BU9882-E2 [ROHM]

EEPROM, PDIP14, DIP-14;
BU9882-E2
型号: BU9882-E2
厂家: ROHM    ROHM
描述:

EEPROM, PDIP14, DIP-14

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 光电二极管
文件: 总17页 (文件大小:812K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TECHNICAL NOTE  
Double-cell Memory for Plug & Play  
EDID Memory  
BR24C21/F/FJ/FV, BU9882/F/FV-W  
BR24C21/F/FJ/FV  
Description  
The BR24C21 series ICs are serial EEPROMs that support DDC1TM/DDC2TM interfaces for Plug and Play displays.  
Features  
1) Compatible with both DDC1TM/DDC2TM  
2) Operating voltage range: 2.5V to 5.5V  
3) Page write function: 8bytes  
4) Low power consumption  
Active (at 5V)  
: 1.5mA (typ)  
Stand-by (at 5V) : 0.1μA (typ)  
5) Address auto increment function during Read operation  
6) Data security  
Write enable feature (VCLK)  
Write protection at low Vcc  
7) Various packages available: DIP-T8 / SOP8 / SOP-J8 / SSOP-B8  
8) Initial data=FFh  
9) Data retention: 10years  
10) Rewriting possible up to 100,000 times  
Absolute maximum ratings (Ta=25)  
Recommended operating conditions  
Parameter  
Symbol  
VCC  
Rating  
-0.3+6.5  
Unit  
V
Parameter  
Supply Voltage  
Input Voltage  
Symbol  
VCC  
Rating  
2.55.5  
0VCC  
Unit  
V
Supply Voltage  
800 (DIP-T8)  
450 (SOP8)  
450 (SOP-J8)  
*1  
*2  
*3  
VIN  
V
Power Dissipation  
Pd  
mW  
350 (SSOP-B8) *4  
Storage  
Temperature  
Operating  
Temperature  
Terminal Voltage  
Tstg  
-65+125  
Memory cell characteristics  
Topr  
-
-40+85  
Limits  
Typ. Max.  
Parameter  
Min.  
Unit  
-0.3VCC+0.3  
V
Write/Erase Cycle  
Data Retention  
100,000  
10  
-
-
-
-
Cycle  
Year  
* Reduce by 8.0 mW/°C over 25°C (*1), 4.5mW/(*2,3), and 3.5mW/(*4)  
Ver.B Oct.2005  
Electrical characteristics - DC (Unless otherwise specified, Ta=-40℃~+85℃、VCC=2.5V5.5V)  
Limits  
Parameter  
Symbol  
Unit  
Condition  
Min.  
0.7VCC  
Typ.  
10  
Max.  
VIH1  
VIL1  
VIH2  
VIL2  
VIL3  
VOL  
ILI  
V
V
SCL, SDA  
SCL, SDA  
VCLK  
“H” Input Voltage 1  
“L” Input Voltage 1  
“H” Input Voltage 2  
“L” Input Voltage 2  
“L” Input Voltage 3  
“L” Output Voltage  
Input Leakage Current  
Output Leakage Current  
Operating Current  
Standby Current  
0.3VCC  
2.0  
V
0.8  
V
VCLK, VCC4.0V  
0.2VCC  
0.4  
V
VCLK, VCC4.0V  
V
SDA, IOL=3.0mA  
-1  
1
μA  
μA  
mA  
μA  
SCL, VCLK, VIN=0VVCC  
SDA, VOUT=0VVCC  
VCC=5.5V, fSCL=400kHz  
VCC=5.5V, SDA=SCL=VCC,VCLK=GND *1  
ILO  
-1  
1
ICC  
ISB  
3.0  
100  
Note: This IC is not designed to be radiation-resistant  
*1 Transmit-Only Mode - After power on, the BR24C21/F/FJ/FV is in Standby mode and does not provide the clock to the  
VCLK pin. After the clock is provided to VCLK, the device is switched from Standby to Transmit-Only Mode, and the  
operating current flows.  
Bi-directional Mode - The BR24C21/F/FJ/FV is in Standby mode after each command is performed.  
Block diagram  
1 Kbit EEPROM ARRAY  
N.C. 1  
8
7
6
5
VCC  
8bit  
7bit  
ADDRESS  
DECODER  
SLAVEWORD  
DATA  
2
VCLK  
SCL  
SDA  
N.C.  
7bit  
ADDRESS REGISTER  
REGISTER  
START  
CONTROL LOGIC  
STOP  
N.C. 3  
GND 4  
ACK  
HIGH VOLTAGE  
VCC LEVEL DETECT  
Fig.1 Block Diagram  
Pin layout diagram  
VCC  
VCLK  
SCL  
SDA  
Pin Name  
I/O  
IN  
Functions  
VCC  
GND  
N.C.  
SCL  
Power Supply  
Ground 0V)  
No Connection  
BR24C21  
BR24C21F  
BR24C21FJ  
BR24C21FV  
Serial Clock Input for Bi-directional Mode  
Slave and Word Address,  
SDA  
IN/OUT  
IN  
Serial Data Input, Serial Data Output *1  
Clock Input (Transmit-Only Mode)  
Write Enable (Bi-directional Mode)  
VCLK  
N.C.  
N.C.  
N.C.  
GND  
*1 An open drain output requires a pull-up resistor.  
Fig.2 Pin Layout  
2/16  
Electrical characteristics - AC (Unless otherwise specified, Ta=-40℃~+85,VCC=2.5V5.5V)  
Fast-mode  
Standard-mode  
VCC=2.5V5.5V  
VCC=2.5V5.5V  
Parameter  
Symbol  
Unit  
Min. Typ. Max. Min. Typ. Max.  
