BU90T81 [ROHM]
ROHM的LVDS接口IC，拥有从8MHz到150MHz的非常宽广的工作频率范围和从35bit开始到70bit的传送bit数的串行解串器的产品线。由于能以7倍速率高速串行传输，可以减少电缆的根数到1/3以下。具备能实现更低EMI的低摆动模式。并且具备250MHz动作的4bitLVDS驱动器接收器，可以在液晶电视等的数字家电，复合机以及办公设备，计算测量设备，医疗设备等上广泛使用。;
| 型号： | BU90T81 |
| 厂家： | 
ROHM |
| 描述： | ROHM的LVDS接口IC，拥有从8MHz到150MHz的非常宽广的工作频率范围和从35bit开始到70bit的传送bit数的串行解串器的产品线。由于能以7倍速率高速串行传输，可以减少电缆的根数到1/3以下。具备能实现更低EMI的低摆动模式。并且具备250MHz动作的4bitLVDS驱动器接收器，可以在液晶电视等的数字家电，复合机以及办公设备，计算测量设备，医疗设备等上广泛使用。 医疗 驱动 电视 驱动器 |
| 文件： | 总13页 (文件大小：522K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LVDS Interface ICs
27bit LVDS Transmitter
BU90T81
●General Description
●Key Specifications
▆Supply Voltage range
▆Operating frequency
▆Operating Temperature Range
▆Power Consumption
The BU90T81 transmitter operates from 20MHz to
112MHz wide clock range, and 27bits data of parallel
LVCMOS level inputs(R/G/B24bits and VSYNC,HSYNC,DE)
are converted to four channels of LVDS data stream. Data is
transmitted seven times (7X) stream and reduce cable
number by 3(1/3) or less.
1.65 to 1.95 V
20 to 112MHz
–20 to 85℃
50mW(Typ)
The BU90T81 operates from a single 1.8V supply for low
power. And the BU90T81 has low swing mode to be able to
expect further low power and low EMI .
●Packages
VBGA048W040
4.00 ㎜×4.00 ㎜×0.90 ㎜
●Features
●Applications
▆Tablet
▆Netbook PC
▆Digital Picture Frame
▆24bits data of parallel LVCMOS level inputs are
converted to four channels of LVDS data stream.
▆Support clock frequency from 20MHz up to 112MHz.
▆Low power 1.8V CMOS design
▆Power down mode
▆Clock edge selectable
▆Support 6bit/8bit mode selectable
▆Support reduced swing LVDS for low EMI.
▆Support LVDS Outputs pin reverse function
▆Support spread spectrum clock generator input
●Block Diagram
LVCMOS Input
LVDS Output
TCLK +/-
(20-112MHz)
CLKIIN
(20-112MHz)
PLL
8
R[7:0]
TA +/-
8
G[7:0]
TB +/-
TC +/-
8
B[7:0]
Parallel to Serial
HSYNC
VSYNC
DE
TD +/-
FLIP
6B8B
RS[1:0]
RF
XRST
Figure-1 Block Diagram
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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BU90T81
●Pin Configuration
Top view
1
2
3
4
5
6
7
A
B
C
D
E
G[5] G[7] R[1]
R[3]
R[5]
R[6]
R[7]
-
G[6] R[0]
R[2]
R[4]
TA-
TA+
TB+
TC+
G[3] G[4] GND RS[1] RS[0] TB-
G[1] G[2]
RF
VDD VDD TC-
G[0] B[7] FLIP 6B8B GND TCLK- TCLK+
F
B[6]
B[4]
B[5]
B[3]
B[2]
B[0]
DE
TD-
TD+
G
B[1] HSYNC VSYNC CLKIN XRST
48pin VBGA
Figure-2 Pin Diagram (Top View)
●Pin Description
Pin Name
Pin No.
