BU27030NUC_技术文档

Datasheet

Ambient Light Sensor IC Series

Digital 16bit Serial Output Type

Ambient Light Sensor IC

BU27030NUC

General Description

Key Specifications

BU27030NUC is a digital Ambient Light Sensor IC with

I²C bus interface. This IC is most suitable for obtaining

ambient light data for adjusting LCD and backlight power

of TV and mobile phone. It is capable of detecting a very

wide range of illuminance.

■ VCC Voltage Range:

1.7 V to 3.6 V

20 klx (Typ)

120 μA (Typ)

1.0 μA (Typ)

■ Illuminance Detection Range:

■ Current Consumption:

■ Power Down Current:

■ Operating Temperature Range:

-40 °C to +85 °C

Features

Package

WSON008X2120

W (Typ) x D (Typ) x H (Max)

 Built-in IR Cut Filter

 2 outputs with Different Spectral Response

 Correspond to Dark Window because of High

Sensitivity

2.1 mm x 2.0 mm x 0.6 mm

 Rejecting 50 Hz / 60 Hz Light Noise

 I²C Bus Interface (f/s mode support)

 Correspond to both 1.2 V and 1.8 V Logic Interface

 Resolution 0.0007 lx/count (Typ)

(In highest gain and longest measurement time setting)

Applications

Mobile Phone, Tablet PC, Note PC, Portable Game

Machine, LCD TV, Digital Camera

Typical Application Circuit

0.1 μF

VCC

ADC

PD0

ADC Logic

+

Micro

Controller

SDA

SCL

I²C Interface

or

ADC

PD1

Baseband

Processor

POR

GND

OSC

TEST

○Product structure : Silicon integrated circuit.

○This product does not include laser transmitter.

○This product has no designed protection against radioactive rays.

○This product does not include optical load.

○This product includes Photo detector, (Photo Diode) inside of it.

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Pin Configuration

TOP VIEW

TEST

VCC

GND

NC

1

2

3

8

7

6

SDA

SCL

4

5

NC

Pin Description

Pin No.

Pin Name

TEST

VCC

GND

NC

Function

1

2

Test pin (Connect to GND)

Power supply^{(Note 1)}

Ground

Non connect^{(Note 2)}

I²C bus serial clock^{(Note 3)}

I²C bus serial data^{(Note 3)}

Non connect^{(Note 2)}

3

4

5

6

7

8

SCL

SDA

NC

(Note 1) Dispose a bypass capacitor as close as possible to the IC.

(Note 2) Please use the NC pin as open pin.

(Note 3) If there is a device falls sharply among other devices connected to the SDA and SCL pins, it might generate undershoot and the pin voltage might be

the ground potential or below. When the undershoot occurs, must take a measure like adding a capacitor near to the pin of the device concerned.

Block Diagram

VCC

ADC

PD0

PD1

ADC Logic

+

SDA

SCL

I²C Interface

ADC

POR

OSC

GND

TEST

Description of Blocks

• PD0, PD1: Photodiode

• IR CUT FILTER: Infrared cut filter

• ADC: Analog-to-Digital Converter for obtaining digital data.

• ADC Logic and I²C Interface: ADC control logic and I/F logic

• OSC: Clock generator for internal logic

• POR: Power ON Reset. All registers are reset after VCC is supplied.

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Supply Voltage

Symbol

Rating

Unit

V_{CC_MR}

V_{IN_MR}

Tstg

4.5

V

Input Voltage [SCL, SDA]

-0.3 to +4.5

-40 to +100

100

Storage Temperature Range

°C

Maximum Junction Temperature

Tjmax

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

WSON008X2120

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

384.2

82

54.2

12

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A (Still-Air).

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70 μm

Thermal Via^{(Note 5)}

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70 μm

74.2 mm x 74.2 mm

35 μm

74.2 mm x 74.2 mm

70 μm

(Note 5) This thermal via connects with the copper pattern of all layers.

