LM393FJ [ROHM]
LM393FJ是含2个电路的接地检测比较器。工作电源电压范围较大,为3V~32V,且消耗电流较小,可用于各种用途。;型号: | LM393FJ |
厂家: | ROHM |
描述: | LM393FJ是含2个电路的接地检测比较器。工作电源电压范围较大,为3V~32V,且消耗电流较小,可用于各种用途。 比较器 |
文件: | 总40页 (文件大小:4117K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
Comparators
Ground Sense Comparators
LM393xxx LM339xxx LM2903xxx LM2901xxx
General Description
Key Specifications
Operating Supply Voltage Range
LM393xxx and LM2903xxx series are two-channel
ground sense comparator. LM339xxx and LM2901xxx
series are quad. These have features of wide operating
voltage that ranges from 3V to 32V with low supply
current. These products are suitable for various
applications.
Single Supply
Dual Supply
Operating Temperature Range:
LM393xxx:
+3.0V to +32.0V
±1.5V to ±16.0V
-40°C to +85°C
-40°C to +85°C
-40°C to +125°C
-40°C to +125°C
4.5mV (Max)
LM339xxx:
LM2903xxx:
LM2901xxx:
Input Offset Voltage
Features
Wide Operating Supply Voltage
Ground-sensed Input and Output
Open Collector Output
Wide Operating Temperature
Low Offset Voltage
Packages
SOP8
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.20mm x 1.71mm
4.90mm x 6.00mm x 1.65mm
3.00mm x 6.40mm x 1.35mm
3.00mm x 6.40mm x 1.20mm
3.00mm x 4.90mm x 1.10mm
2.90mm x 4.00mm x 0.90mm
8.70mm x 6.20mm x 1.71mm
8.65mm x 6.00mm x 1.65mm
5.00mm x 6.40mm x 1.35mm
5.00mm x 6.40mm x 1.20mm
SOP-J8
SSOP-B8
TSSOP-B8
TSSOP-B8J
MSOP8
Application
General Purpose
Current Monitor
Battery Monitor
Multivibrators
SOP14
SOP-J14
SSOP-B14
TSSOP-B14J
Pin Configuration
LM393F, LM2903F
LM393FJ, LM2903FJ
LM393FV, LM2903FV
: SOP8
: SOP-J8
: SSOP-B8
LM393FVT, LM2903FVT : TSSOP-B8
LM393FVJ, LM2903FVJ : TSSOP-B8J
LM393FVM, LM2903FVM : MSOP8
Pin No.
Pin Name
1
2
3
4
5
6
7
8
OUT1
-IN1
1
2
8
7
VCC
OUT2
-IN2
OUT1
-IN1
CH1
+IN1
VEE
+IN2
-IN2
+
-
3
4
6
5
+IN1
VEE
-
CH2
+
+IN2
OUT2
VCC
○Product structure:Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
LM339F, LM2901F
LM339FJ, LM2901FJ
LM339FV, LM2901FV
: SOP14
: SOP-J14
: SSOP-B14
LM339FVJ, LM2901FVJ : TSSOP-B14J
Pin No.
Pin Name
1
2
OUT2
OUT1
VCC
-IN1
OUT2
OUT1
OUT3
OUT4
1
2
14
13
3
4
5
+IN1
-IN2
12
11
10
9
VCC
-IN1
+IN1
3
4
5
VEE
+IN4
6
CH1
CH4
7
+IN2
-IN3
-
+
-
+
8
-IN4
9
+IN3
-IN4
10
11
12
13
14
-IN2
6
7
+IN3
-IN3
CH3
-
CH2
+IN4
VEE
-
+
+
+IN2
8
OUT4
OUT3
Absolute Maximum Ratings (TA=25°C)
Parameter
Rating
Symbol
VCC-VEE
Unit
LM393xxx
LM339xxx LM2903xxx LM2901xxx
Supply Voltage
+36
V
0.68(Note 1,9)
0.67(Note 2,9)
0.62(Note 3,9)
0.62(Note 3,9)
0.58(Note 4,9)
0.58(Note 4,9)
-
0.68(Note 1,9)
0.67(Note 2,9)
0.62(Note 3,9)
0.62(Note 3,9)
SOP8
-
-
-
SOP-J8
SSOP-B8
TSSOP-B8
TSSOP-B8J
MSOP8
SOP14
-
-
-
-
-
0.58(Note 4,9)
-
Power Dissipation
PD
W
-
0.58(Note 4,9)
-
-
-
-
-
0.56(Note 5,9)
1.02(Note 6,9)
0.87(Note 7,9)
0.85(Note 8,9)
-
-
-
-
0.56(Note 5,9)
1.02 (Note 6,9)
0.87(Note 7,9)
0.85(Note 8,9)
SOP-J14
SSOP-B14
TSSOP-B14J
VID
Differential Input Voltage (Note 10)
Common-mode Input Voltage range
Input Current(Note 11)
+36
V
V
VICM
(VEE-0.3) to (VEE+36)
-10
II
mA
Single Supply
Dual Supply
Topr
+3.0 to +32.0
Vopr
Operating Supply Voltage
V
±1.5 to ±16.0
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
-40 to +85
-40 to +125
°C
°C
°C
Tstg
-55 to +150
+150
Tjmax
(Note 1) Reduce 5.5mW per 1°C above 25°C.