Type
Descriptions
TA+/-, TB+/-,
TC+/-,TD+/-
B7,B6,C7,C6,D7,D6,F7,F6
LVDS Data out
LVDS Clock out
LVDS
OUT
TCLK+/-
R[7:0]
E7,6
A7,A6,A5,B5,A4,B4,A3,B3
A2,B2,A1,C2,C1,D2,D1,E1
E2,F1,F2,G1,G2,F3,G3,F4
G[7:0]
B[7:0]
Pixel and control data inputs
Clock input
CMOS
IN
HSYNC,VSYNC,
DE
G4,G5,F5
G6
CLKIN
Power Down
H：Normal operation
L：Power down ( all LVDS output signal are Hi-z)
Input CLK Triggering Edge Select.
H：Rising edge
XRST
G7
D3
RF
L：Falling edge
LVDS swing mode select
RS1
RS0
LVDS swing
TYP=160ｍV
TYP=200ｍV
TYP=350ｍV
Reserved
L
L
RS[1:0]
C3,C5
CMOS
IN
L
H
H
L
H
H
6bit/8bit mode select
H : 6bit mode(FLIP=L TD+/- is Hiz)
(FLIP=H TA+/- is Hiz)
L : 8bit mode
6B8B
FLIP
E4
E3
LVDS output pin reverse select.
H : Reverse
L : Normal
VDD
GND
D4,D5
C3,E5
POWER 1.8V Power supply
GND
Ground Pins
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BU90T81
●Absolute Maximum Ratings
Rating
Parameter
Symbol
Units
Min
-0.3
-0.3
-0.3
-55
Max
2.5
Supply Voltage
Input Voltage
VDD
VIN
V
V
VDD+0.3
VDD+0.3
125
Output Voltage
VOUT
Tstg
V
Storage Temperature Range
℃
●Operating Ratings
Rating
Units
Conditions
Symbol
Parameter
Min
Typ
Max
Supply Voltage
Operating Temperature Range
Operating frequency
VDD
Topr
1.65
1.8
1.95
85
V
℃
-20
20
-
-
Fmax
112
MHz
●Package Power
Package
Power Dissipation (mW)
De-rating(mW/℃)＊１
VBGA048W040
800＊１
8.0＊１
*１:Package power when mounting on the PCB board.
The size of PCB board
The material of PCB board
: 114.3×76.2×1.6（mm3）
: The FR4 glass epoxy board.
●DC characteristics
Table 1 : LVCMOS DC Specifications（VDD=1.65V～1.95V, Ta=-20℃～+85℃）
Rating
Symbol
Parameter
Units
Conditions
Min
Typ
Max
VIH
High Level Input Voltage
VDD×0.7
-
VDD
V
VIL
Low Level Input Voltage
Input Current
GND
-10
-
-
VDD×0.3
+10
V
IINC
μA
0V≤VIN≤VDD
Table2: LVDS Transmitter DC Specifications（VDD=1.65V～1.95V, Ta=-20℃～+85℃）
Rating
Symbol
Parameter
Units
Conditions
Min
Typ
Max
250
350
450
mV
RS[1:0]= HL
VOD
Differential Output Voltage
RL=100Ω
RL=100Ω
130
110
200
160
270
210
mV
mV
RS[1:0]= LH
RS[1:0]= LL
Change in VOD between
complementary output states
ΔVOD
VOC
-
1.125
-
-
1.25
-
35
1.375
35
mV
V
Common Mode Voltage
Change in VOC between
complementary output states
ΔVOC
mV
IOS
IOZ
Output Short Circuit Current
Output TRI-STATE Current
-90
-10
-
-
-
mA
VOUT=0V
XRST=0V,
VOUT=0V to VDD
+10
μA
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BU90T81
●AC characteristics
Table 3 : Switching Characteristics（VDD=1.8V, Ta=25℃ RL=100Ω CL=5ｐF RS[1:0]=HL）
Parameter
