BU9799KV-E2_技术文档

Datasheet

Standard LCD Segment Driver

BU9799KV

MAX 200 segments (SEG50×COM4)

●Features

●Key Specifications

Integrated RAM for display data (DDRAM):

50 x 4 bit (Max 200 Segment)

LCD drive output :

4 Common output, 50 Segment output

Integrated Buffer AMP for LCD driving

Integrated Oscillator circuit

■

Supply Voltage Range:

+2.5V to +5.5V

LCD drive power supply Range:

Operating Temperature Range:

Max Segments:

Display Duty:

Bias:

+2.5V to +5.5V

-40°C to +85°C

200 Segments

1/4

1/2, 1/3 selectable

2wire serial interface

No external components

Interface:

Low power consumption design

Independent power supply for LCD driving

Integrated Electrical volume register (EVR) function

●Package

W (Typ.) x D (Typ.) x H (Max.)

●Applications

Telephone

FAX

Portable equipment (POS, ECR, PDA etc.)

DSC

DVC

Car audio

Home electrical appliances

Meter equipment, etc.

VQFP64

12.00mm x 12.00mm x 1.60mm

●Typical Application Circuit

VDD

VLCD

COM0

COM1

COM2

COM3

VDD

VLCD

SD

SCL

Controller

Segment

LCD

VDD

SEG0

SEG1

INHb

OSCIN

TEST1

TEST2

TEST3

VSS

SEG49

Internal oscillator circuit mode

Figure 1. Typical application circuit

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays.

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MAX 200 segments (SEG50×COM4)

●Block Diagram / Pin Configuration / Pin Description

COM0 …… COM3

…

SEG0 SEG49

VLCD

LCD voltage generator

Segment

driver

Common

driver

＋

－

49

32

SEG21

＋

LCD

SEG38

SEG39

SEG40

SEG41

SEG42

SEG43

SEG44

SEG45

SEG46

SEG47

SEG48

SEG49

COM0

COM1

COM2

COM3

－

SEG20

SEG19

SEG18

SEG17

SEG16

SEG15

SEG14

SEG13

SEG12

SEG11

SEG10

SEG9

BIAS

Blink timing

generator

Common

counter

DDRAM

SELECTOR

＋

－

VSS

INHb

Command

Data Decoder

Command

register

OSCIN

OSCILLATOR

SEG8

Power On Reset

Serial interface

SEG7

SEG6

64

17

VDD

VSS

IF FILTER

SDA

TEST3

TEST2

TEST1

SCL

Figure 2. Block Diagram

Figure 3. Pin Configuration (TOP VIEW)

Table 1 Pin Description

Terminal

Terminal No.

8

I/O

I

Function

Input terminal for turning off display

H: turn on display L: turn off display

INHb

Test input (ROHM use only)

TEST1=”L”: POR circuit enable

TEST1=”H”: POR circuit disable,

refer to “Cautions in Power ON/OFF”

TEST1

9

I

Test input (ROHM use only)

Must be connected to VSS

TEST2

TEST3

OSCIN

SDA

10

I

Test input (ROHM use only)

Must be connected to VSS

5

External clock input

External clock and Internal clock modes can be selected by command.

Must be connected to VSS when use internal oscillation circuit.

4

7

Serial data input

SCL

6

3

Serial data transfer clock

GND

VSS

VDD

2

Power supply

VLCD

SEG0-49

COM0-3

1

Power supply for LCD driving

SEGMENT output for LCD driving

COMMON output for LCD driving

11-60

61-64

O

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MAX 200 segments (SEG50×COM4)

●Absolute Maximum Ratings (VSS=0V)

Parameter

Symbol

Ratings

Unit

V

Remarks

Power Supply Voltage1

Power Supply Voltage2

VDD

-0.5 to +7.0

Power supply

LCD drive voltage

VLCD

V

When operated at more than 25℃,

subtract 7.5mW/°C (Package only)

Power dissipation

Input voltage range

Pd

0.75

W

V

VIN

Topr

Tstg

-0.5 to VDD+0.5

-40 to +85

Operational temperature

range

℃

Storage temperature range

-55 to +125

●Recommended Operating Ratings(Ta=-40°C to +85°C,VSS=0V)

Ratings

Parameter

Symbol

Unit

Remarks

MIN

2.5

TYP

MAX

5.5

Power Supply Voltage1

Power Supply Voltage2

VDD

-

V

Power supply

VLCD

2.5

5.5

LCD drive voltage

●Electrical Characteristics

DC Characteristics (VDD=2.5V to 5.5V, VLCD=2.5V to 5.5V, VSS=0V, Ta=-40℃ to 85℃, unless otherwise specified)

