BU7230SG-TR_技术文档

Datasheet

Comparators

Input Full Swing, Open Drain Output

Low Supply Current CMOS Comparators

BU7230G BU7230SG BU7233F BU7233SF

General Description

Key Specifications

BU7230G/BU7233F are input full swing and open

drain comparators. BU7230SG/BU7233SF have an

expanded operating temperature range. These

features low operating supply voltage of +1.8V to

+5.5V, low supply current and extremely low input bias

current.

 Operating Supply Voltage:

Single Supply

Split Supply

 Supply Current:

BU7230G/BU7230SG

BU7233F/BU7233SF

 Temperature Range:

BU7230G/BU7233F

BU7230SG/BU7233SF

 Input Offset Current:

 Input Bias Current:

+1.8V to +5.5V

±0.9V to ±2.75V

5µA

10µA

-40°C to +85°C

-40°C to +105°C

1pA (Typ)

Features

 Low Operating Supply Voltage

 Low Supply Current

 Input Full Swing

1pA (Typ)

 Open Drain Output Type

 Wide Operating Temperature Range

 Low Input Bias Current

Packages

SSOP5

SOP8

jW(Typ) x D(Typ) x H(Max)

2.90mm x 2.80mm x 1.25mm

5.00mm x 6.20mm x 1.71mm

Applications

 Battery Monitor

 Mobile Equipments

 Limit Comparator

 Consumer Electronics

Pin Configuration

BU7230G, BU7230SG: SSOP5

Pin No.

Pin Name

IN-

VSS

IN+

1

2

3

5

4

VDD

OUT

1

2

3

4

5

-

VSS

+

IN+

OUT

VDD

BU7233F, BU7233SF: SOP8

Pin No.

Pin Name

OUT1

IN1-

1

2

3

4

5

6

7

8

OUT1

IN1-

1

2

3

4

8

7

6

5

VDD

CH1

OUT2

IN2-

IN1+

+

-

VSS

IN1+

CH2

IN2+

-

+

IN2-

IN2+

VSS

OUT2

VDD

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

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Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Package

SSOP5

SOP8

BU7230G

BU7230SG

BU7233F

BU7233SF

Ordering Information

x

B

U

7

2

3

x

-

x

Part Number

BU7230G

BU7230SG

BU7233F

Package

Packaging and Forming Specification

TR: Embossed Tape and Reel

(SSOP5)

E2: Embossed Tape and Reel

(SOP8)

G

F

: SSOP5

: SOP8

BU7233SF

Line-up

T_opr

Channels

Package

Reel of 3000

Orderable Part Number

BU7230G-TR

1ch

2ch

1ch

2ch

SSOP5

SOP8

-40°C to +85°C

-40°C to +105°C

Reel of 2500

Reel of 3000

Reel of 2500

BU7233F-E2

BU7230SG-TR

BU7233SF-E2

SSOP5

SOP8

Absolute Maximum Ratings (T_A=25°C)

Rating

Parameter

Supply Voltage

Symbol

Unit

BU7230G

BU7233F

BU7230SG

BU7233SF

VDD-VSS

+7

V

SSOP5

SOP8

0.54 ^{(Note 1,3)}

-

0.54 ^{(Note 1,3)}

-

Power Dissipation

P_D

W

0.55 ^{(Note 2,3)}

Differential Input

Voltage ^{(Note 4)}

V_ID

VDD - VSS

V

Input Common-mode

Voltage Range

V_ICM

I_I

(VSS-0.3) to (VDD+0.3)

±10

V

mA

V

Input Current ^{(Note 5)}

Operating Supply

Voltage

+1.8 to +5.5

±0.9 to ±2.75

V_opr

Operating

Temperature

T_opr

T_stg

-40 to +85

-40 to +105

°C

Storage Temperature

-55 to +125

+125

Maximum Junction

Temperature

T_Jmax

°C

(Note 1) To use at temperature above T_A=25C reduce 5.4mW/C.

(Note 2) To use at temperature above T_A=25C reduce 5.5mW/C.

(Note 3) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).

(Note 4) The voltage difference between inverting input and non-inverting input is the differential input voltage.

Then input pin voltage is set to more than VSS.

