ML62Q1553C [ROHM]
标准型 ML62Q1500组 ROM容量:32KB to 256KB;型号: | ML62Q1553C |
厂家: | ROHM |
描述: | 标准型 ML62Q1500组 ROM容量:32KB to 256KB |
文件: | 总57页 (文件大小:2331K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
FEDL62Q1500C-03
Issue Date: May19, 2022
ML62Q1500C Group
16-bit micro controller
GENERAL DESCRIPTION
ML62Q1500C Group is a high performance CMOS 16-bit microcontroller equipped with an 16-bit CPU nX-U16/100 and
integrated with program memory (Flash memory), data memory (RAM), data Flash and rich peripheral functions such as the
multiplier/divider, CRC generator, DMA controller, Clock generator, Simplified RTC, Timer, General Purpose Ports, UART,
Synchronous serial port, I2C bus interface unit (Master, Slave), Buzzer, Voltage Level Supervisor (VLS), Successive
approximation type A/D converter, D/A converter, Analog comparator, Safety function (IEC60730/60335 Class B), and so on.
The CPU nX-U16/100 is capable of efficient instruction execution in 1-intruction 1-clock mode by pipeline architecture parallel
processing.
The built-in on-chip debug function enables debugging and programming the software. Also, ISP (In-System Programming)
function supports the Flash programming in production line.
The ML62Q1500C Group has five packages (52pin - 80pin) and ten kinds of memory sizes (96Kbyte - 128Kbyte).
Table 1 ML62Q1500C Group Product List
52pin
TQFP52
64pin
QFP64
TQFP64
80pin
QFP80
Program
memory
Data memory
(RAM)
Data Flash
4KByte
128Kbyte
96Kbyte
ML62Q1544C ML62Q1554C ML62Q1564C
ML62Q1543C ML62Q1553C ML62Q1563C
8Kbyte
Please see the page 58 “Notes for product usage” and the page 59 “Notes” in this document on use with this ML62Q1500C group.
FEATURES
• CPU
− 16-bit RISC CPU: nX-U16/100(A35 core)
− Instruction system: 16-bit length instructions
‒ Instruction set: Transfer, arithmetic operations, comparison, logic operations, multiplication/division, bit manipulations,
bit logic operations, jump, conditional jump, call return stack manipulations, arithmetic shift, and so on
‒ Built-in On-chip debug function
‒ Built-in ISP (In-System Programming) function
‒ Minimum instruction execution time
Approximately 30.5 μs (at 32.768 kHz system clock)
Approximately 62.5ns/41.6ns (at 16 MHz/24MHz system clock)
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FEDL62Q1500C-03
• Coprocessor for multiplication and divisioSmin
− Multiplication
: 16bit × 16bit (operation time: 4 cycles)
: 32bit ÷ 16bit (operation time: 8 cycles)
: 32bit ÷ 32bit (operation time: 16 cycles)
− Division
− Division
− Multiply-accumulate (non-saturating): 16bit × 16bit + 32bit (operation time: 4 cycles)
− Multiply-accumulate (saturating): 16bit × 16bit + 32bit (operation time: 4 cycles)
− Signed or Unsigned is selectable
• Operating voltage and temperature
‒ Operating voltage: VDD = 1.6 to 5.5 V (VDD should be 1.8V or over at Power-on)
‒ Operating temperature: -40 °C to +105 °C
• Internal memory
‒ Program memory area
Rewrite count: 100 cycles
Write unit: 32bit(4byte)
Erase unit: 16Kbyte/1Kbyte
Erase/Write temperature: 0 °C to +40 °C
‒ Data Flash memory area
Rewrite count 10,000 cycles
Write unit: 8bit(1byte)
Erase unit: all area/128byte
Erase/Write temperature: -40 °C to +85 °C
Back Ground Operation (CPU can work while erasing and rewriting)
This product uses Super Flash® technology licensed from Silicon Storage Technology, Inc.
Super Flash® is a registered trademark of Silicon Storage Technology, Inc.
‒ Data RAM area
Rewrite unit: 8bit/16bit (1byte/2byte)
Parity check function is available (interrupt / reset are generatable at Parity error)
• Clock generation circuit
‒ Low-speed clock (LSCLK)
Internal low-speed RC oscillation: Approximately 32.768 kHz
External low-speed clock input: Approximately 32.768 kHz
External low-speed crystal oscillation: 32.768 kHz crystal resonator is connectable
3 selectable crystal oscillation mode (Tough, Normal, and Low current consumption)
⋅
⋅
⋅
Tough mode: Largest oscillation allowance to make highest resistance against leakage between the pins
Normal mode: Normal oscillation allowance and current consumption
Low current consumption mode: Smallest oscillation allowance to make lower current consumption
‒ High-speed clock (HSCLK)
PLL oscillation: 2 selectable oscillation frequency (24MHz and 16MHz) by code option
‒ Watch Dog Timer (WDT): built-in independent clock for WDT (RC1K: Approximately 1kHz)
• Reset
‒ Reset by reset input pin
‒ Reset by Power-On Reset
‒ Reset by WDT overflow
‒ Reset by WDT invalid clear
‒ Reset by RAM parity error
‒ Reset by unused ROM area access (instruction access)
‒ Reset by voltage level supervisor (VLS)
‒ Software reset by BRK instruction (reset CPU only)
‒ Reset the peripherals individually
‒ Collective reset to the all control pins and peripheral circuits
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FEDL62Q1500C-03
• Power management
‒ HALT mode: CPU stops executing instruction, peripheral circuits continue working
‒ HALT-H mode: CPU stops executing instruction, high-speed clock oscillation stops and peripheral circuits continue
working with low-speed clock
‒ HALT-C mode: CPU stops executing instruction, high-speed clock oscillation stops and peripheral circuits working with
low-speed clock remain previous states. Peripheral circuits can work only watchdog timer, external interrupt, low-speed
time base counter, 16-bit timers, and crystal oscillation circuit.
‒ STOP mode: CPU and peripheral circuits stops executing instruction, both high-speed oscillation and low-speed
oscillation stop.
‒ STOP-D mode: CPU and peripheral circuits stops executing instruction, both high-speed oscillation and low-speed
oscillation stop. The internal logic voltage (VDDL) goes down to reduce the current consumption (RAM data is retained).
‒ Clock gear: High-speed system clock frequency can be changed (1/1, 1/2, 1/4, 1/8, 1/16 or 1/32 of HSCLK)
‒ Block Control Function: Powers down the unused function blocks (reset the block or stop supplying the clock)
• Interrupt controller
− External interrupt ports: max. 12
− Non-maskable interrupt source: 1 (Internal sources: WDT)
− Maskable interrupt sources: max. 43
− Four step interrupt levels
• Watchdog timer (WDT)
‒ Selectable Operating clock: select RC1K or LSCLK by code option
‒ Overflow period: 8selectable (7.8ms, 15.6ms, 31.3ms, 62.5ms, 125ms, 500ms, 2s and 8s)
‒ Selectable window function (enable or disable): configurable clear enable period (50% or 75% of overflow period)
‒ Selectable WDT operation: select Enable or Disable by code option
‒ Readable WDT counter: WDT counter monitor function
• DMA (Direct Memory Access) controller
− Channel: 2channel
− Transfer unit: 8bit/16bit
− Transfer count: 1 to 1024
− Transfer cycle: 2 cycle transfer
− Transfer address: Fixed addressing mode, inclement addressing mode, and decrement addressing mode
− Transfer target: Special Function Register (SFR)/RAM SFR/RAM (Transfer from/to Flash is not supported)
− Transfer request: External pins, Serial communication unit, Successive approximation type A/D converter, 16bit timer,
and Functional timer
• Low-speed Time base counter
− Generate 8 frequency (128Hz to1Hz) internal pulse signals by dividing the Low-speed clock (LSCLK)
− Selectable 3 interrupts from eight frequency internal pulse signals
− 1Hz or 2Hz output from general purpose port
− Built-in Frequency adjust function: Adjust range: Approximately -488ppm to +488ppm, adjust resolution:
Approximately 0.119ppm
• Simplified RTC
− Channel: 1channel
− Count by a unit for one second from "00 min. 00 sec" to "59 min. 59 sec"
− Selectable Periodical interrupt request from four periods (0.5s, 1s, 30s or 60s)
− Built-in minute and second writing error protraction function
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FEDL62Q1500C-03
• Functional timer
− Channel: 6channel
− Built-in timer, capture, and PWM function by 16 bit counter
− One shot mode is available
− Two types of PWM output with the same period and different duties, and complementary PWM output with the dead time
− Monitor input signal duty and the period by capture function
− Generate periodical interrupts, duty interrupts, and interrupts coincided with set value
− Counter Start, Stop, Counter clear triggered by an external inputs or Timer
− Generate Emergency stop and emergency stop interrupt triggered by an external input
− Same start/stop among different channels of the functional timer
− Selectable counter clock (external clock or divided by 1 to 128 of LSCLK or HSCLK) for each channels
• 16-bit General timers
− Channel: 6channel
‒ 8 bits timer mode and 16-bit timer mode
− Same start/stop among different channels of 16bit (8bit) timer
‒ Timer output (toggled by overflow)
− Selectable counter clock (external clock or divided by 1 to 128 of LSCLK or HSCLK) for each channels
• Serial communication unit
− Synchronous Serial Port (SSIO) mode or UART mode is selectable
− Channel: Max. 4channel
< Synchronous Serial Port mode>
‒ Selectable from Master and Slave
‒ Selectable from LSB first or MSB first
‒ Selectable 8-bit length or 16-bit length
< UART mode>
‒ Full-duplex communication mode and half-duplex communication mode
‒ 5 to 8 bit length, parity or no parity, odd parity or even parity, 1 stop bit or 2 stop bits
‒ Selectable from Positive logic or Negative logic
‒ Selectable from LSB first or MSB first
‒ Configurable wide range communication speed
32.768kHz operation clock: 1 bit/s to 4,800 bit/s
24MHz operation clock: 600 bit/s to 3M bit/s
16MHz operation clock: 300 bit/s to 2M bit/s
‒ Built-in baud rate generator
• I2C bus unit (Master / Slave)
‒ Selectable from Master mode or Slave mode
‒ Channel: 1channel
< Master function >
‒ Standard mode (100 kbit/s), fast mode (400 kbit/s) and 1Mbps mode(1Mbit/s)
‒ Handshake (Clock synchronization)
‒ 7bit address format (10bit address format is supported)
< Slave function >
‒ Standard mode (100 kbit/s), fast mode (400 kbit/s) and 1Mbps mode(1Mbit/s)
‒ Clock stretch function
‒ 7bit address format
• I2C bus Master
‒ Channel: 2channel
‒ Standard mode (100 kbit/s), fast mode (400 kbit/s) and 1Mbps mode(1Mbit/s)
‒ Handshake (Clock synchronization)
‒ 7bit address format (10bit address format is supported)
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FEDL62Q1500C-03
• General-purpose ports (GPIO)
‒ I/O port: Max. 74 (Including one pin for on-chip debug and pins for other shared functions)
‒ Input port: Max. 2 (Including a shared function)
‒ External interrupt port: Max. 12
‒ LED driver port: Max. 73
‒ Carrier frequency output function (for IR communication)
• Successive approximation type A/D converter (SA-ADC)
‒ Channel: Max.12channel
‒ Resolution: 10bit
‒ Conversion time: Min. 2.25μs / channel (When the conversion clock is 8MHz)
‒ Reference voltages are selectable
(VDD pin / Internal reference voltage (VREFI = Approximately 1.55V) / External reference voltage (VREF pin))
‒ Selected channel repeat conversion
‒ dedicated result register for each channel
‒ Interrupt determining by upper limit or lower limit threshold of conversion result
•
•
Voltage Level Supervisor (VLS)
‒ Accuracy: ±4%
‒ Threshold voltage: 12 selectable (from 1.85V to 4.00V)
‒ Functional Voltage level detection reset (VLS reset)
‒ Functional Voltage level detection interrupt (VLS0 interrupt)
Analog comparator
‒ Channel: 2channel
‒ Selectable interrupt from the comparator output (rising edge or falling edge)
‒ Selectable from sampling or without sampling
‒ Comparable with external 2 inputs
‒ Comparable with external input and internal reference voltage (0.8V)
•
•
•
D/A converter
‒ Channel: 1channel
‒ Resolution: 8bit
‒ Output impedance: 6k ohm (Typ.)