Clock Frequency  
fSCL  
tHIGH  
tLOW  
tR  
0.6  
1.3  
400  
4.0  
4.7  
100 kHz  
Data Clock High Period  
Data Clock Low Period  
SDA and SCL Rise Time  
SDA and SCL Fall Time  
Start Condition Hold Time  
Start Condition Setup Time  
Input Data Hold Time  
μs  
μs  
μs  
μs  
μs  
μs  
ns  
0.3  
0.3  
1.0  
0.3  
tF  
tHD:STA 0.6  
tSU:STA 0.6  
4.0  
4.7  
0
tHD:DAT  
tSU:DAT 100  
tPD  
tSU:STO 0.6  
0
Input Data Setup Time  
Output Data Delay Time(SCL)  
Stop Condition Setup Time  
Bus Free Time  
250  
ns  
0.9  
3.5  
μs  
μs  
μs  
ms  
μs  
4.0  
4.7  
tBUF  
tWR  
tI  
1.3  
Write Cycle Time  
10  
0.1  
10  
0.1  
Noise Spike Width (SDA and SCL)  
AC OPERATING CHARACTERISTICS (Transmit-Only Mode)  
Output Data Delay Time(VCLK)  
VCLK High Period  
tVPD  
1.0  
4.0  
4.7  
0
2.0  
μs  
μs  
μs  
μs  
μs  
μs  
μs  
μs  
tVHIGH 0.6  
VCLK Low Period  
tVLOW  
tVSU  
tVHD  
tVHZ  
tVPU  
tVI  
1.3  
0
VCLK Setup Time  
VCLK Hold Time  
0.6  
0
4.0  
0
Mode Transition Time  
Transmit-Only Powerup Time  
Noise Spike Width (VCLK)  
0.5  
1.0  
0.1  
0.1  
Synchronous data timing  
tR  
tF  
tHIGH  
SCL  
SCL  
tLOW  
t
HD:DAT  
t
SU:DAT  
tHD:STA  
SDA  
D0  
ACK  
SDA  
(IN)  
tWR  
STOP CONDITION  
WRITE DATA(n)  
tBUF  
tPD  
START CONDITION  
SDA  
(OUT)  
Fig.4 Write Cycle Timing  
START BIT  
STOP BIT  
SCL  
SCL  
SDA  
tHD:STA  
tSU:STO  
tSU:STA  
SDA  
STOP BIT  
START BIT  
VCLK  
Fig.3 Synchronous Data Timing  
SDA data is latched into the chip at the rising edge of the SCL clock.  
Output data toggles at the falling edge of the SCL clock.  
WRITE COMMAND  
tVHD  
tVSU  
Fig.5 Write Enable Timing  
3/16  
Transmit-only mode  
After power is on, the BR24C21/F/FJ/FV is in Transmit-Only Mode. In this mode data can be output by providing the  
clock to the VCLK pin.  
When the power is on, the SCL pin needs to be set to VCC(High level).  
SDA is at high-impedance during input of the first 9 clocks. At the 10th rising clock edge of VCLK data is output. After  
power on, the output data is as follows:  
00h address data 01h address data 02h address data …  
The address is incremented by one, after every 9 clocks of VCLK. All addresses are output in this mode.  
When the counter reaches the last address, the next output data is 00h address data. (See Fig. 6)  
In this mode, the NULL bit (High data) is output between the address data and the next address data. (See Fig. 7)  
The read operation is in Transmit-Only Mode and can be started after the power is stabilized.  
tVHIGH tVLOW  
Vcc  
SCL  
VCLK  
tVPD  
9
1
10  
SDA  
D1  
D0  
D7  
D6  
VCLK  
SDA  
tVPU  
ADDRESS  
DATA  
n
NULL BIT  
DATA=1  
ADDRESS n+1  
DATA  
D7  
D6  
D5  
D4  
D3  
00h ADDRESS DATA  
Fig.7 Null Bit  
Fig.6 Transmit Only Mode  
Bi-directional mode  
Bi-directional Mode and Recovery Function  
The BR24C21/F/FJ/FV can be switched from Transmit-Only Mode to Bi-directional Mode by providing a valid High to  
Low transition at the SCL pin, while the state of SDA is at high-impedance.  
After a valid high to low transition on the SCL pin, the BR24C21/F/FJ/FV begins to count the VCLK clock. If the VCLK  
counter reaches 128 clocks without the command for Bi-directional Mode, the device reverts to Transmit-Only Mode  
(Recovery function). The VCLK counter is reset by providing a valid high to low transition at the SCL pin. After reversal  
to Transmit-Only Mode the device begins to output data (00h address data) with the 129th rising clock edge of VCLK.  
If the BR24C21/F/FJ/FV is switched from Transmit-Only Mode and receives the command for Bi-directional  
Mode and responds with an Acknowledge, it is impossible to revert to Transmit-Only Mode. (Power down is the only  
way to revert to Transmit-Only Mode.) Unless the input device code is “1010”, the device does not respond with an  
Acknowledge. If the VCLK counter reaches 128 clocks afterwards, it is possible to revert to Transmit-Only Mode for  
Recovery function. If the Master generates a STOP condition during the Slave address, before an Acknowledge is  
input, it is possible to revert to Transmit-Only Mode.  
When the device is switched from Transmit-Only Mode to Bi-direction Mode, the period of tVHZ needs to be held.  
B i - d i r e c t i o n a l  
B i - d i r e c t i o n a l  
B i - d i r e c t i o n a l  
p a r m a n e n t l y  
T r a n s m i t - o n l y  
T r a n
s
m
i
t
-
O
n l y  
T r a n s m i t - o n l y  
T r a n s i t i o n M o d e w i t h p o s s i b i l i t y  
T r a n s i t i o n M o d e w i t h p o s s i b i l i t y  
MODE  
MODE  
t o r e t u n e t o T r a n s m i t - O n l y M o d e  
t o r e t u n e t o T r a n s m i t - O n l y M o d e  
n<128  
127 128 129  
VCLK  
SCL  
SDA  
VCLK  
SCL  
SDA  
A D D R E S S 0 0 h  
tVHZ  
tVHZ  
D7 D6 D5 D4  
R/W CK  
*Don’t care  
Fig.8 Recovery Mode  
Fig.9 Mode Change  
4/16  
Bi-directional Mode  
START Condition  
All commands are proceeded by the START condition, which is a High to Low transition of SDA when SCL is High.  
The BR24C21/F/FJ/FV continuously monitors the SDA and SCL lines for the START condition and will not respond to  
any commands until this condition has been met.  
(See Fig. 3 Synchronous Data Timing)  
STOP Condition  
All commands must be terminated by a STOP condition, which is a Low to High transition of SDA when SCL  
is High.  
The STOP condition causes the internal write cycle to write data into the memory array after a write sequence.  
The STOP condition is also used to place the device into standby power mode after read sequences.  
A STOP condition can only be issued after the transmitting device has released the bus.  