(Note 2) Reduce 5.4mW per 1°C above 25°C.
(Note 3) Reduce 5.0mW per 1°C above 25°C.
(Note 4) Reduce 4.7mW per 1°C above 25°C.
(Note 5) Reduce 4.5mW per 1°C above 25°C.
(Note 6) Reduce 8.2mW per 1°C above 25°C.
(Note 7) Reduce 7.0mW per 1°C above 25°C.
(Note 8) Reduce 6.8mW per 1°C above 25°C.
(Note 9) Mounted on an FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).
(Note 10) Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs. The input pin voltage is set to more than VEE
.
(Note 11) An excessive input current will flow when input voltages of less than VEE-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Electrical Characteristics
○LM393xxx, LM2903xxx (Unless otherwise specified VCC=+5V, VEE=0V, TA=25°C)
Limit
Typ
1
Temperature
Range
Parameter
Symbol
VIO
Unit
mV
Condition
VOUT=1.4V
Min
Max
4.5
5
25°C
Full range
25°C
-
-
-
-
-
-
Input Offset Voltage(Note 12,13)
-
5
-
VCC=5 to 32V, VOUT=1.4V
50
Input Offset Current(Note 12,13)
Input Bias Current(Note 12,13)
IIO
nA
VOUT=1.4V
Full range
25°C
200
250
500
50
-
IB
nA
V
VOUT=1.4V
Full range
Input Common-mode Voltage
Range
VICM
25°C
0
-
VCC-1.5
-
VCC=15V,
31
90
1000
120
-
-
V/mV
dB
Large Signal Voltage Gain
AV
25°C
VOUT=1.4 to 11.4V,
RL=15kΩ, VRL=15V
VOUT=Open
25°C
-
-
0.6
-
1
Supply Current(Note 13)
ICC
ISINK
VOL
mA
mA
mV
Full range
1.5
VOUT=Open, VCC=32V
V+IN=0V, V-IN=1V,
VOUT=1.5V
Output Sink Current(Note 14)
25°C
8
16
-
Output Saturation Voltage(Note 13)
(Low Level Output Voltage)
V+IN=0V, V-IN= 1V
ISINK=4mA
25°C
-
-
80
-
200
400
Full range
V+IN=1V, V-IN=0V,
VOUT=5V
25°C
-
-
0.1
-
-
nA
Output Leakage Current(Note 13)
(High Level Output Current)
ILEAK
V+IN=1V, V-IN=0V,
VOUT=32V
Full range
1
μA
RL=5.1kΩ, VRL=5V,
-
-
1
-
-
VIN=100mVP-P,
Overdrive=5mV
RL=5.1kΩ, VRL=5V,
VIN=TTL,
Response Time
tRE
25°C
μs
0.4
Logic Swing, VREF=1.4V
(Note 12) Absolute value
(Note 13) LM393xxx Full range: TA=-40°C to +85°C, LM2903xxx Full range: TA=-40°C to +125°C.