Recommended Operating Conditions

Parameter

Symbol

Min

Typ

Max

Unit

Operating Temperature

Supply Voltage

Topr

V_CC

V_IN

-40

1.7

0

+25

1.8

-

+85

3.6

°C

V

Input Voltage[SCL, SDA]

V

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Electrical Characteristics

(Unless otherwise specified, V_CC= 1.8 V, Ta = 25 °C, MEAS_EN = 1, WAIT_EN = 1, MEAS_MODE = 55 ms mode, x1 gain

mode)

Parameter

Symbol

I_CC1

Min

-

Typ

120

Max

200

Unit

Conditions

Current Consumption

µA Ev = 100 lx^{(Note 1)}

No input light

µA MEAS_EN = 0

SCL = SDA = 1.8 V

Ev = 1000 lx^{(Note 1)}

count MEAS_MODE = 100 ms mode

WAIT_EN = 0

Ev = 1000 lx^{(Note 1)}

count MEAS_MODE = 100 ms mode

WAIT_EN = 0

Power Down Current^{(Note 2)}

DATA0 Data Count Value

DATA1 Data Count Value

I_CC2

D_CH0

D_CH1

-

1

4

5000

1200

5900

1450

6800

1700

Dark Count Value

S_{0_0}

t_MT1

V_IH

0

82

0.84

-

91

-

2

100

-

count No input light

Measurement Time

ms

V

SCL SDA Input 'H' Voltage

SCL SDA Input 'L' Voltage

V_IL

-

0.45

0.4

V

SDA Output 'L' Voltage

V_OL

0

-

V

I_OL= 3 mA

(Note 1) White LED is used.

(Note 2) Current value depends on voltage difference between VCC and the SCL or SDA pins.

Typical Performance Curves

1.0

DATA0

0.8

0.6

0.4

DATA1

0.2

0.0

400 500 600 700 800 900 1000 1100

Wavelength [nm]

Figure 1. Ratio vs Wavelength

(Spectral Response)

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I²C Bus Timing Characteristics (Unless otherwise specified V_CC= 1.8 V, Ta = 25 °C)

S: Repeated START

P: STOP

S: START

V_IH

V_IL

V_IH

V_IL

SDA

SCL

V_IL

t_BUF

t_HD;STA

t_SU;DAT

V_IH

V_IL

V_IH

V_IL

t_HIGH

t_LOW

t_HD;STA

t_HD;DAT

t_SU;STA

t_SU;STO

Parameter

SCL Clock Frequency

Symbol

f_SCL

Min

0

Typ

Max

Unit

kHz

µs

Conditions

-

400

'L' Period of the SCL Clock

'H' Period of the SCL Clock

Setup Time for Repeated START

Hold Time for START

Data Setup Time

t_LOW

1.3

0.6

100

0

-

t_HIGH

µs

t_SU;STA

t_HD;STA

t_SU;DAT

t_HD;DAT

t_SU;STO

µs

ns

Data Hold Time

µs

Set Up Time for STOP

0.6

µs

Bus Free Time between STOP and

START

t_BUF

1.3

-

µs

I²C Bus Communication

1. Write Format

(1) Indicate register address

W

0

S

Slave Address

ACK

Register Address

ACK

P

(2) Write data after indicating register address

W

S

Slave Address

ACK

0

Data specified at register

address field

Data specified at register

address field + N

ACK

…

ACK

P

2. Read Format

(1) Read data after indicating register address

W

0

S

Slave Address

ACK

Register Address

ACK

R

1

Data specified at register

address field

ACK

Data specified at register

address field + 1

Data specified at register

address field + N

ACK

…

ACK

NACK

P

(2) Read data from the specified register

R

1

Data specified at register

address field

S

Slave Address

ACK

Data specified at register

address field + 1

Data specified at register

address field + N

ACK

…

ACK

: from master to slave

: from slave to master

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I²C Bus Slave Address

Slave address is 0111000.

Register Map^{(Note 1)}

Register

Register Name

Address

R/W

RW

D7

D6

0

D5

0

D4

0

D3

D2

D1

0

D0

SW_

RESET

0x40

0x41

0x42

0x43

PART_ID [5:0]

SYSTEM_CONTROL

MODE_CONTROL1

MODE_CONTROL2

MODE_CONTROL3

WAIT_

EN

MEAS_

MODE

0

DATA0_GAIN [3:0]

DATA1_GAIN [3:0]

MEAS

_EN

VALID

0

0x50

0x51

0x52

0x53

0x92

R

DATA0_data [7:0]

DATA0_data [15:8]

DATA0

DATA1_data [7:0]

DATA1

DATA1_data [15:8]

MANUFACTURER_ID [7:0]

MANUFACTURER_ID

(Note 1) Do not write any commands to other addresses except above. Do not write ‘1’ to the fields in which value is ‘0’ in above table.

