LMR824FVJ [ROHM]
LMR824FVJ是输出全振幅运算放大器。具有低电压工作、低消耗电流、高电压增益、高转换速率的特点，是适用于移动设备、低电压工作设备、有源滤波器等的运算放大器。;
| 型号： | LMR824FVJ |
| 厂家： | 
ROHM |
| 描述： | LMR824FVJ是输出全振幅运算放大器。具有低电压工作、低消耗电流、高电压增益、高转换速率的特点，是适用于移动设备、低电压工作设备、有源滤波器等的运算放大器。 放大器 运算放大器 有源滤波器 |
| 文件： | 总21页 (文件大小：449K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Operational Amplifiers
Low Power Ground Sense
Operational Amplifiers
LMR821G
●Key Specifications
●General Description
Low Operating Supply Voltage (single supply):
Ground Sense Low Voltage Op-Amp integrates single
Op-Amp on a single chip. Especially, these series are
operable with low voltage and low supply current.
+2.5V to +5.0V
High voltage gain (RL=600Ω):
Wide Temperature Range:
High Slew Rate:
Low Input Offset Voltage:
Low Input Bias Current:
105dB (Typ.)
-40°C to +85°C
2.0V/μs (Typ.)
3.5mV (Max.)
30nA (Typ.)
●Features
Low operating supply voltage
Input Ground Sense, Output Full Swing
High large signal voltage gain
High Slew Rate
●Package
W(Typ.) xD(Typ.) xH(Max.)
2.90mm x 2.80mm x 1.25mm
Low supply current
SSOP5
Low input offset voltage
●Applications
Customer electronics
Buffer
Active filter
Mobile equipment
●Simplified Schematic
VDD
+IN
-IN
OUT
class
AB control
VSS
Figure 1. Simplified Schematic (1 channel only)
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.
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Datasheet
LMR821G
●Pin Configuration
LMR821G (SSOP5)
Pin No.
Pin Name
+IN
VSS
-IN
1
2
3
5 VDD
1
2
3
4
5
+IN
VSS
-IN
+
-
OUT
VDD
4
OUT
Package
SSOP5
LMR821G
●Ordering Information
L M R
8
2
1 G
-
T R
Part Number
LMR821
Package
G:SSOP5
Packaging and forming specification
TR: Embossed tape and reel
(SSOP5)
●Line-up
Topr
Package
Reel of 3000
Operable Part Number
LMR821G-TR
-40°C to +85°C
SSOP5
●Absolute Maximum Ratings(Ta=25°C)
Parameter
Symbol
Ratings
Unit
Supply Voltage
VDD-VSS
+7
675*1*2
V
mW
V
Power dissipation
Differential Input Voltage*3
Pd
SSOP5
Vid
VDD to VSS
Input Common-mode
Voltage Range
Vicm
(VSS - 0.3) to (VDD + 0.3)
V
Operable with low voltage
Operating Temperature
Storage Temperature
Vopr
Topr
Tstg
+2.5 to +5.0
- 40 to +85
- 55 to +150
V
°C
°C
Maximum
Junction Temperature
Tjmax
+150
°C
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application of voltage in excess of absolute maximum rating or use out absolute maximum rated
temperature environment may cause deterioration of characteristics.
*1
*2
*3
To use at temperature above Ta＝25°C reduce 5.4mW/°C.
Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VSS.
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Datasheet
LMR821G
●Electrical Characteristics:
○LMR821G (Unless otherwise specified VDD=+2.7V, VSS=0V)
Limits
Typ.
Temperature
Parameter
Symbol
Unit
Condition
Range
Min.
Max.