(See Fig.3 Synchronous Data Timing)  
Device Addressing  
Following the START condition, the Master outputs the device address of the Slave to be accessed. The most  
significant four bits of Slave address are the “device type indentifier,” For the BR24C21/F/FJ/FV this is fixed as  
“1010.”  
The next three bits of the slave address are inconsequential.  
The last bit of the stream determines the operation to be performed. When set to “1”, a READ operation is selected.  
When set to “0”, a WRITE operation is initiated.  
R/W set to "0" ・ ・ ・ ・ ・ ・ ・ ・ WRITE (This bit is also set to "0" for random read operation)  
R/W set to "1" ・ ・ ・ ・ ・ ・ ・ ・ READ  
1010  
R/W  
Don’t care  
Write Protect Function  
Write Enable (VCLK)  
When using the BR24C21/F/FJ/FV in Bi-directional Mode, the VCLK pin can be used as a write enable pin. Setting  
VCLK High allows normal write operations, while setting VCLK low prevents writing to any location in the array.See  
Fig.5 Write Enable Timing)  
Changing VCLK from High to Low during the self-timed program operation will not halt programming of the device.  
Bidirectional mode command  
Byte Write  
S
T
W
R
I
T
E
S
T
O
P
A
When the Master generates a STOP condition, the  
BR24C21/F/FJ/FV begins the internal write cycle  
to the nonvolatile array.  
SLAVE  
WORD  
ADDRESS  
R
DATA  
ADDRESS  
T
SDA  
LINE  
WA  
0
WA  
6
1
0
1
0
*
*
*
*
D7  
D0  
R
/
W
A
C
K
A
C
K
A
C
K
VCLK  
*:Don’t care  
Fig.10 Byte Write Cycle Timing  
Page Write  
If the Master transmits the next data instead of  
generating a STOP condition during the byte write  
cycle, the BR24C21/F/FJ/FV transfers from byte  
write function to page write function. After receipt  
of each word, the three lower order address bits  
are internally incremented by one, while the high  
order four bits of the word address remains  
constant.  
S
W
R
I
S
T
A
R
T
T
O
P
SLAVE  
WORD  
T
E
DATA(n)  
DATA(n+7)  
ADDRESS  
ADDRESS  
SDA  
LINE  
WA  
WA  
0
***  
1 0 1 0  
D7  
D0  
D0  
*
6
R A  
A
C
K
A
C
K
A
C
K
/ C  
WK  
If the master transmits more than eight words, prior  
to generating the STOP condition, the address  
counter will “roll over,” and the previous  
transmitted data will be overwritten.  
VCLK  
*:Don’t care  
Fig.11 Page Write Cycle Timing  
5/16  
Current Read  
The BR24C21/F/FJ/FV contains an internal address counter which maintains the address of the last word accessed,  
incremented by one. If the last accessed address is address “n” in a Read operation, the next Read operation will  
access data from address “n+1” and increment the current address counter. If the last accessed address is address  
”n” in a Write operation, the next Read operation will access data from address “n”. If the Master does not transfer an  
Acknowledge, but does generate a STOP condition, the current address read operation will only provide a single byte of  
data. At this point, the device discontinues transmission.  
(See Fig.14 Sequential Read Cycle Timing)  
S
R
E
A
D
S
T
O
P
T
A
R
T
SLAVE  
ADRESS  
DATA  
SDA  
LINE  
* * *  
1
0
1
0
D7  
D0  
R
A
C
K
A
C
K
/
W
*:Dont care  
Fig.12 Current Read Cycle Timing  
Random Read  
The Random read operation allows the Master to access any memory location. This operation involves a two-step  
process. First, the Master issues a Write command that includes the START condition and the Slave address field (with  
R/W set to “0”) followed by the word address of the word to be read. This procedure sets the internal address counter of  
the BR24C21/F/FJ/FV to the desired address. After the word address Acknowledge is received by the Master, the  
Master immediately re-issues a START condition followed by the Slave address field with R/W set to “1.” The device will  
respond with an Acknowledge and then transmit the 8-data bits stored at the addressed location. If the Master does not  
acknowledge the transmission but does generate the STOP condition, the IC will discontinue transmission.  
S
T
A
R
T
W
R
I
T
E
S
T
A
R
T
R
E
A
D
S
T
O
P
SLAVE  
ADDRESS  
WORD  
ADDRESS(n)  
SLAVE  
ADDRESS  
DATA(n)  
SDA  
LINE  
WA  
0
WA  
6
1
0
1
0
*
*
*
*
1
0
1
0
*
*
*
D7  
D0  
A
C
K
R
/
W K  
A
C
A
C
K
R
/
W K  
A
C
*:Dont care  
Fig.13 Random Read Cycle Timing  
Sequential Read  
If the Master does not transfer an Acknowledge and does not generate a STOP condition during the current Read  
operation, the BR24C21/F/FJ/FV continues to output the next address data in sequence. For Read operations, all bits  
in the address counter are incremented, allowing the entire array to be read during a single operation. When the  
counter reaches the top of the array, it will “roll over” to the bottom of the array and continue to transmit data.  
If the Master does not acknowledge the transmission but does generate a STOP condition, at this point the device  
discontinues transmission.  
The sequential Read operation can be performed with both Current Read and Random Read.  
S
R
S
T
O
P
T
A
R
T
E
A
D
SLAVE  
ADDRESS  
DATA(n)  
DATA(n+x)  
SDA  
LINE  
1
0
1
0
*
*
*
D7  
D0  
D7  
D0  
R
/
W K  
A
C
A
C
K
A
C
K
A
C
K
*:Dont care  
Fig.14 Sequential Read Cycle Timing  
(Current Read)  
6/16  
BU9882/F/FV-W  
Description  
The BU9882 ICs are dual port EEPROMs compatible with the DDC2TM. 2 independent ports allow 2 EDID channels to be  
read simultaneously.  
