BU7232YFVM-C [ROHM]
本产品是Rail-to-Rail输入、Push-Pull输出的含2个电路的低消耗电流比较器。工作电源电压范围为1.8V~5.5V，可在低电压下工作。电路电流和输入偏置电流都比较小，适合要求低功耗的应用。;
| 型号： | BU7232YFVM-C |
| 厂家： | 
ROHM |
| 描述： | 本产品是Rail-to-Rail输入、Push-Pull输出的含2个电路的低消耗电流比较器。工作电源电压范围为1.8V~5.5V，可在低电压下工作。电路电流和输入偏置电流都比较小，适合要求低功耗的应用。 比较器 |
| 文件： | 总17页 (文件大小：823K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Comparator for Automotive
Rail-to-Rail Input Push-Pull Output
Low Supply Current CMOS Comparator
BU7232YFVM-C
General Description
Key Specifications
◼ Operating Supply Voltage Range:
Single Supply
BU7232YFVM-C is Rail-to-Rail input, Push-Pull output,
dual comparators. It has a wide operating temperature
range. It features low operating supply voltage from 1.8 V
to 5.5 V, low supply current and extremely low input bias
current.
1.8 V to 5.5 V
±0.90 V to ±2.75 V
-40 °C to +125 °C
10 µA(Typ)
Dual Supply
◼ Temperature Range:
◼ Supply Current:
◼ Input Bias Current:
1 pA(Typ)
Features
Special Characteristic
◼ Input Offset Voltage
-40 °C to +125 °C:
◼ AEC-Q100 Qualified(Note 1)
◼ Rail-to-Rail Input
15 mV(Max)
◼ Push-Pull Output
(Note 1) Grade 1
Package
MSOP8
W(Typ) x D(Typ) x H(Max)
2.90 mm x 4.00 mm x 0.90 mm
Applications
◼ Voltage Detection Equipment
◼ Automotive Electronics Equipment
Pin Configuration
Pin Descriptions
(TOP VIEW)
Pin No.
Pin Name
Function
OUT1
-IN1
1
2
3
4
8
7
6
5
VDD
OUT2
-IN2
1
2
3
4
5
6
7
8
OUT1
-IN1
Output 1
CH1
Inverting input 1
－ ＋
+IN1
VSS
+IN2
-IN2
Non-inverting input 1
Ground/Negative power supply
Non-inverting input 2
Inverting input 2
CH2
＋ －
+IN1
VSS
OUT2
VDD
Output 2
+IN2
Positive power supply
Block Diagram
VDD
VBIAS
+IN
-IN
Output
Control
OUT
VBIAS
Block Diagram (One channel only)
VSS
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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Absolute Maximum Ratings (Ta=25 °C)
Parameter
Symbol
VDD-VSS
VID
Rating
Unit
V
Supply Voltage
7
VDD - VSS
Differential Input Voltage(Note 1)
Common-mode Input Voltage Range
Input Current
V
VICM
(VSS - 0.3) to (VDD + 0.3)
±10
V
II
mA
°C
°C
Storage Temperature Range
Maximum Junction Temperature
Tstg
-55 to +150
150
Tjmax
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.
