BU19UA3WNVX-TL_技术文档

Datasheet

CMOS LDO Regulator Series for Portable Equipments

Versatile Package

FULL CMOS LDO Regulator

BUxxUA3WNVX series

●General Description

●Key Specifications

BUxxUA3WNVX series is high-performance FULL

CMOS regulator with 300-mA output, which is mounted

on versatile package SSON004X1010 (1.00mm × 1.00

mm × 0.60mm). It has excellent noise characteristics and

load responsiveness characteristics despite its low circuit

current consumption of 50μA. It is most appropriate for

various applications such as power supplies for logic IC,

RF, and camera modules.ROHM’s.

Output voltage:

1.0V to 3.7V

±1.0% (±25mV)

50μA

Accuracy output voltage:

Low current consumption:

Operating temperature range:

-40°C to +85°C

●Applications

Battery-powered portable equipment, etc.

●Package

SSON004X1010 :

1.00mm x 1.00mm x 0.60mm

●Features

High accuracy detection

low current consumption

Compatible with small ceramic capacitor (Cin=Co=1.0uF)

With built-in output discharge circuit

High ripple rejection

ON/OFF control of output voltage

With built-in over current protection circuit

and thermal shutdown circuit

Low dropout voltage

●Typical Application Circuit

STBY

VIN

STBY

VOUT

VIN

GND

Fig.1 Application Circuit

○Product structure:Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

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Datasheet

BUxxUA3WNVX series

●Connection Diagram

SSON004X1010 (TOP VIEW)

4 VIN

3 STBY

LOT Number

1 2

Part Number Marking

1PIN MARK

1 VOUT

2 GND

●Pin Descriptions

SSON004X1010

PIN No.

Symbol

VOUT

GND

Function

Output Voltage

1

2

Grouding

ON/OFF control of output voltage

(High: ON, Low: OFF)

Power Supply Voltage

3

4

STBY

VIN

● Ordering Information

B

U

x

U

A

3

W

N

V

X

-

T

L

Part

Number

Output Voltage

10 : 1.0V

Low Dropout Voltage

Maximum Output Current

300mA

with Package

output discharge NVX : SSON004X1010

Packageing and forming specification

Embossed tape and reel

TL : The pin number 1 is the lower left

37 : 3.7V

SSON004X1010

1.0 0.1

1PIN MARK

Tape

Embossed carrier tape

5000pcs

Quantity

TL

Direction

of feed

S

The direction is the 1pin of product is at the lower left when you hold

reel on the left hand and you pull out the tape on the left hand

(

)

0.05

0.65 0.05

3-C0.18

R0.05

1

2

45º

4

3

Direction of feed

1pin

0.25 0.05

Reel

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

∗

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Datasheet

BUxxUA3WNVX series

●Lineup

Marking

ml(*)

nl(*)

Ul(*)

Yl(*)

al(*)

ql(*)

TBD(*)

e

Output

Voltage

Part

1.0V

1.05V

1.1V

1.15V

1.2V

1.25V

1.3V

1.35V

1.4V

1.45V

BU10

BU1A

BU11

BU1B

BU12

BU1C

BU13

BU1D

BU14

BU1E

Number

TBD(*)

1.55V

BU1F

TBD(*)

1.6V

TBD(*)

1.65V

BU1G

TBD(*)

1.7V

TBD(*)

1.75V

BU1H

bl(*)

1.85V

BU1J

dl(*)

1.9V

TBD(*)

1.95V

BU1K

el(*)

2.0V

f

g

1.5V

BU15

1.8V

BU18

BU16

BU17

BU19

BU20

fl(*)

gl(*)

2.1V

TBD(*)

2.15V

BU2B

rl(*)

2.2V

TBD(*)

2.25V

BU2C

hl(*)

2.3V

TBD(*)

2.35V

BU2D

TBD(*)

2.4V

TBD(*)

2.45V

BU2E

TBD(*)