‒ R-2R ladder type
Buzzer
‒ 4 buzzer mode (Continuous sound, Single sound, Intermittent sound 1 and Intermittent sound 2)
‒ 8frequencies (4.096kHz to 293Hz)
‒ 15 step duty (1/16 to 15/16)
‒ Selectable from positive logic buzzer output or negative logic buzzer output
CRC (Cyclic Redundancy Check) generator
‒ Generation equation: X16+X12+X5+1
‒ Selectable from LSB first or MSB first
‒ Built-in Automatic program memory CRC calculation mode in HALT mode
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FEDL62Q1500C-03
•
Safety Function (IEC60730/60335 Class B)
‒ Automatic switching to the internal low-speed RC oscillation in case the low-speed crystal oscillation stopped
‒ RAM/SFR guard
‒ Automatic program memory CRC calculation
‒ RAM parity error detection
‒ ROM unused area access reset (instruction access)
‒ Clock mutual monitoring
‒ WDT counter monitoring
‒ SA-ADC test
‒ UART test
‒ Synchronous serial I/O test
‒ I2C bus test
‒ GPIO test
• Shipping package
‒ 52-pin plastic TQFP
ML62Q1543C/1544C - xxxTB (Blank part: ML62Q1543C/1544C - NNNTB)
‒ 64-pin plastic TQFP
ML62Q1553C/1554C - xxxTB (Blank part: ML62Q1553C/1554C - NNNTB)
‒ 64-pin plastic QFP
ML62Q1553C/1554C - xxxGA (Blank part: ML62Q1553C/1554C - NNNGA)
‒ 80-pin plastic QFP
ML62Q1563C/1564C - xxxGA (Blank part: ML62Q1563C/1564C - NNNGA)
xxx: ROM code number
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FEDL62Q1500C-03
ML62Q1500C Group how to read the part number
ML 62 Q 15 6 4C – xxx TB
Package Type
GA
TB
: QFP
: TQFP
ROM Code Number
NNN : Blank
xxx
: Custom Code Number
Program Memory Size
3
4
: 96Kbyte
: 128Kbyte
Pin Count
4
5
6
: 52pin
: 64pin
: 80pin
Group Name
15xxC : 1500C Group
Program Memory Type
Q
: Flash Memory
CPU Type
62
: 16-bit CPU nX-U16/100
LAPIS Technology Logic Product
Figure 1 ML62Q1500C Group Part Number
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FEDL62Q1500C-03
ML62Q1500C Group Main Function List
Table 2 ML62Q1500C Group Main Function List
Pin Interrupt Timer Serial
Analog
Part number
ML62Q1543C
ML62Q1544C
ML62Q1553C
ML62Q1554C
ML62Q1563C
ML62Q1564C
52
64
80
46 45 33
3
4
10
12
3
1
2
58 57
74 73
6
6
1
1
2
12
2
4
1
35
*1: One 16-bit timer is configurable as two 8bit timers
*2: Full-duplex UART and Synchronous Serial Port cannot be used simultaneously in the same channel.
One Full-duplex UART is configurable as two half-duplex UARTs.
*3: Shared with pins for crystal oscillation
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FEDL62Q1500C-03
BLOCK DIAGRAM
CPU (nX-U16/100)
ECSR1~3
DSR/CSR
PC
EPSW1~3
ELR1~3
LR
Multiplier/Divider
(Coprocessor)
GREG
0 ~15
PSW
EA
Timing
Controller
ALU
SP
Program
Memory
(FLASH)
BUS
Controller
Instruction
Decoder
Instruction
Register
On-Chip
ICE
VDD
VSS
INT
SU0~3_SCLK*
SU0~3_SIN*
Power
Circuit
VDDL
VREFO
RAM
SU0~3_SOUT0*
*
Serial
Communication
Unit *1
SU0~3_RXD0*
SU0~3_TXD0*
SU0~3_RXD1*
SU0~3_TXD1*
Data FLASH
RESET_N
TEST0*2
SYSTEM
INT
FLASH
Controller
Clock
Generation
Circuit
INT
OUTLSCLK*
OUTHSCLK*
I2C Bus
Unit
I2CU0_SDA*
I2CU0_SCL*
Low-speed
RC
Oscillation
Interrupt
INT
INT
I2C Bus
Master
I2CM0~1_SDA*
I2CM0~1_SCL*
INT
High-speed
PLL
Oscillation
WDT
VLS
16-Bit
Timer
TMH0~5OUT*
INT
INT
RC
Oscillation
(for WDT)
INT
INT
EXTRIG0~7
FTM0~5P*
FTM0~5N*
Low-speed
Crystal
Oscillation
Functional
Timer
XT0*3
XT1*3
DMA
Controller
INT
INT
VDD
VSS
CRC
Generator
A/D
Converter
VREF
AIN0 to AIN11*
Low Speed
Time Base
Counter
TBCOUT0*
TBCOUT1*
INT
INT
Analog
Comparator
CMP0~1P*
CMP0~1M*
Simplified
RTC
BZ0P*
BZ0N*
Buzzer
D/A
Converter
DACOUT0*
Safety
Function
INT
PX0~PX7
(X= 0~9,A,B)
PI00,PI01
GPIO
(External
Interrupt)
Reset
Function
EXI0~11
*
: Indicates the shared function of general ports.
*1 : Shared UART and Synchronous Serial Port.
*2 : Not available as the input port when connecting to the on-chip debug emulator.
*3 : Not available as the input port when connecting to the crystal resonator.
Figure 2 ML62Q1500C Group Block Diagram
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FEDL62Q1500C-03
PIN CONFIGURATION
The port names in the pin-layout indicate 1st-function. Refer to Table-3 or Table-4 about other functions.
Pin Layout of 52pin TQFP Package
39
27
P51
P41
P30
P50/EXI8
P13
P31
P12
P32
P11
P33
P10
P60
TOP VIEW
TQFP52
P07
P61
P06
P62
P05
P63
P64/EXI9
P65
P04/EXI2/EXTRG2
P71
P72
P73
P66
P43
1
13
Figure 3 Pin Layout of 52pin TQFP52 Package
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FEDL62Q1500C-03
Pin Layout of 64pin TQFP/QFP Package
48
33
P40
P41
P53
P52
P51
P30
P31
P50/EXI8
P32
P13
P33
P12
P60
P11
TOP VIEW
TQFP64/QFP64
P61
P10
P62
P07
P63
P06
P64/EXI9
P65
P05
P04/EXI2/EXTRG2
P66
P70
P71
P72
P73
P67
P42
P43
1
16
Figure 4 Pin Layout of 64pin TQFP/QFP Package
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FEDL62Q1500C-03
Pin Layout of 80pin QFP Package
60
41
PB2
PB3
P96
P95
PB4
P94
PB5
P93
P40
P53
P41
P52
P30
P51
P31
P50
P32
P13
P33
P12
TOP VIEW
QFP80
P60
P11
P61
P10
P62
P07
P63
P06
P64/EXI9
P65
P05
P04/EXI2/EXTRG2
P66
P70
P71
P72
P73
P67
P42
P43
1
20
Figure 5 Pin Layout of 80pin QFP Package
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FEDL62Q1500C-03
PIN LIST
Table 3 Pin List (1/3)
Pin No.
Pin name
(1st func)
1st func.
others
2nd func.
SIU
3rd func.
SIU
4th func.
I2C
5th func.
Timer
6th func.
others
7th func.
others
8th func.
ADC
3
4
5
1
2
6
7
8
3
4
5
1
2
6
7
8
3
4
5
1
2
6
7
8
VDD
VSS
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
VDDL
-
-
-
-
XT0
PI00
-
-
-
XT1
PI01
-
-
-
RESET_N
P00
RESET_N
TEST0
DACOUT0
-
-
-
-
-
-
P01
FTM3P
TBCOUT0
TBCOUT1
EXI0
EXTRG0
SU0_RXD0
SU0_SIN
9
11 14
P02
P03
P04
-
I2CU0_SCL
FTM0P
FTM0N
OUTLSCLK
OUTHSCLK
-
CMP0M
CMP0P
-
-
AIN11
-
EXI1
EXTRG1
SU0_TXD0
SU0_SOUT
10 12 15
17 21 25
SU0_TXD1 I2CU0_SDA
EXI2
EXTRG2
SU0_SCLK
-
I2CU0_SCL
TMH0OUT
18 22 26
19 23 27
20 24 28
21 25 29
22 26 30
P05
P06
P07
P10
P11
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
I2CM0_SDA
SU0_RXD1 SU0_RXD0 I2CM0_SCL
SU0_TXD1
SU0_SCLK
-
-
SU0_RXD0
SU0_SIN
23 27 31
24 28 32
P12
P13
-
-
-
-
TMH4OUT
-
-
-
-
-
SU0_TXD0
SU0_SOUT
SU0_TXD1
TMH1OUT
-
TMH3OUT
27 35 45
28 36 46
29 37 47
P14
P15
P16
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
I2CU0_SDA
I2CU0_SCL
SU1_SCLK
TMH5OUT
FTM1P
EXI3
EXTRG3
30 38 48
31 39 49
32 40 50
P17
P20
P21
SU0_RXD1 SU0_RXD0
-
-
-
TBCOUT0
TBCOUT1
OUTLSCLK
BZ0P
BZ0N
-
AIN0
AIN1
AIN2
-
SU0_TXD1
-
-
FTM1N
EXI4
EXTRG4
SU1_RXD0
SU1_SIN
FTM2P
SU1_TXD0
SU1_SOUT
33 41 51
34 42 52
P22
P23
-
SU1_TXD1 I2CM0_SDA
FTM2N
OUTHSCLK
-
-
-
AIN3
VREFO
EXI5
EXTRG5
VREF
SU1_SCLK
-
I2CM0_SCL TMH2OUT
SU1_RXD0
SU1_SIN
35 43 53
36 44 54
37 45 55
38 46 56
P24
P25
P26
P27
-
-
-
-
-
-
-
-
AIN4
AIN5
AIN6
AIN7
SU1_TXD0
SU1_SOUT
SU1_TXD1
-
-
-
EXI6
EXTRG6
SU1_RXD1 SU1_RXD0 I2CU0_SDA
SU2_SCLK
FTM3P
FTM3N
TBCOUT0
TBCOUT1
BZ0P
BZ0N
EXI7
EXTRG7
SU1_TXD1
I2CU0_SCL
*1
*1: No assignment to products of 52 PIN-and 80 PIN package.