Features  
1) Designed for use with DDC2TM  
2) 2-port simultaneous read function  
3) Operating voltage range: 2.5V-5.5V  
4) Page write function: 8bytes  
5) Low power consumption:  
Active (at 5V) : 1.5mA(typ)  
Stand-by (at 5V) : 0.1μA(typ)  
6) Data security  
Write protection with WP  
Write protection at low power supply voltage  
7) Various package types available: DIP14 / SOP14 / SSOP14  
8) Initial data: FFh  
9) Data retention: 10years  
10) Rewriting possible up to 100,000 times  
Absolute maximum ratings  
Recommended operating conditions  
Parameter  
Symbol  
VCC  
Rating  
Unit  
V
Parameter  
Supply Voltage  
Input Voltage  
Symbol  
VCC  
Rating  
2.55.5  
Unit  
V
Supply Voltage  
-0.3+6.5  
1
*
2
*
3
*
950 (DIP14)  
VIN  
0VCC+1.0  
V
Power Dissipation  
Pd  
450 (SOP14)  
350 (SSOP14)  
mW  
Storage  
Temperature  
Operating  
Temperature  
Terminal Voltage  
Memory cell characteristics  
Tstg  
-65+125  
Limits  
Topr  
-
-40+85  
Parameter  
Min.  
Unit  
Typ. Max.  
4
*
-0.3VCC+1.0  
V
Write/Erase Cycle 100,000  
-
-
-
-
Cycle  
Year  
* Reduce by 9.5 mW/°C over 25°C (*1), 4.5mW/(*2), 3.5mW/(*3).  
Data Retention  
10  
*4 6.8V (Max.)  
Electrical characteristics – DC (Unless otherwise specified, Ta=-40℃~+85,VCC=2.5V5.5V)  
Limits  
Parameter  
Symbol  
Unit  
Condition  
Min.  
2.0  
Typ.  
Max.  
VIH1  
VIL1  
VIL2  
V
V
V
V
“H” Input Voltage 1  
0.8  
VCC4.0V  
VCC4.0V  
“L” Input Voltage 1  
“L” Input Voltage 2  
“L” output Voltage  
0.2VCC  
0.4  
VOL1  
SDA_PC0/1, IOL=3.0mA *1  
SCL_PC0/1,DDCENA, BANKSEL,  
Input Leakage Current 1  
Input Leakage Current 2  
Output Leakage Current  
ILI1  
ILI2  
ILO  
-1  
-1  
-1  
1
50  
1
μA  
μA  
μA  
VIN=0VVCC+1.0  
___  
WP  
SDA_PC0/1,SCL/SDA_MON(DDCENA=GND),  
VOUT=0VVCC+1.0  
fSCL=400kHz, VCC=5.5V  
tWR=10ms  
Operating Current  
Standby Current  
ICC  
ISB  
1.5  
0.1  
3.0  
5
A  
μA  
SCL/SDA_PC0/1=VCC  
SCL/SDA_MON=H-Z  
DDCENA=WPB=BANKSEL=GND  
DUALPCB=VCC  
Note: This IC is not designed to be radiation-resistant  
*1 IOL at monitor mode (DDCENAHIGH) is the sum of current flowing from the pull up resistor at the SDA_MON side to the pull up resistance at SDA_PC0/PC1  
7/16  
Block diagram  
Fig.15 Block Diagram  
Pin layout diagram  
VCC  
WP  
DUALPCB BANKSEL DDCENA SCL_MON SDA_MON  
BU9882-W  
BU9882F-W  
BU9882FV-W  
SCL_PC0 SDA_PC0  
N.C.  
SCL_PC1 SDA_PC1  
N.C.  
GND  
Fig.16 Pin Layout  
Pin description  
Pin Name  
VCC  
I/O  
Functions  
Power Supply  
Ground 0V)  
No Connection  
GND  
N.C.  
Serial Clock Input, Access to BANK0 at DUAL PORT mode  
Access to BANK0 or to BANK1 at SINGLE PORT mode  
Slave and Word Address Serial Data Input, Serial Data Output  
Access to BANK0 at DUAL PORT mode, Access to BANK0 or to BANK1 at SINGLE PORT mode  
Serial Clock Input  
Access to BANK1 at DUAL PORT mode, Don't Care at SINGLE PORT mode  
Slave and Word Address Serial Data Input, Serial Data Output  
Access to BANK1 at DUAL PORT mode, Don't Care at SINGLE PORT mode  
Serial Clock Output  
Connected to SCL_PC0/1 at DDCENA="High", "Hi-Z" output at DDCENA="Low"  
Slave and Word Address Serial Data Output  
Connected to SCL_PC0/1 DDCENA="High", "Hi-Z" output at DDCENA="Low"  
Control of SCL_MON, SDA_MON  
SCL_PC0  
SDA_PC0  
SCL_PC1  
SDA_PC1  
SCL_MON  
IN  
IN/OUT  
IN  
IN/OUT  
OUT  
SDA_MON  
DDCENA  
BANKSEL  
OUT  
IN  
Select a SCL/SDA_MON Connected Port at DUAL PORT mode  
Selected a BANK at SINGLE PORT mode  
IN  
DUALPCB  
_
IN  
IN  
Control of DUAL PORT/SINGLE PORT mode  
Write Protect Control  
WP  
An open drain output requires a pull-up resistor.  
8/16  
Electrical characteristics – AC (Unless otherwise specified, Ta=-40℃~+85℃、VCC=2.5V5.5V)  
Fast-mode  
Standard-mode  
Unit  
Typ.  
Parameter  
Clock Frequency  
Symbol  
VCC=2.5V5.5V  
VCC=2.5V5.5V  
Min.  
Typ. Max.  
Min.  
Typ. Max.  
fSCL  
tHIGH  
tLOW  
tR  
0.6  
1.3  
400  
4.0  
4.7  
100  
kHz  
μs  
μs  
μs  
μs  
μs  
μs  
ns  
Data Clock High Period  
Data Clock Low Period  
SDA and SCL Rise Time  
SDA and SCL Fall Time  
Start Condition Hold Time  
Start Condition Setup Time  
Input Data Hold Time  
0.3  
0.3  
1.0  
0.3  
tF  
tHD:STA  
tSU:STA  
tHD:DAT  
tSU:DAT  
tPD  
0.6  
0.6  
0
4.0  
4.7  
0
Input Data Setup Time  
Output Data Delay Time(SCL)  
Stop Condition Setup Time  
Bus Free Time  
100  
250  
ns  
0.9  
3.5  
μs  
μs  
μs  
ms  
μs  
tSU:STO  
tBUF  
0.6  
1.3  
4.0  
4.7  
Write Cycle Time  
tWR  
10  
0.1  
10  
0.1  
Noise Spike Width (SDA and SCL)  
tI  
Synchronous data timing  
Write cycle timing  
tR  
tF  
tHIGH  
SCL  
SCL  
tHD:STA  
tSU:DAT  
tLOW  
tHD:DAT  
SDA  
D0  
ACK  
SDA  
(IN)  
tWR  
WRITE DATA (n)  
tBUF  
tPD  
STOP CONDITION  
START CONDITION  
SDA  
(OUT)  
Fig.18 Write Cycle Timing  
SCL  
SDA  
tSU:STA  
tHD:STA  
tSU:STO  
START BIT  
STOP BIT  
Fig.17 Synchronous Data Timing  
SDA data is latched into the chip at the rising edge of the SCL clock.  