(Note 14) Consider the power dissipation of the IC under high temperature when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Electrical Characteristics - continued
○LM339xxx, LM2901xxx (Unless otherwise specified VCC=+5V, VEE=0V, TA=25°C)
Limit
Typ
1
Temperature
Range
Parameter
Symbol
VIO
Unit
mV
Condition
VOUT=1.4V
Min
Max
4.5
5
25°C
Full range
25°C
-
-
-
-
-
-
Input Offset Voltage(Note 15,16)
-
5
-
VCC=5 to 32V, VOUT=1.4V
50
Input Offset Current(Note 15,16)
Input Bias Current(Note 15,16)
IIO
nA
VOUT=1.4V
Full range
25°C
200
250
500
50
-
IB
nA
V
VOUT=1.4V
Full range
Input Common-mode Voltage
Range
VICM
25°C
0
-
VCC-1.5
-
VCC=15V,
VOUT=1.4 to 11.4V,
RL=15kΩ, VRL=15V
31
90
1000
120
-
-
V/mV
dB
Large Signal Voltage Gain
AV
25°C
25°C
-
-
1.2
-
2
VOUT=Open
Supply Current(Note 16)
ICC
ISINK
VOL
mA
mA
mV
Full range
2.5
VOUT=Open, VCC=32V
V+IN=0V, V-IN=1V,
VOUT=1.5V
Output Sink Current(Note 17)
25°C
8
16
-
Output Saturation Voltage(Note 16)
(Low Level Output Voltage)
V+IN=0V, V-IN= 1V
ISINK=4mA
25°C
-
-
80
-
200
400
Full range
V+IN=1V, V-IN=0V,
VOUT=5V
V+IN=1V, V-IN=0V,
VOUT=32V
25°C
-
-
0.1
-
-
nA
Output Leakage Current(Note 16)
(High Level Output Current)
ILEAK
Full range
1
μA
RL=5.1kΩ, VRL=5V,
-
-
1
-
-
VIN=100mVP-P,
Overdrive=5mV
RL=5.1kΩ, VRL=5V,
VIN=TTL,
Response Time
tRE
25°C
μs
0.4
Logic Swing, VREF=1.4V
(Note 15) Absolute value
(Note 16) LM339xxx Full range: TA=-40°C to +85°C, LM2901xxx Full range: TA=-40°C to +125°C.
(Note 17) Consider the power dissipation of the IC under high temperature when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Description of Electrical Characteristics
The relevant electrical terms used in this datasheet are described below. Items and symbols used are also shown. Note
that item names, symbols, and their meanings may differ from those of another manufacturer’s document or general
document.
1. Absolute Maximum Ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of the
absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of
electrical characteristics.
(1) Supply Voltage (VCC/VEE
)
Indicates the maximum voltage that can be applied between the VCC pin and VEE pin without deterioration of
characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between the non-inverting and inverting pins without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM
)
Indicates the maximum voltage that can be applied to the non-inverting and inverting pins without deterioration or
destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical Characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting pin and inverting pin. It can be translated to the input voltage
difference required for setting the output voltage to 0V.
(2) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting pins.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the
non-inverting and inverting pins.
(4) Input Common-mode Voltage Range (VICM
)
Indicates the input voltage range at which IC normally operates.
(5) Large Signal Voltage Gain (AV)
Indicates the amplification rate (gain) of output voltage against the voltage difference between non-inverting pin and
inverting pin. It is normally the amplification rate (gain) with reference to DC voltage.
Av = (Output Voltage) / (Differential Input Voltage)
(6) Supply Current (ICC
)
Indicates the current that flows within the IC under specified no-load conditions.
(7) Output Sink Current (ISINK
)
The maximum current that the IC can output under specific output conditions
(8) Output Saturation Voltage, Low Level Output Voltage (VOL
)
Signifies the voltage range that can be output under specific output conditions.
(9) Output Leakage Current, High Level Output Current (ILEAK
)
Indicates the current that flows into the IC under specific input and output conditions.
(10) Response Time (tRE
)
Response time indicates the delay time between the input and output signal which is determined by the time
difference from the fifty percent of input signal swing to the fifty percent of output signal swing.