The input pin voltage is set to more than VSS
.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
MSOP8
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
284.1
21
135.4
11
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
Recommended Operating Conditions
Parameter
Symbol
Vopr
Min
Typ
Max
Unit
1.8
±0.90
3.0
±1.50
5.5
±2.75
Operating Supply Voltage
Operating Temperature
V
Topr
-40
+25
+125
°C
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Electrical Characteristics (Unless otherwise specified VDD=3.0 V, VSS=0.0 V, Ta=25 °C)
Limit
Temperature
Parameter
Symbol
Unit
mV
Conditions
Range
Min
Typ
Max
25 °C
Full range
25 °C
-
1
14
Input Offset Voltage(Note 1,2)
-
VIO
-
-
15
Input Offset Current(Note 1)
Input Bias Current(Note 1,2)
IIO
IB
-
1
-
pA
pA
-
-
25 °C
-
1
-
25 °C
-
10
25
RL=∞,
All comparators
Supply Current(Note 2)
IDD
VOH
VOL
µA
V
Full range
25 °C
-
-
50
VDD-0.10
-
-
RL=10 kΩ,
VRL=VDD/2 V
Output Voltage (High)(Note 2)
Full range
25 °C
VDD-0.15
-
-
-
-
-
-
-
VSS+0.05
VSS+0.10
-
RL=10 kΩ,
VRL=VDD/2 V
Output Voltage (Low)(Note 2)
Large Signal Voltage Gain
V
Full range
25 °C
AV
100
dB
V
RL=10 kΩ
-
Common-mode Input Voltage
Range
VICM
25 °C
0
-
3
Common-mode Rejection Ratio
Power Supply Rejection Ratio
CMRR
PSRR
25 °C
25 °C
-
80
80
2.0
-
-
-
dB
dB
-
-
-
25 °C
1.0
-
Output Source Current(Note 1,2,3)
Output Sink Current(Note 1,2,3)
ISOURCE
mA
mA
VOUT=VDD-0.4 V
VOUT=VSS+0.4 V
Full range
25 °C
0.8
-
3
1
-
7
-
ISINK
Full range
25 °C
-
-
Output Rise Time
Output Fall Time
tR
tF
50
20
1.7
-
-
ns
ns
25 °C
-
-
25 °C
-
-
CL=15 pF,
V-IN=1.5 V,
100 mV Overdrive
Propagation Delay Time L to
H(Note 2)
tPLH
µs
µs
Full range
25 °C
-
5
-
-
0.6
-
Propagation Delay Time H to
L(Note 2)
tPHL
Full range
-
3
(Note 1) Absolute value
(Note 2) Full range: Ta=-40 °C to +125 °C
(Note 3)Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pins are
short-circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
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Typical Performance Curves
30
30
25
20
15
10
5
+125 °C
25
20
15
10
5
5.5 V
3.0 V
+25 °C
-40 °C
1.8 V
0
0
-50 -25
0
25
50
75 100 125 150
1
2
3
4
5
6
Ambient Temperature : Ta [°C]
SupplyVoltage : VDD [V]
Figure 1. Supply Current vs Supply Voltage
Figure 2. Supply Current vs Ambient Temperature
10.0
7.5
10.0
7.5
5.0
5.0
2.5
2.5
1.8
3.0 V
-40 °C
0.0
0.0
+25 °C
5.5 V
+125 °C
-2.5
-5.0
-7.5
-10.0
-2.5
-5.0
-7.5
-10.0
1
2
3
4
5
6
-50 -25
0
25
50
75 100 125 150
SupplyVoltage : VDD [V]
Ambient Temperature : Ta [°C]
Figure 3. Input Offset Voltage vs Supply Voltage
(VICM=VDD, EK=-VDD/2)
Figure 4. Input Offset Voltage vs Ambient Temperature
(VICM=VDD, EK=-VDD/2)
(Note) The above characteristics are measurements of typical sample,
they are not guaranteed.
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Typical Performance Curves - continued
6
6
5
4
3
2
1
0
5.5 V
5
-40 °C
4
+25 °C
+125 °C
3
3.0 V
1.8 V
2
1
0
1
2
3
4
5
6
-50 -25
0
25
50
75 100 125 150
SupplyVoltage : VDD [V]
Ambient Temperature : Ta [°C]
Figure 5. Output Voltage (High) vs Supply Voltage
(RL=10 kΩ)
Figure 6. Output Voltage (High) vs Ambient Temperature
(RL=10 kΩ)
50
40
30
50
40
30
20
20
+125 °C
5.5 V
3.0 V
+25 °C
10
10
-40 °C
1.8 V
0
0
0
2
4
6
8
-75 -50 -25
0
25 50 75 100 125 150
SupplyVoltage : VDD [V]
Ambient Temperature : Ta [°C]
Figure 7. Output Voltage(Low) vs Supply Voltage
(RL=10 kΩ)
Figure 8. Output Voltage (Low) vs Ambient Temperature
(RL=10 kΩ)
(Note) The above characteristics are measurements of typical sample,
they are not guaranteed.
