EDZTE6124B [ROHM]
Zener Diode, 24.25V V(Z), 2.2%, 0.15W,;型号: | EDZTE6124B |
厂家: | ROHM |
描述: | Zener Diode, 24.25V V(Z), 2.2%, 0.15W, 测试 二极管 |
文件: | 总7页 (文件大小:559K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Data Sheet
Zener Diode
EDZ24B
Applications
Dimensions (Unit : mm)
Land size figure (Unit : mm)
Constant voltage control
0.8±0.05
0.12±0.05
0.8
Features
1)2-pin ultra mini-mold type for high-density
mounting (EMD2)
2) High reliability
3)Can be mounted automatically,using chip
mounter.
EMD2
Construction
Strctue
0.3±0.05
0.6.1
Silicon epitaxial planer
ROHM : EMD2
JEDEC :SOD-523
JEITA : SC-79
EX. EDZ3.6B
Taping dimensinUnit : mm)
0.2±0.05
±0.
2.0±0.05
4.0
+
0.2
φ0.5
4.0±0.1
2.0±0.05
0.90±0.05
Empty pocket
0.75±0.05
Aolute maximum ratings (Ta=25C)
Parameter
Pwer dissipation
Limits
Symbol
P
Unit
mW
C
C
C
150
150
Junction temperature
Storage temperature
Operating temperature
Tj
-55 to +150
-55 to +150
Tstg
Topr
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2011.05 - Rev.F
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1/4
Data Sheet
EDZ24B
ꢀ
Electical voltage (Ta=25C)
Symbol
Operating
Reverse current :
Rising operating
Zener voltage:Vz(V)
TYP.
IR(uA)
resistance : Zz( ) resistance : Zz(
)
VR(V)
1.0
MIN.
MAX.
3.845
Iz(mA)
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
2.0
2.0
2.0
2.0
MAX. Iz(mA) MAX. Iz(mA)
MAX.
10.0
5.0
5.0
2.0
2.0
1.0
1.0
0.5
0.5
0.5
0.5
0.1
0
0.1
0.1
0.1
0.1
0.1
0.
0.1
01
0.1
0.1
EDZ 3.6B 3.600
EDZ 3.9B 3.890
100
100
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
20
2.0
20
2.0
1000
1000
1000
800
500
200
100
60
1.0
1.0
1.0
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
5
4.160
1.0
EDZ 4.3B
EDZ 4.7B
EDZ 5.1B
EDZ 5.6B
EDZ 6.2B
EDZ 6.8B
EDZ 7.5B
EDZ 8.2B
EDZ 9.1B
EDZ 10B
EDZ 11B
EDZ 12B
EDZ 13B
EDZ 15B
EDZ 16B
EDZ 18B
EDZ 20B
EDZ 22B
EDZ 24B
EDZ 27B
EDZ 30B
EDZ 33B
4.170
4.550
4.430
100
100
80
1.0
4.750
1.0
4.980
5.200
1.5
5.490
5.730
60
2.5
6.060
6.330
60
3.0
6.650
6.930
40
3.5
7.280
7.600
30
60
4.0
8.020
8.360
30
60
5.
8.850
9.230
30
60
6.0
9.770
10.210
11.220
12.240
13.490
14.980
16.510
18.350
20.390
22.470
24.780
27.530
30.690
33.790
36.870
30
60
7.0
10.760
11.740
12.910
14.340
15.850
17.560
19.520
21.540
23.720
26.190
29.190
32.150
30
60
8.0
30
80
9.0
37
80
10.0
11.0
12
10
15.0
10
19.0
21.0
23.0
25.0
27.0
42
80
50
80
65
80
85
10
00
1
150
200
250
30
100
120
150
200
250
0
EDZ 36B 35.070
(1)The zener voltage(Vz) is measured 40r power is s
(2)The operating resistances(Zz,Zzk) re measured by superig a minute alternating curren
on the regulated current(Iz)
MARKING (Type No.)
TYPE
TYP
TYPEꢀNO.
62
72
TYPEꢀNO.
25
35
EDZꢀ3.6B
EDZꢀ3.9B
EDZꢀ4
EDZꢀ4.7B
EDB
EDZ6B
ꢀ6.2B
EDZꢀ6.8B
EDZꢀ7.5B
EDZꢀ8.2B
EDZꢀ9.1B
EDZꢀ10B
EDZꢀ11B
Zꢀ12B
DZꢀ13B
EDZꢀ15B
EDZꢀ16B
EDZꢀ18B
EDZꢀ20B
EDZꢀ22B
EDZꢀ24B
EDZꢀ27B
EDZꢀ30B
EDZꢀ33B
EDZꢀ36B
82
92
A2
C2
E2
F2
H2
J2
45
55
65
75
85
95
A5
C5
E5
F5
L2
05
15
ꢀ
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© 2011 ROHM Co., Ltd. All rights reserved.
2/4
2011.05 - Rev.F
Data Sheet
ꢀ
EDZ24B
10
1
0.1
7.5
4.7
4.3
5.1
5.6
6.2
8.2
0.01
6.8
9.1
10
3.9
11
15
33
16
24
30
12
27
36
3.6
13
22
18
0.001
0
5
10
15
20
2
35
40
ZENELTAGE:Vz(V)
CHAACTERISTICS
00
1000
100
10
160
140
120
100
80
PRSM
t
60
40
1
20
0.1
0
0.001
0.01
0.1
1
10
100
0
25
50
125
150
TIME : t(ms)
PRSM-TIME CHARACTERISTICS
AMBIENT TEMATURE : Ta(℃)
Pd-TaꢀCHARATERISTICS
0.12
0.1
40
35
30
25
20
15
10
5
1000
100
10
Rth(j-a)
Rth(j-c)
0.08
0.06
0.04
0.02
0
Mounted on epoxy board
IM=10mA
IF=100mA
-0.02
-0.04
-0.06
-0.08
1
1ms
time
300us
0
-5
0.1
0
10
20
30
40
0.001 0.01
0.1
1
10
100
1000
TIME : t(s)
ZENER VOLTAGE : Vz(V)
Rth-t CHARACTERISTICS
γz-Vz CHARACTERISTICS
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3/4
2011.05 - Rev.F
Data Sheet
ꢀ
EDZ24B
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4/4
2011.08 - Rev.G
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
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(Note1) Medical Equipment Classification of the Specific Applications
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[g] Use of our Products without cleaning residue o(even if you use no-clean type fluxes, cleaning residue of
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[h] Use of the Prcts in places subjecdw condensation
4. The Producnot subject to radiation-proof design.
5. Please verify aconfirm chacteris f the final or mounted products in using the Products.
6. In pular, if a transienarge amount of load applied in a short period of time, such as pulse. is applied,
confirman of performance haracteristics after on-board mounting is strongly recommended. Avoid applying power
ding normal rated powerexceeding the power rating under steady-state loading condition may negatively affect
ct performance and reliability.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
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Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
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2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
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please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. e take proper
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1. Product performance and soldered connections may deteriorate if the Products are stn the places where:
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[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability oducts out of recommened storage time period
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