25°C
Full Range
-
-
1
-
3.5
4
Input Offset Voltage *4*5
Input Offset Voltage Drift
Input Offset Current*4
Input Bias Current *4
Vio
ΔVio/ΔT
Iio
mV
μV/°C
nA
VDD=2.5V to 5.0V
25°C
25°C
25°C
-
-
-
1
-
-
-
-
0.5
30
30
90
Ib
nA
25°C
-
-
220
-
300
500
Supply Current*5
IDD
μA
Av=0dB, VIN=1.35V
Full range
2.50
2.60
-
-
-
2.58
2.66
130
80
100
100
-
RL=600Ω to VDD/2
RL=2kΩ to VDD/2
RL=600Ω to VDD/2
RL=2kΩ to VDD/2
RL=600Ω to VDD/2
RL=2kΩ to VDD/2
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Large Signal Voltage Gain
VOH
VOL
25°C
25°C
V
-
200
120
-
mV
Av
25°C
25°C
25°C
dB
V
95
-
Input Common-mode
Voltage Range
Vicm
VSS
70
-
VDD-0.9
-
VSS to VDD
VCM=0.5V
Common-mode Rejection Ratio CMRR
85
dB
VDD=2.7V to 5.0V
VCM=1V
PSRR
Isource
Isink
SR
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
75
12
12
-
85
16
-
-
-
-
-
-
-
-
dB
mA
Power supply reject-ratio
Output Source Current *6
Output Sink Current *6
Slew Rate
OUT=0V, short current
OUT=2.7V, short current
CL=25pF
26
mA
1.5
4.5
45
V/μs
MHz
Deg
dB
CL=25pF, Av=40dB
f=1MHz
Gain Bandwidth
GBW
θ
-
Phase Margin
-
CL=25pF, Av=40dB
CL=25pF, Av=40dB
Gain Margin
GM
-
4.5
45
Input Referred Noise Voltage
Vn
-
nV/ Hz f=1kHz
OUT=2.2VP-P, f=1kHz
Total Harmonic Distortion
+ Noise
THD+N
25°C
-
0.01
-
%
RL=10kΩ
Av=0dB, DIN-AUDIO
*4
*5
*6
Absolute value.
Full range: Ta=-40°C to +85°C
Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
○LMR821G (Unless otherwise specified VDD=+2.5V, VSS=0V)
Limits
Typ.
Temperature
Parameter
Symbol
Unit
Condition
Range
Min.
Max.
25°C
Full Range
-
1
-
2.37
2.46
130
80
3.5
4
-
Input Offset Voltage *7
Vio
mV
V
VDD=2.5V to 5.0V
-
2.30
2.40
-
RL=600Ω to VDD/2
RL=2kΩ to VDD/2
RL=600Ω to VDD/2
RL=2kΩ to VDD/2
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
VOH
VOL
25°C
25°C
-
200
120
mV
-
*7
Absolute value.
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Datasheet
LMR821G
○LMR821G (Unless otherwise specified VDD=+5.0V, VSS=0V)
Limits
Typ.
Temperature
Parameter
Symbol
Unit
Condition
Range
Min.
Max.
25°C
Full Range
-
-
1
-
3.5
4
Input Offset Voltage *8*9
Input Offset Voltage Drift
Input Offset Current*8
Vio
ΔVio/ΔT
Iio
mV
μV/°C
nA
VDD=2.5V to 5.0V
25°C
25°C
25°C
-
-
-
1
-
-
0.5
40
30
-
Input Bias Current *8
Ib
100
nA
-
25°C
Full range
-
-
300
-
400
600
Supply Current*9
IDD
μA
Av=0dB, VIN=2.5V
4.75
4.85
-
-
-
4.84
4.90
170
100
105
105
-
RL=600Ω to VDD/2
RL=2kΩ to VDD/2
RL=600Ω to VDD/2
RL=2kΩ to VDD/2
RL=600Ω to VDD/2
RL=2kΩ to VDD/2
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Large Signal Voltage Gain
VOH
VOL
Av
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
V
-
250
150
-
mV
dB
95
-
Input Common-mode
Voltage Range
Vicm
VSS
-
VDD-0.9
V
VSS to VDD
VCM=0.5V
Common-mode Rejection Ratio CMRR
72
75
20
20
-
90
85
45
40
2.0
5
-
-
-
-
-
-
-
-
-
dB
VDD=2.7V to 5.0V
VCM=1V
PSRR
Isource
Isink
SR
dB
Power supply reject-ratio
Output Source Current *10
Output Sink Current *10
Slew Rate
mA
mA
V/μs
MHz
Deg
dB
OUT=0V, short current
OUT=5V, short current
CL=25pF
CL=25pF, Av=40dB
f=1MHz
Gain Bandwidth
GBW
θ
-
Phase Margin
-
45
4.5
42
CL=25pF, Av=40dB
CL=25pF, Av=40dB
Gain Margin
GM
-
Input Referred Noise Voltage
Vn
-
nV/ Hz f=1kHz
OUT=4.1VP-P, f=1kHz
Total Harmonic Distortion
+ Noise
THD+N
25°C
-
0.01
-
%
RL=10kΩ
Av=0dB, DIN-AUDIO
*8
*9
Absolute value
Full range: Ta=-40°C to +85°C
*10 Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
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Datasheet
LMR821G
Description of electrical characteristics
Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown.