The output date toggles at the falling edge of the SCL clock.  
Operation notes  
DDCENA Operation  
When DDCENA is set to High, SCL_PC0/1 and SDA_PC0/1 will be connected to SCL_MON and SDA_MON,  
respectively. Therefore, monitoring of the communications between the PC and EEPROM, and the communications of  
the MONITOR and PC, is possible.  
Selection of PC0/PC1 is determined according to the state of the DUALPCB and BANKSEL inputs.  
When DDCENA is Low, the SCL/SDA_MON output is set to "Hi-Z".  
SCL_MON,SDA_MON  
DUALPCB  
BANKSEL  
(CONNECTION PORT)  
PC0 PORT  
Low  
High  
Low  
High  
Low (DUAL PORT)  
High (SINGLE PORT)  
PC1 PORT  
PC0 PORT  
9/16  
BANKSEL  
BANKSEL serves as an input for connection port of SCL/SDA_MON during DUAL PORT mode.  
It turns into the BANK selection terminal of internal memory in SINGLE PORT mode.  
Only the PC0 port can access the memory in SINGLE PORT mode.  
DUALPCB  
BANKSEL  
Low  
CONNECTION BANK  
PC0 PORTBANK0  
PC1 PORTBANK1  
BANK0  
Low (DUAL PORT)  
High  
Low  
High (SINGL PORT)  
High  
BANK1  
WP  
When WP=Low, all data at all addresses are write-protected. The terminal has a built-in pull down resister. Make sure  
that WP=High when writing data.  
Utilize this function in order to prevent incorrect write command input from the PC, as well as incorrect input during  
communication between the PC and monitor.  
Data Read  
The data read function allows simultaneous read from SCL_PC0/1, SDA_PC0/1 in DUAL PORT mode.  
Data Write  
Write operation is performed  
S
T
A
R
T
W
R
I
using either PC0/1 (SCL or  
SDA) even when accessed  
simultaneously in DUAL PORT  
mode. Port selection is made  
by detecting the data D0 of  
the first byte of the WRITE  
command input.  
S
T
O
P
SLAVE  
WORD  
ADDRESS  
T
E
DATA  
ADDRESS  
SDA_PC  
WA  
0
WA  
6
1
0
1
0
0
0
0
*
D7  
D0  
R
/
W
A
C
K
A
C
K
A
C
K
*:Don’t care  
After this, the other port is  
made unavailable for both  
READ and WRITE commands  
until the write operation is  
completed.  
During other port is write command.  
this ack is no output.  
D0 detected first write operation  
performed through the port  
Fig.19 Write Cycle Timing  
START Condition  
All commands are preceeded by the START condition, which is a High to Low transition of SDA when SCL is High. This  
IC continuously monitors the SDA and SCL lines for the START condition and will not respond to any commands until  
this condition has been met.  
STOP Condition  
All commands must be terminated by a STOP condition, which is a Low to High transition of SDA when SCL is HIGH.  
(See Fig.17)  
WRITE Command  
Unless a STOP condition is executed, the data will not be written into the memory array.  
DEVICE ADDRESSING  
Following a START condition, the Master outputs the device address of the slave to be accessed.  
The most significant four bits of the Slave address are the "device type indentifier".  
For the IC this is fixed as "1010".  
The next three bits are "000".  
The last bit of the stream determines the operation to be performed.  
When set to "1", Read operation is selected ; when set to "0", Write operation is selected.  
R/W set to "0" ・ ・ ・ ・ ・ ・ ・ ・ WRITE  
R/W set to "1" ・ ・ ・ ・ ・ ・ ・ ・ READ  
__  
1010  
0
0
0
R/W  
10/16  
Commands  
Byte Write  
S
T
A
R
T
W
R
I
T
E
S
T
O
P
When the Master generates a STOP condition, the IC  
begins an internal write cycle to the nonvolatile array.  
SLAVE  
ADDRESS  
WORD  
ADDRESS  
DATA  
SDA  
LINE  
WA  
0
WA  
6
1
0
1
0
0
0
0
*
D7  
D0  
R
/
W
A
C
K
A
C
K
A
C
K
*:Don’t care  
Fig.20 Byte Write Cycle Timing  
Page Write  
After the receipt of each word, the three low order  
address bits are internally increased by one. The  
S
T
W
R
I
T
E
S
T
O
P
A
SLAVE  
WORD  
R
four higher order bits of the address(WA6WA3)  
remain constant. This IC is capable of eight byte  
page write operation.  
DATA(n)  
DATA(n+7)  
ADDRESS  
T
ADDRESS  
SDA  
LINE  
WA  
WA  
0
1
0
1
0
0
0
0
D7  
D0  
D0  
*
6
If the master transnmits more than eight words,  
prior to generating the STOP condition, the address  
counter will "roll over", and the previous transmitted  
data will be overwritten.  
R
/
W
A
C
K
A
C
K
A
C
K
A
C
K
*:Don’t care  
Fig.21 Page Write Cycle Timing  
Current Read  
S
T
A
In case the previous operation is random or current read (which includes  
sequential read), the internal address counter is increased by one from the  
last acceseed address (n). Thus current read outputs the data of the next  
word address (n+1).  
R
E
A
D
S
T
O
P
SLAVE  
R
DATA  
ADRESS  
T
SDA  
LINE  
1
0
1
0
0
0
0
D7  
D0  
If the last command is byte or page write, the internal address stays at the  
last address(n). Thus current read outputs the data of the word address (n).  
If the master does not transfer the Acknowledge, but does generate a stop  
condition, the current address read operation only provides a single byte of  
data.  
R
A
C
K
A
C
K
/
W
Fig.22 Current Read Cycle Timing  
At this point, the BU9882/F/FV-W discontinues transmission.  
Random Read  
Random read operation allows the master to  
S
T
A
R
T
W
R
I
S
T
A
R
T
R
E
A
D
S
T
O
P
access any location.  