(Note 5) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied.

The input current can be set to less than the rated current by adding a limiting resistor.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open

circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case

the IC is operated over the absolute maximum ratings.

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Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Electrical Characteristics

○BU7230G, BU7230SG（Unless otherwise specified VDD=+3V, VSS=0V, T_A=25°C）

Limit

Typ

Temperature

Range

Parameter

Symbol

Unit

Conditions

Min

-

Max

11

Input Offset Voltage ^{(Note 6)}

Input Offset Current ^{(Note 6)}

Input Bias Current ^{(Note 6)}

V_IO

I_IO

I_B

25°C

1

mV

pA

-

25°C

-

5

-

15

30

Supply Current ^{(Note 7)}

I_DD

μA

R_L=∞

Full Range

Maximum Output Voltage(High)

Maximum Output Voltage(Low)

Large Signal Voltage Gain

V_OH

V_OL

25°C

VDD-0.1

-

V

R_L=10kΩ, V_RL=3V

-

VSS+0.1

R_L=10kΩ

A_V

90

-

3

-

dB

V

R_L=10kΩ

Input Common-mode

Voltage Range

V_ICM

CMRR

PSRR

I_SINK

t_F

0

-

VSS to VDD

Common-mode Rejection Ratio

Power Supply Rejection Ratio

Output Sink Current ^{(Note 8)}

Output Fall Time

80

6

dB

mA

ns

µs

-

3

-

OUT=VSS+0.4V

R_L=10kΩ

V_RL=3V

C_L=15pF

IN-=1.5V

20

1.8

0.6

-

Propagation Delay Time L to H

t_PLH

-

100mV Overdrive

Propagation Delay Time H to L

t_PHL

-

(Note 6) Absolute value

(Note 7) Full range: BU7230G: T_A=-40°C to +85°C BU7230SG: T_A=-40°C to +105°C

(Note 8) Under the high temperature environment, consider the power dissipation of IC when selecting the output current.

When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.

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Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Electrical Characteristics - continued

○BU7233F, BU7233SF（Unless otherwise specified VDD=+3V, VSS=0V, T_A=25°C）

Limit

Typ

Temperature

Range

Parameter

Symbol

Unit

Conditions

Min

-

Max

11

Input Offset Voltage ^{(Note 9)}

Input Offset Current ^{(Note 9)}

Input Bias Current ^{(Note 9)}

V_IO

I_IO

I_B

25°C

1

mV

pA

-

25°C

-

10

-

25

50

R_L=∞

All Comparators

Supply Current ^{(Note 10)}

I_DD

μA

Full Range

Maximum Output Voltage(High)

Maximum Output Voltage(Low)

Large Signal Voltage Gain

V_OH

V_OL

25°C

VDD-0.1

-

V

R_L=10kΩ, V_RL=3V

-

VSS+0.1

R_L=10kΩ

A_V

90

-

3

-

dB

V

R_L=10kΩ

Input Common-mode

Voltage Range

V_ICM

CMRR

PSRR

I_SINK

t_F

0

-

VSS to VDD

Common-mode Rejection Ratio

Power Supply Rejection Ratio

Output Sink Current ^{(Note 11)}

Output Fall Time

80

6

dB

mA

ns

µs

-

3

-

OUT=VSS+0.4V

R_L=10kΩ

V_RL=3V

C_L=15pF

IN-=1.5V

20

1.8

0.6

-

Propagation Delay Time L to H

t_PLH

-

100mV Overdrive

Propagation Delay Time H to L

t_PHL

-

(Note 9) Absolute value

(Note 10) Full range: BU7233F: T_A=-40°C to +85°C BU7233SF: T_A=-40°C to +105°C

(Note 11) Under the high temperature environment, consider the power dissipation of IC when selecting the output current.

When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.

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TSZ22111･15･001

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Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Description of Electrical Characteristics

Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also

shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or

general document.

1. Absolute Maximum Ratings

Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute

maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.

(1) Supply Voltage (VDD/VSS)

Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without

deterioration or destruction of characteristics of internal circuit.

(2) Differential Input Voltage (V_ID)

Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging

the IC.

(3) Input Common-mode Voltage Range (V_ICM

)

Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration

or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure

normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.

