BU4066BCFFV [ROHM]
Quad-Analog Switch;
| 型号： | BU4066BCFFV |
| 厂家： | 
ROHM |
| 描述： | Quad-Analog Switch |
| 文件： | 总20页 (文件大小：1709K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
General Purpose CMOS Logic IC
Quad-Analog Switch
BU4066BC BU4066BCF BU4066BCFV
General Description
Key Specifications
The BU4066BC series ICs each contain 4 independent
switches capable of controlling either digital or analog
signals.
Operating Supply Voltage Range:
Input Voltage Range:
Operating Temperature Range:
3V to 18V
VEE to VDD
-40°C to +85°C
Features
Packages
DIP14
W(Typ) x D(Typ) x H(Max)
19.40mm x 6.50mm x 7.95mm
8.70mm x 6.20mm x 1.71mm
5.00mm x 6.40mm x 1.35mm
Low Power Consumption
Wide Operating Supply Voltage Range
SOP14
SSOP-B14
DIP14
SOP14
SSOP-B14
Truth Table
Inputs
Switches
SWA is turned on. (1pin－2pin)
SWA is turned off. (1pin－2pin)
SWB is turned on. (3pin－4pin)
SWB is turned off. (3pin－4pin)
SWC is turned on. (8pin－9pin)
SWC is turned off. (8pin－9pin)
SWD is turned on. (10pin－11pin)
SWD is turned off. (10pin－11pin)
H
L
H
L
H
L
H
L
CONT.A
CONT.B
CONT.C
CONT.D
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
.www.rohm.com
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
1/16
TSZ22111 • 14 • 001
BU4066BC BU4066BCF BU4066BCFV
Pin Configuration
(TOP VIEW)
1
2
3
4
5
6
7
IN/OUT.A
OUT/IN.A
OUT/IN.B
IN/OUT.B
CONT.B
CONT.C
VEE
14
13
12
VDD
OUT/IN IN/OUT
SWA
CONT.A
CONT.D
SWD
OUT/IN IN/OUT
11 IN/OUT.D
IN/OUT OUT/IN
SWB
OUT/IN.D
OUT/IN.C
IN/OUT.C
10
9
SWC
IN/OUT OUT/IN
8
Pin Description
Pin No.
Pin Name
IN/OUT.A
OUT/IN.A
OUT/IN.B
IN/OUT.B
CONT.B
CONT.C
VEE
I/O
I/O
I/O
I/O
I/O
I
Function
Analog Switch Input / Output.A
Analog Switch Input / Output.A
Analog Switch Input / Output.B
Analog Switch Input / Output.B
Control Input.B
1
2
3
4
5
I
Control Input.C
6
-
Power Supply(-)
7
IN/OUT.C
OUT/IN.C
OUT/IN.D
IN/OUT.D
CONT.D
CONT.A
VDD
I/O
I/O
I/O
I/O
I
Analog Switch Input / Output.C
Analog Switch Input / Output.C
Analog Switch Input / Output.D
Analog Switch Input / Output.D
Control Input.D
8
9
10
11
12
13
14
I
Control Input.A
-
Power Supply(+)
www.rohm.com
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
2/16
TSZ22111 • 15 • 001
BU4066BC BU4066BCF BU4066BCFV
Block Diagram
OUT / IN .A to D
IN / OUT.A to D
CONT.A to D
Absolute Maximum Ratings (TA = 25°C)
Parameter
Symbol
Rating
Unit
Supply Voltage
VDD
VIN
V
V
-0.5 to +20.0
(VEE-0.5) to (VDD+0.5)
±10
Input Voltage
Control Input Current
Operating Temperature
Storage Temperature
Maximum Junction Temperature
IIN
mA
°C
°C
°C
Topr
Tstg
TJmax
-40 to +85
-55 to +150
+150
1.18 (Note 1)
0.56 (Note 2)
0.87 (Note 3)
DIP14
Power Dissipation
PD
SOP14
W
SSOP-B14
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins
or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding
a fuse, in case the IC is operated over the absolute maximum ratings.