Note that item name and symbol and their meaning may differ from those on another manufacture’s document or general
document.
1. Absolute maximum ratings
Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
1.1 Power supply voltage (VDD/VSS)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without
deterioration and destruction of characteristics of IC.
1.3 Input common-mode voltage range (Vicm)
Indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without
deterioration or destruction of characteristics. Input common-mode voltage range of the maximum ratings not assures
normal operation of IC. When normal Operation of IC is desired, the input common-mode voltage of characteristics
item must be followed.
1.4 Power dissipation (Pd)
Indicates the power that can be consumed by specified mounted board at the ambient temperature 25℃(normal temperature).
As for package product, Pd is determined by the temperature that can be permitted by IC chip in the package
(maximum junction temperature) and thermal resistance of the package.
2.Electrical characteristics item
2.1 Input offset voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
2.2 Input offset voltage drift (△Vio/△T)
Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.
2.3 Input offset current (Iio)
Indicates the difference of input bias current between non-inverting terminal and inverting terminal.
2.4 Input bias current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias current at
non-inverting terminal and input bias current at inverting terminal.
2.5 Circuit current (IDD)
Indicates the IC current that flows under specified conditions and no-load steady status.
2.6 Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL)
Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into
maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage.
Maximum output voltage low indicates the lower limit.
2.7 Output source current/ output sink current (Isource/Isink)
The maximum current that can be output under specific output conditions, it is divided into output source current and
output sink current. The output source current indicates the current flowing out of the IC, and the output sink current
the current flowing into the IC.
2.8 Large signal voltage gain (Av)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage fluctuation) / (Input offset fluctuation)
2.9 Input common-mode voltage range (Vicm)
Indicates the input voltage range where IC operates normally.
2.10 Common-mode rejection ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the
fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.11 Power supply rejection ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of
DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation)
2.12 Slew rate (SR)
Indicates the time fluctuation ratio of voltage output when step input signal is applied.
2.13 Gain Band Width (GBW)
Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave.
2.14 Phase Margin (θ)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
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Datasheet
LMR821G
2.15 Gain Margin (GM)
Indicates the difference between 0dB and the gain where operational amplifier has 180 degree phase delay.
2.16 Total harmonic distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
2.17 Input referred noise voltage (Vn)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
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Datasheet
LMR821G
●Typical Performance Curves
○LMR821G
400
350
300
250
200
800
600
400
200
0
LMR821G
85℃
25℃
-40℃
85
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0
25
50
75
100
SUPPLYVOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Figure 3.
Supply Current – Supply Voltage
Figure 2.
Derating curve
400
350
300
250
200
6
5
4
3
2
85℃
5.0V
25℃
-40℃
2.7V
-50
-25
0
25
50
75
100
2
3
4
5
6
AMBIENT TEMPERATURE [
]
℃
SUPPLYVOLTAGE [V]
Figure 5.
Figure 4.