(4) Power Dissipation (P_D)

Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C

(normal temperature). As for package product, P_Dis determined by the temperature that can be permitted by the IC in

the package (maximum junction temperature) and the thermal resistance of the package.

2. Electrical Characteristics

(1) Input Offset Voltage (V_IO)

Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the

input voltage difference required for setting the output voltage at 0 V.

(2) Input Offset Current (I_IO)

Indicates the difference of input bias current between the non-inverting and inverting terminals.

(3) Input Bias Current (I_B)

Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at

the non-inverting and inverting terminals.

(4) Supply Current (I_DD

Indicates the current that flows within the IC under specified no-load conditions.

(5) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (V_OH/V_OL

)

Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output

voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output

voltage low indicates the lower limit.

(6) Large Signal Voltage Gain (A_V)

Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal

and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.

Av = (Output voltage) / (Differential input voltage)

(7) Input Common-mode Voltage Range (V_ICM

)

Indicates the input voltage range where IC normally operates.

(8) Common-mode Rejection Ratio (CMRR)

Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is

normally the fluctuation of DC.

CMRR = (Change of input common-mode voltage)/(Input offset fluctuation)

(9) Power Supply Rejection Ratio (PSRR)

Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.

It is normally the fluctuation of DC.

PSRR= (Change of power supply voltage)/(Input offset fluctuation)

(10) Output Sink Current (I_SINK

)

The maximum current that can be output from the IC under specific output conditions. The output sink current

indicates the current flowing into the IC.

(11) Output Fall Time (t_F)

Indicates the time required for an output voltage step to change from 90% to 10% of its final value.

(12) Propagation Delay Time L to H /Propagation Delay Time H to L (t_PLH/ t_PHL

)

Indicates the time to reach 50% of the output voltage after the step voltage is applied at the input pin.

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TSZ22111･15･001

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Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Typical Performance Curves

○BU7230G, BU7230SG

0.8

0.6

0.4

0.2

0.0

0.8

0.6

0.4

0.2

0.0

BU7230G

BU7230SG

105

85

0

25

50

75

100

125

0

25

50

75

100

125

Ambient Temperature [°C]

Figure 1.

Figure 2.

Power Dissipation vs Ambient Temperature

(Derating Curve)

Power Dissipation vs Ambient Temperature

(Derating Curve)

12

10

8

12

10

8

105°C

85°C

5.5V

25°C

6

3.0V

-40°C

4

1.8V

2

0

1

2

3

4

5

6

-50

-25

0

25

50

75

100

125

Supply Voltage [V]

Ambient Temperature [°C]

Figure 4.

Figure 3.

Supply Current vs Ambient Temperature

Supply Current vs Supply Voltage

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7230G: -40C to +85C BU7230SG: -40C to +105C

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Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Typical Performance Curves - continued

○BU7230G, BU7230SG

6

5

4

3

2

1

0

6

5

5.5V

4

105°C

3.0V

1.8V

85°C

25°C

3

-40°C

2

1

0

1

2

3

4

5

6

-50

-25

0

25

50

75

100 125

Supply Voltage [V]

Ambient Temperature [°C]

Figure 5.

Figure 6.

Maximum Output Voltage (High) vs Supply Voltage

Maximum Output Voltage (High) vs Ambient Temperature

(R_L=10kΩ, V_RL=VDD)

30

25

20

15

10

5

30

25

20

15

10

5

25°C

5.5V

105°C

85°C

-40°C

3.0V

1.8V

0

-50

-25

0

25

50

75

100 125

1

2

3

4

5

6

Supply Voltage [V]

Ambient Temperature [°C]

Figure 7.

Figure 8.

Maximum Output Voltage (Low) vs Supply Voltage

Maximum Output Voltage (Low) vs Ambient Temperature

(R_L=10kΩ)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7230G: -40C to +85C BU7230SG: -40C to +105C

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TSZ22111･15･001

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Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Typical Performance Curves - continued

○BU7230G, BU7230SG

30

25

20

15

10

5

-40°C

25

25°C

20

85°C

15

5.5V

105°C

3.0V

10

1.8V

5

0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

-50

-25

0

25

50

75

100

125

Ambient Temperature [°C]

Output Voltage [V]

Figure 9.