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Typical Performance Curves - continued
4.0
3.5
3.0
16
14
12
10
8
5.5 V
5.5 V
2.5
2.0
3.0 V
3.0 V
6
1.5
4
1.0
1.8 V
1.8 V
0.5
2
0.0
0
-50 -25
0
25
50 75 100 125 150
-50 -25
0
25
50
75 100 125 150
Ambient Temperature : Ta [°C]
Ambient Temperature : Ta [°C]
Figure 9. Output Source Current vs Ambient Temperature
(VOUT=VDD-0.4 V)
Figure 10. Output Sink Current vs Ambient Temperature
(VOUT=VSS+0.4 V)
3.0
2.5
9
8
-40 °C
7
+25 °C
2.0
6
+125 °C
-40 °C
5
+25 °C
1.5
4
3
2
1
0
1.0
+125 °C
0.5
0.0
0.0
0.3
0.6
0.9
1.2
1.5
1.8
0.0
0.3
0.6
0.9
1.2
1.5
1.8
Output Voltage : VOUT [V]
Output Voltage : VOUT [V]
Figure 11. Output Source Current vs Output Voltage
(VDD=1.8 V)
Figure 12. Output Sink Current vs Output Voltage
(VDD=1.8 V)
(Note) The above characteristics are measurements of typical sample,
they are not guaranteed.
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Typical Performance Curves - continued
30
25
20
15
10
5
10
-40 °C
+25 °C
8
-40 °C
6
+25 °C
+125 °C
+125 °C
4
2
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Output Voltage : VOUT [V]
Output Voltage : VOUT [V]
Figure 13. Output Source Current vs Output Voltage
(VDD=3.0 V)
Figure 14. Output Sink Current vs Output Voltage
(VDD=3.0 V)
80
40
32
-40 °C
+25 °C
60
-40 °C
24
+125 °C
+25 °C
40
20
0
+125 °C
16
8
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Output Voltage : VOUT [V]
Output Voltage : VOUT [V]
Figure 15. Output Source Current vs Output Voltage
(VDD=5.5 V)
Figure 16. Output Sink Current vs Output Voltage
(VDD=5.5 V)
(Note) The above characteristics are measurements of typical sample,
they are not guaranteed.
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Typical Performance Curves - continued
10.0
7.5
10.0
7.5
5.0
2.5
0.0
5.0
2.5
0.0
+125 °C
+25 °C
-40 °C
-40 °C
+125 °C
+25 °C
-2.5
-5.0
-7.5
-10.0
-2.5
-5.0
-7.5
-10.0
-1
0
1
2
3
4
-1
0
1
2
3
Input Voltage : VIN [V]
Input Voltage : VIN [V]
Figure 17. Input Offset Voltage vs Input Voltage
(VDD=1.8 V)
Figure 18. Input Offset Voltage vs Input Voltage
(VDD=3.0 V)
10.0
140
120
100
80
7.5
5.0
2.5
-40 °C
0.0
+25 °C
60
+125 °C
-2.5
-5.0
-7.5
-10.0
40
20
0
-50 -25
0
25
50
75 100 125 150
-1
0
1
2
3
4
5
6
7
Ambient Temperature : Ta [°C]
Input Voltage : VIN [V]
Figure 19. Input Offset Voltage vs Input Voltage
(VDD=5.5 V)
Figure 20. Power Supply Rejection Ratio vs Ambient
Temperature
(Note) The above characteristics are measurements of typical sample,
they are not guaranteed.
