RRS125N03TB [ROHM]

Power Field-Effect Transistor, 12.5A I(D), 30V, 0.0128ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, SOP-8;
RRS125N03TB
型号: RRS125N03TB
厂家: ROHM    ROHM
描述:

Power Field-Effect Transistor, 12.5A I(D), 30V, 0.0128ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, SOP-8

开关 脉冲 光电二极管 晶体管
文件: 总5页 (文件大小:96K)
中文:  中文翻译
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RRS125N03  
Transistors  
4V Drive Nch MOSFET  
RRS125N03  
zStructure  
zDimensions (Unit : mm)  
Silicon N-channel MOSFET  
SOP8  
zFeatures  
1) Low on-resistance.  
2) Built-in G-S Protection Diode.  
3) Small Surface Mount Package (SOP8) .  
zApplication  
Each lead has same dimensions  
Switching  
zPackaging specifications  
zEquivalent circuit  
(8)  
(7)  
(6)  
(5)  
(8) (7) (6) (5)  
Package  
Taping  
TB  
Type  
Code  
Basic ordering unit (pieces)  
2500  
RRS125N03  
2  
(1) (2) (3) (4)  
1  
(1) Source  
(2) Source  
(3) Source  
(4) Gate  
(5) Drain  
(6 )Drain  
(7) Drain  
(8) Drain  
(1)  
(2)  
(3)  
(4)  
1 ESD PROTECTION DIODE  
2 BODY DIODE  
A protection diode is included between the gate and  
the source terminals to protect the diode against static  
electricity when the product is in use. Use the protection  
circuit when the fixed voltages are exceeded.  
zAbsolute maximum ratings (Ta=25°C)  
Parameter  
Drain-source voltage  
Gate-source voltage  
Symbol  
Limits  
30  
Unit  
V
VDSS  
VGSS  
ID  
20  
V
12.5  
50  
A
Continuous  
Pulsed  
Drain current  
1  
IDP  
IS  
A
1.6  
A
Source current  
(Body diode)  
Continuous  
Pulsed  
1
2
ISP  
PD  
Tch  
50  
A
2.0  
W
°C  
°C  
Total power dissipation  
Channel temperature  
150  
Tstg  
55 to 150  
Range of storage temperature  
1 Pw10µs, Duty cycle1%  
2 Mounted on a ceramic board.  
zThermal resistance  
Parameter  
Symbol  
Limits  
62.5  
Unit  
Channel to ambient  
Mounted on a ceramic board.  
Rth (ch-a)  
°C / W  
1/4  
RRS125N03  
Transistors  
zElectrical characteristics (Ta=25°C)  
Parameter  
Symbol Min. Typ. Max.  
Conditions  
µA VGS= 20V, VDS=0V  
ID=1mA, VGS=0V  
µA VDS=30V, VGS=0V  
Unit  
Gate-source leakage  
IGSS  
10  
Drain-source breakdown voltage V(BR) DSS 30  
V
Zero gate voltage drain current  
Gate threshold voltage  
IDSS  
1.0  
1
VGS (th)  
2.5  
10.0  
12.2  
12.8  
40.5  
V
VDS=10V, ID=1mA  
ID=12.5A, VGS=10V  
7.5  
9.2  
9.8  
2300  
420  
360  
20  
55  
100  
115  
27  
7
Static drain-source on-state  
resistance  
RDS (on)  
mID=12.5A, VGS=4.5V  
ID=12.5A, VGS=4V  
Forward transfer admittance  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
Yfs  
Ciss  
10  
S
ID=12.5A, VDS=10V  
VDS=10V  
VGS=0V  
f=1MHz  
ID=6.25A, VDD 15V  
VGS=10V  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
nC  
Coss  
Crss  
td (on)  
t
r
td (off)  
tf  
Qg  
Turn-off delay time  
Fall time  
RL=2.40Ω  
RG=10Ω  
VDD 15V  
Total gate charge  
Gate-source charge  
ID=12.5A,  
Qgs  
Qgd  
nC VGS=5V  
nC RL=1.20Ω, RG=10Ω  
Gate-drain charge  
10  
Pulsed  
zBody diode characteristics (Source-Drain) (Ta=25°C)  
Parameter  
Forward voltage  
Symbol Min. Typ. Max.  
Conditions  
IS=12.5A, VGS=0V  
Unit  
V
VSD  
1.2  
Pulsed  
2/4  
RRS125N03  
Transistors  
zElectrical characteristic curves  
100  
100  
100  
V
DS=10V  
V
GS=10V  
Ta=25°C  
Pulsed  
Pulsed  
Pulsed  
10  
1
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
V
V
V
GS=4.0V  
GS=4.5V  
GS=10V  
10  
10  
0.1  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
0.01  
0.001  
1
0.1  
1
0.1  
1.0  
1.5  
2.0  
2.5  
3.0  
1
10  
100  
1
10  
100  
GATE-SOURCE VOLTAGE : VGS (V)  
DRAIN CURRENT : ID (A)  
DRAIN CURRENT : ID (A)  
Fig.1 Typical Transfer Characteristics  
Fig.3 Static Drain-Source  
On-State Resistance  
vs. Drain Current(ΙΙ)  
Fig.2 Static Drain-Source  
On-State Resistance  
vs. Drain Current(  
)
50  
40  
30  
20  
10  
0
100  
100  
Ta=25°C  
Pulsed  
V
GS=4.5V  
V
GS=4V  
Pulsed  
Pulsed  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
I
I
D
=12.5A  
=6.25A  
D
10  
10  
1
0.1  
1
0.1  
0
5
10  
15  
1
10  
100  
1
10  
100  
GATE-SOURCE VOLTAGE : VGS (V)  
DRAIN CURRENT : I  
D
(A)  
DRAIN CURRENT : ID (A)  
Fig.6 Static Drain-Source  
Fig.4 Static Drain-Source  
On-State Resistance  
vs. Drain Current(ΙΙΙ)  
Fig.5 Static Drain-Source  
On-State Resistance  
On-State Resistance vs.  
Gate-Source Voltage  