SLAVE  
WORD  
SLAVE  
ADDRESS  
T
E
DATA(n)  
ADDRESS  
ADDRESS  
If the master does not transfer the Acknowledge  
but does generate a stop condition, the current  
address read operation only provides a single byte  
of data. (At 1Kbit all address read possible).  
This communication must be terminated by a stop  
condition, which is a Low to High transition of SDA  
when SCL is High.  
SDA  
LINE  
WA  
0
WA  
6
1
0
1
0
0
0
0
*
1
0
1
0
0
0
0
D7  
D0  
A
C
K
R
/
W K  
A
C
A
C
K
R
/
W K  
A
C
*:Don’t care  
Fig.23 Random Read Cycle Timing  
Sequential Read  
During the Current read operation, if an  
Acknowledge is detected, and no STOP condition  
is generated by the master(μ-COM), the device  
will continue to transmit the data. (It can transmit  
all data(1Kbit 128word)). If an Acknowledge is not  
detected, the devive will terminate further data  
transmissions and await a STOP condition before  
returning to the standby mode. The Sequential  
Read operation can be performed with both  
Current Read and Random Read.  
S
R
E
A
D
S
T
A
R
T
T
O
P
SLAVE  
DATA(n)  
DATA(n+x)  
ADDRESS  
SDA  
LINE  
1
0
1
0
0
0
0
D7  
D0  
D7  
D0  
R
/
W K  
A
C
A
C
K
A
C
K
A
C
K
Fig.24 Sequential Read Cycle Timing  
11/16  
Peripheral Circuits  
DUAL PORT  
DUAL PORTs are used to connect two PCs to one monitor. PC0 is connected to BANK0 and PC1 to BANK1. Each bank  
operates as 1Kbit EEPROM.  
To Use DUAL PORT  
PC 0  
MONITOR  
Start the operation of the DUAL PORT by  
following the instructions below:  
CC  
SCL  
1. Set the DUAL PCB to LOW with neither of  
the ports being operated by commands.  
2. Input the command from PC0 or PC1.  
Simultaneous Access  
SDA  
VCC  
SCL_PC0  
BANK0  
(1kbit)  
SDA_PC0  
WP  
DUALPCB  
BANKSEL  
DDCENA  
NC  
SCL_PC1  
CPU  
<READ OPERATION>  
BANK1  
(1kbit)  
SDA_PC1  
NC  
EEPROM data read allows simultaneous access  
from PC0, PC1 ports.  
SCL_MON  
SDA_MON  
PC 1  
GND  
<WRITE OPERATION>  
SCL  
SDA  
Write operation is performed for either of PC0/1  
even when accessed simultaneously from both.  
Port selection is made by detecting the data D0  
of the first byte of the WRITE command input.  
Write operation is performed only for the port  
where D0 of the first byte of the write data is  
detected first.  
Fig.25 Example of Peripheral Circuit with Dual Port  
Write operation performed  
Through the port.  
S
T
A
R
T
S
T
A
R
T
S
T
O
P
S
T
O
P
R
/
W
R
/
W
A
C
K
A
C
K
SLAVE  
ADDRESS  
BANK0 WORD  
ADDRESS(W)  
SLAVE  
ADDRESS  
Output Data from BANK0  
SDA-PC0  
BUS  
SDA-PC0  
BUS  
*WA6  
*
WA0  
1
1
D7  
D0  
1
1
D7  
D0  
S
T
O
Output Data from BANK1  
BANK1 WORD  
ADDRESS(W)  
P
SDA-PC1  
BUS  
1
D0  
SDA-PC1  
BUS  
*WA6  
WA0  
1
1
D7  
D0  
1D7
No ACK  
*:Don’t care  
Fg27 Smultaneous Access  
Fig.27 Simultaneous Access  
Fig.26 Simultaneous Access  
of Read Operation  
of White Operation  
MONITOR OUTPUT  
BU9882/F/FV-W has a monitor output terminal. This allows communication between the PC and monitor CPU.  
The monitor output for the use of DUAL PORT can be switched with BANKSEL input, as shown in the table below.  
BANKSEL input  
SCL_MON,SDA_MON connection port  
PC0 PORT  
Low  
High  
PC1 PORT  
PC 0  
MONITOR  
SINGLE PORT  
SINGLE PORT is for connecting one  
PC to one monitor. In this case, it is  
accessible only from PC0. BANK  
selection is made with BANKSEL.  
Switching this BANKSEL allows  
access to the total of 2kbit EEPROM,  
with BANK0 and BANK1, from PC0.  
To use SINGLE PORT  
CC  
SCL  
SDA  
VCC  
SCL_PC0  
SDA_PC0  
NC  
BANK0  
(1kbit)  
WP  
DUALPCB  
BANKSEL  
DDCENA  
SCL_PC1  
SDA_PC1  
CPU  
BANK1  
(1kbit)  
Start the SINGLE PORT operation  
by following the instructions below:  
1. Set the DUAL PCB to High with  
neither of the ports being operated  
by commands.  
SCL_MON  
SDA_MON  
NC  
GND  
2. Select the BANK with BANKSEL.  
3. Input the command from PC0.  
Fig.28 Example of Peripheral Circuit with Single Port  
12/16  
Common Application Note  
Dummy Clock×14  
Start×2  
Software Reset  
Execute software reset in case the device is at  
an unexpected state after power up and/or the  
command input needs to be reset. The following  
figures (Fig.29-(a), Fig.29-(b), Fig.29-(c))  
During dummy clock, please release SDA BUS  
(tied to Vcc by pull up resistor).  
2
13  
14  
1
SCL  
SDA  
COMMAND  
COMMAND  
Fig.29-(a) Dummy Clock×14StartStart  
During that time, the device may pull the SDA  
line Low for acknowledge or outputting read  
data. If the master controls the SDA line High, it  
will conflict with the device output Low then it  
Start  
Start  
Dummy Clock×9  
1
2
8
9
SCL  
SDA  
COMMAND  
COMMAND  
makes  
a current overload. It may cause  
Fig.29-(b) StartDummy Clock×9Start  
instantaneous power down and may damage  
the device.  
Start×9  
3
7
SCL  
SDA  
2
8
9
1
COMMAND  
COMMAND  
Fig.29-(c) Start×9  
Acknowledge Polling  
During the internal write cycle,  
no ACK will be returned.  
