BU3087FV_技术文档

Datasheet

Built in VCXO,

Spread-Spectrum Clock Generator

BU3087FV

●Description

●Key Specifications

BU3087FV has built in VCXO that is necessary for the

Crystal Pullability

±105ppm (Typ.)

34.5kHz (Typ.)

180psec (Typ.)

45mA (Typ.)

Digital-TV signal reception.

Modulation Frequency

Cycle-to-Cycle Jitter

Operating Current

Operating Temperature

Connecting 27MHz crystal oscillator generates clock

signals to 74.25MHz for Hi-Vision.

BU3087FV has built in Spread-Spectrum function too.

-10℃ to +75℃

●Features

●Package

(Typ.)

(Max.)

3225 size crystal is usable

ON / OFF of Spread-Spectrum is selectable

Four kinds of Modulation-Rate is selectable

（±0.25% / ±0.50% / ±0.75% / ±1.00%）

Triangular Modulation

SSOP-B16

5.00mm x 6.40mm x 1.35mm

●Applications

Digital-TV, STB, TV-Tuner

SSOP-B16

●Typical Application Circuit

3.3V (Typ.)

27MHz Crystal

CL

RD

XIN

XOUT

PDB

AVDD1

0.1μF

AVSS1

CLKOUT

VDD

VCTRL

0.1μF

AVDD2

VSS

AVSS2

SSON

TEST

MODSEL1

MODSEL2

CLK27M

Figure 1. Typical Application Circuit

(Caution) CL and RD in Typical Application Circuit should be optimized as to using crystal and board condition.

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

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●Block Diagram

7:MODSEL1

with Pull-up

Control

Logic

8:MODSEL2

with Pull-down

11:SSON

with Pull-up

Spread-Spectrum

PLL

10:TEST

with Pull-down

14:CLKOUT

15:PDB

with Pull-up

4:VCTRL

1:XIN

VCXO

9:CLK27M

16:XOUT

Figure 2. Block Diagram

●Pin Configuration

XIN

XOUT

1

2

3

4

16

15

14

AVDD1

PDB

CLKOUT

VDD

AVSS1

VCTRL

AVDD2

VSS

5

6

7

8

12

11

10

9

AVSS2

SSON

TEST

MODSEL1

MODSEL2

CLK27M

Figure 3.Pin Configuration (TOP VIEW)

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●Pin Function

PIN No.

PIN Name

XIN

Function

1

2

3

4

5

6

Crystal Input terminal

Power supply for VCXO

GND for VCXO

AVDD1

AVSS1

VCTRL

AVDD2

AVSS2

VCXO control input terminal

Power supply for PLL-Analog

GND for PLL-Analog

Spread-Spectrum Modulation control terminal

(Refer to Table of Spread-Spectrum Modulation)

with pull-up

Spread-Spectrum Modulation control terminal

(Refer to Table of Spread-Spectrum Modulation)

with pull-down

7

8

MODSEL1

MODSEL2

9

CLK27M

TEST

SSON

VSS

27.000000MHz Output

10

11

12

13

14

15

16

Test terminal, with pull-down

Spread-Spectrum ON／OFF choice（H：ON、L：OFF）, with pull-up

GND for PLL-Digital

VDD

Power supply for PLL-Digital

CLKOUT

PDB

74.250000MHz Output

Power-down control terminal, with pull-up

Crystal Output terminal

XOUT

●Table of Spread-Spectrum Modulation（1Pin_XIN input frequency =27.000000MHz）

In the case of 11Pin_SSON=H, outputs it according to the following table.

MODSEL2

MODSEL1

CLKOUT

L

H

L

74.250000MHz ±0.25% Modulation

74.250000MHz ±0.50% Modulation

74.250000MHz ±0.75% Modulation

74.250000MHz ±1.00% Modulation

H

In the case of 11Pin・SSON=L, outputs unmodulated clock.

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●Absolute Maximum Ratings (Ta=25°C)

Parameter

Supply voltage

Input Voltage

Symbol

VDD

VIN

Ratings

-0.3 to 4.0

Unit

V

-0.3 to VDD+0.3

-55 to 125

V

Storage Temperature

range

Tstg

°C

mW

1

Power dissipation

PD

690^※

1

※

A measure value at mounting on 70mm x 70mm x 1.6mm glass epoxy substrate.

In the case of exceeding Ta=25°C, 6.9mW should be reduced per 1°C.