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Typical Performance Curves
○LM393xxx, LM2903xxx
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40°C
25°C
36V
5V
85°C
3V
125°C
-50 -25
0
25
50
75 100 125 150
0
10
20
Supply Voltage [V]
30
40
Ambient Temperature [°C]
Figure 2. Supply Current vs Ambient Temperature
Figure 1. Supply Current vs Supply Voltage
200
150
100
50
200
150
100
50
125°C
3V
85°C
5V
25°C
-40°C
36V
0
0
0
10
20
30
40
-50 -25
0
25
50
75 100 125 150
Supply Voltage [V]
Ambient Temperature [°C]
Figure 3. Output Saturation Voltage vs
Supply Voltage (ISINK=4mA)
Figure 4. Output Saturation Voltage vs
Ambient Temperature (ISINK=4mA)
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM393xxx: -40°C to +85°C
LM2903xxx: -40°C to +125°C
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Typical Performance Curves - continued
○LM393xxx, LM2903xxx
2
1.5
1
80
60
40
20
0
85°C
36V
-40°C
25°C
5V
125°C
0.5
0
3V
0
4
8
12
16
20
-50 -25
0
25
50
75 100 125 150
Output Sink Current [mA]
Ambient Temperature [°C]
Figure 5. Output Voltage vs Output Sink Current
(VCC=5V)
Figure 6. Output Sink Current vs Ambient
Temperature (VOUT=VCC
)
4
3
4
3
2
2
1
1
25℃
36V
85℃
125℃
3V
0
0
-40℃
-1
-2
-3
-4
-1
-2
-3
-4
5V
-50 -25
0
25
50
75 100 125 150
0
10
20
30
40
Ambient Temperature [°C]
Supply Voltage [V]
Figure 7. Input Offset Voltage vs Supply Voltage
Figure 8. Input Offset Voltage vs Ambient
Temperature
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM393xxx: -40°C to +85°C
LM2903xxx: -40°C to +125°C
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Typical Performance Curves - continued
○LM393xxx, LM2903xxx
160
140
120
100
80
160
140
120
100
80
-40℃
3V
25℃
85℃
36V
5V
60
60
40
40
125℃
20
20
0
0
0
10
20
Supply Voltage [V]
30
40
-50 -25
0
25
50
75 100 125 150
Ambient Temperature [°C]
Figure 10. Input Bias Current vs Ambient
Temperature
Figure 9. Input Bias Current vs Supply Voltage
50
40
50
40
30
30
20
20
10
10
85℃
36V
3V
5V
125℃
-40℃
25℃
0
0
-10
-20
-30
-40
-50
-10
-20
-30
-40
-50
0
10
20
30
40
-50 -25
0
25
50
75 100 125 150
Supply Voltage [V]
Ambient Temperature [°C]
Figure 12. Input Offset Current vs Ambient
Temperature
Figure 11. Input Offset Current vs Supply Voltage
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM393xxx: -40°C to +85°C
LM2903xxx: -40°C to +125°C
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Typical Performance Curves - continued
○LM393xxx, LM2903xxx
140
130
120
110
100
90
140
130
120
110
100
90
125°C
85°C
36V
5V
25°C
-40°C
3V
80
80
70
70
60
60
-50 -25
0
25
50
75 100 125 150
0
10
20
Supply Voltage [V]
30
40
Ambient Temperature [°C]
Figure 14. Large Signal Voltage Gain vs Ambient
Figure 13. Large Signal Voltage Gain vs Supply
Temperature (RL=15kΩ)
Voltage (RL=15kΩ)
4
3
2.5
2.0
1.5
1.0
0.5
0.0
2
1
85°C
125°C
0
125°C
-1
-2
-3
-4
85°C
-40°C
25°C
25°C
-40°C
-1
0
1
2
3
4
5
-100
-80
-60
-40
-20
0
Input Voltage [V]
Overdrive Voltage [mV]
Figure 16. Response Time (Low to High) vs
Overdrive Voltage (VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 15. Input Offset Voltage vs Input Voltage
(VCC=5V)
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM393xxx: -40°C to +85°C
LM2903xxx: -40°C to +125°C
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Typical Performance Curves - continued
○LM393xxx, LM2903xxx
2.5
2.0
1.5
1.0
0.5
0.0
2.0
1.6
1.2
0.8
0.4
0.0
5mV Overdrive
20mV Overdrive
125°C
85°C
100mV Overdrive
-40°C
25°C
-50 -25
0
25
50
75 100 125 150
0
20
40
60
80
100
Overdrive Voltage [mV]
Ambient Temperature [°C]
Figure 18. Response Time (High to Low) vs