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Table 3 Pin List (2/3)
Pin No.
Pin name
(1st func)
1st func.
others
2nd func.
SIU
3rd func.
SIU
4th func.
I2C
5th func.
Timer
6th func.
others
7th func.
others
8th func.
ADC
41 51 67
42 52 68
43 53 69
44 54 70
P30
P31
P32
P33
P40
P41
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TBCOUT0
TBCOUT1
SU1_RXD1 SU1_RXD0
-
-
-
-
-
-
-
-
-
SU1_TXD1
-
-
-
TMH3OUT
-
49 65
-
-
-
-
40 50 66
SU3_TXD1
*1
-
63 79
P42
-
-
-
-
-
-
-
52 64 80
P43
P44
P45
P46
-
-
-
-
-
-
-
-
-
-
-
-
TBCOUT0
TBCOUT1
AIN10
-
-
-
9
12
-
FTM3N
-
-
-
-
-
-
-
-
-
-
10 13
13 16
-
-
-
I2CU0_SDA
FTM1N
I2CU0_SCL
*1
11 14 17
P47
-
SU0_SCLK
FTM1P
-
-
-
25 29 33
26 30 34
P50
P51
P52
P53
EXI8
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
31 35
32 36
SU2_RXD1 SU2_RXD0
-
-
33 43
34 44
P54
P55
-
-
-
-
-
-
-
-
-
-
-
-
*1
*1
SU2_TXD1
*1
-
SU2_RXD0
SU2_SIN
*1
39 47 57
P56
P57
-
-
-
-
-
-
-
-
-
-
-
-
-
SU2_TXD0
SU2_SOUT
*1
SU2_TXD1
*1
-
48 58
45 55 71
46 56 72
47 57 73
48 58 74
P60
P61
P62
P63
-
-
-
-
-
-
-
-
-
-
-
-
I2CM1_SCL
-
-
-
-
-
-
-
-
-
-
I2CM1_SDA
-
-
-
-
FTM4N
FTM4P
CMP1P
CMP1M
SU3_RXD0
SU3_SIN
49 59 75
P64
EXI9
-
-
FTM5P
-
-
-
SU3_TXD0
SU3_SOUT
50 60 76
51 61 77
P65
P66
P67
-
-
-
SU3_TXD1
-
-
-
-
FTM5N
-
-
-
-
-
-
AIN8
AIN9
-
SU3_SCLK
-
-
SU3_RXD1 SU3_RXD0
-
62 78
*1
*1
-
20 24
P70
P71
P72
P73
P74
P75
P76
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
16 19 23
15 18 22
14 17 21
13 16 20
12 15 19
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
18
EXI10
-
-
*1: No assignment to products of 52 PIN-package.
14/57
FEDL62Q1500C-03
Table 3 Pin List (3/3)
Pin No.
Pin name
(1st func)
1st func.
others
2nd func.
SIU
3rd func.
SIU
4th func.
I2C
5th func.
Timer
6th func.
others
7th func.
others
8th func.
ADC
-
-
-
-
-
-
-
-
-
-
9
P80
P81
P82
P93
P94
P95
P96
PA1
PA2
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
10
11
37
38
39
40
41
42
SU2_SCLK
*1
-
-
59
PA3
EXI11
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
60
61
62
63
64
PA4
PB2
PB3
PB4
PB5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
*1: No assignment to products of 52 PIN and 64 PIN-packages.
15/57
FEDL62Q1500C-03
PIN DESCRIPTION
Table 4 Pin Description (1/5)
Function
Power
Signal name
Pin name
I/O
-
Description
Negative power supply pin (-)
Positive power supply pin (+). Connect a capacitor CV
between this pin and VSS
Logic
-
-
VSS
-
VDD
-
-
.
Power supply pin for internal logic (internal regulator’s
output). Connect a capacitor CV (1μF) between this pin
and VSS.
-
VDDL
-
-
Input pin for testing. Also, used for on-chip debug
interface or ISP function.
P00 is initialized as pull-up input mode by the system
reset.
Test
TEST0
VREFO
P00
P23
I/O
-
-
-
Reference voltage output.
Reset input.
Applying “L” level shifts the MCU in system reset mode.
Applying “H” level shifts the CPU in program running
mode.
RESET_N
RESET_N
I
Negative
Used for on-chip debug interface and ISP function.
No pull-up resistor is installed.
System
Low-speed crystal oscillation pins
Connect 32.768kHz crystal resonator and have
capacitors between the pin and VSS.
XT0
XT1
XT0
XT1
I
-
-
O
P02
P21
P03
P22
OUTLSCLK
OUTHSCLK
O
O
Low-speed clock output.
High-speed clock output.
-
-
General purpose input.
Not available as general inputs when using the crystal
resonator.
General input port
(GPI)
PI00, PI01
XT0, XT1
I
Positive
General purpose I/O port
- High-impedance
- Input with Pull-UP (initial value)
- Input without Pull-UP
- CMOS output
P00
P00
I/O
Positive
- N-channel open drain output
Not available to use as I/O pin when using for on-chip
debug interface or ISP function.
P01 – P07
P10 – P17
P20 – P27
P30 – P33
P40 – P47
P50 – P57
P60 – P67
P70 – P76
P80 – P82
P93 – P96
PA1 – PA4
PB2 – PB5
P01 – P07
P10 – P17
P20 – P27
P30 – P33
P40 – P47
P50 – P57
P60 – P67
P70 – P76
P80 – P82
P93 – P96
PA1 – PA4
PB2 – PB5
General port
(GPIO)
General I/O port
- High-impedance (initial value)
- Input with Pull-UP
- Input without Pull-UP
- CMOS output
- N-channel open drain output
I/O
Positive
16/57
FEDL62Q1500C-03
Logic
Table 4 Pin Description (2/5)
Function
Signal name
SU0_TXD0
Pin name
I/O
Description
P03
P13
P02
P07
P12
P17
P03
P10
P13
P20
P07
P17
P22
P25
P21
P24
P26
P32
P22
P25
P27
P33
P26
P32
P57
P54
P56
P55
P57
P54
P65
P64
P67
P42
P65
P67
O
Serial communication unit0 UART0 data output
Positive
Serial communication unit0 Full-duplex data input
Serial communication unit0 UART0 data input
SU0_RXD0
SU0_TXD1
I
Positive
Serial communication unit0 Full-duplex data output
Serial communication unit0 UART1 data output
O
Positive
SU0_RXD1
SU1_TXD0
I
Serial communication unit0 UART1 data input
Serial communication unit1 UART0 data output
Positive
Positive
O
Serial communication unit1 Full-duplex data input
Serial communication unit1 UART0 data input
SU1_RXD0
SU1_TXD1
I
Positive
Positive
UART
Serial communication unit1 Full-duplex data output
Serial communication unit1 UART1 data output
O
SU1_RXD1
SU2_TXD0
SU2_RXD0
I
O
I
Serial communication unit1 UART1 data input
Serial communication unit2 UART0 data output
Positive
Positive
Positive
Serial communication unit2 Full-duplex data input
Serial communication unit2 UART0 data input
Serial communication unit2 Full-duplex data output
Serial communication unit2 UART1 data output
SU2_TXD1
O
Positive
SU2_RXD1
SU3_TXD0
I
Serial communication unit2 UART1 data input
Serial communication unit3 UART0 data output
Positive
Positive
O
Serial communication unit3 Full-duplex data input
Serial communication unit3 UART0 data input
SU3_RXD0
I
Positive
Serial communication unit3 Full-duplex data output
Serial communication unit3 UART1 data output
SU3_TXD1
SU3_RXD1
O
I
Positive
Positive
Serial communication unit3 UART1 data input
17/57
FEDL62Q1500C-03
Logic
Table 4 Pin Description (3/5)
Function
Signal name
SU0_SIN
Pin name
I/O
Description
P02
P12
P04
P11
P47
P03
P13
P21
P24
P16
P23
P22
P25
P56
P27
PA3
Serial communication unit0 Synchronous serial data
input
I
Positive
Serial communication unit0 Synchronous serial clock
I/O
SU0_SCK
I/O
Positive
Serial communication unit0 Synchronous serial data
output
SU0_SOUT
SU1_SIN
O
I
Positive
Positive
Positive
Serial communication unit1 Synchronous serial data
input
Serial communication unit1 Synchronous serial clock
I/O
SU1_SCK
I/O
Synchronous Serial
Port
Serial communication unit1 Synchronous serial data
output
SU1_SOUT
SU2_SIN
O
I
Positive
Positive
Positive
Serial communication unit2 Synchronous serial data
Serial communication unit2 Synchronous serial clock
I/O
SU2_SCLK
I/O
Serial communication unit2 Synchronous serial data
output
SU2_SOUT
SU3_SIN
P57
P64
P66
P65
O
I
Positive
Positive
Positive
Positive
Serial communication unit3 Synchronous serial data
input
Serial communication unit3 Synchronous serial clock
I/O
SU3_SCLK
SU3_SOUT
I/O
O
Serial communication unit3 Synchronous serial data
output
P03
P15
P26
P46
P02
P04
P16
P27
P47
P06
I2C Unit0 (Master and Salve) Data I/O
I/O N-channel open drain
I2CU0_SDA
I2CU0_SCL
Positive
Positive
Connect a pull-up resistor externally
I2C Unit0 (Master and Salve) Clock I/O
I/O N-channel open drain output
Connect a pull-up resistor externally
I2C Master0 Data I/O pin
I/O N-channel open drain output
Connect a pull-up resistor externally
I2C Master0 Clock I/O
I/O N-channel open drain output
Connect a pull-up resistor externally
I2C Master1 Data I/O
I/O N-channel open drain output
Connect a pull-up resistor externally
I2C Master1 Clock I/O
I/O N-channel open drain output
Connect a pull-up resistor externally
I2C Bus
I2CM0_SDA
I2CM0_SCL
I2CM1_SDA
I2CM1_SCL
Positive
