Class
Within ±30%
Perform the final measurement according to
Note2.
F(Y5V)
Within ±30%
Moisture
≥
㎊
30
≥
: Q 200
Q
Capacitance
14
Resistance
Ⅰ
㎊
≥
: Q
(Class
)
Capacitance <30
100 + 10/3×C (C: Capacitance)
1. Characteristic : A(X5R),
B(X7R)
2. Characteristic : F(Y5V)
0.05max (16V and over)
0.075max (10V)
0.075max (25V and over)
㎌
0.1max (16V, C<1.0
)
≥
㎌
0.125max(16V, C 1.0
)
0.075max
δ
Tan
0.15max (10V)
(6.3V except Table 1)
Ⅱ
(Class
)
0.195max (6.3V)
0.125max*
(refer to Table 1)
X(X6S) 0.11max (6.3V and below)
Insulation
㏁
㏁ ㎌
· whichever is smaller.
500
or 25
Resistance
RELIABILTY TEST CONDITION
NO
ITEM
PERFORMANCE
TEST CONDITION
Applied Voltage : 200%* of the rated voltage
Temperature : max. operating temperature
Duration Time : 1000 +48/-0 Hr.
Appearance No mechanical damage shall occur.
Characteristics
Capacitance Change
㎃
Charge/Discharge Current : 50 max.
㎊
Within ±3% or ±0.3
,
Ⅰ
Class
Whichever is larger
* refer to table(3) : 150%/100% of the rated
voltage
A(X5R)/
B(X7R)
Capacitance
Within ±12.5%
Perform the initial measurement according to
X(X6S) Within ±25%
Ⅱ
Class
Ⅱ
Note1 for Class
Within ±30%
F(Y5V)
Within ±30%
≥
㎊
≥
: Q 350
Capacitance 30
Perform the final measurement according to
Note2.
Q
≤
㎊
≥
: Q 275 + 2.5×C
10 Capacitance <30
Ⅰ
)
(Class
㎊
≥
Capacitance < 10 :Q 200 +10×C (C: Capacitance)
High
1. Characteristic : A(X5R), 2. Characteristic : F(Y5V)
15
Temperature
Resistance
B(X7R)
0.05max
0.075max
(16V and over)
0.075max (10V)
0.075max
(25V and over)
㎌
0.1max(16V, C<1.0
)
≥
㎌
)
0.125max(16V, C 1.0
δ
Tan
(6.3V except Table 1)
0.125max*
0.15max (10V)
Ⅱ
)
(Class
0.195max (6.3V)
(refer to Table 1)
X(X6S) 0.11max (6.3V and below)
Insulation
㏁
㏁ ㎌
or 50 whichever is smaller.
1,000
·
Resistance
Capacitor shall be subjected to 5 cycles.
Condition for 1 cycle :
Appearance No mechanical damage shall occur.
Characteristics Capacitance Change
℃
Step
Temp.(
)
Time(min.)
㎊
Within ±2.5% or ±0.25
Ⅰ
Class
Min. operating
temp.+0/-3
Whichever is larger
1
2
3
4
30
2~3
30
Capacitance
A(X5R)/
B(X7R)/
Within ±7.5%
25
Class
Temperature
Cycle
Max. operating
temp.+3/-0
Ⅱ
X(X6S) Within ±15%
F(Y5V) Within ±20%
16
25
2~3
Q
Within the specified initial value
Within the specified initial value
Within the specified initial value
Ⅰ
(Class
)
Leave the capacitor in ambient condition
for specified time* before measurement
δ
Tan
Ⅰ
* 24 ± 2 hours (Class
24 ± 2 hours (Class
)
Ⅱ
)
(Class
Ⅱ
)
Insulation
Resistance
RELIABILTY TEST CONDITION
Recommended Soldering Method
Condition
Size
Temperature
Characteristic
Capacitance
inch (mm)
Flow
-
Reflow
0201 (0603)
0402 (1005)
○
-
-
-
○
○
-
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
Class I
Class II
Class I
Class II
＜
㎌
㎌
0603 (1608)
C
C
1
1
≥
○
○
-
-
Recommended
Soldering Method
18
＜
㎌
4.7
C
0805 (2012)
≥
㎌
4.7
C
By Size & Capacitance
Array
-
-
○
○
-
Class I
-
＜
㎌
㎌
C
10
10
1206 (3216)
Class II
Array
≥
C
-
-
-
1210 (3225)
1808 (4520)
1812 (4532)
2220 (5750)
-
-
Ⅱ
Note1. Initial Measurement For Class
℃
℃
Leave the capacitor in ambient condition for 48±4 hours before measurement.