Overdrive Voltage (VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 17. Response Time (Low to High) vs Ambient
Temperature (VCC=5V, VRL=5V, RL=5.1kΩ)
2.0
1.6
1.2
0.8
0.4
0.0
5mV Overdrive
20mV Overdrive
100mV Overdrive
-50 -25
0
25
50
75 100 125 150
Ambient Temperature [°C]
Figure 19. Response Time (High to Low) vs Ambient
Temperature (VCC=5V, VRL=5V, RL=5.1kΩ)
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM393xxx: -40°C to +85°C
LM2903xxx: -40°C to +125°C
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Typical Performance Curves - continued
○LM339xxx, LM2901xxx
2.5
2.0
1.5
1.0
0.5
0.0
2.5
2.0
1.5
1.0
0.5
0.0
-40°C
25°C
36V
5V
85°C
3V
125°C
-50 -25
0
25
50
75 100 125 150
0
10
20
Supply Voltage [V]
30
40
Ambient Temperature [°C]
Figure 21. Supply Current vs Ambient Temperature
Figure 20. Supply Current vs Supply Voltage
200
150
100
50
200
150
100
50
125°C
3V
85°C
5V
25°C
-40°C
36V
0
0
0
10
20
30
40
-50 -25
0
25
50
75 100 125 150
Supply Voltage [V]
Ambient Temperature [°C]
Figure 22. Output Saturation Voltage vs
Supply Voltage (ISINK=4mA)
Figure 23. Output Saturation Voltage vs
Ambient Temperature (ISINK=4mA)
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM339xxx: -40°C to +85°C
LM2901xxx: -40°C to +125°C
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Typical Performance Curves - continued
○LM339xxx, LM2901xxx
2
1.5
1
80
60
40
20
0
85°C
36V
-40°C
25°C
5V
125°C
0.5
0
3V
0
4
8
12
16
20
-50 -25
0
25
50
75 100 125 150
Output Sink Current [mA]
Ambient Temperature [°C]
Figure 24. Output Voltage vs Output Sink Current
(VCC=5V)
Figure 25. Output Sink Current vs Ambient
Temperature (VOUT=VCC
)
4
3
4
3
2
2
1
1
25℃
36V
85℃
125℃
3V
0
0
-40℃
-1
-2
-3
-4
-1
-2
-3
-4
5V
-50 -25
0
25
50
75 100 125 150
0
10
20
30
40
Ambient Temperature [°C]
Supply Voltage [V]
Figure 26. Input Offset Voltage vs Supply Voltage
Figure 27. Input Offset Voltage vs Ambient
Temperature
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM339xxx: -40°C to +85°C
LM2901xxx: -40°C to +125°C
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Typical Performance Curves - continued
○LM339xxx, LM2901xxx
160
140
120
100
80
160
140
120
100
80
-40℃
3V
25℃
85℃
36V
5V
60
60
40
40
125℃
20
20
0
0
0
10
20
Supply Voltage [V]
30
40
-50 -25
0
25
50
75 100 125 150
Ambient Temperature [°C]
Figure 29. Input Bias Current vs Ambient
Temperature
Figure 28. Input Bias Current vs Supply Voltage
50
40
50
40
30
30
20
20
10
10
85℃
36V
3V
5V
125℃
-40℃
25℃
0
0
-10
-20
-30
-40
-50
-10
-20
-30
-40
-50
0
10
20
30
40
-50 -25
0
25
50
75 100 125 150
Supply Voltage [V]
Ambient Temperature [°C]
Figure 31. Input Offset Current vs Ambient
Temperature
Figure 30. Input Offset Current vs Supply Voltage
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM339xxx: -40°C to +85°C
LM2901xxx: -40°C to +125°C
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LM393xxx LM339xxx LM2903xxx LM2901xxx
Typical Performance Curves - continued
○LM339xxx, LM2901xxx
140
130
120
110
100
90
140
130
120
110
100
90
125°C
85°C
36V
5V
25°C
-40°C
3V
80
80
70
70
60
60
-50 -25
0
25
50
75 100 125 150
0
10
20
Supply Voltage [V]
30
40
Ambient Temperature [°C]
Figure 33. Large Signal Voltage Gain vs Ambient
Figure 32. Large Signal Voltage Gain vs Supply
Temperature (RL=15kΩ)
Voltage (RL=15kΩ)
4
3
2.5
2.0
1.5
1.0
0.5
0.0
2
1
85°C
125°C
0
125°C
-1
-2
-3
-4
85°C
-40°C
25°C
25°C
-40°C
-1
0
1
2
3
4
5
-100
-80
-60
-40
-20
0
Input Voltage [V]
Overdrive Voltage [mV]
Figure 35. Response Time (Low to High) vs
Overdrive Voltage (VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 34. Input Offset Voltage vs Input Voltage
(VCC=5V)
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM339xxx: -40°C to +85°C