Limits

Parameter

Symbol

Unit

Conditions

MIN

TYP

MAX

“H” level input voltage

“L” level input voltage

“H” level input current

“L” level input current

VIH

VIL

IIH

0.8VDD

-

VDD

V

SDA,SCL

VSS

-

0.2VDD

-

-1

-

1

-

µA SDA,SCL

IIL

-

SEG

COM

RON

Ist

3.5

-

kΩ

LCD Driver on

resistance

Iload=±10µA

-

kΩ

Standby current

-

5

µA Display off, Oscillation off

VDD=3.3V, VLCD=5V, Ta=25℃

µA Power save mode1, FR=70Hz

1/3 bias, Frame inverse

VDD=3.3V, VLCD=5V, Ta=25℃

µA Power save mode1, FR=70Hz

1/3 bias, Frame inverse

Power consumption 1

Power consumption 2

IDD

-

2.5

10

15

20

ILCD

Oscillation Characteristics (VDD=2.5V to 5.5V, VLCD=2.5V to 5.5V, VSS=0V, Ta=-40℃ to 85℃, unless otherwise specified)

Limits

Parameter

Frame frequency

MPU interface Characteristics

Symbol

fCLK

Unit

Conditions

MIN

56

TYP

80

MAX

104

Hz FR = 80Hz setting, VDD=3.3V

(VDD=2.5V to 5.5V, VLCD=2.5V to 5.5V, VSS=0V, Ta=-40℃ to 85℃, unless otherwise specified)

Limits

Parameter

Symbol

Unit

Conditions

MIN

-

TYP

MAX

Input rise time

tr

-

0.3

µs

us

µs

Input fall time

tf

-

0.3

SCL cycle time

tSCYC

tSHW

tSLW

2.5

0.6

1.3

100

1.3

0.6

-

“H” SCL pulse width

“L” SCL pulse width

SDA setup time

tSDS

SDA hold time

tSDH

Buss free time

tBUF

START condition hold time

START condition setup time

STOP condition setup time

tHD;STA

tSU;STA

tSU;STO

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MAX 200 segments (SEG50×COM4)

SDA

tf

tS LW

tSCYC

tBUF

SCL

SDA

tSDH

tS HW

tSDS

tHD; STA

tr

tSU; STO

tSU; STA

Figure 4. Interface Timing

●I/O equivalent circuit

SDA

VDD

VSS

SCL

VSS

VLCD

VSS

VDD

OSCIN

VSS

TEST3

VSS

VLCD

SEG/COM

VSS

Figure 5. I/O equivalent circuit

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MAX 200 segments (SEG50×COM4)

●Example of recommended circuit

VDD

VLCD

COM0

COM1

COM2

COM3

VDD

VLCD

SD

SCL

Controller

Segment

LCD

VDD

SEG0

SEG1

INHb

OSCIN

TEST1

TEST2

TEST3

VSS

SEG49

Internal oscillator circuit mode

VLCD

VDD

COM0

COM1

COM2

COM3

VDD

VLCD

SD

SCL

Controller

Segment

LCD

VDD

SEG0

SEG1

INHb

OSCIN

TEST1

TEST3

TEST2

VSS

SEG49

External clock input mode

Figure 6. Example of recommended circuit

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MAX 200 segments (SEG50×COM4)

●Functional descriptions

○Command /Data transfer method

This device is controlled by 2-wire signal (SDA, SCL).

SDA

SCL

START condition

STOP condition

Figure 7. 2-SPI Command/Data transfer Format

It is necessary to generate START condition and STOP condition in 2wire serial interface transfer method.

Slave address

A

Display Data

A

P

Command

S

0

1

0

A

C

Command or data judgment bit

Acknowledge

STOP condition

START condition

Figure 8. Interface protcol

Method of how to transfer command and data is shown as follows.

1) Generate “START condition”.

2) Issue Slave address.

3) Transfer command and display data.

○Acknowledge

Data format is 8bits. After transfer of 8-bits data, Acknowledge bit is returned.

When SCL 8th =’L’ after transfer 8bit data (Slave Address, Command, Display Data), SDA outputs ’L’

When SCL 9th =’L’, SDA stops output function.

(Since SDA Output format is NMOS-Open-Drain, it can’t output ‘H’ level.)

If there is no need Acknowledge function, please input ‘L’ level from SCL 8th=’L’ to SCL 9th=’L’.

SDA

1-7

8

9

1-7

8

9

1-7

8

9

SCL

S

P

ACK

DATA

SLAVE ADDRESS

ACK

START

STOP

condition

Figure 9. Acknowledge timing

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MAX 200 segments (SEG50×COM4)

○Command transfer method

Issue Slave Address (“01111100”) after generation of “START condition”.