●Recommended Operating Ratings

Parameter

Supply voltage

Symbol

VDD

VIH

Ratings

3.135 to 3.465

0.8VDD to VDD

0.0 to 0.2VDD

-10 to 75

Unit

V

Input ”H” Voltage

Input ”L” Voltage

Operating Temperature

V

VIL

V

topr

°C

V

Frequency Control

Voltage

Vc

0.0 to VDD

Output load

CL

15 (MAX)

pF

1

※

In case of Output load exceeds previous value , consideration should be adapted Rise Time and Fall Time for condition of use.

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●Electrical Characteristics

DC Characteristics

(VDD=3.3V, Ta=25°C, Crystal Frequency=27.000000MHz, at No Load, unless otherwise specified）

Limit

Parameter

Symbol

Unit

Conditions

Min.

VDD-0.4

－

Typ.

－

Max.

－

Output H voltage

Output L voltage

VOH

VOL

V

IOH=4.0mA

－

0.4

IOL=4.0mA

Operating

Circuit current

Output no load,

±0.50% Modulation

IDD

－

45.0

58.0

1.5

mA

PDB, SSON, MODSEL1 Terminal

VIH=VDD

Input H current 1

IupH

-1.5

－

μA

Input H current 2

Input H current 3

μA

IdnH

IdirH

35.0

-1.5

70.0

105.5

1.5

MODSEL2, TEST Terminal,VIH=VDD

VCTRL Terminal,VIH=VDD

－

PDB, SSON, MODSEL1 Terminal

VIL=0.0V

Input L current 1

μA

IupL

-105.5

-70.0

-35.0

Input L current 2

Input L current 3

CLKOUT

μA

IdnL

IdirL

-1.5

－

1.5

MODSEL2, TEST Terminal,VIL=0.0V

VCTRL Terminal,VIL=0.0V

VCTRL=1/2VDD

μA

MHz

CLKOUT 74.248144 74.250000 74.251856

1

※

Crystal Pullability

Spread-Spectrum

fp

±80

±105

±130

ppm 0≦VCTRL≦VDD

Triangular Modulation,

Fmod

32.5

34.5

36.5

kHz

Modulation Frequency

Independently of Modulation Rate

¹This is a guarantee with only IC. It is finished with confirmation to operate with Crystal (DSX321G・8pF load) made in DAISHINKU CORP.

※

AC Characteristics

(VDD=3.3V, Ta=25°C, Crystal Frequency=27.000000MHz, Output load=15pF, unless otherwise specified）

Following the table cannot test directly on characteristic when shipment, so it is a design guarantee.

Limit

Parameter

Symbol

Duty

Unit

%

Conditions

Measured at 1/2VDD

Min.

45

Typ.

50

Max.

55

Duty

2

Period Jitter 1σ^※

,

Jitter 1σ

JsSD

－

35

－

psec

in Spread-Spectrum OFF

Period Jitter MIN-MAX value^※

in Spread-Spectrum OFF

Cycle-to-Cycle Jitter,

2

,

Jitter P-P

JsABS

180

psec

Jitter

JsCyCy

Cycle-to-Cycle

In ±0.50% Modulation

Rise Time

Fall Time

Tr

Tf

－

1.2

0.7

－

1

nsec Time between 0.2VDD and 0.8VDD

nsec Time between 0.8VDD and 0.2VDD

3

※

Lock Up Time

Tlock

msec

※２

Jitter means center value when using Japan Tektronix : TDS7104 Digital Phosphor Oscilloscope.

Time between voltage supply leads to 3.135V and output clock gets stable.

※３

●Spread-Spectrum Modulation Waveform

Modulation Waveform is triangular. Modulation Rate is selectable among ±0.25%／±0.50%／±0.75%／±1.00%.

In addition, Modulation Frequency is 34.5kHz without depending on Modulation Rate.

( Figure 4 shows ±0.50% Modulation Waveform. )

74.250000MHz x (100 + 0.5)%

74.250000MHz

74.250000MHz x (100 - 0.5)%

Modulation Frequency 34.5kHz

；

Figure 4. Spread-Spectrum Modulation Waveform

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●Typical Wave Forms (VDD=3.3v, Ta=25°C, Spread-Spectrum OFF setting)

CLK27M

(500mV/div.)

CLK27M

(500mV/div.)

TIME (5nsec/div.)

Figure 5. CLK27M Output Waveform

TIME (1nsec/div.)

Figure 6. CLK27M Period-Jitter

CLKOUT

(500mV/div.)

CLKOUT

(500mV/div.)

TIME (5nsec/div.)

Figure 7. CLKOUT Output Waveform

TIME (1nsec/div.)