LM2901xxx: -40°C to +125°C
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Typical Performance Curves - continued
○LM339xxx, LM2901xxx
2.5
2.0
1.5
1.0
0.5
0.0
2.0
1.6
1.2
0.8
0.4
0.0
5mV Overdrive
20mV Overdrive
125°C
85°C
100mV Overdrive
-40°C
25°C
-50 -25
0
25
50
75 100 125 150
0
20
40
60
80
100
Overdrive Voltage [mV]
Ambient Temperature [°C]
Figure 37. Response Time (High to Low) vs
Overdrive Voltage (VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 36. Response Time (Low to High) vs Ambient
Temperature (VCC=5V, VRL=5V, RL=5.1kΩ)
2.0
1.6
1.2
0.8
0.4
0.0
5mV Overdrive
20mV Overdrive
100mV Overdrive
-50 -25
0
25
50
75 100 125 150
Ambient Temperature [°C]
Figure 38. Response Time (High to Low) vs Ambient
Temperature (VCC=5V, VRL=5V, RL=5.1kΩ)
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM339xxx: -40°C to +85°C
LM2901xxx: -40°C to +125°C
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Application Information
NULL method condition for Test Circuit 1
VCC, VEE, EK, VICM, VRL Unit: V; RL Unit: Ohms
Parameter
Input Offset Voltage
Input Offset Current
VF
SW1 SW2 SW3
ON ON ON 5 to 32
OFF OFF
VCC
VEE
0
EK
VICM
0
VRL
RL Calculation
VF1
VF2
VF3
VF4
VF5
VF6
-1.4
-1.4
5 to 32 5.1k
1
2
ON
5
0
0
5
5
10k
10k
OFF
ON
ON
Input Bias Current
ON
5
0
0
-1.4
0
0
3
4
OFF
-1.4
Large Signal Voltage Gain
ON
ON
ON
15
VIO
15
15k
-11.4
- Calculation -
|VF1|
1. Input Offset Voltage (VIO)
=
[V]
1 + RF/RS
|VF2 - VF1|
2. Input Offset Current (IIO)
3. Input Bias Current (IB)
IIO
=
[A]
RI x (1 + RF/RS)
|VF4 - VF3|
IB =
[A]
2 x RI x (1 + RF/RS)
EK × (1+RF/RS)
4. Large Signal Voltage Gain (AV)
[dB]
Av = 20Log
|VF6 - VF5|
RF=50kΩ
500kΩ
0.01μF (Note 18)
SW1
VCC
15V
EK
RS=50Ω
RI=10kΩ
VOUT
500kΩ
DUT
0.01uF
0.01uF
SW3
NULL
-15V
1000pF (Note 18)
RI=10kΩ
RS=50Ω
RL
VICM
V VF
50kΩ
SW2
VRL
VEE
(Note 18) Use 1uF capacitor for Input Bias Current and Input Offset Current
Figure 39. Test Circuit 1 (One Channel Only)
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LM393xxx LM339xxx LM2903xxx LM2901xxx
Application Information – continued
Switch Condition for Test Circuit 2
Parameter
SW1
SW2
SW3
SW4
SW5
SW6
SW7
Supply Current
ON
ON
ON
ON
ON
ON
ON
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
OFF
ON
Output Sink Current
VOUT=1.5V
Output Saturation Voltage ISINK=4mA
ON
OFF
ON
Output Leakage Current
Response Time
VOUT=32V
ON
OFF
OFF
OFF
OFF
RL=5.1kΩ, VRL=5V
OFF
OFF
VCC
+
-
SW4
SW5
SW6
SW7
SW2
SW3
SW1
VEE
RL
VRL
V+IN
V-IN
VOUT
Figure 40. Test Circuit 2 (One Channel Only)
Input Voltage
Input Voltage
1.5V
1.405V
Δov=5mV
VREF=1.4V
Overdrive Voltage
Overdrive Voltage
VREF=1.4V
Δov=5mV
1.395V
1.3V
t
t
Input Wave
Input Wave
Output Voltage
VCC
Output Voltage
VCC
VCC/2
VCC/2
0V
0V
tRE (Low toHigh)
tRE (High to Low)
t
t
Output Wave
Output Wave
Figure 41. Response Time
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Application Information – continued
1. Unused Circuits
It is recommended to apply the connection (see Figure 42) and set the non-inverting input pin at a potential within the
Input Common-mode Voltage Range (VICM) for any unused circuit.
VCC
OPEN
+
-
Keep this potential in VICM
VICM
VEE
Figure 42. Example of Application Circuit for Unused Comparator
2. Input Pin Voltage
Regardless of the supply voltage, applying VEE+32V to the input pin is possible without causing deterioration of the
electrical characteristics or destruction. However, this does not ensure normal circuit operation. Please note that the
circuit operates normally only when the input voltage is within the common mode input voltage range of the electric
characteristics.