1byte after Slave Address always becomes command input.

MSB (“command or data judge bit”) of command decide if next data is command or display data.

When set “command or data judge bit”=‘1’, next byte data is command.

When set “command or data judge bit”=‘0’, next byte data is display data.

S

Slave address

Display Data

A

1 Command

A

1

Command

A 1

A

0

…

P

Command

When display data is transferred, inputting of command is not allowed

When one wants to input command again, please generate “START condition” once.

If “START condition” or “STOP condition” are inputted in the middle of command transmission, command will be

canceled.

If Slave address is inputted after “START condition”, execution of command is allowed.

Please input “Slave Address” in the first data transmission after “START condition”.

When Slave Address cannot be recognized in the first data transmission, Acknowledge does not return and next

transmission will be invalid. When data transmission is invalid status, if “START conditions” are transmitted again, it will

return to valid status.

Take care to observe MPU Interface characteristic such as Input rise time and Setup/Hold time when transferring

command and data (Refer to MPU Interface).

○Write display and transfer method

This device has Display Data RAM (DDRAM) of 50×4=200bits.

The relationship between data input and display data, DDRAM data and address are as follows;

Slave address

Command

S

01111100

A

0

0000000

A

a

b

c

d

e

f

g

h

A

i

j

k

l

m

n

o

p

A

…

P

Display Data

8 bit data will be stored in DDRAM. The address to be written is the address specified by ADSET command, and the

address is automatically incremented in every 4bit data.

Data can be continuously written in DDRAM by transmitting Data continuously.

(When RAM data is written successively after writing RAM data to 31h (SEG49), the address is returned to 00h (SEG0)

by the auto-increment function.

DDRAM address

00

a

01

e

f

02

03

m

n

04

05

06

07

・・・

2Fh

30h

31h

0

1

2

3

i

j

COM0

COM1

COM2

COM3

b

BIT

c

g

h

k

l

o

d

p

SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7

SEG47 SEG48 SEG49

Data transfer to DDRAM happens every 4bit data.

So it will be finished to transfer with no need to wait ACK.

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MAX 200 segments (SEG50×COM4)

○OSCILLATOR

There are two kinds of clock for logic and analog circuit; from internal oscillator circuit or external clock input. If internal

oscillator circuit will be used, OSCIN must be connected to VSS.

*When using external clock mode, it has to input external clock from OSCIN terminal after ICSET command setting.

Clock

OSCIN

VSS

OSCIN

VSS

BU9799KV

Figure 10. Internal oscillator circuit mode

Figure 11. External clock input mode

○ LCD Driver Bias Circuit

This device generates LCD driving voltage with on-chip Buffer AMP.

And it can drive LCD at low power consumption.

*1/3 and 1/2Bias can set in MODESET command.

*Line and frame inversion can set in DISCTL command.

Refer to the “LCD driving waveform” about each LCD driving waveform.

○ Blink timing generator

This device has Blink function.

* This device will be at Blink mode with BLKCTL command.

Blink frequency varies widely by characteristic of fCLK, when internal oscillator circuit is used.

Refer to Oscillation Characteristics for more details on fCLK.

○ Reset initialize condition

Initial conditions after execution of Software Reset are as follows.

・Display is OFF.

・DDRAM address is initialized (DDRAM Data is not initialized).

Refer to Command Description about initialize value of register.

●Command / Function List

Description List of Command / Function

No.

1

Command

Mode Set (MODE SET)

Function

Set LCD drive mode

2

Address set (ADSET)

Display control (DISCTL)

Set IC Operation (ICSET)

Blink control (BLKCTL)

All Pixel control (APCTL)

EVR Set 1 (EVRSET1)

EVR Set 2 (EVRSET2)

Set LCD display mode 1

Set LCD display mode 2

Set IC operation

Set Blink mode

3

4

5

6

Set pixel condition

Set EVR 1

7

8

Set EVR 2

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MAX 200 segments (SEG50×COM4)

●Detailed command description

D7 (MSB) is bit for command or data judgment.

Refer to Command and data transfer method.

C: 0: Next byte is RAM write data.

1: Next byte is command.

○Mode Set (MODE SET)

MSB

D7

LSB

D0

D6

1

D5

0

D4

0

D3

P3

D2

P2

D1

*

C

*

( * : Don’t care)

Set display ON and OFF

Setting

P3

Reset initialize condition

Display OFF

Display ON

0

1

○

Display OFF : Regardless of DDRAM data, all SEGMENT and COMMON output will be stopped after 1frame off

data write. Display OFF mode will be finished by Display ON.