Output Voltage High – Supply Voltage
Supply Current – Ambient Temperature
(RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR821G
●Typical Performance Curves (Reference data) – Continued
○LMR821G
6
100
90
80
70
60
50
40
30
20
10
0
5
85℃
5.0V
4
3
25℃
2.7V
-40℃
2
1
0
-50
-25
0
25
50
75
100
2
3
4
5
6
SUPPLYVOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Figure 6.
Figure 7.
Output Voltage High – Ambient Temperature
Output Voltage Low – Supply Voltage
(RL=2kΩ)
(RL=2kΩ)
100
30
25
20
15
10
5
90
80
70
60
50
40
30
20
10
0
5.0V
25℃
-40℃
2.7V
85℃
0
-50 -25
0
25
50
75 100
0
1
2
3
AMBIENT TEMPERATURE [
]
℃
OUTPUT VOLTAGE [V]
Figure 8.
Figure 9.
Output Voltage Low –Ambient Temperature
Output Source Current – Output Voltage
(VDD=2.7V)
(RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR821G
●Typical Performance Curves (Reference data) – Continued
○LMR821G
40
35
30
25
20
15
10
5
100
90
-40℃
80
25℃
5.0V
70
60
50
40
85℃
2.7V
30
20
10
0
0
0.0
1.0
2.0
3.0
-50
-25
0
25
50
75
100
OUTPUT VOLTAGE [V]
AMBIENT TEMPERATURE [
Figure 10.
]
℃
Figure 11.
Output Source Current –Ambient Temperature
Output Sink Current – Output Voltage
(VDD=2.7V)
4
3
2
1
0
100
90
80
70
60
85℃
5.0V
50
40
30
-1
-2
-3
-4
-40℃
25℃
20
2.7V
10
0
2
3
4
5
6
-50 -25
0
25
50
75 100
SUPPLYVOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Figure 12.
Figure 13.
Input Offset Voltage – Supply Voltage
Output Sink Current – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR821G
●Typical Performance Curves (Reference data) - Continued
○LMR821G
4
3
2
4
3
2
25℃
85℃
1
1
5.0V
0
0
2.7V
-1
-1
-2
-3
-4
-40℃
-2
-3
-4
-50
-25
0
25
50
75
100
-1
0
1
2
3
INPUT VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Figure 14.
Figure 15.
Input Offset Voltage – Ambient Temperature
Input Offset Voltage – Input Voltage
(VDD=2.7V)
140
130
120
110
100
90
140
130
120
110
100
90
85℃
5.0V
-40℃
25℃
2.7V
80
80
2
3
4
5
6
-50 -25
0
25
50
75 100
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Figure 16.
Figure 17.
Large Signal Voltage Gain – Supply Voltage
Large Signal Voltage Gain – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
LMR821G
●Typical Performance Curves (Reference data) – Continued
○LMR821G
140
130
120
110
100
90
140
130
120
5.0V
-40℃
110
2.7V
100
25℃
85℃
90
80
80
-50
-25
0
25
50
75
100
2
3
4
5
6
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Figure 18.
Figure 19.
Common Mode Rejection Ratio – Supply Voltage
(VDD=2.7V)
Common Mode Rejection Ratio – Ambient Temperature
3.0
2.5
2.0
140
130
120
110
100
90
2.7V
5.0V
1.5
1.0
0.5
0.0
80
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [
]
℃
AMBIENT TEMPERATURE [
]
℃
Figure 20.
Figure 21.
Power Supply Rejection Ratio – Ambient Temperature
(VDD=2.7V~5.0V)
Slew Rate L-H – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
LMR821G
●Typical Performance Curves (Reference data) - Continued
○LMR821G
3.0
2.5
100
80
60
40
20
0
200
Phase
150
100
50
2.0
5.0V
2.7V
1.5
Gain
1.0
0.5
0.0
0
103
104
105
106
107
108
-50
-25
0
25
50
75
100
FREQUENCY [Hz]
AMBIENT TEMPERATURE [
]
℃
Figure 22.
Slew Rate H-L – Ambient Temperature
Figure 23.