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Typical Performance Curves - continued
120
100
160
140
120
100
80
5.5 V
80
5.5 V
3.0 V
60
3.0 V
1.8 V
40
20
0
1.8 V
60
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Ambient Temperature : Ta [°C]
Ambient Temperature : Ta [°C]
Figure 21. Common-mode Rejection Ratio vs Ambient
Temperature
Figure 22. Large Signal Voltage Gain vs Ambient
Temperature
2.0
4.0
3.5
3.0
2.5
1.5
1.0
0.5
0.0
5.5 V
2.0
3.3 V
1.5
1.8 V
1.8 V
3.0 V
1.0
5.5 V
0.5
0.0
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25 50 75 100 125 150
Ambient Temperature : Ta [°C]
Ambient Temperature : Ta [°C]
Figure 23. Propagation Delay Time(L to H) vs Ambient
Temperature
Figure 24. Propagation Delay Time(H to L) vs Ambient
Temperature
(Note) The above characteristics are measurements of typical sample,
they are not guaranteed.
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Application Information
1. Unused Circuits
If there are unused comparators, we recommend connecting as shown below, connecting the non-inverting input pin to
the VDD pin and connecting the inverting input pin to the VSS pin.
VDD
VSS
2. Input Voltage
Regardless of the power supply voltage, a voltage of VSS-0.3 V to VDD+0.3 V can be applied to the input pin without
deteriorating characteristics or destruction.
However, this does not guarantee circuit operation.
Please note that the circuit will not operate properly if it is not within the common-mode input voltage range described in
the electrical characteristics.
3. Power Supply (Single / Dual)
The comparator operates when the voltage supplied is between the VDD and VSS pin. Therefore, the single supply
comparator can also be used as a dual supply comparator.
4. About the External Capacitor of the Output Pin
When the VDD pin is shorted to the VSS(GND) potential, the accumulated charge of the external capacitor goes
through the parasitic element inside the circuit or the pin protection element and is discharged to the VDD pin, so that
the elements inside the IC may be damaged (thermal destruction).
When used for applications that do not cause oscillation due to output capacitive load (such as a voltage comparator
that does not constitute a negative feedback circuit), in order to prevent damage to the IC due to accumulated charge of
the external capacitor, the capacitance of the external capacitor must be 0.1 μF or less.
5. Latch-up
Do not set the voltage of the input/output pin to VDD or more and VSS or less because there is a possibility of latch-up
state peculiar to the CMOS device. Also, be careful that the abnormal noise and etc. are not added to the IC.
6. Start-up the Supply Voltage
This IC has ESD protection diode between input pin and the VDD and VSS pin. When apply the voltage to input pin
before start-up the supply voltage, then a current flows in the VDD or VSS pin through this diode. The current is
depending on applied voltage. This phenomena causes breakdown the IC or malfunction. Therefore, give a special
consideration to input pin protection and start-up order of supply voltage.
Also, after turning on the power supply, this IC outputs High level voltage regardless of the state of input up to around 1
V of the start-up voltage of the circuit. Pay attention to the sequence of turning on the power supply and the etc.,
because there is a possibility of the set malfunction.
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all
power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
11. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower
than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply
voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages
within the values specified in the electrical characteristics of this IC.
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B
U 7
2
3 2 Y F V M - C T R
Part Number
Package
Product Rank
BU7232YFVM
FVM : MSOP8
C: Automotive
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
MSOP8(TOP VIEW)
Part Number Marking
7
2
3
LOT Number
2
C
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
MSOP8
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Revision History
Date
Revision
001
Changes
20.June.2018
06.Sep.2018
30.Sep.2021
New Release
002
Electrical Characteristics(IB) : Delete description in the full temperature range
Electrical Characteristics(IB) : Delete Max Limit Value
003
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GNG2G500010-1-2
14/14
30.Sep.2021 Rev.003
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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