Display ON : SEGMENT and COMMON output will be active and start to read the display data from DDRAM.

Set bias level

setup

P2

0

Reset initialize condition

1/3 Bias

1/2 Bias

○

1

Refer to LCD driving waveform

○Address set (ADSET)

MSB

D7

LSB

D0

D6

0

D5

0

D4

P4

D3

P3

D2

P2

D1

P1

C

P0

It is set address as follows;

MSB

LSB

Internal register

command

Address [5]

ICSET [P2]

Address [4]

・・・

Address [0]

ADSET [P0]

ADSET [P4]

The range of address can be set as 00000 to 10001(2).

Don’t set out of range address, otherwise address will be set 00000.

ICSET command is only define MSB bit of address, not set the address of DDRAM.

If want to set the address of DDRAM, it has to be input ADSET command.

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MAX 200 segments (SEG50×COM4)

○Display control (DISCTL)

MSB

D7

LSB

D0

D6

0

D5

1

D4

P4

D3

P3

D2

P2

D1

P1

C

P0

Set Power save mode FR

Power save mode FR

P4

P3

Reset initialize condition

Normal mode (80Hz)

0

1

0

1

0

1

○

Power save mode1 (71Hz)

Power save mode2 (64Hz)

Power save mode3 (50Hz)

* Power consumption is reduced in the follow order:

Normal mode > Power save mode1 > Power save mode2 > Power save mode3

Set LCD drive waveform

Setup

Line inversion

Frame inversion

P2

0

Reset initialize condition

○

1

* Power consumption is reduced in the follow order: Line inversion > Frame inversion

Refer to LCD drive waveform

Set Power save mode SR

Setup

Power save mode1

Power save mode2

Normal mode

P1

0

P0

0

Reset initialize condition

0

1

0

○

High power mode

1

* Power consumption is increased in the follow order:

Power save mode 1 < Power save mode 2 < Normal mode < High power mode

(Reference current consumption data)

Setup

Power save mode 1

Power save mode 2

Normal mode

Current consumption

×0.6

×0.8

×1.0

×1.2

High power mode

*Above data is reference. It depends on Panel load.

(Note) The setting of Power save mode FR, LCD waveform, Power save mode will influence the following display image qualities.

Please select most suitable value from current consumption and display image quality with LCD panel.

Mode

Flicker

Image quality, contrast

Power save mode FR

LCD waveform

○

-

○

Power save mode SR

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MAX 200 segments (SEG50×COM4)

○Set IC Operation (ICSET)

MSB

D7

LSB

D0

D6

1

D5

1

D4

0

D3

1

D2

P2

D1

P1

C

P0

P2: Define the MSB bit of address of DDRAM. Refer to ADSET command.

Set software reset execution

Setup

No operation

P1

0

Software Reset execute

1

This command will be set initialize condition.

When executed Software reset, P1 and P0 will be ignored.

Set oscillator mode

setup

P0

0

Reset initialize condition

Internal oscillation

○

External clock input

1

Internal oscillation: Must be connected to VSS.

External clock input: Input external clock from OSCIN terminal

ICSET

Command

OSCIN_EN

(internal)

Internal OSC mode

External clock mode

INT oscillation

(internal)

EXT clock

(OSCIN)

Figure 12. Oscillator mode change timing

○Blink control (BLKCTL)

MSB

D7

LSB

D0

D6

1

D5

1

D4

1

D3

0

D2

*

D1

P1

C

P0

Set blink mode

Blink mode (Hz)

P1

P0

0

Reset initialize condition

OFF

0.5

1

0

1

○

1

0

2

1

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MAX 200 segments (SEG50×COM4)

○All Pixel control (APCTL)

MSB

D7

LSB

D0

D6

1

D5

1

D4

1

D3

1

D2

1

D1

P1

C

P0

All display set ON, OFF

APON

P1

Reset initialize condition

Normal

0

1

○

All pixel ON

APOFF

Normal

P0

0

Reset initialize condition

○

All pixel OFF

1

All pixels ON

All pixels OFF

:

All pixels are ON regardless of DDRAM data

All pixels are OFF regardless of DDRAM data

(Note) This command is valid in Display on status.

The data of DDRAM don’t change by this command. If set both P1 and P0 =”1”, APOFF will be select.

○EVR Set 1(EVRSET1)

MSB

D7

LSB

D0

D6

1

D5

1

D4

0

D3

0

D2

P2

D1

P1

C

P0

It is able to control 32-step Electrical Volume Register (EVR).

It is able to set V0 voltage level (the max level voltage of LCD driving voltage).