Perform the heat treatment at 150 +0/-10 for 1 hour. Then
Then perform the measurement.
Note2. Latter Measurement
Ⅰ
1. CLASS
Leave the capacitor in ambient condition for 24±2 hours before measurement
Then perform the measurement.
Ⅱ
2. Class
℃
℃
Perform the heat treatment at 150 +0/-10 for 1 hour. Then Leave the capacitor in ambient condition for 48±4 hours before measurement.
Then perform the measurement.
*Table1.
*Table2.
High Temperature Resistance test
*Table3.
δ
Tan
0.125max*
High Temperature Resistance test
Δ
C (Y5V)
± 30%
≥
≥
≥
≥
≥
≥
≥
≥
㎌
0.022
0201 C
0402 C
0603 C
0805 C
1206 C
1210 C
1812 C
2220 C
Applied
Voltage
100% of the rated
voltage
150% of the rated
voltage
㎌
0.22
≥
≥
≥
≥
≥
≥
≥
㎌
0.47
0402 C
0603 C
0805 C
1206 C
1210 C
1812 C
2220 C
㎌
2.2
㎌
2.2
≥
≥
≥
≥
≥
≥
㎌
㎌
㎌
≥
≥
≥
≥
≥
≥
≥
≥
㎌
0.022
0201 C
0402 C
0603 C
0805 C
1206 C
1210 C
0.1
1.0
4.7
0201 C
0402 C
0603 C
0805 C
1206 C
1210 C
1812 C
2220 C
㎌
4.7
㎌
4.7
Ⅱ
㎌
0.47
Class
Ⅱ
Class
㎌
Ⅱ
Class
10.0
22.0
47.0
㎌
㎌
㎌
10.0
22.0
47.0
㎌
A(X5R),
B(X7R)
2.2
4.7
F(Y5V)
㎌
㎌
A(X5R),
B(X7R),
X(X6S),
F(Y5V)
㎌
㎌
㎌
22.0
47.0
㎌
10.0
22.0
47.0
㎌
100.0
㎌
100.0
㎌
㎌
㎌
100.0
All Low Profile
All Low Profile
Capacitors (P.16).
Capacitors (P.16).
㎌
100.0
Note3. All Size In Reliability Test Condition Section is "inch"
PACKAGING
● CARDBOARD PAPER TAPE (4mm)
Feeding Hole
Chip Inserting Hole
D
E
F
A
W
B
t
P0
P2
E
P1
P1
unit : mm
Symbol
A
B
W
F
P2
P0
D
t
Type
D
i
1.1
±0.2
1.9
±0.2
0603
(1608)
m
e
n
s
i
o
n
Φ
1.6
±0.2
2.4
±0.2
8.0
±0.3
3.5
±0.05
1.75
±0.1
4.0
±0.1
2.0
±0.05
4.0
±0.1
1.5
1.1
Below
0805
(2012)
+0.1/-0
2.0
±0.2
3.6
±0.2
1206
(3216)
● CARDBOARD PAPER TAPE (2mm)
Feeding Hole
Chip Inserting Hole
D
E
A
F
W
B
t
P0
P2
E
P1
P1
unit : mm
Symbol
A
B
W
F
P2
P0
D
t
Type
D
i
0.38
±0.03
0.68
±0.03
0.37
±0.03
0201
(0603)
m
e
n
s
i
Φ
8.0
±0.3
3.5
±0.05
1.75
±0.1
2.0
±0.05
2.0
±0.05
4.0
±0.1
1.5
+0.1/-0.03
0.62
±0.04
1.12
±0.04
0.6
±0.05
0402
(1005)
o
n
PACKAGING
● EMBOSSED PLASTIC TAPE
F eeding H ole
C hip inserting H ole
D
E
F
A
W
B
t1
P 0
P 2
P 1
t0
un it : m m
S ym bol
A
B
W
F
E
P1
P 2
P 0
D
t1
t0
Type
1.45
±0.2
2.3
±0.2
0805
(2012)
1.9
±0.2
3.5
±0.2
8.0
±0.3
3.5
±0.05
4.0
±0.1
2.5
m ax
1206
D
i
(3216)
2.9
±0.2
3.7
±0.2
m
e
n
s
i
1210
(3225)
Φ
1.5
1.75
±0.1
2.0
±0.05
4.0
±0.1
0.6
Below
+0.1/-0
2.3
±0.2
4.9
±0.2
1808
(4520)
o
n
3.6
±0.2
4.9
±0.2
12.0
±0.3
5.60
±0.05
8.0
±0.1
3.8
m ax
1812
(4532)
5.5
±0.2
6.2
±0.2
2220
(5750)
● TAPING SIZE
Em pty Section
45 Pitch
Em pty Section
50 Pitch
Loading Section