3. Power Supply (Single/Dual)
The comparators operate when the voltage supplied is between VCC pin and VEE pin. Therefore, the single supply
comparators can be used as dual supply comparators as well.
4. IC Handling
When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to the
piezoelectric effect. Be careful of warps on the printed circuit board.
I/O Equivalent Circuit
Symbol
Pin No.
Equivalent Circuit
LM393xxx, LM2903xxx: 2,3,5,6
LM339xxx, LM2901xxx:
4,5,6,7,8,9,10,11
+IN
-IN
LM393xxx, LM2903xxx: 1,7
LM339xxx, LM2901xxx: 1,2,13,14
OUT
VCC
LM393xxx, LM2903xxx: 8
LM339xxx, LM2901xxx: 3
VCC
VEE
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Example of Circuit
V+IN
○Reference voltage is V-IN
VCC
VRL
RL
VREF
Time
V+IN
+
-
VOUT
Reference
Voltage
VREF
VEE
VOUT
High
When the input voltage is bigger than reference voltage,
output voltage is high. When the input voltage is smaller than
reference voltage, output voltage is low.
Low
Time
○Reference voltage is V+IN
V-IN
VCC
VRL
VREF
Time
RL
Reference
Voltage
+
-
VOUT
VREF
V-IN
VEE
VOUT
High
Low
When the input voltage is smaller than reference voltage,
output voltage is high. When the input voltage is bigger than
reference voltage, output voltage is low.
Time
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Datasheet
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Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature
that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal
resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 43(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (Tjmax), and power dissipation
(PD).
θJA
=
(Tjmax-TA) / PD
°C/W
The Derating curve in Figure 43(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance
(θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity,
etc. This may also vary even when the same package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Figure 43(c) to (f) show the examples of the derating curves for LM393xxx, LM2903xxx,
LM339xxx, and LM2901xxx respectively.
Power dissipation of LSI [W]
PDmax
θJA=(Tjmax-TA)/ PD °C/W
P2
θJA2 < θJA1
Ambient temperature TA [ °C ]
θJA2
P1
Tjmax
θJA1
150
0
25
50
75
100
125
Chip surface temperature Tj [ °C ]
Ambient temperature TA [ °C ]
(a) Thermal Resistance
(b) Derating Curve
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
LM393F(Note 19)
LM2903F(Note 19)
LM393FJ(Note 20)
LM2903FJ(Note 20)
LM393FVT(Note 21)
LM393FV(Note 21)
LM2903FVT(Note 21)
LM2903FV(Note 21)
LM2903FVJ(Note 22)
LM2903FVM(Note 22)
LM393FVJ(Note 22)
LM393FVM(Note 22)
85
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Ambient Temperature [°C]
Ambient Temperature [°C]
(c) LM393xxx
(d) LM2903xxx
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
1.5
1.2
0.9
0.6
0.3
0.0
1.5
1.2
0.9
0.6
0.3
0.0
LM339FJ (Note 24)
LM2901FJ (Note 24)
LM339FV (Note 25)
LM339FVJ (Note 26)
LM2901FV (Note 25)
LM2901FVJ (Note 26)
LM339F (Note 23)
LM2901F (Note 23)
85
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Ambient Temperature [°C]
Ambient Temperature [°C]
(e) LM339xxx
(f) LM2901xxx
Note 19
5.5
Note 20
5.4
Note 21
5.0
Note 22
4.7
Note 23
4.5
Note 24
8.2
Note 25
7.0
Note 26
6.8
Unit
mW/°C
Reduce the value above per 1°C above 25°C.
Power dissipation is the value when the IC mounted on FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.
Figure 43. Thermal Resistance and Derating Curve
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Datasheet
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines
of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature
and aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the
IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of
connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to
many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge
deposited in between pins during assembly to name a few.