It is set electrical volume register as follows;

MSB

EVR4

LSB

EVR0

EVR3

EVR2

EVR1

EVRSET1 EVRSET1 EVRSET1 EVRSET2 EVRSET2

P2

P1

P0

P1

P0

0

Reset initialize condition

Electrical Volume Register (EVR) is set “00000” in reset initialize condition

In “00000” condition, V0 voltage output VLCD voltage.

Please refer to next page about V0 output voltage.

It is prohibited the EVR setting that V0 voltage will be under 2.5V.

EVRSET1 is defined the upper 3bit of electrical volume register.

It will be set the electrical volume register by this command (EVRSET1) input.

○EVR Set 2(EVRSET2)

MSB

D7

LSB

D0

D6

1

D5

1

D4

1

D3

1

D2

0

D1

P1

C

P0

EVRSET2 is defined the lower 2bit of electrical volume register.

It will be set the electrical volume register by this command (EVRSET2) input.

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MAX 200 segments (SEG50×COM4)

○The relationship of Electrical Volume Register (EVR) setting and V0 voltage

Calculation

formula

EVR

VLCD= 5.500 VLCD= 5.000 VLCD= 4.000 VLCD= 3.500 VLCD= 3.000 VLCD= 2.500 [V]

V0= 5.500

0

VLCD

V0= 5.000

V0= 4.839

V0= 4.688

V0= 4.545

V0= 4.412

V0= 4.286

V0= 4.167

V0= 4.054

V0= 3.947

V0= 3.846

V0= 3.750

V0= 3.659

V0= 3.571

V0= 3.488

V0= 3.409

V0= 3.333

V0= 3.261

V0= 3.191

V0= 3.125

V0= 3.061

V0= 3.000

V0= 2.941

V0= 2.885

V0= 2.830

V0= 2.778

V0= 2.727

V0= 2.679

V0= 2.632

V0= 2.586

V0= 2.542

V0= 2.500

V0= 2.459

V0= 4.000

V0= 3.871

V0= 3.750

V0= 3.636

V0= 3.529

V0= 3.429

V0= 3.333

V0= 3.243

V0= 3.158

V0= 3.077

V0= 3.000

V0= 2.927

V0= 2.857

V0= 2.791

V0= 2.727

V0= 2.667

V0= 2.609

V0= 2.553

V0= 2.500

V0= 2.449

V0= 2.400

V0= 2.353

V0= 2.308

V0= 2.264

V0= 2.222

V0= 2.182

V0= 2.143

V0= 2.105

V0= 2.069

V0= 2.034

V0= 2.000

V0= 1.967

V0= 3.500

V0= 3.387

V0= 3.281

V0= 3.182

V0= 3.088

V0= 3.000

V0= 2.917

V0= 2.838

V0= 2.763

V0= 2.692

V0= 2.625

V0= 2.561

V0= 2.500

V0= 2.442

V0= 2.386

V0= 2.333

V0= 2.283

V0= 2.234

V0= 2.188

V0= 2.143

V0= 2.100

V0= 2.059

V0= 2.019

V0= 1.981

V0= 1.944

V0= 1.909

V0= 1.875

V0= 1.842

V0= 1.810

V0= 1.780

V0= 1.750

V0= 1.721

V0= 3.000

V0= 2.903

V0= 2.813

V0= 2.727

V0= 2.647

V0= 2.571

V0= 2.500

V0= 2.432

V0= 2.368

V0= 2.308

V0= 2.250

V0= 2.195

V0= 2.143

V0= 2.093

V0= 2.045

V0= 2.000

V0= 1.957

V0= 1.915

V0= 1.875

V0= 1.837

V0= 1.800

V0= 1.765

V0= 1.731

V0= 1.698

V0= 1.667

V0= 1.636

V0= 1.607

V0= 1.579

V0= 1.552

V0= 1.525

V0= 1.500

V0= 1.475

V0= 2.500 [V]

V0= 2.419 [V]

V0= 2.344 [V]

V0= 2.273 [V]

V0= 2.206 [V]

V0= 2.143 [V]

V0= 2.083 [V]

V0= 2.027 [V]

V0= 1.974 [V]

V0= 1.923 [V]

V0= 1.875 [V]

V0= 1.829 [V]

V0= 1.786 [V]

V0= 1.744 [V]

V0= 1.705 [V]

V0= 1.667 [V]

V0= 1.630 [V]

V0= 1.596 [V]

V0= 1.563 [V]

V0= 1.531 [V]

V0= 1.500 [V]

V0= 1.471 [V]

V0= 1.442 [V]

V0= 1.415 [V]