Figure 10.

Output Sink Current vs Output Voltage

(VDD=3V)

Output Sink Current vs Ambient Temperature

(OUT=VSS+0.4V)

10.0

7.5

10.0

7.5

5.0

2.5

85°C

105°C

-40°C

5.5V

0.0

1.8V

3.0V

25°C

-2.5

-5.0

-7.5

-10.0

-2.5

-5.0

-7.5

-10.0

1

2

3

4

5

6

-50

-25

0

25

50

75

100 125

Ambient Temperature [°C]

Supply Voltage [V]

Figure 11.

Figure 12.

Input Offset Voltage vs Supply Voltage

(V_ICM=VDD, E_K=-VDD/2)

Input Offset Voltage vs Ambient Temperature

(V_ICM=VDD, E_K=-VDD/2)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7230G: -40C to +85C BU7230SG: -40C to +105C

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TSZ22111･15･001

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Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Typical Performance Curves - continued

○BU7230G, BU7230SG

160

10.0

7.5

140

120

100

80

5.0

105°C

85°C

25°C

85°C

2.5

0.0

25°C

-40°C

-2.5

-5.0

-7.5

-10.0

105°C

-40°C

60

1

2

3

4

5

6

-1

0

1

2

3

4

Supply Voltage [V]

Input Voltage [V]

Figure 13.

Figure 14.

Input Offset Voltage vs Input Voltage

(VDD=3V)

Large Signal Voltage Gain vs Supply Voltage

120

100

80

60

40

20

0

160

140

120

100

80

105°C

85°C

5.5V

3.0V

-40°C

25°C

1.8V

60

1

2

3

4

5

6

-50

-25

0

25

50

75

100

125

Ambient Temperature [°C]

Supply Voltage [V]

Figure 15.

Figure 16.

Large Signal Voltage Gain vs Ambient Temperature

Common-mode Rejection Ratio vs Supply Voltage

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7230G: -40C to +85C BU7230SG: -40C to +105C

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TSZ22111･15･001

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25.Dec.2013 Rev.002

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Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Typical Performance Curves - continued

○BU7230G, BU7230SG

120

100

80

60

40

20

0

120

100

80

60

40

20

0

5.5V

3.0V

1.8V

-50

-25

0

25

50

75

100

125

-50

-25

0

25

50

75

100

125

Ambient Temperature [°C]

Figure 17.

Figure 18.

Common-mode Rejection Ratio vs Ambient Temperature

Power Supply Rejection Ratio vs Ambient Temperature

2.5

1.0

0.8

0.6

0.4

0.2

0.0

2.0

5.5V

1.8V

3.0V

1.5

3.0V

5.5V

1.0

1.8V

0.5

0.0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100

125

Ambient Temperature [°C]

Figure 19.

Figure 20.

Propagation Delay Time L to H vs Ambient Temperature

(R_L=10kΩ, V_RL=3V, C_L=15pF

Propagation Delay Time H to L vs Ambient Temperature

(R_L=10kΩ, V_RL=3V, C_L=15pF

IN-=1.5V, 100mV Overdrive)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7230G: -40C to +85C BU7230SG: -40C to +105C

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TSZ22111･15･001

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25.Dec.2013 Rev.002

10/24

Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Typical Performance Curves - continued

○BU7233F, BU7233SF

0.8

0.6

0.8

0.6

0.4

0.2

0.0

BU7233F

BU7233SF

0.4

0.2

0.0

105

85

0

25

50

75

100

125

0

25

50

75

100

125

Ambient Temperature [°C]

Figure 21.

Figure 22.

Power Dissipation vs Ambient Temperature

(Derating Curve)

Power Dissipation vs Ambient Temperature

(Derating Curve)

20

16

12

8

20

16

12

8

105°C

5.5V

85°C

25°C

3.0V

-40°C

1.8V

4

0

1

2

3

4

5

6

-50

-25

0

25

50

75

100

125

Supply Voltage [V]

Ambient Temperature [°C]

Figure 24.

Figure 23.