Positive
Positive
Positive
P22
P07
P23
P61
P60
18/57
FEDL62Q1500C-03
Table 4 Pin Description (4/5)
Function
Signal name
FTM0P
Pin name
I/O
O
Description
Functional Timer0 P output
Logic
P02
P03
P17
P47
P20
P46
P21
P22
P01
P26
P27
P44
P63
P62
P64
P65
P02
P03
P04
P17
P21
P23
P26
P27
P04
P13
P23
P13
P33
P12
P16
P02
P03
P01
P17
P26
P31
P43
P01
P20
P27
P31
P43
P17
P26
P20
P27
Positive
Negative
FTM0N
O
Functional Timer0 N output
FTM1P
FTM1N
O
O
Functional Timer1 P output
Positive
Functional Timer1 N output
Negative
FTM2P
FTM2N
O
O
Functional Timer2 P output
Functional Timer2 N output
Positive
Negative
FTM3P
FTM3N
O
O
Functional Timer3 P output
Functional Timer3 N output
Positive
Negative
Functional Timer
(FTM)
FTM4P
FTM4N
O
O
O
O
I
Functional Timer4 P output
Positive
Functional Timer4 N output
Negative
FTM5P
Functional Timer5 P output
Positive
FTM5N
Functional Timer5 N output
Negative
EXTRG0
EXTRG1
EXTRG2
EXTRG3
EXTRG4
EXTRG5
EXTRG6
EXTRG7
TMH0OUT
TMH1OUT
TMH2OUT
Functional Timer event trigger input
Functional Timer event trigger input
Functional Timer event trigger input
Functional Timer event trigger input
Functional Timer event trigger input
Functional Timer event trigger input
Functional Timer event trigger input
Functional Timer event trigger input
16bit General Timer 0 output
-
I
-
I
-
I
-
I
-
I
-
I
-
I
-
O
O
O
Positive
Positive
Positive
16bit General Timer 1 output
16bit General Timer 2 output
TMH3OUT
O
16bit General Timer 3 output
Positive
16-bit Timer
TMH4OUT
TMH5OUT
EXTRG0
O
O
I
16bit General Timer 4 output
16bit General Timer 5 output
16bit Timer trigger input
Positive
Positive
-
-
EXTRG1
I
16bit Timer trigger input
The virtual frequency adjustment signal output or The
low speed time base counter output signal
TBCOUT0
TBCOUT1
O
O
Positive
Positive
Low-speed
Time Base Counter
(LTBC)
1Hz/2Hz clock output for the Simplified RTC
BZ0P
BZ0N
O
O
Buzzer output (positive phase)
Buzzer output (negative phase)
Positive
Buzzer
Negative
19/57
FEDL62Q1500C-03
Table 4 Pin Description (5/5)
Function
Signal name
EXI0
Pin name
I/O
I
Description
External Interrupt 0 Input
Logic
P02
P03
P04
P17
P21
P23
P26
P27
P50
P64
P76
PA3
P23
P17
P20
P21
P22
P24
P25
P26
P27
P65
P66
P43
P03
P03
P02
P62
P63
P01
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EXI1
I
External Interrupt 1 Input
External Interrupt 2 Input
External Interrupt 3 Input
External Interrupt 4 Input
External Interrupt 5 Input
External Interrupt 6 Input
External Interrupt 7 Input
External Interrupt 8 Input
External Interrupt 9 Input
External Interrupt 10 Input
External Interrupt 11 Input
SA-ADC external reference voltage input
SA-ADC channel 0 input
EXI2
I
EXI3
I
EXI4
I
EXI5
I
External Interrupt
EXI6
I
EXI7
I
EXI8
I
EXI9
I
EXI10
EXI11
VREF
I
I
-
I
AIN0
AIN1
I
SA-ADC channel 1 input
AIN2
I
SA-ADC channel 2 input
AIN3
I
SA-ADC channel 3 input
AIN4
I
SA-ADC channel 4 input
Successive
approximation type
A/D converter
AIN5
I
SA-ADC channel 5 input
AIN6
I
SA-ADC channel 6 input
AIN7
I
SA-ADC channel 7 input
AIN8
I
SA-ADC channel 8 input
AIN9
I
SA-ADC channel 9 input
AIN10
AIN11
CMP0P
CMP0M
CMP1P
CMP1M
DACOUT
I
SA-ADC channel 10 input
SA-ADC channel 11 input
Comparator input 0 (noninverting input)
Comparator input 0 (inverting input)
Comparator input 1 (noninverting input)
Comparator input 1 (inverting input)
D/A converter 0 output
I
I
I
Analog comparator
D/A converter
I
I
O
20/57
FEDL62Q1500C-03
TERMINATION OF UNUSED PINS
Table 5 Termination of unused pins
Recommended pin termination
Connect to VDD
Connect to VDD with initial state (pulled-up input mode)
Pin
RESET_N
.
P00/TEST0
XT0/PI00, XT1/PI01
P01 to P07
P10 to P17
P20 to P27
P30 to P33
P40 to P47
P50 to P57
P60 to P67
P70 to P76
P80 to P82
P93 to P96
PA1 to PA4
PB2 to PB5
Open with initial state(Hi-impedance)
[Note]
Terminate unused input pins according to the table 5 in order to avoid unexpected through-current in the
pins.
21/57
FEDL62Q1500C-03
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
(VSS = 0V)
Unit
Parameter
Power supply voltage 1
Power supply voltage 2
Input voltage
Symbol
Condition
Ta = +25°C
Ta = +25°C
Ta = +25°C
Ta = +25°C
Rating
VDD
VDDL
VIN
-0.3 to +6.5
-0.3 to +2.0
-0.3 to VDD+0.3*1
-0.3 to VDD+0.3*1
-40*2
V
V
V
V
Output voltage
VOUT
1pin
Total
1pin
“H” level output current
“L” level output current
IOUTH
IOUTL
mA
mA
Ta = +25°C
Ta = +25°C
Ta = +25°C
-180*2
+40
Total
+180
Power dissipation
PD
1
W
Storage temperature
TSTG
-
-55 to +150
°C
*1 6.5V or lower
*2 The current flowing out the LSI through the pin is described in the negative number.
The applicable maximum current is the absolute value.
For example, -1mA means the maximum current 1mA flows out the LSI through the pin.
[Note]
Use the product within absolute maximum ratings. The absolute maximum ratings are conditions which
may physically deteriorate the quality of product.
Recommended Operating Conditions
(VSS = 0V)
Parameter
Symbol
Ta
Condition
Range
Unit
°C
°C
V
Operating temperature (Ambient)
Operating temperature (Chip-Junction)
Operating voltage 1
-
-40 to +105
-40 to +115
1.6 to 5.5
30k to 4M
30k to 25M
1.0 ±30%
Tj
-
VDD
-
VDD = 1.6 to 5.5V
VDD = 1.8 to 5.5V
-
Operating frequency (CPU)
VDDL pin external capacitance
fOP
CL
Hz
μF
22/57
FEDL62Q1500C-03
Thermal characteristics
The maximum chip-junction temperature, Tjmax, may be calculated using the following equation.
푇
ꢀ 푚ꢀꢁ
= 푇
+ 푃퐷 푚ꢀꢁ × 휃
푗 푚ꢀꢁ
푇
ꢀ 푚ꢀꢁ 푗ꢀ
: maximum ambient temperature
푃퐷 푚ꢀꢁ ∶ LSI maximum power dissipation
: Package junction to ambient thermal resistance
휃
푗ꢀ
Design a Mounting board by considering heat radiation such as power dissipation and ambient temperature to satisfy the
recommended conditions.
The following table shows each package’s thermal resistance for thermal design reference estimated by simulation based on the
PCB (printed circuit board) conditions define as a below.
Value
Parameter
Symbol
Package type
Unit
L1
L2
TQFP52
TQFP64
QFP64
QFP80
61.7
63.2
47.2
55.5
56.7
58.2
43.3
51.6
Thermal
resistance
θja
oC/W
PCB conditions:
PCB name
L1
L2
Unit
mm
PCB size (L / W / T)
Number of layers
Wiring density
114.3 / 76.2 / 1.6
1
114.3 / 76.2 / 1.6
2
layer
―
60% (top layer)
60% (top and bottom layer)
Wind condition
No wind (0m/s)
―
23/57
FEDL62Q1500C-03
Current Consumption
(VDD=1.6 to 5.5V, VSS =0V, Ta=-40 to +105oC, unless otherwise specified)
Measurin
Parameter
Symbol
IDD0
Condition
Min.
Typ.*3
Max.
34
68
38
74
42
80
42
80
40
76
Unit
g circuit
Ta = -40 to
+85 oC
-
-
-
-
-
-
-
-
-
-
CPU is in STOP-D state.
All oscillations are stopped.
Supply current 0
Supply current 1
Supply current 2-1
Supply current 2-2
Supply current 2-3
0.8
µA
Ta = -40 to
+105 oC
Ta = -40 to
+85 oC
CPU is in STOP state.
All oscillations are stopped.
IDD1
1.2
4.0
3.0
2.2
µA
µA
µA
Ta = -40 to
+105 oC
Ta = -40 to
+85 oC
Low-speed RC32K Oscillating.*1
CPU is in HALT state.
IDD2-1
IDD2-2
IDD2-3
Ta = -40 to
+105 oC
PLL oscillation is stopped.
Ta = -40 to
+85 oC
Low-speed Crystal Oscillating.*1*4
CPU is in HALT state.
Ta = -40 to
+105 oC
PLL oscillation is stopped.
1
Ta = -40 to
+85 oC
Low-speed Crystal Oscillating.*1*4
CPU is in HALT-C state.
µA
µA
Ta = -40 to
+105 oC
PLL oscillation is stopped.
CPU: Running with low-speed
RC32K oscillation clock*1*2
PLL oscillation is stopped.
Ta = -40 to
+105 oC
Supply current 3
Supply current 4
IDD3
IDD4
-
-
17
104
4.0
CPU: Running with 16MHz PLL
oscillating clock*1*2
Ta = -40 to
+105 oC
3.2
PLL 16MHz is oscillating.
VDD=1.8~5.5V
mA
CPU: Running with 24MHz PLL
oscillating clock*1*2
Ta = -40 to
+105 oC
Supply current 5
IDD5
-
4.5
5.2
PLL 24MHz is oscillating.