V0= 1.389 [V]

V0= 1.364 [V]

V0= 1.339 [V]

V0= 1.316 [V]

V0= 1.293 [V]

V0= 1.271 [V]

V0= 1.250 [V]

V0= 1.230 [V]

1

0.967*VLCD V0= 5.323

0.937*VLCD V0= 5.156

0.909*VLCD V0= 5.000

0.882*VLCD V0= 4.853

0.857*VLCD V0= 4.714

0.833*VLCD V0= 4.583

0.810*VLCD V0= 4.459

0.789*VLCD V0= 4.342

0.769*VLCD V0= 4.231

0.750*VLCD V0= 4.125

0.731*VLCD V0= 4.024

0.714*VLCD V0= 3.929

0.697*VLCD V0= 3.837

0.681*VLCD V0= 3.750

0.666*VLCD V0= 3.667

0.652*VLCD V0= 3.587

0.638*VLCD V0= 3.511

0.625*VLCD V0= 3.438

0.612*VLCD V0= 3.367

0.600*VLCD V0= 3.300

0.588*VLCD V0= 3.235

0.576*VLCD V0= 3.173

0.566*VLCD V0= 3.113

0.555*VLCD V0= 3.056

0.545*VLCD V0= 3.000

0.535*VLCD V0= 2.946

0.526*VLCD V0= 2.895

0.517*VLCD V0= 2.845

0.508*VLCD V0= 2.797

0.500*VLCD V0= 2.750

0.491*VLCD V0= 2.705

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

Prohibit setting

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MAX 200 segments (SEG50×COM4)

●LCD driving waveform

(1/3bias)

Line inversion

Frame inversion

SEGn SEGⁿ⁺¹SEGn+2 SEGn+3

SEGn SEGⁿ⁺¹SEGⁿ⁺²SEGⁿ⁺³

COM0

COM1

COM2

COM3

stateA

stateB

COM0

stateA

stateB

COM1

COM2

COM3

1frame

V0

COM0

COM1

COM2

COM3

SEGn

COM0

VSS

V0

VSS

V0

COM1

VSS

V0

VSS

V0

COM2

VSS

V0

VSS

V0

COM3

VSS

V0

VSS

V0

SEGn

VSS

V0

VSS

V0

SEGn+1

SEGn+2

SEGn+3

SEGn+1

SEGn+2

SEGn+3

VSS

V0

VSS

V0

VSS

V0

VSS

V0

VSS

stateA

(COM0-SEGn)

stateA

(COM0-SEGn)

stateB

(COM1-SEGn)

stateB

(COM1-SEGn)

Figure 13. LCD waveform at line inversion (1/3bias)

Figure 14. LCD waveform at frame inversion (1/3bias)

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MAX 200 segments (SEG50×COM4)

(1/2bias)

Line inversion

Frame inversion

SEGn SEGⁿ⁺¹SEGⁿ⁺²SEGn+3

SEGn SEGⁿ⁺¹SEGⁿ⁺²SEGⁿ⁺³

COM0

COM1

COM2

COM3

stateA

stateB

COM0

COM1

COM2

COM3

stateA

stateB

1frame

V0

COM0

COM1

COM2

COM0

COM1

COM2

COM3

SEGn

VSS

V0

VSS

V0

VSS

V0

VSS

V0

VSS

V0

VSS

VLCD

COM3

VSS

V0

VLCD

SEGn

VSS

V0

VSS

V0

SEGn+1

SEGn+2

SEGn+3

VSS

V0

VSS

V0

SEGn+2

SEGn+3

VSS

V0

VSS

V0

VSS

stateA

(COM0-SEGn)

stateA

(COM0-SEGn)

stateB

(COM1-SEGn)

stateB

(COM1-SEGn)

Figure 15. LCD waveform in line inversion (1/2bias)

Figure 16. LCD waveform in frame inversion (1/2bias)

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MAX 200 segments (SEG50×COM4)

●Example of display data

If LCD layout pattern is like as Figure 17, Figure 18, and display pattern is like as Figure 19.

Display data will be shown as follows;

COM0

COM1

COM2

COM3

Figure 17. Example COM line pattern

SEG1 SEG3

SEG2

SEG5 SEG7

SEG4 SEG6 SEG8

SEG9

SEG10

Figure 18. Example SEG line pattern

Figure 19. Example Display pattern

S

E

G

0

S

E

G

1

S

E

G

2

S

E

G

3

S

E

G

4

S

E

G

5

S

E

G

6

S

E

G

7

S

E

G

8

S

E

G

9

S

E

G

S

E

G

S

E

G

S

E

G

S

E

G

S

E

G

S

E

G

S

E

G

S

E

G

S

E

G

10 11 12 13 14 15 16 17 18 19

COM0 D0

COM1 D1

COM2 D2

COM3 D3

Address

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h

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MAX 200 segments (SEG50×COM4)

●Initialize sequence

Please follow below sequence after Power-on to set this LSI to initial condition.