(Note 1) Reduce 9.5mW/°C above 25°C.
(Note 2) Mounted on 70.0mm x 70.0mm x 1.6mm board glass epoxy board, reduce 4.5mW/°C above 25°C.
(Note 3) Mounted on 70.0mm x 70.0mm x 1.6mm board glass epoxy board, reduce 7.0mW/°C above 25°C.
Recommended Operating Conditions (TA= -40°C to +85°C)
Parameter
Supply Voltage
Input Voltage
Symbol
Min
Typ
Max
Unit
VDD
VIN
3.0
-
-
18.0
VDD
V
V
VEE
www.rohm.com
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
3/16
TSZ22111 • 15 • 001
BU4066BC BU4066BCF BU4066BCFV
Electrical Characteristics (Unless otherwise specified VEE=0V TA=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
DC Characteristics
-
-
-
-
-
-
3.5
VDD=5V
Input “H” Voltage
Input “L” Voltage
VIH
7.0
V
V
VDD=10V
VDD=15V
VDD=5V
-
-
11.0
-
-
-
-
-
-
-
-
-
-
1.5
3.0
VIL
VDD=10V
VDD=15V
VDD=15V
VDD=15V
3.75
0.3
µA
µA
Input “H” Current
Input “L” Current
IIH
IIL
VIH=15V
VIL=0V
-0.3
VDD=5V
CONT=5V
VDD=10V
CONT=10V
VDD=15V
VIN=2.5V
RL=10kΩ
VIN=5V
RL=10kΩ
VIN=7.5V
RL=10kΩ
-
-
-
500
120
80
600
500
280
Ω
ON Resistance
RON
CONT=15V
VDD=5V
-
-
-
25
10
5
-
-
-
VIN=VDD/2
RL=10kΩ
ON Resistance Defluxion
△RON
IOFF
IDD
Ω
VDD=10V
VDD=15V
VIN=15V
VOUT=0V
VIN=0V
-
-
-
-
0.3
VDD=15V
VDD=15V
Channel-OFF
Leakage Current
µA
µA
-0.3
VOUT=15V
-
-
-
-
-
-
1.0
2.0
4.0
VDD=5V
Static Supply Current
VDD=10V
VDD=15V
VIN=VDD or VEE
Input Capacitance
(Control Input)
Input capacitance
(Switch Input)
CC
CS
-
-
8
-
-
pF
pF
-
-
f=1MHz
f=1MHz
10
Switching Characteristics, CL=50pF
-
-
-
-
-
-
-
-
-
20
12
10
40
35
30
60
20
15
50
40
30
90
80
70
140
50
40
VDD=5V
Propagation Delay Time
IN→OUT
tPLH
tPHL
ns
ns
ns
RL=10kΩ
RL=1kΩ
RL=1kΩ
VDD=10V
VDD=15V
VDD=5V
Propagation Delay Time
CONT→OUT
tPHZ,tPLZ
VDD=10V
VDD=15V
VDD=5V
Propagation Delay Time
CONT→OUT
VDD=10V
VDD=15V
tPZH,tPZL
VDD=5V
VSS=-5V
VDD=5V
VSS=-5V
VDD=5V
VSS=-5V
VDD=5V
VSS=-5V
RL=10kΩ
VIN=5VP-P VOUT=-50dB
RL=10kΩ
VIN=5VP-P
RL=10kΩ,f=1MHz
VIN=5VP-P
Feed Through Attenuation
Sine Wave Distortion
FT
D
-
-
-
-
0.7
0.1
-
-
MHz
%
-
600
-
Cross Talk
CONT→OUT
Cross Talk
CTc
CT
mVP-P
MHz
RL=10kΩ
VIN=5VP-P,VOUT=-50dB
1
Between Channels
www.rohm.com
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
4/16
TSZ22111 • 15 • 001
BU4066BC BU4066BCF BU4066BCFV
Waveforms of Switching Characteristics
VDD
VDD
50%
IN/OUT
(INPUT)
50%
VEE
CONT
OUT/IN
IN/OUT
P.G
50%
50%
OUT/IN
(OUTPUT)
C
L
R
L
VEE
VEE
tPHL
tPLH
Figure 2. Propagation Delay Time IN→OUT(tPHZ,tPLZ
)
Figure 1. Propagation Delay Time IN→OUT(tPHZ,tPLZ
)
Test Circuit
Input/Output Waveform
VDD
CONT
(INPUT)
50%
50%
P.G
VEE
VDD
CONT
90%
OUT/IN
(OUTPUT)
OUT/IN
IN/OUT
50%
C
L
R
L
tPHZ
tPZH
VEE
VEE
Figure 4. Propagation Delay Time CONT→OUT (tPZH,tPHZ
)
Figure 3. Propagation Delay Time CONT→OUT (tPZH,tPHZ
)
Test Circuit
Input/Output Waveform
VDD
VDD
VDD
50%
CONT
(INPUT)
50%
P.G
VEE
R
L
C
L
CONT
OUT/IN
IN/OUT
OUT/IN
(OUTPUT)
50%
10%
VEE
tPLZ
tPZL
Figure 6. Propagation Delay Time CONT→OUT (tPZL,tPLZ
)
Figure 5. Propagation Delay Time CONT→OUT (tPZL,tPLZ
)
Test Circuit
Input/Output Waveform
VDD
CONT
OUT/IN
IN/OUT
VOUT
R
L
VIN= VDD/2
RON = RL(VIN/VOUT -1)
VEE
VEE
Figure 7. ON Resistance (RON) Test Circuit
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