Supply Current vs Ambient Temperature

Supply Current vs Supply Voltage

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7233F: -40C to +85C BU7233SF: -40C to +105C

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TSZ22111･15･001

TSZ02201-0RFR1G200440-1-2

25.Dec.2013 Rev.002

11/24

Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Typical Performance Curves - continued

○BU7233F, BU7233SF

6

5

4

3

2

1

0

6

5

5.5V

4

105°C

3.0V

1.8V

85°C

25°C

3

-40°C

2

1

0

1

2

3

4

5

6

-50

-25

0

25

50

75

100

125

Supply Voltage [V]

Ambient Temperature [°C]

Figure 25.

Figure 26.

Maximum Output Voltage (High) vs Supply Voltage

Maximum Output Voltage (High) vs Ambient Temperature

(R_L=10kΩ, V_RL=VDD)

30

25

20

15

10

5

30

25

20

15

10

5

105°C

5.5V

85°C

25°C

-40°C

3.0V

1.8V

0

-50

-25

0

25

50

75

100 125

1

2

3

4

5

6

Supply Voltage [V]

Ambient Temperature [°C]

Figure 27.

Figure 28.

Maximum Output Voltage (Low) vs Supply Voltage

Maximum Output Voltage (Low) vs Ambient Temperature

(R_L=10kΩ)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7233F: -40C to +85C BU7233SF: -40C to +105C

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TSZ22111･15･001

TSZ02201-0RFR1G200440-1-2

25.Dec.2013 Rev.002

12/24

Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Typical Performance Curves - continued

○BU7233F, BU7233SF

30

25

20

15

10

5

-40°C

25

25°C

20

85°C

15

5.5V

105°C

3.0V

10

1.8V

5

0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

-50

-25

0

25

50

75

100

125

Ambient Temperature [°C]

Output Voltage [V]

Figure 29.

Figure 30.

Output Sink Current vs Output Voltage

(VDD=3V)

Output Sink Current vs Ambient Temperature

(OUT=VSS+0.4V)

10.0

7.5

10.0

7.5

5.0

2.5

105°C

85°C

5.5V

0.0

1.8V

3.0V

-40°C

25°C

-2.5

-5.0

-7.5

-10.0

-2.5

-5.0

-7.5

-10.0

1

2

3

4

5

6

-50

-25

0

25

50

75

100 125

Ambient Temperature [°C]

Supply Voltage [V]

Figure 31.

Figure 32.

Input Offset Voltage vs Supply Voltage

(V_ICM=VDD, E_K=-VDD/2)

Input Offset Voltage vs Ambient Temperature

(V_ICM=VDD, E_K=-VDD/2)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7233F: -40C to +85C BU7233SF: -40C to +105C

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Typical Performance Curves - continued

○BU7233F, BU7233SF

160

10.0

7.5

140

120

100

80

5.0

105°C

-40°C

85°C

2.5

25°C

85°C

0.0

105°C

-2.5

-5.0

-7.5

-10.0

25°C

-40°C

60

1

2

3

4

5

6

-1

0

1

2

3

4

Supply Voltage [V]

Input Voltage [V]

Figure 33.

Figure 34.

Input Offset Voltage vs Input Voltage

(VDD=3V)

Large Signal Voltage Gain vs Supply Voltage

160

140

120

100

80

120

100

80

60

40

20

0

25°C

-40°C

5.5V

105°C

85°C

3.0V

1.8V

60

1

2

3

4

5

6

-50

-25

0

25

50

75

100

125

Supply Voltage [V]

Ambient Temperature [°C]

Figure 35.

Figure 36.

Large Signal Voltage Gain vs Ambient Temperature

Common-mode Rejection Ratio vs Supply Voltage

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7233F: -40C to +85C BU7233SF: -40C to +105C

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Typical Performance Curves - continued

○BU7233F, BU7233SF

120

100

80

60

40

20

0

5.5V

3.0V

100

80

60

40

20

0

1.8V

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100

125

Ambient Temperature [°C]

Figure 37.

Figure 38.

Common-mode Rejection Ratio vs Ambient Temperature

Power Supply Rejection Ratio vs Ambient Temperature

1.0

4.5

4.0

3.5

0.8

0.6

0.4

0.2

0.0

5.5V

3.0

1.8V

3.0V

2.5

3.0V

5.5V

2.0

1.5

1.8V

1.0

0.5

0.0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Ambient Temperature [°C]

Figure 39.