vs. Drain Current(  
)
10  
10000  
10000  
Ta=25°C  
f=1MHz  
GS=0V  
Ta=25°C  
V
GS=0V  
V
V
DD=15V  
GS=10V  
Pulsed  
V
Ta= −25°C  
Ta=25°C  
R
G
=10Ω  
Ciss  
1000  
100  
Pulsed  
1000  
10  
1
t
f
t
d (off)  
r
C
oss  
rss  
t
C
Ta=75°C  
Ta=125°C  
100  
10  
t
d (on)  
10  
1
0.1  
0.01  
100  
0.01  
0.1  
1
10  
100  
0.01  
0.1  
1
10  
100  
0.1  
1
10  
(A)  
DRAIN CURRENT : I  
D
DRAIN-SOURCE VOLTAGE : VDS (V)  
DRAIN CURRENT : ID (A)  
Fig.7 Forward Transfer  
Admittance vs.  
Fig.8 Typical Capacitance  
Fig.9 Switching Characteristics  
vs. Drain-Source Voltage  
Drain Current  
3/4  
RRS125N03  
Transistors  
10  
100  
10  
Ta=25°C  
V
GS=0V  
V
DD=15V  
Pulsed  
I
R
D
=12.5A  
G=10Ω  
Pulsed  
5
1
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
0.1  
0.01  
0
0
5
10 15 20 25 30 35 40 45 50 55 60  
0.0  
0.5  
1.0  
1.5  
TOTAL GATE CHARGE : Qg (nC)  
SOURCE-DRAIN VOLTAGE : VSD (V)  
Fig.10 Dynamic Input Characteristics  
Fig.11 Source Current vs.  
Source-Drain Voltage  
zElectrical characteristic curves  
Pulse Width  
90%  
V
GS  
ID  
V
DS  
50%  
10%  
50%  
V
GS  
DS  
RL  
V
10%  
10%  
D.U.T.  
RG  
V
DD  
90%  
90%  
t
d(on)  
td(off)  
t
r
tr  
t
on  
t
off  
Fig.13 Switching Time Waveforms  
Fig.12 Switching Time Test Circuit  
V
G
V
GS  
ID  
V
DS  
Q
g
RL  
V
GS  
I
G (Const.)  
D.U.T.  
Q
gs  
Qgd  
RG  
V
DD  
Charge  
Fig.14 Gate Charge Test Circuit  
Fig.15 Gate Charge Waveform  
4/4  
Appendix  
Notes  
No technical content pages of this document may be reproduced in any form or transmitted by any  
means without prior permission of ROHM CO.,LTD.  
The contents described herein are subject to change without notice. The specifications for the  
product described in this document are for reference only. Upon actual use, therefore, please request  
that specifications to be separately delivered.  
Application circuit diagrams and circuit constants contained herein are shown as examples of standard  
use and operation. Please pay careful attention to the peripheral conditions when designing circuits  
and deciding upon circuit constants in the set.  
Any data, including, but not limited to application circuit diagrams information, described herein  
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM  
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any  
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of  
whatsoever nature in the event of any such infringement, or arising from or connected with or related  
to the use of such devices.  
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or  
otherwise dispose of the same, no express or implied right or license to practice or commercially  
exploit any intellectual property rights or other proprietary rights owned or controlled by  
ROHM CO., LTD. is granted to any such buyer.  
Products listed in this document are no antiradiation design.  
The products listed in this document are designed to be used with ordinary electronic equipment or devices  
(such as audio visual equipment, office-automation equipment, communications devices, electrical  
appliances and electronic toys).  
Should you intend to use these products with equipment or devices which require an extremely high level  
of reliability and the malfunction of which would directly endanger human life (such as medical  
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers  
and other safety devices), please be sure to consult with our sales representative in advance.  
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance  
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow  
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in  
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM  
cannot be held responsible for any damages arising from the use of the products under conditions out of the  
range of the specifications or due to non-compliance with the NOTES specified in this catalog.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact your nearest sales office.  
THE AMERICAS / EUROPE / ASIA / JAPAN  
ROHM Customer Support System  
Contact us : webmaster@ rohm.co.jp  
www.rohm.com  
TEL : +81-75-311-2121  
FAX : +81-75-315-0172  
Copyright © 2008 ROHM CO.,LTD.  
21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan  
Appendix1-Rev2.0  

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