5/16
BU4066BC BU4066BCF BU4066BCFV
Typical Performance Curves
1200
1000
900
750
600
450
300
150
0
800
85°C
25°C
600
85°C
25°C
-40°C
-40°C
400
200
0
0
1
2
3
4
5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Input Voltage [V]
Input Voltage [V]
Figure 8. ON Resistance vs Input Voltage
(VDD=3V, VEE=0V, CONT=3V)
Figure 9. ON Resistance vs Input Voltage
(VDD=5V, VEE=0V, CONT=5V)
900
750
600
450
300
150
0
900
750
600
450
300
150
0
85°C
25°C
-40°C
85°C
25°C
-40°C
0
2
4
6
8
10
0
3
6
9
12
15
Input Voltage [V]
Input Voltage [V]
Figure 11. ON Resistance vs Input Voltage
(VDD=15V, VEE=0V, CONT=15V)
Figure 10. ON Resistance vs Input Voltage
(VDD=10V, VEE=0V, CONT=10V)
www.rohm.com
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
6/16
TSZ22111 • 15 • 001
BU4066BC BU4066BCF BU4066BCFV
Typical Performance Curves - continued
50
50
40
30
20
10
0
Operating Temperature Range
Operating Temperature Range
40
30
VDD=3V
VDD=3V
VDD=5V
VDD=10V
20
VDD=5V
VDD=10V
10
VDD=18V
VDD=18V
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
Ambient Temperature [°C]
Figure 12. Propagation Delay Time IN→OUT(tPLH) vs
Figure 13. Propagation Delay Time IN→OUT(tPHL)
Ambient Temperature
vs Ambient Temperature
200
200
160
120
80
Operating Temperature Range
Operating Temperature Range
160
120
80
VDD=3V
VDD=5V
VDD=3V
VDD=5V
VDD=10V
VDD=18V
40
40
VDD=10V
VDD=18V
0
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
Ambient Temperature [°C]
Figure 14. Propagation Delay Time CONT→OUT(tPZH) vs
Figure 15. Propagation Delay Time CONT→OUT(tPHZ) vs
Ambient Temperature
Ambient Temperature
www.rohm.com
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
7/16
TSZ22111 • 15 • 001
BU4066BC BU4066BCF BU4066BCFV
Typical Performance Curves - continued
200
200
160
120
80
Operating Temperature Range
Operating Temperature Range
160
120
VDD=3V
VDD=5V
VDD=3V
80
VDD=10V
VDD=18V
VDD=5V
VDD=10V
VDD=18V
40
40
0
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
Ambient Temperature [°C]
Figure 16. Propagation Delay Time CONT→OUT(tPLZ) vs
Figure 17. Propagation Delay Time CONT→OUT(tPZL) vs
Ambient Temperature
Ambient Temperature
www.rohm.com
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
8/16
TSZ22111 • 15 • 001
BU4066BC BU4066BCF BU4066BCFV
Power Dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at TA=25°C(normal temperature). IC is
heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable
power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and
thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the
maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin
or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is
called thermal resistance, represented by the symbol θJA (°C/W).The temperature of IC inside the package can be
estimated by this thermal resistance. Figure 11 shows the model of thermal resistance of the package. Thermal resistance
θJA, ambient temperature TA, maximum junction temperature TJmax, and power dissipation PD can be calculated by the
equation below:
θJA = (TJmax - TA) / PD
(°C/W)
Derating curve in Figure 12 indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition.