VDD=1.8~5.5V
*1 LTBC and WDT is operating, Significant bits of BCKCON0-3 and BRECON0-3 registers are all “1”
*2 CPU running in wait mode
*3 On the condition of VDD=3.0V, Ta=+25 oC
*4 When the noise filter is not used in the low power consumption mode
24/57
FEDL62Q1500C-03
Low-speed Crystal Oscillation
(VDD=1.6 to 5.5V, VSS =0V, Ta=-40 to +105oC, unless otherwise specified)
Range
Typ.
Parameter
Symbol
Condition
Unit
Min.
-
Max.
-
Crystal oscillation
frequency *1 *2
fXTL
-
-
32.768
kHz
s
Crystal oscillation start
time
TXTL
-
-
2
*1: The oscillation frequency is determined by the oscillation circuit, crystal resonator and the external capacitance
(CGL/CDL). As those parameters changes depending the crystal resonator, it requires evaluation on the actual PCB
circuit for matching. Ask crystal resonator makers for matching and confirm the oscillation characteristics.
*2: The quality of oscillation characteristics might be lost, depending on material of PCB, condition of wiring
capacitance or parasitic capacitance on the external circuits. Note for designing the external circuit.
- Make the wires on the external circuit as short as possible.
- Place the crystal resonator and oscillation circuit as close to the MCU as possible and make the wires between
the external capacitance and crystal resonator as short as possible.
- Ensure no signal line flowing big current runs near the oscillation circuit.
- Ensure no signal line runs under and near the oscillation circuit.
- Make ground of external capacitance the same as MCU ground VSS pin and connect them to the ground that has
low variation of current and voltage.
- The quality of oscillation characteristics might be lost depending on operating environment due to moisture
absorption of PCB and condensation of PCB surface, recommended to have measures such as covering the
oscillation circuit with resin.
Low-speed Crystal Oscillation external circuit example
XT0
XT1
VSS
Crystal resonator
(32.768kHz)
CDL
CGL
External Clock Input
(VDD=1.6 to 5.5V, VSS =0V, Ta=-40 to +105oC, unless otherwise specified)
Range
Parameter
Symbol
Condition
Unit
Min.
Typ.
Max.
Typ.
-1.0%
Typ.
+1.0%
Input Frequency
Input pulse width
fEXCK
-
-
32.768
kHz
s
1/fEXCK
x 0.4
1/fEXCK
x 0.6
tEXCKW
-
25/57
FEDL62Q1500C-03
On-chip Oscillator
(VDD=1.6 to 5.5V, VSS =0V, Ta=−40 to +105οC, unless otherwise specified)
Measuri
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
ng
circuit
Typ.
-1.0%
Typ.
+1.0%
Ta= +25°C
32.768
32.768
32.768
32.768
32.768
32.768
16/24
VDD = 1.8 to 5.5V
Typ.
-2.5%
Typ.
+2.5%
Ta= -40 to +85°C
VDD = 1.8 to 5.5V
Low-speed RC oscillator
frequency accuracy 1
fRCL1
Typ.
-3.0%
Typ.
+3.0%
Ta= -40 to +105°C
VDD = 1.8 to 5.5V
Without software adjustment
kHz
Typ.
-3.5%
Typ.
+3.5%
VDD = 1.6 to 1.8V
Typ.
-1.0%
Typ.
+1.0%
Ta= -40 to +85°C
VDD = 1.8 to 5.5V
Low-speed RC oscillator
frequency accuracy 2
With software adjustment
fRCL2
fPLL1
fPLL2
Typ.
-1.5%
Typ.
+1.5%
Ta= -40 to +105°C
VDD = 1.8 to 5.5V
1
Typ.
-2.5%
Typ.
+2.5%
Ta= -40 to +85°C
VDD = 1.8 to 5.5V
PLL oscillation frequency
accuracy 1
Without software adjustment
Typ.
-3.0%
Typ.
+3.0%
Ta= -40 to +105°C
VDD = 1.8 to 5.5V
16/24
Typ.
-3.5%
Typ.
+3.5%
VDD = 1.6 to 5.5V
16/24
MHz
Typ.
-1.0%
Typ.
+1.0%
Ta= -40 to +85°C
VDD = 1.8 to 5.5V
16/24
PLL oscillation frequency
accuracy 2
Typ.
-1.5%
Typ.
+1.5%
Ta= -40 to +105°C
VDD = 1.8 to 5.5V
With software adjustment
16/24
PLL oscillation start time
TPLL
VDD = 1.6 to 5.5V
-
-
2
ms
1kHz Low-speed RC oscillator
(for WDT) frequency accuracy
Ta= -40 to +105°C
VDD = 1.6 to 5.5V
fRC1K
0.5
1
2.5
kHz
26/57
FEDL62Q1500C-03
Input / Output pin 1
(VDD=1.6 to 5.5V, VSS =0V, Ta=−40 to +105οC, unless otherwise specified)
Measur
ing
circuit
Symbol
VOH1
Parameter
Condition
Min.
Typ.
Max.
Unit
Output voltage1
“H”/“L” level
(P00-P07)
(P10-P17)
(P20-P27)
(P30-P33)
(P40-P47)
(P50-P57)
(P60-P67)
(P70-P76)
(P80-P82)
(P93-P96)
(PA1-PA4)
(PB2-PB5)
IOH1=-10mA
VDD≥4.5V
VDD
-1.5
-
-
-
-
IOH1=-1mA
VDD≥1.6V
VDD
-0.5
IOL1=+10mA
VDD≥4.5V
-
-
-
-
1.5
0.5
VOL1
IOL1=+1mA
VDD≥1.6V
V
2
Output voltage2
“L” level
IOL2=+15mA
-
-
-
-
0.7
0.5
VDD≥4.5V
(P01-P07)
(P10-P17)
(P20-P27)
(P30-P33)
(P40-P47)
(P50-P57)
(P60-P67)
(P70-P76)
(P80-P82)
(P93-P96)
(PA1-PA4)
(PB2-PB5)
IOL2=+8mA
VDD≥3.0V
When N-ch open
drain output
VOL2
mode is selected
IOL2=+3mA
-
-
-
-
0.4
0.4
VDD≥2.0V
IOL2=+2mA
VDD≥1.6V
27/57
FEDL62Q1500C-03
Input / Output pin 2
(VDD=1.6 to 5.5V, VSS =0V, Ta=−40 to +105οC, unless otherwise specified)
Measu
ring
circuit
Symbol
IOH1
Parameter
Condition
Min.
Typ.
Max. Unit
VDD≥4.5V
VDD≥1.6V
-10*3*5
-1*3*5
-
-
-
-
“H” level output
current1 *6
1pin
Total of ‘P00-P07,
P10-P13, P44-P47,
P50-P53, P70-P76,
P80-P82,P93-P96’
or
Total of ‘P14-P17,
P20-P27, P30-P33,
P40-P43, P54-P57
P60-P67, PA1-PA4,
PB2-PB5’
VDD≥4.5V
VDD≥1.6V
-90*5
-20*5
-
-
-
-
“H” level output
total current *1*4
IOH3
(duty≤50%)
VDD≥4.5V
VDD≥1.6V
VDD≥4.5V
VDD≥1.6V
VDD≥4.5V
VDD≥3.0V
VDD≥2.0V
VDD≥1.6V
-180*5
-40*5
-
-
-
-
-
-
-
-
-
-
All pin totals
(duty≤50%)
-
-
-
-
-
-
10*3
1*3
15*3
8*3
3*3
2*3
“L” level output
current1 *6
1pin (CMOS output
mode)
IOL1
IOL2
mA
“L” level output
current2 *6
1pin (N-ch open drain
output mode)
Total of ‘P00-P07,
P10-P13, P44-P47,
P50-P53, P70-P76,
P80-P82,P93-P96’
or
Total of ‘P14-P17,
P20-P27, P30-P33,
P40-P43, P54-P57
P60-P67, PA1-PA4,
PB2-PB5’
VDD≥4.5V
VDD≥3.0V
VDD≥2.0V
VDD≥1.6V
-
-
-
-
-
-
-
-
90
40
15
10
3
“L” level output
total current *2*4
IOL3
(N-ch open drain output
mode, duty≤50%)
All pin totals
(N-ch open drain output
mode, duty≤50%)
VDD≥4.5V
VDD≥1.6V
-
-
-
-
180
20
Output leak
(P00-P07)
(P10-P17)
(P20-P27)
(P30-P33)
(P40-P47)
(P50-P57)
(P60-P67)
(P70-P76)
(P80-P82)
(P93-P96)
(PA1-PA4)
(PB2-PB5)
IOOH
IOOL
VOH=VDD (High impedance mode)
VOL=VSS (High impedance mode)
-
-
-
+1
μA
-
-1*5
28/57
FEDL62Q1500C-03
*1 Sink-out current from VDD to the output pin, which can guarantee the device operation.
*2 Sink-in current from the output pin to VSS, which can guarantee the device operation.
*3 Do not beyond total current.
*4 The total current is on the condition of Duty≤50% (same applies to IOH1).
When the duty>50% the total current is calculated by following formula.
Total current = IOL3 x 50/n (When the duty is n%)
<For an example> When IOL3=100mA and n=80%,
Total current = IOL3 x 50/80 = 62.5mA
Current allowed per 1pin is independent of the duty and specified as IOL1 and IOL2.
Do not apply current larger than Absolute Maximum Ratings.
*5 The current flowing out the LSI through the pin is described in the negative number.
The applicable maximum current is the absolute value.
For example, -1mA means the maximum current 1mA flows out the LSI through the pin.
*6 VOH1, VOL1, and VOL2 are satisfied with this spec.