Power on

↓

STOP condition

↓

START condition

↓

Issue slave address

↓

Execute Software Reset by sending ICSET command.

*Each register value and DDRAM address, DDRAM data are random condition after power on till initialize sequence is executed.

●Start sequence

○Start sequence example1

No.

1

Input

D7 D6 D5 D4 D3 D2 D1 D0

Descriptions

Power on

VDD=0→5V (Tr=0.1ms)

↓

2

3

4

5

6

7

8

wait 100µs

Initialize IC

↓

Stop

Stop condition

Start condition

Issue slave address

Software Reset

↓

Start

↓

Slave address

0

1

0

1

0

1

0

1

0

1

*

0

1

0

1

0

↓

ICSET

↓

BLKCTL

*

↓

DISCTL

0

↓

EVRSET1

EVRSET2

↓

9

1

0

1

0

1

0

1

10

11

12

13

ICSET

↓

1

0

1

0

1

0

1

0

*

0

1

0

ADSET

↓

0

RAM address set

Display Data

*

address

00h - 01h

02h - 03h

Display Data

*

address

12h - 13h

↓

14

15

16

17

18

Stop

Stop condition

Start condition

Issue slave address

Display ON

↓

Start

↓

Slave address

0

1

0

1

0

1

0

*

0

*

↓

MODESET

↓

Stop

Stop condition

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MAX 200 segments (SEG50×COM4)

○Start sequence example2

Initialize

Initialize Sequence

DISPON Sequence

RAM write Sequence

DISPOFF Sequence

DISPON

RAM write

DISPOFF

This LSI is initialized with Initialize Sequence. And start to display with DISPON Sequence.

This LSI will update display data with RAM write Sequence.

And stop the display with DISPOFF sequence.

If you want to restart to display, This LSI will restart to display with DISPON Sequence.

Initialize sequence

DATA

Input

Description

D7 D6 D5 D4 D3 D2 D1 D0

Power on

wait 100us

STOP

START

Execute Software Reset

Display OFF

0

1

0

*

1

0

*

1

0

*

1

0

*

1

0

*

1

0

*

0

1

0

*

0

*

Slave address

ICSET

RAM address set

Display data

MODESET

ADSET

Display data

…

STOP

DISPON sequence

DATA

Input

Description

D7 D6 D5 D4 D3 D2 D1 D0

START

Slave address

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

Execute internal OSC mode

Set Display Control

Set BLKCTL

ICSET

DISCTL

BLKCTL

APCTL

Set APCTL

Set EVR1

EVRSET1

EVRSET2

MODESET

Set EVR2

Display ON

STOP

RAM write sequence

DATA

Input

Description

D7 D6 D5 D4 D3 D2 D1 D0

START

Slave address

0

1

0

*

1

0

1

0

*

1

0

*

1

0

1

0

1

0

*

1

0

1

0

1

0

*

1

0

1

0

1

0

*

0

1

0

*

0

1

0

*

Execute internal OSC mode

Set Display Control

Set BLKCTL

ICSET

DISCTL

BLKCTL

APCTL

Set APCTL

Set EVR1

EVRSET1

EVRSET2

MODESET

ADSET

Set EVR2

Display ON

RAM address set

Display data

Display Data

…

STOP

DISPOFF sequence

DATA

Input

Description

D7 D6 D5 D4 D3 D2 D1 D0

START

Slave address

0

1

0

1

0

1

0

1

0

1

0

Execute internal OSC mode

Display OFF

ICSET

MODESET

STOP

According to the effect of noise or other external factor, BU9799KV occur abnormal operation.

To avoid this phenomenon, please input command according to upper sequence certainly,

when initializing IC, displaying ON/OFF, and refreshing RAM data.

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MAX 200 segments (SEG50×COM4)

●DISCTL setup flow chart

START

Picture

quality

Power save FR = Normal Mode

Line inversion

Power save SR = High Power Mode

Reduce Power consumption

or

Best picture image quality

DISCTL setting

"10100011"

Power consumption

Power save FR = Save mode3

Frame inversion

Power save SR = Save mode1

DISCTL setting

"10111100"

Power save FR = Save mode3

Frame inversion

No

DISCTL setting

"10111100"

Display flicker exist?