1.6
1.4
BU4066BC(DIP14)
1.2
1.0
BU4066BCFV (SSOP-B14)
0.8
0.6
θJA =( TJmax - TA)/ PD (°C/W)
Ambient temperature TA (℃)
0.4
0.2
0.0
BU4066BCF (SOP14)
Chip surface temperature TJ(℃)
85
0
25
50
75
100
125
150
Ambient Temperature [℃]
Figure 18. Thermal Resistance
Figure 19. Derating Curve
I/O Equivalent Circuits
Input Terminals
5,6,12,13
Input/Output Terminals
1,2,3,4,8,9,10,11
Pin No.
VDD
VDD
VDD
Equivalence
Circuit
VEE
VEE
VEE
www.rohm.com
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
9/16
TSZ22111 • 15 • 001
BU4066BC BU4066BCF BU4066BCFV
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage above that of the VDD pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
www.rohm.com
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
10/16
TSZ22111 • 15 • 001
BU4066BC BU4066BCF BU4066BCFV
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
www.rohm.com
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
11/16
TSZ22111 • 15 • 001
BU4066BC BU4066BCF BU4066BCFV
Ordering Information
x
B
U
4
0
6
6
B
C
x
x
-
x
Part Number
BU4066BC
BU4066BCF
BU4066BCFV
Package
None: DIP14
Packaging and forming specification
None: Tube
E2 : Embossed tape and reel
F
: SOP14
FV : SSOP-B14
Marking Diagrams
DIP14(TOP VIEW)
SOP14(TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
BU4066BC
BU4066BCF
1PIN MARK
SSOP-B14(TOP VIEW)
Part Number Marking
4066C
LOT Number
1PIN MARK
www.rohm.com
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
12/16
TSZ22111 • 15 • 001
BU4066BC BU4066BCF BU4066BCFV
Physical Dimension, Tape and Reel Information
Package Name
DIP14
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
13/16
BU4066BC BU4066BCF BU4066BCFV
Physical Dimension, Tape and Reel Information – continued
Package Name
SOP14
(Max 9.05 (include.BURR))
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
14/16
BU4066BC BU4066BCF BU4066BCFV
Physical Dimension, Tape and Reel Information – continued
Package Name
SSOP-B14
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
15/16
BU4066BC BU4066BCF BU4066BCFV
Revision History
Date
Revision
001
Changes
12.Nov.2014
New Release
www.rohm.com
TSZ02201-0RDR0GZ00270-1-2
12.Nov.2014 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
16/16
TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-GE
Rev.003
© 2013 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-GE
Rev.003
© 2013 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
Datasheet
Buy
BU4066BC - Web Page
Distribution Inventory
Part Number
Package
BU4066BC
DIP14
Unit Quantity
1000
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
25
Tube
inquiry
Yes
相关型号：
©2020 ICPDF网 联系我们和版权申明