29/57
FEDL62Q1500C-03
Input / Output pin 3
(VDD=1.6 to 5.5V, VSS =0V, Ta=−40 to +105οC, unless otherwise specified)
Measur
ing
circuit
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
IIH1
IIL1
IIL2
V/IIL2
IIH2Z
IIL2Z
VIH1=VDD
VIL1=VSS
-
-
-
1
-
Input current1
(RESET_N)
-1*1
μA
VIL2=VSS (pull-up mode) *2
VIL2=VSS (pull-up mode) *2
VIH1=VDD (High impedance mode)
VIL1=VSS (High impedance mode)
-1500*1 -300*1 -20*1
3.7
-
10
-
-
80
1
-
kΩ
Input current2
(P00/TEST0)
-1*1
μA
Input current3
(P01-P07)
(P10-P17)
(P20-P27)
(P30-P33)
(P40-P47)
(P50-P57)
(P60-P67)
(P70-P77)
(P80-P82)
(P93-P96)
(PA1-PA4)
(PB2-PB5)
Input current4
(PI00-PI01)
Input voltage1
(RESET_N)
(P01-P07)
(P10-P17)
(P20-P27)
(P30-P33)
(P40-P47)
(P50-P57)
(P60-P67)
(P70-P77)
(P80-P82)
(P93-P96)
(PA1-PA4)
(PB2-PB5)
(PI00-PI01)
IIL3
VIL1=VSS (pull-up mode) *2
-250*1
-30*1
100
-
-2*1
800
1
4
V/IIL3
IIH3Z
VIL1=VSS (pull-up mode) *2
22
-
kΩ
VIH1=VDD (High impedance mode)
μA
IIL3Z
VIL1=VSS (High impedance mode)
-1*1
-
-
IIH4
IIL4
VIH1=VDD
VIL1=VSS
-
-
-
1
-
-1*1
0.7
x VDD
VIH1
VIL1
-
-
-
-
VDD
V
5
0.3
x VDD
0
0.7
x VDD
VIH2
VIL2
-
-
-
-
VDD
Input voltage2
(P00/TEST0)
0.25
x VDD
0
Pin capacitance
(RESET_N)
(P00/TEST0)
(P01-P07)
(P10-P17)
(P20-P27)
(P30-P33)
(P40-P47)
(P50-P57)
(P60-P67)
(P70-P77)
(P80-P82)
(P93-P96)
(PA1-PA4)
(PB2-PB5)
(PI00-PI01)
f = 10kHz
Ta = +25°C
CPIN
-
-
10
pF
-
*1 The current flowing out the LSI through the pin is described in the negative number. The applicable maximum current
is the absolute value. For example, -1mA means the maximum current 1mA flows out the LSI through the pin.
*2 Measurement conditions: Typ.: VDD = 3.0V, Max.: VDD = 1.6V, Min.: VDD = 5.5V
30/57
FEDL62Q1500C-03
Synchronous Serial Port
Slave mode
(VDD=1.8 to 5.5V, VSS =0V, Ta=−40 to +105οC, unless otherwise specified)
Symbol
tSCYC
tSW
Parameter
Condition
Min.
1 *2
0.5 *3
Typ.
Max.
Unit
µs
SCK input cycle
-
-
-
-
-
-
SCK input pulse width
µs
100+
V
DD=2.4 to 5.5V
-
-
-
-
-
ns
ns
ns
ns
HSCLK*1×3
SOUT output delay time
SIN input setup time
tSD
200+
VDD=1.8 to 5.5V
-
HSCLK*1×3
HSCLK*1
x1
tSS
tSH
-
-
-
-
80+
SIN input hold time
HSCLK*1×3
*1 Cycle of high speed clock
*2 Need input cycles of HSCLK x8 or longer
*3 Need input cycles of HSCLK x4 or longer
tSCYC
tSW
tSW
0.7×VDD
SUn_SCLK*
0.3×VDD
tSD
tSD
0.7×VDD
0.3×VDD
SUn_SOUT*
tSS
tSH
0.7×VDD
0.3×VDD
SUn_SIN*
*:2nd to 8th function of port, n=0~3
31/57
FEDL62Q1500C-03
Master mode
Parameter
(VDD=1.8 to 5.5V, VSS =0V, Ta=−40 to +105οC, unless otherwise specified)
Symbol
tSCYC
Condition
-
Min.
Typ.
SCLK*1
Max.
Unit
ns
SCK output cycle
-
-
SCLK*1
×0.4
SCLK*1
×0.5
SCLK*1
×0.6
SCK output pulse width
tSW
tSD
tSS
tSH
-
ns
VDD=2.4 to 5.5V
VDD=1.8 to 5.5V
VDD=2.4 to 5.5V
VDD=1.8 to 5.5V
VDD=2.4 to 5.5V
VDD=1.8 to 5.5V
-
-
-
-
-
-
-
100
ns
ns
ns
ns
ns
ns
SOUT output delay time
SIN input setup time
SIN input hold time
-
160
120
180
80
-
-
-
-
100
*1 Clock cycle selected by bit12~8(SnCK4~0) of the serial port n mode register (SIOnMOD)
VDD≥2.4V: min250ns, VDD≥1.8V: min500ns
tSCYC
tSW
tSW
0.7×VDD
SUn_SCLK*
SUn_SOUT*
SUn_SIN*
0.3×VDD
tSD
tSD
0.7×VDD
0.3×VDD
tSS
tSH
0.7×VDD
0.3×VDD
*:2nd to 8th function of port, n=0~3
32/57
FEDL62Q1500C-03
I2C Bus Interface
Standard Mode 100kbps
(VDD=1.8 to 5.5V, VSS =0V, Ta=−40 to +105οC, unless otherwise specified)
Parameter
Symbol
fSCL
Condition
-
Min.
0
Typ.
-
Max.
100
Unit
kHz
SCL clock frequency
SCL hold time
(start/restart condition)
tHD:STA
-
4.0
-
-
µs
SCL “L” level time
SCL “H” level time
tLOW
tHIGH
-
-
4.7
4.0
-
-
-
-
µs
µs
SCL setup time
(restart condition)
tSU:STA
-
4.7
-
-
µs
SDA hold time
SDA setup time
tHD:DAT
tSU:DAT
-
-
0
-
-
-
-
µs
µs
0.25
SDA setup time
(stop condition)
tSU:STO
tBUF
-
-
4.0
4.7
-
-
-
-
µs
µs
Bus-free time
When using the I2C as the master, configure the I2C master n mode register (I2MnMOD) and I2C bus 0 mode register
(master side, I2UM0MOD) so that meet these specifications.
Start
Condition
Re-start
Condition
Stop
Condition
I2CUn_SDA
I2CMn_SDA
0.7×VDD
0.3×VDD
0.7×VDD
0.3×VDD
I2CUn_SCL
I2CMn_SCL
tSU:STO
F
tHD:STA
tLOW
tSU:STA tHD:STA
tSU:DAT tHD:DAT
tHIGH
n:0 to 1
33/57
FEDL62Q1500C-03
Fast Mode 400kbps
Parameter
(VDD=1.8 to 5.5V, VSS =0V, Ta=−40 to +105οC, unless otherwise specified)
Symbol
Condition
-
Min.
0
Typ.
-
Max.
400
Unit
kHz
SCL clock frequency
fSCL
SCL hold time
(start/restart condition)
tHD:STA
-
0.6
-
-
µs
SCL “L” level time
SCL “H” level time
tLOW
tHIGH
-
-
1.3
0.6
-
-
-
-
µs
µs
SCL setup time
(restart condition)
tSU:STA
-
0.6
-
-
µs
SDA hold time
SDA setup time
tHD:DAT
tSU:DAT
-
-
0
-
-
-
-
µs
µs
0.1
SDA setup time
(stop condition)
tSU:STO
-
0.6
-
-
µs
Bus-free time
tBUF
-
1.3
-
-
µs
When using the I2C as the master, configure the I2C master n mode register (I2MnMOD) and I2C bus 0 mode register
(master side, I2UM0MOD) so that meet these specifications.
Start
Condition
Re-start
Condition
Stop
Condition
I2CUn_SDA
I2CMn_SDA
0.7×VDD
0.3×VDD
0.7×VDD
0.3×VDD
I2CUn_SCL
I2CMn_SCL
tSU:STO
F
tHD:STA
tLOW
tSU:STA tHD:STA
tSU:DAT tHD:DAT
tHIGH
n:0 to 1
34/57
FEDL62Q1500C-03
1Mbps Mode
Parameter
(VDD=2.7 to 5.5V, VSS =0V, Ta=−40 to +105οC, unless otherwise specified)
Symbol
Condition
-
Min.
0
Typ.
-
Max.
1000
Unit
kHz
SCL clock frequency
fSCL
SCL hold time
(start/restart condition)
tHD:STA
-
0.26
-
-
µs
SCL “L” level time
SCL “H” level time
tLOW
tHIGH
-
-
0.5
-
-
-
-
µs
µs
0.26
SCL setup time
(restart condition)
tSU:STA
-
0.26
-
-
µs
SDA hold time
SDA setup time
tHD:DAT
tSU:DAT
-
-
0
-
-
-
-
µs
µs
0.1
SDA setup time
(stop condition)
tSU:STO
-
0.26
-
-
µs
Bus-free time
tBUF
-
0.5
-
-
µs
When using the I2C as the master, configure the I2C master n mode register (I2MnMOD) and I2C bus 0 mode register
(master side, I2UM0MOD) so that meet these specifications.
Start
Condition
Re-start
Condition
Stop
Condition
I2CUn_SDA
I2CMn_SDA
0.7×VDD
0.3×VDD
0.7×VDD
0.3×VDD
I2CUn_SCL
I2CMn_SCL
tSU:STO
F
tHD:STA
tLOW
tSU:STA tHD:STA
tSU:DAT tHD:DAT
tHIGH
n:0 to 1
35/57
FEDL62Q1500C-03
Reset
(VDD=1.6 to 5.5V, VSS =0V, Ta=−40 to +105οC, unless otherwise specified)
Measur
ing
circuit
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
Reset pulse width*2
P00 “H” level setup time*1
P00 “H” level hold time*1
PRST
tSP00
tHP00
-
-
-
2
1
1
-
-
-
-
-
-
ms
ms
ms
1
*1: The specification is for except the ISP mode. See Chapter 25.4 “In-System Programing Function” in the User’s
Manual for the timing in ISP mode.
*2: It means the time after the voltage of VDD reached to 1.6V or higher in the case of power on.
VIH1
RESET_N
VIL1
VIL1
PRST
VIH2
VIH2
“H” level or “L” level
“H” level input
“H” level or “L” level
P00/TEST0
tSP00
tHP00
[Note]
Do not drive a pulse into the RESET_N pin that has the pulse width shorter than the Reset pulse width
(PRST), otherwise unexpected operation may possibly happen.
36/57
FEDL62Q1500C-03
Slope of Power supply and Power on Reset
(VSS =0V, Ta=−40 to +105οC, unless otherwise specified)
Measur
ing
circuit
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
Power on rising slope
Power on falling slope
SVR
SVF
-
-
-
60
2
V/ms
V/ms
V
-
-
-
VPORR
VPORF
Power up (rising)
Power down (falling)
1.47
1.33
1.57
1.49
1.80
1.58
Power on reset detection
voltage
V
Power on reset minimum
pulse width
1
PPOR
VINIT
-
200
1.8
-
-
-
-
µs
Power on voltage
At power on
V
CPU operation start time
(from the release of reset to
the CPU starts to run)
tCPUI
-
11
16
-
ms
At Power supply voltage level change
SVF
SVR
At Power supply restart
SVF
SVR
SVR
VDD
VINIT
VPORR
VPORF
0V
PPOR
tCPUI
At Power on
At Power off
[Note]
If a pulse shorter than the Power on reset minimum pulse width is asserted to VDD, it may cause the MCU
malfunction.