Figure 40.

Propagation Delay Time L to H vs Ambient Temperature

(R_L=10kΩ, V_RL=3V, C_L=15pF

Propagation Delay Time H to L vs Ambient Temperature

(R_L=10kΩ, V_RL=3V, C_L=15pF

IN-=1.5V, 100mV Overdrive)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7233F: -40C to +85C BU7233SF: -40C to +105C

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Application Information

NULL Method Conditions for Test Circuit1

VDD, VSS, E_K, V_ICMUnit:V

Parameter

V_F

SW1 SW2 SW3 VDD VSS

E_K

V_ICMCalculation

Input Offset Voltage

V_F1

ON

ON OFF

3

0

-0.1

0.3

1

2

3

4

V_F2

V_F3

V_F4

V_F5

V_F6

V_F7

-0.3

-2.7

Large Signal Voltage Gain

ON

0

3

Common-mode Rejection Ratio

(Input Common-mode Voltage Range)

ON OFF

-0.1

1.8

5.5

Power Supply Rejection Ratio

0.3

- Calculation -

|V_F1|

1 + R_F/R_S

1. Input Offset Voltage (V_IO)

V_IO

=

[V]

E_K× (1+R_F/R_S)

2. Large Signal Voltage Gain (A_V)

Av = 20Log

[dB]

|V_F3- V_F2|

V_ICM× (1+R_F/R_S)

CMRR = 20Log

3. Common-mode Rejection Ratio (CMRR)

4. Power Supply Rejection Ratio (PSRR)

[dB]

|V_F5- V_F4|

VDD × (1+ R_F/R_S)

PSRR = 20Log

[dB]

|V_F7- V_F6|

0.47μF

R_F=50kΩ

500kΩ

SW1

0.01μF

VDD

15V

E_K

R_S=50Ω

R_I=1MΩ

Vo

500kΩ

0.1μF

DUT

SW3

NULL

-15V

R_I=1MΩ

R_S=50Ω

50kΩ

R_L

V_RL

V_ICM

V V_F

SW2

VSS

Figure 41. Test Circuit 1(One channel only)

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Application Information - continued

Switch Conditions for Test Circuit 2

SW1

SW2

SW3

SW4

SW5

SW6

SW7

SW8

SW No.

Supply Current

OFF

ON

OFF

ON

OFF

ON

OFF

ON

OFF

ON

OFF

ON

Maximum Output Voltage (R_L=10kΩ)

Output Current

OFF

ON

OFF

ON

OFF

Response Time

OFF

VDD

＋

－

SW1

SW2

SW4 SW5

SW6

SW7

SW8

SW3

V_IN

VSS

R_L

C_L

IN+

IN-

V_RL

OUT

Figure 42. Test Circuit 2 (One channel only)

Input Voltage

1.6V

Input Voltage

1.6V

100mV Overdrive

V_re1.5V

1.5V

100mV Overdrive

1.4V

t

Input Wave

Output Voltage

3V

Output Voltage

3V

t_PLH

t_F

90%

50%

1.5V

0V

50%

1.5V

0V

10%

t_PHL

Output Wave

t

Output Wave

Figure 43. Response Time Input and Output Wave

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Power Dissipation

Power dissipation (total loss) indicates the power that the IC can consume at T_A=25°C (normal temperature). As the IC

consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable

temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and

consumable power.

Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the

thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the

maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold

resin or lead frame of the package. Thermal resistance, represented by the symbol θ_JA°C/W, indicates this heat dissipation

capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.

Figure 44(a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the

thermal resistance (θ_JA), given the ambient temperature (T_A), maximum junction temperature (T_Jmax), and power dissipation

(P_D).

θ_JA= (T_Jmax-T_A) / P_D

°C/W

The derating curve in Figure 44(b) indicates the power that the IC can consume with reference to ambient temperature.

Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal

resistance (θ_JA), which depends on the chip size, power consumption, package, ambient temperature, package condition,

wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a

reference value measured at a specified condition. Figure 44(c) to (f) shows the derating curve for BU7230G, BU7230SG,

BU7233F and BU7233SF.