35 Pitch
Packed Part
EN D
ST AR T
C ardboa rd
P aper Tape
E m bosse d
P lastic Tape
Type
S ym bol
S iz e
S ym bol
S iz e
≤
All Size
3216
0201(0603)
0402(1005)
10,000
10,000
1210(3225),1808(4520)
2,000
1,000
≤
(t 1.6m m )
7" R eel
C
E
-
≥
1210(3225)(t 2.0m m )
≥
OT H ER S
-
4,000
1808(4520)(t 2.0m m )
1,000
-
10" R eel
O
D
10,000
-
≤
All Size
3216
0402(1005)
OT H ER S
50,000
1210(3225),1808(4520)
(t<1.6m m )
10,000
≤
1210(3225)(1.6 t<2.0m m )
10,000
8,000
4,000
4,000
2,000
≤
1206(3216)(1.6 t)
13" R eel
F
1210(3225),1808(4520)
0603(1608)
0805(2012)
10,000 or 15,000
≥
(t 2.0m m )
15,000 or
10,000(Option)
≤
L
1812(4532)(t 2.0m m )
≤
(t 0.85m m )
1206(3216)
1812(4532)(t>2.0m m )
5750(2220)
10,000
≤
(t 0.85m m )
PACKAGING
●
REEL DIMENSION
E
C
B
R
D
W
t
A
unit : mm
Symbol
A
B
C
D
E
W
t
R
φ
φ
φ
±
1.2 0.2
180+0/ -3
60+1/ -3
7" Reel
φ
±
±
±
±
9 1.5
13 0.3 25 0.5
2.0 0.5
1.0
φ
±
±
2.2 0.2
330 2.0
80+1/ -3
13" Reel
●
BULK CASE PACKAGING
- Bulk case packaging can reduce the stock space and transportation costs.
- The bulk feeding system can increase the productivity.
- It can eliminate the components loss.
A
B
T
C
D
E
W
F
G
H
L
I
unit : mm
Symbol
A
B
T
C
D
E
±
±
±
6.8 0.1
8.8 0.1
12 0.1
1.5+0.1/-0
2+0/-0.1
3.0+0.2/-0
Dimension
Symbol
F
W
G
H
L
I
±
±
±
±
31.5+0.2/-0
36+0/-0.2
19 0.35
7 0.35
110 0.7
5 0.35
Dimension
●
QUANTITY OF BULK CASE PACKAGING
unit : pcs
0805(2012)
Size
0402(1005)
0603(1608)
T=0.65mm
T=0.85mm
5,000 or 10,000
50,000
10,000 or 15,000
10,000
Quantity
APPLICATION MANUAL
●
ELECTRICAL CHARACTERISTICS
▶
CAPACITANCE - TEMPERATURE CHARACTERISTICS
%
C
%
8
C
40
6
4
20
X5R
S2L
125
-6 0
-4 0
-2 0
25
40
60
80
10 0
12 0
2
X7R
-55 -40
-20
25 40
60
80
100
C O G
-2 0
-4 0
o
Temp.(oC)
-2
-4
Y5V
U 2J
-6 0
-8 0
-6
-8
-10
▶
▶
CAPACITANCE CHANGE - AGING
CAPACITANCE - DC VOLTAGE CHARACTERISTICS
20
10
C0G
X7R/X5R
C %
COG
0
5
-10
X7R 50V
X7R 16V
-20
-30
-40
-50
10
X5R 50V
Y5V
-60
-70
-80
15
Y5V
-90
-100
10
20
30
40
Vdc
50
Time(hr)
1
10
100
1000
10000
▶
IMPEDANCE - FREQUENCY CHARACTERISTICS
Ohm
100
Ohm
C0G
X7R/X5R/Y5V
100
10
㎌
0.001
㎌
0.01
10
㎌
0.1
1
1
10pF
100pF
1000pF
0.1
0.1
0.01
0.01
1.E+06
1MHz
1.E+07
10MHz
1.E+08
100MHz
1.E+09
1GHz
1.E+06
1MHz
1.E+07
10MHz
1.E+08
100MHz
1.E+09
1GHz
1.E+10
10GHz
● STORAGE CONDITION
▶ Storage Environment
The electrical characteristics of MLCCs were degraded by the environment of high temperature or
humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative humidity
of less than 40℃ and 70%, respectively.