Apply prevent measurement such as bypass capacitors or external reset input, and so on.
Start the high-speed clock when the VDD is within the operating voltage.
37/57
FEDL62Q1500C-03
VLS
(VDD=1.6 to 5.5V, VSS =0V, Ta=−40 to +105οC, unless otherwise specified)
Condition
VLS0LV *1
Measuring
circuit
Symbol
Parameter
Min.
Typ.
Max.
Unit
VVLSR
VVLSF
VVLSR
VVLSF
VVLSR
VVLSF
VVLSR
VVLSF
VVLSR
VVLSF
VVLSR
VVLSF
VVLSR
VVLSF
VVLSR
VVLSF
VVLSR
VVLSF
VVLSR
VVLSF
VVLSR
VVLSF
VVLSR
VVLSF
IVLS
Rising
Falling
Rising
Falling
Rising
Falling
Rising
Falling
Rising
Falling
Rising
Falling
Rising
Falling
Rising
Falling
Rising
Falling
Rising
Falling
Rising
Falling
Rising
Falling
3.86
3.84
3.57
3.55
2.94
2.92
2.85
2.83
2.75
2.73
2.66
2.64
2.56
2.54
2.46
2.44
2.37
2.35
1.98
1.96
1.89
1.87
1.79
1.77
-
4.06
4.00
3.76
3.70
3.11
3.05
3.01
2.95
2.91
2.85
2.81
2.75
2.71
2.65
2.61
2.55
2.51
2.45
2.11
2.05
2.01
1.95
1.91
1.85
50
4.26
4.16
3.95
3.85
3.28
3.18
3.17
3.07
3.07
2.97
2.96
2.86
2.86
2.76
2.76
2.66
2.65
2.55
2.24
2.14
2.13
2.03
2.03
1.93
-
00H
01H
02H
03H
04H
05H
06H
07H
08H
09H
0AH
0BH
VLS threshold
voltage *2
V
1
VLS Current
-
nA
*1 Bit3~Bit0 of voltage level detection circuit 0 level register (VLS0LV).
*2 The Data VSL0LV = 0CH~0FH is not available to use, if the data is specified it will the same spec as that 0BH is
specified.
Analog Comparator
(VDD=1.8 to 5.5V, VSS =0V, Ta=-40 to +105oC, unless otherwise specified)
Measuring
Symbol
VCMR
Parameter
Condition
Min.
Typ.
Max.
Unit
circuit
Comparator same
phase input
voltage range
VDD
-1.5
-
0.1
-
V
Comparator0 input
offset
1
VCMOF
Ta=+25 OC、VDD=5.0V
-
5
-
mV
V
Comparator
Reference Voltage
VCMREF
-
0.75
0.8
0.85
38/57
FEDL62Q1500C-03
Successive Approximation Type A/D Converter
(VDD=1.8 to 5.5V, VSS =0V, Ta=-40 to +105
Symbol
Parameter
Resolution
Overall error
Condition
-
Min.
-
Typ.
nAD
-
-
4.5V≤VREFP *1≤5.5V
2.7V≤VREFP *1≤5.5V
2.2V≤VREFP *1<2.7V
1.8V≤VREFP *1<2.2V
VREFP=Internal reference voltage
2.7V≤VREFP *1≤5.5V
2.2V≤VREFP *1<2.7V
1.8V≤VREFP *1<2.2V
VREFP=Internal reference voltage
RI≤1kΩ
-3.5
-4
1.2
-
-6
-
Integral non-linearity error
INLAD
-10
-15
-3
-
-
-
-5
-
Differential non-linearity
error
DNLAD
-9
-
-14
-6
-
Zero-scale error
Full-scale error
ZSE
FSE
VREF
VREFI
-
RI≤1kΩ
-6
-
A/D reference voltage
Internal reference voltage
-
1.8
1.5
2.25
4.5
18
-
-
1.55
4.5V≤VDD≤5.5V
2.2V≤VDD≤5.5V
1.8V≤VDD≤5.5V
-
-
-
Conversion time
tCONV
*1 : VDD or P23/VREF is selected for the reference voltage of Successive Approximation Type A/D Converter.
The current flows during the ADC sampling as it takes charging. Make the output impedance of the analog signal source 1kΩ or smal
0.1uF capacitor on the ADC input pin is recommended to reduce the noise.
VDD
VDDL
1.0μF
A
RI≤1kΩ
0.1μF
-
1.0μF
AINx
Analog input
+
VSS
39/57
FEDL62Q1500C-03
D/A Converter
Parameter
(VDD=1.8 to 5.5V, VSS =0V, Ta=-40 to +105oC, unless otherwise specified)
Symbol
nDA
Condition
Min.
-
Typ.
Max.
Unit
bit
Resolution
-
-
-
-
8
-
Conversion cycle
tc
-
10
-2
μs
Integral non-linearity error
INLDA
RL=4MΩ
2
LSB
Differential non-linearity
error
DNLDA
Ro
RL=4MΩ
-1
3
-
1
9
DACEN bit of D/A converter enable
register =1
Output impedance
6
kΩ
Reference Voltage Output
(VDD=1.8 to 5.5V, VSS =0V, Ta=-40 to +105oC, unless otherwise specified)
Symbol
VREFO
Parameter
Output voltage
Output impedance
Condition
Min.
Typ.
1.55
-
Max.
-
Unit
V
-
-
-
-
RVREFO
500
kΩ
Flash Memory
(VSS= 0V)
Unit
Symbol
TOP
Parameter
Condition
Data flash memory, At write/erase
Flash ROM, At write/erase
At write/erase
Range
-40 to +85
0 to +40
Operating temperature
Operating voltage
°C
V
VDD
+1.8 to +5.5
10000
100
CEPD
CEPP
Data Flash
Maximum rewrite count
times
Program Flash
Program Flash
Block erase
16K
-
B
Data Flash
all area
1K
Erase unit
Program Flash
Sector erase
-
-
-
B
ms
B
Data Flash
128
Block erase /
Sector erase
Erase time (Max.)
Write unit
50
Program Flash
Data Flash
Program Flash
Data Flash
-
4
1
-
-
80
40
15
Write time (Max.)
μs
Data retention period
YDR
years
40/57
FEDL62Q1500C-03
Measuring circuit
Measuring circuit 1
CV : 1.0μF
CL : 1.0μF
CGL : 12pF
CDL : 12pF
VDD
VDDL
VSS
XT0
Crystal resonator
(32.768kHz)
CGL
XT1
A
CV
CL
Measuring circuit 2
(*2)
VIH
V
(*1)
Current
load
VIL
VDD
VDDL
VSS
(*1) Input logic circuit to determine the specified measuring conditions
(*2) Measured connecting specified pins
Measuring circuit 3
(*2)
A
VIH
(*1)
VIL
VDD
VDDL
VSS
(*1) Input logic circuit to determine the specified measuring conditions
(*2) Measured connecting specified pins
41/57
FEDL62Q1500C-03
Measuring circuit 4
(*2)
A
VDD
VSS
VDDL
(*2) Measured connecting specified pins
Measuring circuit 5
VIH
(*1)
VIL
VDD
VDDL
VSS
(*1) Input logic circuit to determine the specified measuring conditions
42/57
FEDL62Q1500C-03
Characteristics graphs
These Graphs on the following pages are references for designing an application.
43/57
FEDL62Q1500C-03
IOH vs VDD-VOH1 (VDD=5V TYP.)
IOH vs VDD-VOH1 (VDD=5V TYP.)
-40[℃]
25[℃]
85[℃]
105[℃]
5
4
3
2
1
0
-60
-50
-40
-30
-20
-10
0
IOH[mA]
IOH vs VDD-VOH1 (VDD=3V TYP.)
IOH vs VDD-VOH1 (VDD=3V TYP.)
-40[℃]
25[℃]
85[℃]
105[℃]
3
2.5
2
1.5
1
0.5
0
-30
-25
-20
-15
-10
-5
0
IOH[mA]
44/57
FEDL62Q1500C-03
IOL vs VOL1 (VDD=5V TYP.)
IOL vs VOL1 (VDD=5V TYP.)
-40[℃]
25[℃]
85[℃]
105[℃]
5
4
3
2
1
0
0
10
20
30
40
50
IOL[mA]
IOL vs VOL1 (VDD=3V TYP.)
IOL vs VOL1 (VDD=3V TYP.)
-40[℃]
25[℃]
85[℃]
105[℃]
3
2.5
2
1.5
1
0.5
0
0
5
10
15
20
IOL[mA]
45/57
FEDL62Q1500C-03
IOL vs VOL2 (VDD=5V TYP.)
IOL vs VOL2 (VDD=5V TYP.)
-40[℃]
25[℃]
85[℃]
105[℃]
5
4
3
2
1
0
0
20
40
60
80
100
IOL[mA]
IOL vs VOL2 (VDD=3V TYP.).
IOL vs VOL2 (VDD=3V TYP.)
-40[℃]
25[℃]
85[℃]
105[℃]
3
2.5
2
1.5
1
0.5
0
0
10
20
30
40
50
IOL[mA]
46/57
FEDL62Q1500C-03
VDD VS IIL2 (TYP. VIL2=VSS)
VDD vs IIL2 (TYP. VIL2=VSS)
-40℃
25℃
85℃
105℃
0
-100
-200
-300
-400
-500
-600
-700
1
2
3
4
5
6
VDD[V]
Pull-up resistor
VDD VS VDD/IIL2 (TYP. VIL2=VSS)
Pull-up resistor
VDD vs VDD/IIL2 (TYP. VIL2=VSS)
-40℃
25℃
85℃
105℃
14
12
10
8
6
4
2
0
1
2
3
4
5
6
VDD[V]
47/57
FEDL62Q1500C-03
VDD VS IIL3 (TYP. VIL3=VSS)
VDD vs IIL3 (TYP. VIL3=VSS)
-40℃
25℃
85℃
105℃
0
-50
-100
-150
-200
1
2
3
4
5
6
VDD[V]
Pull-up resistor
VDD VS VDD/IIL3 (TYP. VIL3=VSS)
Pull-up resistor
VDD vs VDD/IIL3 (TYP. VIL3=VSS)
-40℃
25℃
85℃
105℃
350
300
250
200
150
100
50
0
1
2
3
4
5
6
VDD[V]
48/57
FEDL62Q1500C-03
Consumption current of ADC VS operating voltage
PLL frequency=16MHz temp=25oC ch0 VREF=VDD
consumption current of ADC
(PLL frequency=16MHz temp=25oC ch0 VREF=VDD )
1.2
1
0.8
0.6
0.4
0.2
0
2
2.5
3
3.5
VDD [V]
4
4.5
5
5.5
49/57
FEDL62Q1500C-03
TEMP VS Low-speed RC oscillator frequency accuracy 1
without software adjustment (Typ.)