(ACK=High)  
Since the device ignores all input commands  
during the internal write cycle, no ACK will be  
returned. When the master sends the next  
command following the write command, and the  
device returns the ACK, it means that the  
program is completed. If no ACK is returned, it  
means that the device is still busy. By using  
Acknowledge polling, the waiting time is  
minimized to less than tWR=5ms. To prevent  
operating Write or Current Read immediately  
after Write, first send the slave address (R/W is  
"High" or "Low"). After the device returns the  
ACK, continue word address input or data  
output, respectively.  
THE FIRST WRITE COMMAND  
S
S
T
T
S
T
A
R
T
S
A
A
SLAVE  
SLAVE  
T
A
R
T
C
K
H
C
K
H
A
WRITE COMMAND  
O
R
P
T
ADDRESS  
ADDRESS  
tWR  
THE SECOND WRITE COMMAND  
S
S
T
A
R
T
S
T
A
C
K
L
A
C
K
L
A
A
C
K
L
WORD  
T
A
R
T
SLAVE  
SLAVE  
ADDRESS  
C
K
H
DATA  
O
P
ADDRESS  
ADDRESS  
tWR  
After the internal write cycle  
is completed ACK will be returned  
(ACK=Low). Then input next  
Word Address and data.  
Fig.30 Successive Write Operation By Acknowledge Polling  
Command Cancellation By Start And Stop Condition  
During a command input, command is canceled  
by the successive inputs of start condition and  
SCL  
stop condition (Fig.31). However, during ACK or  
data output, the device may output the SDA line  
Low. In such cases, operation of start and stop  
condition is impossible, making the reset  
inoperable. Execute the software reset in the  
cases. (Fig.29)  
SDA  
1
1
0
0
Start  
Stop  
Condition  
Operating the command cancel by start and  
stop condition during the command of Random  
Read or Sequential Read or Current Read,  
internal address counter is not confirmed.  
Therefore operation of Current Read after this is  
not valid. Operate a Random Read in this case.  
Condition  
Fig.31 Command Cancellation  
13/16  
I/O Circuit  
SDA Pin Pull-up Resister  
The pull up resister is needed because SDA is NMOS open drain. Choose the correct value of this resister(RPU), by  
considering VIL, IL characteristics of a controller which control the device and VOH, IOL characteristics of the device. If  
large RPU is chosen, clock frequency needs to be slow. In case of small RPU, the operating current increases.  
Maximum Rpu  
Maximum value of RPU is determined by following factors:  
SDA rise time determined by RPU and the capacitance of bus line(CBUS) must be less than tR.  
Other timing must keep the conditions of AC spec.  
When SDA bus is High, the voltage A of SDA bus determined by a total input leak(IL) of the all devices connected to  
the bus. RPU must be significantly higher than the High level input of a controller and the device, including a noise  
margin 0.2VCC.  
MICRO  
COMPUTER  
VCC-ILRPU-0.2 VCC VIH  
CC IH  
0.8V -V  
RPU  
PU  
R
IL  
A
SDA PIN  
Examples: When VCC=3V IL=10μA VIH=0.7VCC  
According to ②  
IL  
IL  
0.8×3-0.7×3  
10×10-6  
PU  
R
THE CAPACITANCE OF  
BUS LINE (CBUS)  
kΩ]  
300  
Minimum RPU  
The minimum value of RPU is determined by following factors:  
Meets the condition that VOLMAX=0.4V, IOLMAX=3mA when the output is Low.  
Fig.32 I/O Circuits  
CC OL  
V
-V  
OL  
I  
PU  
R
CC OL  
V
-V  
PU  
R
OL  
I
VOLMAX=0.4V must be lower than the input Low level of the microcontroller and the EEPROM  
including the recommended noise margin of 0.1VCC.  
VOLMAX VIL-0.1 VCC  
Examples: VCC=3V, VOL=0.4V, IOL=3mA, the VIL of the controller and the EEPROM is VIL=0.3VCC,  
3-0.4  
3×10 -3  
PU  
R
According to ①  
Ω
867  
and  
VOL=0.4V]  
VIL=0.3×3  
=0.9V]  
so that conditionis met  
SCL Pin Pull-up Resister  
When SCL is controlled by the CMOS output the pull-up resistor at SCL is not required.  
However, should SCL be set to Hi-Z, connection of a pull-up resistor between SCL and VCC is recommended.  
Several kΩ are recommended for the pull-up resistor in order to drive the output port of the microcontroller.  
14/16  
Notes For Power Supply  
VCC rises through the low voltage region in which the internal circuit of the IC and the controller are unstable. Therefore, the  
device may not work properly due to an incomplete reset of the internal circuit. To prevent this, the device has a P.O.R. and  
LVCC feature. At power up, maintain the following conditions to ensure functions of P.O.R and LVCC.  
1. "SDA='H'" and "SCL='L' or 'H'".  
2. Follow the recommended conditions of tR, tOFF, Vbot for the P.O.R. function during power up.  
tR  
Recommended conditions of tR, tOFF, Vbot  
VCC  
tR  
tOFF  
Vbot  
Below 10ms Above 10ms Below 0.3V  
Below 100ms Above 10ms Below 0.2V  
tOFF  
Vbot  
0
Fig.33 Vcc rising wave from  
3. Prevent SDA and SCL from being "Hi-Z".  
In case conditions 1 and/or 2 cannot be met, take following actions:  
AIf unable to keep condition 1 ( SDA is "Low" during power up):  
Control SDA ,SCL to be "High" as shown in figure below.  
VCC  
tLOW  
SCL  
SDA  
After Vcc becoms stable  
After Vcc becoms stable  
tDH tSU:DAT  
tSU:DAT  
Fig.34 SCL="H" and SDA="L"  
BIf unable to keep condition 2.  
Fig.35 SCL="L" and SDA="L"  
After power becomes stable, execute software reset. (See Fig.29)  
CIf unable to keep both conditions 1 and 2.  
Follow the instruction A first, then the instruction B.  
LVCC Circuit  
LVCC circuit inhibits write operation at low voltage, and prevents an inadvertent write. Write operation is inhibited below the  
LVCC voltage (Typ.=1.2V).  
Vcc NOISE  
Bypass Condenser  
Noise and surges on power line may cause abnormal function. It is recommended that the bypass condensers (0.1μF) are  
attached on the Vcc and GND line beside the device. It is also recommended to attach bypass condensers on the board close  
to the connector.  