(0x40) SYSTEM_CONTROL

Fields

Function

When software reset is performed, all registers are reset.

0: - (No action)

SW_RESET

1: Perform software reset

PART_ID

PART ID 0x12 (Read only register)

default value 0x12

(0x41) MODE_CONTROL1

Fields

Function

0: There is no interval

1: There is interval after each measurement. (Low current consumption mode)

Only in 55 ms mode this function is available.

When this mode is active, measurement time is same at 100 ms mode

Measurement mode for DATA0 and DATA1

0: 100 ms mode

WAIT_EN

MEAS_MODE

1: 55 ms mode

default value 0x00

(0x42) MODE_CONTROL2

Fields

Function

Gain setting of ADC DATA0

0010: x1 gain mode

DATA0_GAIN

DATA1_GAIN

1010: x32 gain mode

1100: x256 gain mode

Other setting is prohibited.

Gain setting of ADC DATA1

0010: x1 gain mode

1010: x32 gain mode

1100: x256 gain mode

Other setting is prohibited.

default value 0x22

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Register Map - continued

(0x43) MODE_CONTROL3

Fields

Function

Measurement data update status after changing settings of the below registers or reading

MODE_CONTROL3 register. (Read only register)

VALID

0: Measurement data is not updated.

1: Measurement data is updated.

Object registers: 0x41, 0x42, 0x43

0: Disable measurement

1: Enable measurement

MEAS_EN

default value 0x00

(0x50 / 0x51) DATA0

Fields

Function

DATA0_data [15:0]

DATA0 measurement data

default value 0x0000

(0x52 / 0x53) DATA1

Fields

Function

DATA1 measurement data

DATA1_data [15:0]

default value 0x0000

(0x92) MANUFACTURER_ID

Fields

Function

MANUFACTURER_ID

MANUFACTURER_ID: 0xE0

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Power Supply Sequence (Unless otherwise specified V_CC= 1.8 V, Ta = 25 °C)

t_PSL

VCC (Min)

t_PSC

VCC (Min)

t_PSC

VCC (Min)

VCC

0.4 V

Command Acceptable

Conditions

Undefined Behavior

Command Acceptable

Undefined Behavior

Parameter

Symbol

t_PSC

Min

100

1

Typ

Max

Unit

Command Input Wait Time

after Power-up

-

µs

Power Down Time

t_PSL

ms

Command input is available after “t_PSC” from V_CCis supplied. If VCC voltage is below the recommended operating voltage

range, internal state is “Undefined Behavior”. In this case, once power down and power up again. Keep V_CC< 0.4 V for “t_PSL

”

or more before V_CCis supplied again.

Optical Design for the Device

Top View

2 mm

0.45 mm

1.05 mm

2.1mm

2.1 mm

0.76 mm

0.31 mm

PD area

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I/O Equivalence Circuits

Pin Name

Equivalence Circuit

VCC

Pin Name

Equivalence Circuit

VCC

SCL

SDA

VCC

TEST

-

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

10. Regarding the Input Pin of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The

operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical

damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an

input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins

when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the

input pins have voltages within the values specified in the electrical characteristics of this IC.

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

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Ordering Information

B U 2

7

0

3

0 N U C

-

E 2

Package

Packaging and forming specification

NUC: WSON008X2120 E2: Embossed tape and reel

Marking Diagram

WSON008X2120 (TOP VIEW)

Part Number Marking

1 PIN MARK

A

L

LOT Number

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Physical Dimension and Packing Information

Package Name

WSON008X2120

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Revision History

Date

Revision

Changes

19.Sep.2019

06.Dec.2019

001

002

New Release

Revise Physical Dimension and Packing Information

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004


型号：	BU27030NUC
厂家：	ROHM
描述：	BU27030NUC是适用于I2C bus接口的数字照度传感器IC。可检测大范围的照度，适用于液晶TV及智能手机的亮度调整。手机智能手机电视传感器
文件：	总16页 (文件大小：1057K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BU27030NUC [ROHM]

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