Voltage Gain, Phase – Frequency
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR821G
●Application Information
NULL method condition for Test Circuit 1
VDD, VSS, EK, Vicm Unit:V
Parameter
Calculation
VF
S1
S2
S3
VDD VSS
EK
-1.5
-0.5
-2.5
Vicm
3
Input Offset Voltage
VF1
VF2
VF3
VF4
VF5
ON
ON
OFF
3
0
1
Large Signal Voltage Gain
ON
ON
ON
3
0
1.5
2
0
3
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
ON
ON
ON
ON
OFF
OFF
3
0
0
-1.5
-1.2
3
4
VF6
VF7
2.5
5.0
Power Supply Rejection Ratio
0
－ Calculation－
|VF1|
Vio
Av
[V]
=
1. Input Offset Voltage (Vio)
1+RF/RS
2 × (1+RF/RS)
|VF2-VF3|
2. Large Signal Voltage Gain(Av)
[dB]
= 20Log
3. Common-mode Rejection Ratio (CMRR)
4. Power Supply Rejection Ratio (PSRR)
3 × (1+RF/RS)
|VF4 - VF5|
CMRR 20Log
[dB]
=
3.2 × (1+ RF/RS)
|VF6 - VF7|
PSRR
[dB]
= 20Log
0.1µF
RF=50kΩ
0.01µF
500kΩ
SW1
VDD
DUT
EK
15V
Vo
RS=50Ω
Ri=10kΩ
500kΩ
0.1µF
0.1µF
NULL
SW3
1000pF
Ri=10kΩ
RS=50Ω
50kΩ
VF
RL
Vicm
VRL
-15V
VSS
Figure 24. Test circuit1
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Datasheet
LMR821G
●Switch Condition for Test Circuit 2
SW No.
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12
Supply Current
OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF
OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF
OFF ON OFF OFF ON OFF OFF OFF OFF ON OFF OFF
OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON
ON OFF OFF ON ON OFF OFF OFF ON OFF OFF ON
Maximum Output Voltage RL=10kΩ
Output Current
Slew Rate
Unity gain Frequency
SW３
SW4
R2 100kΩ
VDD=3V
●
●
－
＋
SW1
R1
SW2
SW8 SW9
SW10 SW11 SW12
SW6
SW7
1kΩ
VSS
RL
CL
VIN-
VIN+
Vo
Figure 25. Test circuit2
Input voltage
VH
VL
t
Input wave
Output voltage
VH
SR=ΔV/Δt
90%
ΔV
10%
VL
Δt
t
Output wave
Figure 26. Slew rate input output wave
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Datasheet
LMR821G
●Examples of circuit
○Voltage follower
Voltage gain is 0dB.
This circuit controls output voltage (OUT) equal input
voltage (IN), and keeps OUT with stable because of high
input impedance and low output impedance.
OUT is shown next expression.
VDD
OUT=IN
OUT
IN
VSS
Figure 27. Voltage follower
○Inverting amplifier
For inverting amplifier, Vi(b) Derating curve voltage gain
decided R1 and R2, and phase reversed voltage is
output.
OUT is shown next expression.
OUT=-(R2/R1)・IN
Input impedance is R1.
IN
OUT
Figure 28. Inverting amplifier circuit
○Non-inverting amplifier
For non-inverting amplifier, IN is amplified by voltage
gain decided R1 and R2, and phase is same with IN.
OUT is shown next expression.
R1
R2
OUT=(1 + R2/R1)・IN
VDD
This circuit performes high input impedance because
Input impedance is operational amplifier’s input
Impedance.
OUT
IN
VSS
Figure 29. Non-inverting amplifier circuit
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Datasheet
LMR821G
●Power Dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated
when it consumed power, and the temperature of IC ship becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage package (heat dissipation capability). The maximum junction temperature is typically equal to the
maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin
or lead frame of the package. The parameter which indicates this heat dissipation capability (hardness of heat release) is
called thermal resistance, represented by the symbol θja℃/W. The temperature of IC inside the package can be estimated
by this thermal resistance.