Caution On Use  
1) Described numeric values and data are design representative values, and the values are not guaranteed.  
2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further  
sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in  
consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI.  
3) Absolute maximum ratings  
If the absolute maximum ratings such as impressed voltage and operating temperature range and so forth are exceeded, LSI  
may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear  
exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions  
exceeding the absolute maximum ratings should not be impressed to LSI.  
4) GND electric potential  
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltages is lower than that of  
GND terminal.  
5) Heat design  
In consideration of permissible dissipation in actual use condition, carry out heat design with sufficient margin.  
6) Terminal to terminal shortcircuit and wrong packaging  
When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may destruct  
LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND owing to foreign  
matter, LSI may be destructed.  
7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluated design sufficiently.  
15/16  
Selection of order type  
BR  
24  
C
21  
/F/FJ/FV  
E2  
Package type  
Blank:DIP-T8  
F:SOP8  
FJ:SOP-J8  
FV:SSOP-B8  
Product  
Package specifications  
ROHM type  
name  
BUS type  
24:I2C  
Capacity  
21=1k  
type  
Blank:Tube(only for DIP)  
E2:Embossed carrier tape  
C:2.5V Version  
BU  
9882  
/F/FV  
W
E2  
Package specifications  
ROHM type  
name  
Package type  
Blank:DIP14  
F:SOP14  
FV:SSOP-B14  
Double cell  
Product  
No  
Blank:Tube(only for DIP)  
E2:Embossed carrier tape  
SOP8  
DIP-T8  
<Dimension>  
<Tape and Reel information>  
<Packing information>  
<Dimension>  
Tape  
Embossed carrier tape  
2500pcs  
9.3 0.3  
Container  
Quantity  
Tube  
Quantity  
8
5
2000pcs  
5.0 0.2  
Direction  
of feed  
E2  
Direction  
of feed  
Direction of products is fixed in a container tube.  
8
5
(The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand)  
1
4
7.62  
1
4
0.15 0.1  
0.1  
1.27  
0.4 0.1  
2.54  
0.5 0.1  
0° ∼ 15°  
Direction of feed  
1Pin  
Reel  
(Unit:mm)  
(Unit:mm)  
When you order , please order in times the amount of package quantity.  
When you order , please order in times the amount of package quantity.  
SOP-J8  
<Dimension>  
SSOP-B8  
<Dimension>  
<Tape and Reel information>  
<Tape and Reel information>  
Tape  
Embossed carrier tape  
2500pcs  
Tape  
Embossed carrier tape  
2500pcs  
4.9 0.2  
Quantity  
Quantity  
3.0 0.2  
8
7
6
5
8
5
Direction  
of feed  
E2  
E2  
Direction  
of feed  
(The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand)  
(The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand)  
1
4
0.15 0.1  
0.2 0.1  
0.1  
0.1  
0.22 0.1  
(0.52) 0.65  
1.27  
0.42 0.1  
Direction of feed  
1pin  
1Pin  
When you order , please order in times the amount of package quantity.  
Directionof feed  
Reel  
Reel  
(Unit:mm)  
Unit:mm)  
When you order , please order in times the amount of package quantity.  
SOP14  
DIP14  
<Tape and Reel information>  
<Dimension>  
<Packing information>  
<Dimension>  
Tape  
Embossed carrier tape  
Container  
Quantity  
Tube  
19.4 0.3  
Quantity  
2500pcs  
8.7 0.2  
14  
1
8
7
1000pcs  
8
E2  
14  
1
Direction  
of feed  
Direction  
of feed  
Direction of products is fixed in a container tube.  
(The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand)  
7.62  
7
0.15 0.1  
0.1  
1.27  
0.4 0.1  
0°  
15°  
2.54  
0.5 0.1  
1Pin  
Direction of feed  
Reel  
(Unit:mm)  
(Unit:mm)  
When you order , please order in times the amount of package quantity.  
SSOP-B14  
<Dimension>  
<Tape and Reel information>  
Embossed carrier tape  
Tape  
Quantity  
2500pcs  
5.0 0.2  
14  
8
.
E2  
Direction  
of feed  
(The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand)  
1
7
0.15 0.1  
0.1  
0.22 0.1  
0.65  
1pin  
Direction of feed  
Reel  
Unit:mm)  
When you order , please order in times the amount of package quantity.  
Catalog No.05T326Be '05.11 ROHM C 1000 TSU  
Appendix  
Notes  
No technical content pages of this document may be reproduced in any form or transmitted by any  
means without prior permission of ROHM CO.,LTD.  
The contents described herein are subject to change without notice. The specifications for the  
product described in this document are for reference only. Upon actual use, therefore, please request  
that specifications to be separately delivered.  
Application circuit diagrams and circuit constants contained herein are shown as examples of standard  
use and operation. Please pay careful attention to the peripheral conditions when designing circuits  
and deciding upon circuit constants in the set.  
Any data, including, but not limited to application circuit diagrams information, described herein  
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM  
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any  
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of  
whatsoever nature in the event of any such infringement, or arising from or connected with or related  
to the use of such devices.  
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or  
otherwise dispose of the same, no express or implied right or license to practice or commercially  
exploit any intellectual property rights or other proprietary rights owned or controlled by  
ROHM CO., LTD. is granted to any such buyer.  
Products listed in this document are no antiradiation design.  
The products listed in this document are designed to be used with ordinary electronic equipment or devices  
(such as audio visual equipment, office-automation equipment, communications devices, electrical  
appliances and electronic toys).  
Should you intend to use these products with equipment or devices which require an extremely high level  
of reliability and the malfunction of which would directly endanger human life (such as medical  
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers  
and other safety devices), please be sure to consult with our sales representative in advance.  
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance  
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow  
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in  
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM  
cannot be held responsible for any damages arising from the use of the products under conditions out of the  
range of the specifications or due to non-compliance with the NOTES specified in this catalog.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact your nearest sales office.  
THE AMERICAS / EUROPE / ASIA / JAPAN  
ROHM Customer Support System  
Contact us : webmaster@ rohm.co.jp  
www.rohm.com  
TEL : +81-75-311-2121  
FAX : +81-75-315-0172  
Copyright © 2008 ROHM CO.,LTD.  
21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan  
Appendix1-Rev2.0  

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