Symbol
tTCP
tTCIT
tTCH
tTCL
Min
Typ
Max
Units
ns
CLK OUT Period
CLK IN Transition time
CLK IN High Time
8.93
-
50
-
-
5.0
ns
0.35tTCP
0.5tTCP
0.65tTCP
ns
CLK IN Low Time
0.35tTCP
0.5tTCP
0.65tTCP
ns
tTS
LVSMOS Data Set up to CLK IN
LVCMOS Data Hold from CLK IN
2.5
0
-
-
-
-
ns
tTH
ns
tLVT
LVDS Transition Time
Differential Output
-
0.6
1.5
ns
TTSUP
TTHLD
CLKOUT=112MHz
-
-
-
200
200
ｐs
ｐs
Set up Time
Differential Output
Hold time
CLKOUT=112MHz
-
tTCP
tTCP
tTCP
2
3
4
5
6
7
8
- TTHLD
2
2
3
4
5
6
7
8
+ TTSUP
tTOP6
tTOP5
tTOP4
tTOP3
tTOP2
tTOP1
Output Data Position 6
ns
ns
ns
ns
ns
ns
7
tTCP
7
7
7
tTCP
7
tTCP
Output Data Position 5
Output Data Position 4
Output Data Position 3
Output Data Position 2
Output Data Position 1
- TTHLD
- TTHLD
- TTHLD
- TTHLD
- TTHLD
- TTHLD
3
+ TTSUP
+ TTSUP
+ TTSUP
+ TTSUP
+ TTSUP
+ TTSUP
7
tTCP
7
tTCP
tTCP
7
4
7
tTCP
7
tTCP
tTCP
7
5
7
tTCP
7
tTCP
tTCP
7
6
7
tTCP
7
tTCP
tTCP
7
7
7
tTCP
7
tTCP
tTCP
7
8
tTOP0
tTPLL
Output Data Position 0
ns
7
Phase Locked Loop Set Time
-
-
10
ｍs
●AC Timing Diagrams
LVCMOS Input
tTCP
tTCH
90%
90%
CLKIN
LVCMOS Input
RF=L
RF=H
VDD/2
VDD/2
VDD/2
CLKIN
10%
10%
tTCL
tTH
tTCIT
tTCIT
tTS
LVDS Output
Vdiff=(Tx+)-(Tx-)
DATA_IN
VDD/2
VDD/2
tTCD
Tx+
80%
20%
80%
20%
Vdiff
CL
RL
TCLK+
TCLK-
VOC
Tx-
tLVT
tLVT
LVDS Output Load
x=A,B,C.D,CLK
DATA_IN= R[7:0], G[7:0], B[7:0], VSYNC, HSYNC, DE
Figure-3 LVCMOS Input AC Timing Diagrams
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BU90T81
TCLK OUT
(Differential)
TA+/-
G[2] R[7] R[6] R[5] R[4] R[3] R[2]
TB+/-
B[3] B[2] G[7] G[6] G[5] G[4] G[3]
VSY HSY
TC+/-
DE
B[7] B[6] B[5] B[4]
NC
NC
TD+/-
L
B[1] B[0] G[1] G[0] R[1] R[0]
Previous Cycle
tTOP1
Next Cycle
tTOP0
tTOP6
tTOP5
tTOP4
tTOP3
tTOP2
Figure-4 LVDS Output AC Timing Diagrams
●Phase Locked Loop Set Time
1.65
VDD
VDD
V
DD×0.7
XRST
tTPLL
CLKIN
Vdiff=0V
TCLK+/-
Figure-5 Phase Locked Loop Set Time
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BU90T81
●Supply Current
Table 4: Supply Current (6B8B = L)
Rating
Typ
Symbol
Parameter
Units
Conditions
Min
Max
RL=100Ω,CL=5pF
VDD=1.8V,RS[1:0]=HL
Gray Scale Pattern
-
30.4
22.5
20.4
32.4
24.5
-
mA
f=85MHz
f=85MHz
f=85MHz
f=85MHz
f=85MHz
f=85MHz
RL=100Ω,CL=5pF
VDD=1.8V,RS[1:0]=LH
Gray Scale Pattern
Transmitter Supply
Current
ITCCG
-
-
-
-
-
-
-
-
mA
mA
mA
mA
RL=100Ω,CL=5pF
VDD=1.8V, RS[1:0]=LL
Gray Scale Pattern
RL=100Ω,CL=5pF
VDD=1.8V, RS[1:0]=HL
Worst case Pattern
RL=100Ω,CL=5pF
VDD=1.8V, RS[1:0]=LH
Worst case Pattern
Transmitter Supply
Current