Figure 8. CLKOUT Period-Jitter

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●Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF)

180

160

140

120

100

80

180

160

140

120

100

80

Ta=25°C

VDD=3.3V

60

40

20

0

3.1

3.2

3.3

3.4

3.5

-20

0

20

40

60

80

SUPPLY VOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 10. CLK27M Period-Jitter MIN-MAX

Figure 9. CLK27M Period-Jitter MIN-MAX

55

54

53

52

51

50

49

48

47

46

45

55

54

53

52

51

50

49

48

47

46

45

Ta=25°C

VDD=3.3V

3.1

3.2

3.3

3.4

3.5

-20

0

20

40

60

80

AMBIENT TEMPERATURE : Ta[

]

℃

SUPPLY VOLTAGE : VDD[V]

Figure 11. CLK27M Duty

Figure 12. CLK27M Duty

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●Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF)

2.4

2.0

1.6

1.2

0.8

0.4

0.0

2.4

2.0

1.6

1.2

0.8

0.4

0.0

Ta=25°C

VDD=3.3V

3.10

3.20

3.30

3.40

3.50

-20

0

20

40

60

80

SUPPLY VOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 14. CLK27M Rise-Time

Figure 13. CLK27M Rise-Time

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

Ta=25°C

VDD=3.3V

3.10

3.20

3.30

3.40

3.50

-20

0

20

40

60

80

SUPPLY VOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 16. CLK27M Fall-Time

Figure 15. CLK27M Fall-Time

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●Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF)

280

240

200

160

120

80

280

240

200

160

120

80

Ta=25°C

VDD=3.3V

40

0

3.1

3.2

3.3

3.4

3.5

-20

0

20

40

60

80

SUPPLY VOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 18. CLKOUT Period-Jitter MIN-MAX

Figure 17. CLKOUT Period-Jitter MIN-MAX

55

54

53

52

51

50

49

48

47

46

45

55

54

53

52

51

50

49

48

47

46

45

VDD=3.3V

Ta=25°C

3.1

3.2

3.3

3.4

3.5

-20

0

20

40

60

80

AMBIENT TEMPERATURE : Ta[

]

℃

SUPPLYVOLTAGE : VDD[V]

Figure 20. CLKOUT Duty

Figure 19. CLKOUT Duty

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●Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF)

2.4

2.0

1.6

1.2

0.8

0.4

0.0

2.4

2.0

1.6

1.2

0.8

0.4

0.0

Ta=25°C

VDD=3.3V

3.10

3.20

3.30

3.40

3.50

-20

0

20

40

60

80

SUPPLY VOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 22. CLKOUT Rise-Time

Figure 21. CLKOUT Rise-Time

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

VDD=3.3V

Ta=25°C

3.10

3.20

3.30

3.40

3.50

-20

0

20

40

60

80

SUPPLY VOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 24. CLKOUT Fall-Time

Figure 23. CLKOUT Fall-Time

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●Typical Wave Forms (VDD=3.3v, Ta=25°C, Spread-Spectrum ON setting)

CLKOUT

(10dB/div.)

FREQUENCY (500kHz/div.)

Figure 25. CLKOUT±0.25% Modulation Spectrum

FREQUENCY (500kHz/div.)

Figure 26. CLKOUT±0.50% Modulation Spectrum

CLKOUT

(10dB/div.)

CLKOUT

(10dB/div.)

FREQUENCY (500kHz/div.)

Figure 27. CLKOUT±0.75% Modulation Spectrum

FREQUENCY (500kHz/div.)

Figure 28. CLKOUT±1.00% Modulation Spectrum

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●Typical Wave Forms (VDD=3.3v, Ta=25°C, Spread-Spectrum ON setting)

CLKOUT (60psec/div.)

TIME (20μsec/div.)

Figure 29. CLKOUT±0.25% Modulation Waveform

CLKOUT (78psec/div.)

TIME (20μsec/div.)

Figure 30. CLKOUT±0.50% Modulation Waveform

CLKOUT (93psec/div.)

TIME (20μsec/div.)

Figure 31. CLKOUT±0.75% Modulation Waveform

CLKOUT (113psec/div.)

TIME (20μsec/div.)