Guaranteed storage period is within 6 months from the outgoing date of delivery.
▶ Corrosive Gases
Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere
such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.
▶ Temperature Fluctuations
Since dew condensation may occur by the differences in temperature when the MLCCs are taken
out of storage, it is important to maintain the temperature-controlled environment.
● DESIGN OF LAND PATTERN
When designing printed circuit boards, the shape and size of the lands must allow for the proper
amount of solder on the capacitor.
The amount of solder at the end terminations has a direct effect on the crack.
The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount
of solder. In contrast, if too little solder is applied, the termination strength will be insufficiently.
Use the following illustrations as guidelines for proper land design.
Recommendation of Land Shape and Size.
Solder Resist
Solder Resist
T
W
b
a
Solder
Land
2/3W < b < W
2/3T < a < T
● ADHESIVES
When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions.
▶ Requirements for Adhesives
They must have enough adhesion, so that, the chips will not fall off or move during the handling of the
circuit board.
They must maintain their adhesive strength when exposed to soldering temperature.
They should not spread or run when applied to the circuit board.
They should harden quickly. They should not corrode the circuit board or chip material.
They should be a good insulator. They should be non-toxic, and not produce harmful gases, nor be
harmful when touched.
▶ Application Method
It is important to use the proper amount of adhesive. Too little and much adhesive will cause poor
adhesion and overflow into the land, respectively.
Solder Resist
a
a
Land
b
unit : mm
Type
21
31
PCB
0.2 min
0.2 min
a
b
c
㎛
㎛
70~100
> 0
70~100
> 0
c
c
▶ Adhesive hardening Characteristics
To prevent oxidation of the terminations, the adhesive must harden at 160℃ or less, within 2 minutes
or less.
● MOUNTING
▶ Mounting Head Pressure
Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum during
mounting.
▶ Bending Stress
When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side of the
board. When the MLCCs are mounted onto the other side,
it is important to support the board as shown in the illustration. If the circuit board is not supported,
the crack occur to the ready-installed MLCCs by the bending stress.
nozzle
force
support pin
▶ Manual Soldering
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors.
The hot soldering iron tip comes into direct contact with the end terminations, and operator's
carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic
body of the capacitor.
Therefore the soldering iron must be handled carefully, and close attention must be paid
to the selection of the soldering iron tip and to temperature control of the tip.
▶ Amount of Solder
Too much
Solder
Cracks tend to occur due
to large stress
W eak holding force may
cause bad connections or
detaching of the capacitor
Not enough
Solder
Good
▶ Cooling
Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the
temperature difference(△T) must be less than 100℃
▶ Cleaning
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in
the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This
means that the cleaning fluid must be carefully selected, and should always be new.
▶ Notes for Separating Multiple, Shared PC Boards.
A multi-PC board is separated into many individual circuit boards after soldering has been completed.
If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors.
Carefully choose a separation method that minimizes the bending often circuit board.
▶ Recommended Soldering Profile
Reflow
Gradual cooling
260+0/-5℃
in the air
10sec.max.
Pre-heating
Soldering
Temp.(℃ )
200℃
150℃
Time(sec)
Flow
℃
260±3
Gradual Cooling
in the air
Pre-heating
5 sec. max.
Soldering
℃
Temp. (
)
△
T
i) 1206(3216) and
below
℃
: 150
max.
Pre-heating
℃
Temp. (
)
Time (sec.)
120 sec. min.
Soldering Iron
Soldering
Pre-heating
Time (Sec)
Soldering
Cooling
Variation of Temp.
℃
Temp (
)
Time(Sec)
Time(Sec)
△ ≤
T 130
±
℃
≥
≤
4
300 10 max
60
-
Condition of Iron facilities
Tip Diameter
Wattage
20W Max
Soldering Time
4 Sec Max
㎜
3
Max
* Caution - Iron Tip Should Not Contact With Ceramic Body Directly.
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