Low-speed RC oscillator frequency accuracy 1
without software adjustment (Typ.)
VDD=1.8V
VDD=3V
VDD=5.5V
4
3
2
1
0
-1
-2
-3
-4
-40
-20
0
20
40
60
80
100
Temp[oC]
TEMP VS PLL oscillator frequency accuracy 1
without software adjustment (24MHz Typ.)
PLL oscillator frequency accuracy 1
without software adjustment (24MHz Typ.)
VDD=1.8V
VDD=3V
VDD=5.5V
4
3
2
1
0
-1
-2
-3
-4
-40
-20
0
20
40
60
80
100
Temp[oC]
50/57
FEDL62Q1500C-03
PACKAGE DIMENSIONS
52pin TQFP Package
(Unit: mm)
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore,
before you perform reflow mounting, contact a ROHM sales office for the product name, package name, pin number, package
code and desired mounting conditions (reflow method, temperature and times).
51/57
FEDL62Q1500C-03
64pin TQFP Package
(Unit: mm)
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore,
before you perform reflow mounting, contact a ROHM sales office for the product name, package name, pin number, package
code and desired mounting conditions (reflow method, temperature and times).
52/57
FEDL62Q1500C-03
64pin QFP Package
(Unit: mm)
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore,
before you perform reflow mounting, contact a ROHM sales office for the product name, package name, pin number, package
code and desired mounting conditions (reflow method, temperature and times).
53/57
FEDL62Q1500C-03
80pin QFP Package
(Unit: mm)
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore,
before you perform reflow mounting, contact a ROHM sales office for the product name, package name, pin number, package
code and desired mounting conditions (reflow method, temperature and times).
54/57
FEDL62Q1500C-03
REVISION HISTORY
Page
Document
No.
Date
Description
Previous Current
Edition
Edition
FEDL62Q1500C-01
Nov 15, 2019
-
-
1st Revision.
Changed comment for UART.
4, 8
21
4, 8
21
Changed note for Termination of unused pins.
Added parameter “Operating temperature (Chip-Junction)”
in Recommended Operating Conditions
22
22
Removed the section “Operation Confirmed Crystal
Unit(32.768kHz)”.
This section is mentioned in Applications Note;
“Operation-confirmed oscillator for ML62Q1000 series”.
FEDL62Q1500C-02
Jul 28, 2020
23
-
-
37
*
23
37
*
Added thermal characteristics section
Changed note for Slope of Power supply and Power on Reset.
Corrected typo
*
*
Corrected Typo
FEDL62Q1500C-03
May 19, 2022
-
56
Added Notes for product usage
55/57
FEDL62Q1500C-03
Notes for product usage
Notes on this page are applicable to the all microcontroller products.
For individual notes on each LAPIS Technology microcontroller product, refer to [Note]
in the chapters of each user's manual.
The individual notes of each user’s manual take priority over those contents in this page if they are different.
1. HANDLING OF UNUSED INPUT PINS
Fix the unused input pins to the power pin or GND to prevent to cause the device performing wrong operation or
increasing the current consumption due to noise, etc. If the handlings for the unused pins are described in the chapters,
follow the instruction.
2. STATE AT POWER ON
At the power on, the data in the internal registers and output of the ports are undefined until the power supply voltage
reaches to the recommended operating condition and "L" level is input to the reset pin.
On LAPIS Technology microcontroller products that have the power on reset function, the data in the internal registers
and output of the ports are undefined until the power on reset is generated.
Be careful to design the application system does not work incorrectly due to the undefined data of internal registers and
output of the ports.
3. ACCESS TO UNUSED MEMORY
If reading from unused address area or writing to unused address area of the memory, the operations are not guaranteed.
4. CHARACTERISTICS DIFFERENCE BETWEEN THE PRODUCTS
Electrical characteristics, noise tolerance, noise radiation amount, and the other characteristics are different from each
microcontroller product.
When replacing from other product to LAPIS Technology microcontroller products, please evaluate enough the
apparatus/system which implemented LAPIS Technology microcontroller products.
5. USE ENVIRONMENT
When using this product in a high humidity environment and an environment where dew condensation, take
moisture-proof measures.
56/57
FEDL62Q1500C-03
Notes
1) The information contained herein is subject to change without notice.
2) When using LAPIS Technology Products, refer to the latest product information (data sheets, user’s manuals, application notes, etc.), and
ensure that usage conditions (absolute maximum ratings, recommended operating conditions, etc.) are within the ranges specified. LAPIS
Technology disclaims any and all liability for any malfunctions, failure or accident arising out of or in connection with the use of LAPIS
Technology Products outside of such usage conditions specified ranges, or without observing precautions. Even if it is used within such
usage conditions specified ranges, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent
personal injury, fire or the other damage from break down or malfunction of LAPIS Technology Products, please take safety at your own
risk measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing
backups and fail-safe procedures. You are responsible for evaluating the safety of the final products or systems manufactured by you.
3) Descriptions of circuits, software and other related information in this document are provided only to illustrate the standard operation of
semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software,
and information in the design of your product or system. And the peripheral conditions must be taken into account when designing circuits
for mass production. LAPIS Technology disclaims any and all liability for any losses and damages incurred by you or third parties arising
from the use of these circuits, software, and other related information.
4) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of LAPIS Technology or any third
party with respect to LAPIS Technology Products or the information contained in this document (including but not limited to, the Product
data, drawings, charts, programs, algorithms, and application examples、etc.). Therefore LAPIS Technology shall have no responsibility
whatsoever for any dispute, concerning such rights owned by third parties, arising out of the use of such technical information.
5) The Products are intended for use in general electronic equipment (AV/OA devices, communication, consumer systems,
gaming/entertainment sets, etc.) as well as the applications indicated in this document. For use of our Products in applications requiring a
high degree of reliability (as exemplified below), please be sure to contact a LAPIS Technology representative and must obtain written
agreement: transportation equipment (cars, ships, trains, etc.), primary communication equipment, traffic lights, fire/crime prevention,
safety equipment, medical systems, servers, solar cells, and power transmission systems, etc. LAPIS Technology disclaims any and all
liability for any losses and damages incurred by you or third parties arising by using the Product for purposes not intended by us. Do not use
our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and
submarine repeaters, etc.
6) The Products specified in this document are not designed to be radiation tolerant.
7) LAPIS Technology has used reasonable care to ensure the accuracy of the information contained in this document. However, LAPIS
Technology does not warrant that such information is error-free and LAPIS Technology shall have no responsibility for any damages arising
from any inaccuracy or misprint of such information.
8) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. LAPIS
Technology shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.
9) When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and
provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations
and the Foreign Exchange and Foreign Trade Act..
10) Please contact a ROHM sales office if you have any questions regarding the information contained in this document or LAPIS Technology's
Products.
11) This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Technology.
(Note) “LAPIS Technology” as used in this document means LAPIS Technology Co., Ltd.
Copyright 2018 – 2022 LAPIS Technology Co., Ltd.
2-4-8 Shinyokohama, Kouhoku-ku,Yokohama 222-8575, Japan
https://www.lapis-tech.com/en/
57/57
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ML62Q1564
ML62Q1500/ML62Q1800系列是内置16位CPU nX-U16/100、并集成了程序存储器(FLASH存储器)、数据存储器(RAM)、DATA FLASH、乘除法运算器、CRC运算器、DMA控制器、时钟发生电路、定时器、通用端口、简易RTC、UART、同步串行端口、I2C总线(主/从)、蜂鸣器、电压电平检测功能(VLS)、逐次比较型A/D转换器、D/A转换器、模拟比较器、安全功能等丰富外围功能的高性能CMOS 16位微控制器。16位CPU nX-U16/100可通过流水线架构的并行处理实现一个时钟周期一个指令的高效指令执行。ML62Q1500/ML62Q1800系列具有片上调试功能,可在开发板上进行软件调试及软件改写。另外还具有ISP(In-System Programming)功能,可轻松实现在量产生产线上的FLASH写入功能。
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ML62Q1565
ML62Q1500/ML62Q1800系列是内置16位CPU nX-U16/100、并集成了程序存储器(FLASH存储器)、数据存储器(RAM)、DATA FLASH、乘除法运算器、CRC运算器、DMA控制器、时钟发生电路、定时器、通用端口、简易RTC、UART、同步串行端口、I2C总线(主/从)、蜂鸣器、电压电平检测功能(VLS)、逐次比较型A/D转换器、D/A转换器、模拟比较器、安全功能等丰富外围功能的高性能CMOS 16位微控制器。16位CPU nX-U16/100可通过流水线架构的并行处理实现一个时钟周期一个指令的高效指令执行。ML62Q1500/ML62Q1800系列具有片上调试功能,可在开发板上进行软件调试及软件改写。另外还具有ISP(In-System Programming)功能,可轻松实现在量产生产线上的FLASH写入功能。
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ML62Q1566
ML62Q1500/ML62Q1800系列是内置16位CPU nX-U16/100、并集成了程序存储器(FLASH存储器)、数据存储器(RAM)、DATA FLASH、乘除法运算器、CRC运算器、DMA控制器、时钟发生电路、定时器、通用端口、简易RTC、UART、同步串行端口、I2C总线(主/从)、蜂鸣器、电压电平检测功能(VLS)、逐次比较型A/D转换器、D/A转换器、模拟比较器、安全功能等丰富外围功能的高性能CMOS 16位微控制器。16位CPU nX-U16/100可通过流水线架构的并行处理实现一个时钟周期一个指令的高效指令执行。ML62Q1500/ML62Q1800系列具有片上调试功能,可在开发板上进行软件调试及软件改写。另外还具有ISP(In-System Programming)功能,可轻松实现在量产生产线上的FLASH写入功能。
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ML62Q1567
ML62Q1500/ML62Q1800系列是内置16位CPU nX-U16/100、并集成了程序存储器(FLASH存储器)、数据存储器(RAM)、DATA FLASH、乘除法运算器、CRC运算器、DMA控制器、时钟发生电路、定时器、通用端口、简易RTC、UART、同步串行端口、I2C总线(主/从)、蜂鸣器、电压电平检测功能(VLS)、逐次比较型A/D转换器、D/A转换器、模拟比较器、安全功能等丰富外围功能的高性能CMOS 16位微控制器。16位CPU nX-U16/100可通过流水线架构的并行处理实现一个时钟周期一个指令的高效指令执行。ML62Q1500/ML62Q1800系列具有片上调试功能,可在开发板上进行软件调试及软件改写。另外还具有ISP(In-System Programming)功能,可轻松实现在量产生产线上的FLASH写入功能。
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