Power save SR = Save mode1

Yes

Power save FR = Save mode2

Frame inversion

DISCTL setting

"10110100"

Power save SR = Save mode1

Power save FR = Save mode2

Frame inversion

Power save SR = Save mode1

No

DISCTL setting

"10110100"

Display flicker exist?

Yes

Power save FR = Save mode1

Frame inversion

Power save SR = Save mode1

DISCTL setting

"10101100"

Power save FR = Save mode1

Line inversion

Power save SR = Save mode1

No

DISCTL setting

"10101100"

Display flicker exist?

Yes

Power save FR = Normal

Frame inversion

Power save SR = Save mode1

DISCTL setting

"10100100"

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MAX 200 segments (SEG50×COM4)

●Cautions in Power ON/OFF

○Power supply sequence

Please keep Power ON/OFF sequence as below waveform.

To prevent incorrect display, malfunction and abnormal current,

VDD must be turned on before VLCD In power up sequence.

VDD must be turned off after VLCD In power down sequence.

Please satisfies VLCD≥VDD, t1>0ns, t2>0ns

t1

t2

VLCD

10%

VDD min

VDD

VDD min

Figure 20. Power supply sequence

○Caution in P.O.R circuit use

This device has “P.O.R” (Power-On Reset) circuit and Software Reset function.

Please keep the following recommended Power-On conditions in order to power up properly.

Please set power up conditions to meet the recommended tR, tF, tOFF, and Vbot spec below in order to ensure P.O.R

operation

*It has to set TEST1=”L” to be valid in POR circuit.

tF

VDD

tR

Recommended condition of tR, tF, tOFF, Vbot (Ta=25℃)

tR tF tOFF Vbot

Less than Less than More than Less than

5ms 5ms 20ms 0.3V

tOFF

Vbot

Figure 21. Power ON/OFF waveform

If it is difficult to meet above conditions, execute the following sequence after Power-On.

*It has to keep the following sequence in the case of TEST1=”H”. As POR circuit is invalid status.

(1) TEST1 =”H”

VDD

SDA

SCL

STOP condition

Figure 22. Stop condition

(2) Generate STOP condition

(3) Generate START condition

(4) Issue slave address

(5) Execute ICSET command (Software reset).

Refer to the item of the ICSET command for the details.

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MAX 200 segments (SEG50×COM4)

●Operational Notes

(1) Absolute Maximum Ratings

Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit

between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as

adding a fuse, in case the IC is operated over the absolute maximum ratings.

(2) Recommended Operating conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

(3) Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

terminals.

(4) Power Supply Lines

Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines

of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the

analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature

and aging on the capacitance value when using electrolytic capacitors.

(5) Ground Voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no

pins are at a voltage below the ground pin at any time, even during transient condition.

(6) Short between Pins and Mounting Errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong

orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

(7) Operation under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

(8) Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

(9) Regarding Input Pins of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation

of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.

Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower

than the GND voltage should be avoided. Furthermore, do not apply a voltage to the input terminals when no power

supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input terminals have

voltages within the values specified in the electrical characteristics of this IC..

(10) GND Wiring Pattern

When using both small-signal and large-current GND traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on

the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.

(11) External Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

(12) Unused Input Terminals

Input terminals of an IC are often connected to the gate of a CMOS transistor. The gate has extremely high impedance

and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of IC. So unless otherwise specified, input terminals not being used should be connected to the

power supply or ground line.

(13) Rush current

When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to the

parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special consideration

to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.

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MAX 200 segments (SEG50×COM4)

●Ordering Information

B

U

9

7

9

K

V -

E 2

Package

Part Number

Packaging and forming specification

KV

: VQFP64 E2: Embossed tape and reel

(VQFP64)

●Marking Diagram

VQFP64 (TOP VIEW)

Part Number Marking

LOT Number

B U 9 7 9 9

1PIN MARK

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MAX 200 segments (SEG50×COM4)

●Physical Dimension, Tape and Reel Information

Package Name

VQFP64

Tape

Embossed carrier tape (with dry pack)

Quantity

1000pcs

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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MAX 200 segments (SEG50×COM4)

●Revision History

Date

Revision

Changes

14.Mar.2012

001

002

003

New Release

Improved the statement in all pages.

Deleted “Status of this document” in page 23.

Changed format of Physical Dimension, Tape and Reel Information.

8.Jan.2013

23.Jan.2015

Add the condition when power supply in page 20.

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BU9799KV-E2
厂家：	ROHM
描述：	Liquid Crystal Driver, 50-Segment, PQFP64, ROHS COMPLIANT, VQFP-64 驱动接口集成电路
文件：	总27页 (文件大小：705K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BU9799KV-E2 [ROHM]

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