Figure 32. CLKOUT±1.00% Modulation Waveform

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●Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF)

36.5

36.0

35.5

35.0

34.5

34.0

33.5

33.0

32.5

36.5

36.0

35.5

35.0

34.5

34.0

33.5

33.0

32.5

Ta=25°C

VDD=3.3V

3.10

3.20

3.30

3.40

3.50

-20

0

20

40

60

80

SUPPLY VOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 34. CLKOUT ±0.50% Modulation Frequency

Figure 33. CLKOUT ±0.50% Modulation Frequency

0.60

VDD=3.3V

Ta=25°C

0.58

0.56

0.54

0.52

0.50

0.48

0.46

0.44

0.42

0.40

0.58

0.56

0.54

0.52

0.50

0.48

0.46

0.44

0.42

0.40

3.10

3.20

3.30

3.40

3.50

-20

0

20

40

60

80

SUPPLY VOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 36. CLKOUT ±0.50% Modulation Rate

Figure 35. CLKOUT ±0.50% Modulation Rate

Modulation Frequency has a same characteristic despite a Modulation control.

Modulation Rate has a same trend despite a control.

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●Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF)

360

300

240

180

120

60

360

300

240

180

120

60

Ta=25°C

VDD=3.3V

0

3.1

3.2

3.3

3.4

3.5

-20

0

20

40

60

80

SUPPLY VOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 38. CLKOUT ±0.25% Modulation

Figure 37. CLKOUT ±0.25% Modulation

Cycle-to-Cycle Jitter

360

300

240

180

120

60

360

300

240

180

120

60

Ta=25°C

VDD=3.3V

0

3.1

3.2

3.3

3.4

3.5

-20

0

20

40

60

80

SUPPLY VOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 40. CLKOUT ±0.50% Modulation

Figure 39. CLKOUT ±0.50% Modulation

Cycle-to-Cycle Jitter

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●Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF)

360

300

240

180

120

60

360

300

240

180

120

60

Ta=25°C

VDD=3.3V

0

3.1

3.2

3.3

3.4

3.5

-20

0

20

40

60

80

SUPPLY VOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 42. CLKOUT ±0.75% Modulation

Figure 41. CLKOUT ±0.75% Modulation

Cycle-to-Cycle Jitter

360

300

240

180

120

60

360

300

240

180

120

60

Ta=25°C

VDD=3.3V

0

3.1

3.2

3.3

3.4

3.5

-20

0

20

40

60

80

SUPPLY VOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 44. CLKOUT ±1.00% Modulation

Figure 43. CLKOUT ±1.00% Modulation

Cycle-to-Cycle Jitter

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●Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF)

60

56

52

48

44

40

60

56

52

48

44

40

Ta=25°C

VDD=3.3V

3.1

3.2

3.3

3.4

3.5

-20

0

20

40

60

80

SUPPLYVOLTAGE : VDD[V]

AMBIENT TEMPERATURE : Ta[

]

℃

Figure 46. Operating Current

Figure 45. Operating Current

120

VDD=3.3v, Ta=25°C

80

40

0

-40

-80

-120

-160

0.0

0.3

0.6

0.9

1.2

1.5

1.8

2.1

2.4

2.7

3.0

3.3

VCXO-Control-Voltage : Vctrl[V]

Figure 47. VCXO Crystal Pullability

VCXO Crystal Pullability has been gathered from following the evaluation environment.

Evaluation board: 70mm x 70mm x 1.6mm, 4 layers、FR-4

Using parts

:

27MHz Crystal (DSX321G・8pF load) made in DAISHINKU CORP. RD=200Ω, CL=4pF

VCXO Crystal Pullability modulates by a using crystal and a board condition.

In order to use, should be checked matting with a final board condition.

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●Typical Application Circuit

In the case of Spread-Spectrum Modulation Rate =±0.75% setting, 7Pin_MODSEL1 connects GND, and 8Pin_MODSEL2

connect Power supply directly following the diagram.

In the case of other Modulation Rate setting, should be changed connections as a Table of Spread-Spectrum Modulation (P3).

(In the case of ±0.50% setting, it is no problem that 7Pin_MODSEL1 and 8Pin_MODSEL2 are OPEN Manages.)

3.3V (Typ.)

27MHz Crystal

CL

RD

XIN

XOUT

PDB

AVDD1

0.1μF

AVSS1

CLKOUT

VDD

VCTRL

0.1μF

AVDD2

VSS

AVSS2

SSON

TEST

MODSEL1

MODSEL2

CLK27M

Figure 48. Modulation Rate =±0.75% setting Typical Application Circuit

In the case of Spread-Spectrum OFF setting, 11Pin_SSON connect GND directly as the following diagram.

(In the case of using Spread-Spectrum, it is no problem that 11Pin_SSON are OPEN Manages.)

3.3V (Typ.)