Power Dissipation of LSI [W]

P_Dmax

θ_JA=(T_Jmax-T_A)/P_DC/W

P2

θ_JA2<θ_JA1

Ambient Temperature T_A[

]

C

P1

θ_JA2

T_Jmax

θ_JA1

0

50

75

100

25

125

Chip Surface Temperature T_J[C]

Ambient Temperature T_A[C]

(b) Derating Curve

(a) Thermal Resistance

0.8

0.6

0.4

0.2

0.0

0.8

0.6

0.4

0.2

0.0

BU7230G ^{(Note 12)}

BU7230SG ^{(Note 12)}

105

85

0

25

50

75

100

125

0

25

50

75

100

125

Ambient Temperature [°C]

(c) BU7230G

(d) BU7230SG

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0.8

0.6

0.8

0.6

0.4

0.2

0.0

BU7233F ^{(Note 13)}

BU7233SF ^{(Note 13)}

0.4

0.2

0.0

105

85

0

25

50

75

100

125

0

25

50

75

100

125

Ambient Temperature [°C]

(e) BU7233F

(f) BU7233SF

Figure 44. Thermal Resistance and Derating Curve

(Note 12)

5.4

(Note 13)

5.5

Unit

mW/°C

When using the unit above T_A=25°C, subtract the value above per Celsius degree. Power dissipation is the value

when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%) is mounted.

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the P_Dstated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the P_Drating.

6.

7.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

8.

9.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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Operational Notes – continued

12. Regarding the Input Pin of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The

operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical

damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an

input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when

no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins

have voltages within the values specified in the electrical characteristics of this IC.

VDD

13. Unused Circuits

When there are unused comparators, it is recommended that they are

connected as in Figure 45, setting the non-inverting input terminal to the

VDD, inverting input terminal to the VSS.

14. Input Voltage

Applying VDD+0.3V to the input terminal is possible without causing

deterioration of the electrical characteristics or destruction, regardless of

the supply voltage. However, this does not ensure normal circuit

VSS

operation. Please note that the circuit operates normally only when the

Figure 45. Example of Application Circuit

input voltage is within the common mode input voltage range of the

for Unused Comparator

electric characteristics.

15. Power Supply(single/dual)

The voltage comparator operates when the voltage supplied is between VDD and VSS. Therefore, the single supply

voltage comparator can be used as dual supply voltage comparator as well.

16. Output Capacitor

If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into

the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor

smaller than 0.1µF between output pin and VSS pin.

17. Oscillation by Output Capacitor

Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop

circuit with these ICs.

18. Latch up

Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and

protect the IC from abnormaly noise.

19. Open Drain Output

Please connect and use a pull-up resistor to the output since this IC has an open-drain output.

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Physical Dimensions, Tape and Reel Information

Package Name

SSOP5

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Physical Dimensions, Tape and Reel Information – continued

Package Name

SOP8

(Max 5.35 (include.BURR))

(UNIT : mm)

PKG : SOP8

Drawing No. : EX112-5001-1

Tape

Embossed carrier tape

2500pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Datasheet

BU7230G BU7230SG BU7233F BU7233SF

Marking Diagram

SSOP5(TOP VIEW)

Part Number Marking

SOP8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

LOT Number

Product Name

Package Type

SSOP5

Marking

BU7230

BU7230S

BU7233

BU7233S

H1

H2

G

F

7233

7233S

SOP8

Land Pattern Data

All dimensions in mm

Land length

Land pitch

e

Land space

MIE

Land width

b2

Package

≧ℓ 2

SSOP5

SOP8

0.95

1.27

2.4

1.0

0.6

4.60

1.10

0.76

SSOP5

SOP8

e

MIE

b2

ℓ 2

Revision History

Date

Revision

Changes

08.Nov.2013

25.Dec.2013

001

New Release

Changed Propagation Delay Time H to L (Typ value)

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Daattaasshheeeett

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BU7230SG-TR
厂家：	ROHM
描述：	Input Full Swing, Open Drain Output Low Supply Current CMOS Comparators
文件：	总27页 (文件大小：613K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BU7230SG-TR [ROHM]

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