Figure 30. (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta,
maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below:
θja = (Tjmax－Ta) / Pd ℃/W
・・・・・ (Ⅰ)
Derating curve in Figure 30. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power
that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Figure 31. show a derating curve for an example of LMR821
.
[W]
n of LSI
Power dissipa
tio
Pd (max)
θja=(Tjmax-Ta)/Pd ℃/W
P2
θja2 < θja1
Ta[
]
Ambient temperature
℃
Package face temperature
θ' ja2
P1
θ ja2
Tj ' (max) Tj (max)
θ' ja1
θ ja1
75
Tj[
]
Chip surface temperature
℃
0
25
50
100
125
150
Ambient temperature Ta [
]
℃
(a) Thermal resistance
(b) Derating curve
Figure 30. Thermal resistance and derating
800
LMR821G
600
400
200
0
0
25
50
75
100
125
AMBIENT TEMPERATURE [
]
℃
5.4
mW/℃
When using the unit above Ta=25℃, subtract the value above per degree℃. Permissible dissipation is the value
when FR4 glass epoxy board 70mm×70mm×1.6mm (cooper foil area below 3%) is mounted
Figure 31. Derating Curve
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Datasheet
LMR821G
VDD
●Operational Notes
1) Unused circuits
+
-
When there are unused circuits it is recommended that they are connected
as in Figure 32., setting the non-inverting input terminal to a potential within
input common-mode voltage range (Vicm).
Connect
to Vicm
Vicm
VSS
2) Applied voltage to the input terminal
For normal circuit operation of voltage comparator, please input voltage for its
input terminal within input common mode voltage VDD + 0.3V. Then, regardless of
power supply voltage, VSS-0.3V can be applied to input terminals without
deterioration or destruction of its characteristics.
Figure 32. The example of
application circuit for unused
op-amp
3) Power supply (single / dual)
The op-amp operates when the specified voltage supplied is between VDD
and VSS. Therefore, the single supply op-amp can be used as dual supply
op-amp as well.
4) Power dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in
chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation
(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating
curves for more information.
5) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and
the power supply, or the output and GND may result in IC destruction.
6) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
7) IC handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezo resistance effects.
8) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the
power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly
process as well as during transportation and storage.
9) The IC destruction caused by capacitive load
The transistors in circuits may be damaged when VDD terminal and VSS terminal is shorted with the charged output
terminal capacitor.When IC is used as a operational amplifier or as an application circuit, where oscillation is not activated
by an output capacitor, the output capacitor must be kept below 0.1μF in order to prevent the damage mentioned above.
10) Latch up
Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up operation.
And protect the IC from abnormaly noise
11) Decupling capacitor
Insert the decupling capacitance between VDD and VSS, for stable operation of operational amplifier.
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Datasheet
LMR821G
●Physical Dimensions Tape and Reel Information
SSOP5
<Tape and Reel information>
°
°
+
−4
2.9 0.2
6
°
4
Tape
Embossed carrier tape
3000pcs
5
4
Quantity
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
1pin
+0.05
0.13
−0.03
S
+0.05
−0.04
0.42
0.1
0.95
S
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
∗
●Marking Diagram
SSOP5(TOP VIEW)
LOT Number
Part Number Marking
Product Name
LMR821
Package Type
SSOP5
Marking
L3
G
●Land Pattern
SSOP5
0.95
0.95
0.6
Unit：mm
Land Length
Land Pitch
e
Land Space
MIE
Land Width
b2
PKG
≧ℓ 2
SSOP5
0.95
2.4
1.0
0.6
●Revision History
Date
Revision
001
Changes
2013.1.18
New Release
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Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3) Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4) The Products are not subject to radiation-proof design.
5) Please verify and confirm characteristics of the final or mounted products in using the Products.
6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8) Confirm that operation temperature is within the specified range described in the product specification.
9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
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●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2) You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
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●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5) The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
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相关型号：
LMR824FVJ-E2
Operational Amplifier, 4 Func, 5000uV Offset-Max, PDSO14, 5 X 6.40 MM, 1.20 MM HEIGHT, TSSOP-14
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