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Datasheet
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Operational Notes – continued
11. Regarding Input Pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P+
P+
P+
P+
P
N
P
N
N
N
N
N
N
N
Parasitic
Element
Parasitic
Element
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Element
Parasitic
Element
Parasitic element
or Transistor
Figure 44. Example of Monolithic IC Structure
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Datasheet
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Physical Dimension Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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Physical Dimensions, Tape and Reel Information – continued
Package Name
SOP-J8
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Physical Dimensions, Tape and Reel Information – continued
Package Name
SSOP-B8
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Physical Dimensions, Tape and Reel Information – continued
Package Name
TSSOP-B8
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Physical Dimensions, Tape and Reel Information – continued
Package Name
TSSOP-B8J
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Physical Dimensions, Tape and Reel Information – continued
Package Name
MSOP8
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Physical Dimensions, Tape and Reel Information – continued
Package Name
SOP14
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Physical Dimensions, Tape and Reel Information – continued
Package Name
SOP-J14
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Physical Dimensions, Tape and Reel Information – continued
Package Name
SSOP-B14
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Physical Dimensions, Tape and Reel Information – continued
Package Name
TSSOP-B14J
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Ordering Information
L M x
x
x
x
x
x
-
x
x
Part Number
LM393F
LM393FJ
LM393FV
LM393FVT
LM393FVJ
LM393FVM
LM339F
Package
F
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SOP-J8/SSOP-B8/
TSSOP-B8/SOP14/SOP-J14/
SSOP-B14/TSSOP-B14J)
TR: Embossed tape and reel
(MSOP8)
: SOP8
: SOP14
: SOP-J8
: SOP-J14
: SSOP-B8
: SSOP-B14
: TSSOP-B8
: TSSOP-B8J
FJ
FV
FVT
FVJ
LM339FJ
LM339FV
LM339FVJ
LM2903F
: TSSOP-B14J
: MSOP8
FVM
LM2903FJ
LM2903FV
LM2903FVT
LM2903FVJ
LM2903FVM
LM2901F
LM2901FJ
LM2901FV
LM2901FVJ
Line-up
Operating Temperature Range
Channel
Package
Orderable Part Number
SOP8
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 3000
Reel of 2500
Reel of 3000
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 3000
Reel of 2500
Reel of 3000
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 2500
LM393F-E2
SOP-J8
LM393FJ-E2
LM393FV-E2
LM393FVT-E2
LM393FVJ-E2
LM393FVM-TR
LM339F-E2
SSOP-B8
TSSOP-B8
TSSOP-B8J
MSOP8
2ch
-40°C to +85°C
SOP14
SOP-J14
SSOP-B14
TSSOP-B14J
SOP8
LM339FJ-E2
LM339FV-E2
LM339FVJ-E2
LM2903F-E2
LM2903FJ-E2
LM2903FV-E2
LM2903FVT-E2
LM2903FVJ-E2
LM2903FVM-TR
LM2901F-E2
LM2901FJ-E2
LM2901FV-E2
LM2901FVJ-E2
4ch
2ch
4ch
SOP-J8
SSOP-B8
TSSOP-B8
TSSOP-B8J
MSOP8
-40°C to +125°C
SOP14
SOP-J14
SSOP-B14
TSSOP-B14J
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Marking Diagram
SOP8(TOP VIEW)
SOP-J8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
TSSOP-B8(TOP VIEW)
SSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SOP14(TOP VIEW)
SOP-J14(TOP VIEW)
SSOP-B14(TOP VIEW)
TSSOP-B8J(TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
1PIN MARK
1PIN MARK
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
1PIN MARK
1PIN MARK
TSSOP-B14J (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Marking Diagram – continued
Product Name
Package Type
Marking
393L
F
FJ
SOP8
SOP-J8
FV
FVT
FVJ
FVM
F
SSOP-B8
TSSOP-B8
TSSOP-B8J
MSOP8
LM393
SOP14
LM339F
FJ
SOP-J14
SSOP-B14
TSSOP-B14J
SOP8
LM339FJ
LM339
LM2903
LM2901
FV
FVJ
F
339L
2903L
03L
FJ
SOP-J8
FV
FVT
FVJ
FVM
F
SSOP-B8
TSSOP-B8
TSSOP-B8J
MSOP8
2903L
SOP14
LM2901F
FJ
SOP-J14
SSOP-B14
TSSOP-B14J
LM2901FJ
FV
FVJ
2901L
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Datasheet
LM393xxx LM339xxx LM2903xxx LM2901xxx
Revision History
Date
Revision
001
Changes
8.Dec.2015
New Release
Add LM393xxx (FJ, FV, FVT, FVM, FVJ), LM339xxx (F, FJ, FV, FVJ)
LM2903xxx (F, FJ, FV, FVT, FVM, FVJ), LM2901xxx (F, FJ, FV, FVJ)
15.Jul.2016
002
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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