ITCCW
RL=100Ω,CL=5pF
VDD=1.8V, RS[1:0]=LL
Worst case Pattern
-
-
22.4
-
-
mA
Transmitter Power Down
Supply Current
ITCCS
10
μA
XRST=L
Gray Scale Pattern
CLKIN
D[0]
D[1]
D[2]
D[3]
D[4]
D[5]
D[6]
D[7]
D=R,G,B
Figure -6 Gray Scale Pattern
Worst Case Pattern (Maximum Power condition)
CLKIN
D[0]
D[1]
D[2]
D[3]
[
D[4]
D[5]
D[6]
D[7]
D=R,G,B
Figure -7 Worst Case Pattern
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BU90T81
●LVDS Data Output Table for Function of FLIP pin
Table 5: LVDS Data Output Pin Name
Output Pin Names
Pin No
FLIP=L
FLIP=H
B7
B6
C7
C6
TA+
TA-
TD-
TD+
TA- TA+
TB- TB+
TD+ TD-
TCLK+TCLK-
TC+ TC-
TB+ TB-
TA+ TA-
TB+
TB-
TCLK-
TCLK+
TC- TC+
D7
D6
E7
TC+
TC-
TC-
TC+
TB-
TCLK- TCLK+
TD- TD+
TCLK+
E6
TCLK-
TB+
F7
F6
TD+
TD-
TA-
TA+
FLIP=H
FLIP=L
●LVCMOS Data Inputs Pixel Map Table
Table 6: LVCMOS Data Inputs Pixel Map Table
TFT Panel Data
BU90T81 Input
24Bit
R0
18Bit
-
LSB
R0
R0
R1
-
R2
R0
R1
R2
R3
R4
R5
-
R1
R3
R2
R4
R3
R5
R4
R6
R5
MSB
LSB
R7
R6
G0
R7
G0
G1
G2
G3
G4
G5
G6
G7
B0
G1
-
G2
G0
G1
G2
G3
G4
G5
-
G3
G4
G5
G6
MSB
LSB
G7
B0
B1
-
B2
B0
B1
B2
B3
B4
B5
VSYNC
HSYNC
DE
B1
B3
B2
B4
B3
B5
B4
B6
B5
MSB
B7
B6
VSYNC
HSYNC
DE
B7
HSYNC
DE
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BU90T81
●LVDS Output Data Mapping
TCLK OUT
(Differential)
TA+/-
TB+/-
TC+/-
TD+/-
G[2] R[7] R[6] R[5] R[4] R[3] R[2]
B[3] B[2] G[7] G[6] G[5] G[4] G[3]
VSY HSY
DE
B[7] B[6] B[5] B[4]
NC
NC
L
B[1] B[0] G[1] G[0] R[1] R[0]
Figure-8 LVDS output mapping (6B8B=L, FLIP=L)
TCLK OUT
(Differential)
TA+/-
TB+/-
TC+/-
G[2] R[7] R[6] R[5] R[4] R[3] R[2]
B[3] B[2] G[7] G[6] G[5] G[4] G[3]
VSY HSY
DE
B[7] B[6] B[5] B[4]
NC
NC
TD+/-
Hiz
Figure-9 LVDS output mapping (6B8B=H, FLIP=L)
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BU90T81
●Typical Application Circuit ( 24bit mode)
Example
BU90T81: LVCMOS Data Input /rising edge/200mV swing output/normal output mapping
Figure-10 Application Circuit (24bit mode)
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BU90T81
●Typical Application Circuit ( 18bit mode)
Example
BU90T81: LVCMOS Data Input /rising edge/200mV swing output/normal output mapping
Figure-11 Application Circuit (18bit mode)
●Status of this document
The Japanese version of this document is formal specification. A customer may use this translation
version only for a reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
Rev.002
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
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