27MHz Crystal

CL

RD

XIN

XOUT

PDB

AVDD1

0.1μF

AVSS1

CLKOUT

VDD

VCTRL

0.1μF

AVDD2

VSS

AVSS2

SSON

TEST

MODSEL1

MODSEL2

CLK27M

Figure 49. Spread-Spectrum OFF setting Typical Application Circuit

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●Application Information

Basically, mount ICs to the printed circuit board for use.

(If the ICs are not mounted to the printed circuit board, the characteristics of ICs may not be fully demonstrated.)

Mount 0.1µF capacitors in the vicinity of the IC Pins between 2Pin_AVDD1, 3Pin_AVSS1, and 5Pin_AVDD2,

6Pin_AVSS2, and 12Pin_VSS, 13Pin_VDD respectively.

To obtain accurate frequency, confirm the Crystal-matching with the last board to get rid of a problem

by a mass-production.

Depending on the conditions of the printed circuit board, mount an additional electrolytic capacitor between the power

supply and GND terminal.

For EMI protection, it is effective to put ferrite beads in the origin of power supply to be fed to BU3087FV from the

printed circuit board or to insert a capacitor (of 1Ω or less), which bypasses high frequency desired, between the power

supply and the GND terminal.

For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal

powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring,

width of GND wiring, and routing of wiring.

Typical Application Circuit is recommendation, but in order to use, thoroughly check to be sure characteristic.

●Power Dissipation

(SSOP-B16 package)

700

600

500

400

300

200

100

0

25

50

75

100

125

AMBIENT TEMPERATURE : Ta [

]

℃

* 70mm x 70mm x 1.6mm Glass Epoxy Board

Figure 50. Power Dissipation Curve (Pd-Ta Curve)

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●I/O Equivalence Circuit

Pin No.

Equivalent Circuit

Schmitt-trigger Pin

7, 11, 15

( with Pull-Up )

8, 10

( with Pull-Down )

To IC inside

VCXO Control Input Pin

4

To IC inside

From IC inside

Clock Output Pin

9, 14

From IC inside

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●I/O Equivalence Circuit

Pin No.

Equivalent Circuit

Crystal Input Pin

1

To IC inside

From IC inside

Crystal Output Pin

16

From IC inside

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●Operational Notes

(1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can

break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any

special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety

measures including the use of fuses, etc.

(2) Operating conditions

These conditions represent a range within which characteristics can be provided approximately as expected. The

electrical characteristics are guaranteed under the conditions of each parameter.

(3) Reverse connection of power supply connector

The reverse connection of power supply connector can break down ICs. Take protective measures against the

breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s

power supply terminal.

(4) Power supply line

Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,

for the digital block power supply and the analog block power supply, even though these power supplies has the same

level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing

the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.

For the GND line, give consideration to design the patterns in a similar manner.

Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At

the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be

used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.

(5) GND voltage

Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.

Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.

(6) Short circuit between terminals and erroneous mounting

In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can

break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between

the terminal and the power supply or the GND terminal, the ICs can break down.

(7) Operation in strong electromagnetic field

Be noted that using ICs in the strong electromagnetic field can malfunction them.

(8) Inspection with set PCB

On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.

Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set

PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the

jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In

addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention

to the transportation and the storage of the set PCB.

(9) Input terminals

In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the

parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the

input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals

a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage

to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is

applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of

electrical characteristics.

(10) Ground wiring pattern

If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND

pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that

resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the

small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.

(11) External capacitor

In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a

degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.

(12) Thermal design

Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual

states of use.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority.

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BU3087FV

●Ordering Information

B

U

3

0

8

7

F

V

-

E 2

Part Number

Package

FV : SSOP-B16

Packaging and forming specification

E2: Embossed tape and reel

●Physical Dimension Tape and Reel Information

SSOP-B16

5.0 0.2

Tape

Embossed carrier tape

2500pcs

16

9

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

8

0.15 0.1

0.1

0.65

Direction of feed

1pin

0.22 0.1

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

●Marking Diagram

SSOP-B16(TOP VIEW)

Part Number Marking

3087F

LOT Number

1PIN MARK

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●Revision History

Date

Revision

001

Changes

New Release

17.AUG.2012

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BU3087FV
厂家：	ROHM
描述：	BU3087FV内置有在接收地面波Digital-TV信号时必需的VCXO功能。此外，通过连接27MHz晶体振荡器，可生成Hi-Vision 用时钟的74.25MHz。还内置扩频功能。・NX3225GA 27.000MHz 时钟石英晶振压控振荡器电视晶体振荡器
文件：	总26页 (文件大小：725K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BU3087FV [ROHM]

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