2.55V

BU2F

h

2.05V

BU2A

2.5V

BU25

BU21

BU22

BU23

BU24

m(*)

2.6V

TBD(*)

2.65V

BU2G

ul(*)

2.7V

yl(*)

2.75V

BU2H

n(*)

2.8V

BU28

q(*)

2.85V

BU2J

u(*)

2.9V

BU29

0i(*)

2.95V

BU2K

TBD(*)

3.05V

BU3A

1i(*)

3.1V

k

3.0V

BU30

BU26

BU27

BU31

TBD(*)

3.15V

BU3B

2i(*)

3.2V

TBD(*)

3.25V

BU3C

y(*)

3.3V

BU33

TBD(*)

3.35V

BU3D

3i(*)

3.4V

TBD(*)

3.45V

BU3E

TBD(*)

3.5V

TBD(*)

3.55V

BU3F

TBD(*)

3.6V

TBD(*)

3.65V

BU3G

BU32

BU34

BU35

BU36

9(*)

3.7V

BU37

TBD(*)

3.75V

BU3H

TBD(*)

3.8V

TBD(*)

3.85V

BU3J

TBD(*)

3.9V

TBD(*)

3.95V

BU3K

TBD(*)

4.0V

(*)Under development

BU38

BU39

BU40

●Absolute Maximum Ratings (Ta=25°C)

PARAMETER

Symbol

Limit

Unit

VMAX

Pd

Power Supply Voltage

-0.3 ～ +6.0

560(*1)

V

mW

℃

Power Dissipation

Maximum junction temperature

Operating Temperature Range

Storage Temperature Range

TjMAX

Topr

+125

-40 ～ +85

-55 ～ +125

℃

Tstg

℃

(*1)Pd deleted at 5.6mW/℃at temperatures above Ta=25℃, mounted on 70×70×1.6 mm glass-epoxy PCB.

● RECOMMENDED OPERATING RANGE (not to exceed Pd)

PARAMETER

Symbol

VIN

Limit

Unit

V

Power Supply Voltage

1.7～5.5

Maximum Output Current

IMAX

300

mA

●OPERATING CONDITIONS

PARAMETER

Symbol

Cin

MIN.

TYP.

1.0

MAX.

Unit

μF

CONDITION

Input Capacitor

Output Capacitor

0.47(*2)

-

Ceramic capacitor recommended

Co

1.0

μF

(*2)Make sure that the output capacitor value is not kept lower than this specified level across a variety of

temperature, DC bias, changing as time progresses characteristic.

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Datasheet

BUxxUA3WNVX series

●Electrical Characteristics

(Ta=25℃, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=1.0μF, Co=1.0μF, unless otherwise noted.)

Limit

PARAMETER

Symbol

VOUT1

Unit

Conditions

MIN.

TYP.

MAX.

Overall Device

VOUT×0.99

VOUT×1.01

VOUT+25mV

90

IOUT=10μA，VOUT≧2.5V

Output Voltage 1

V

VOUT

VOUT-25mV

IOUT=10μA，VOUT＜2.5V

IOUT=0mA

Operating Current

IIN

-

50

-

μA

Operating Current (STBY)

ISTBY

1.0

STBY=0V

Ripple Rejection Ratio

RR

45

-

70

-

dB

mV

VRR=-20dBv,fRR=1kHz,IOUT=10mA, VIN=3.6V

1.0V≦VOUT＜1.2V(IOUT=300mA)

1.2V≦VOUT＜1.5V(IOUT=300mA)

1.5V≦VOUT＜1.7V(IOUT=300mA)

1.7V≦VOUT＜2.1V(IOUT=300mA)

2.1V≦VOUT＜2.5V(IOUT=300mA)

2.5V≦VOUT(IOUT=300mA)

470

350

280

250

220

200

700

500

380

320

260

220

-

Dropout Voltage

VSAT

-

Line Regulation

Load Regulation

VDL

-

2

20

45

mV

VIN=VOUT+1.0V to 5.5V(*4), IOUT=10μA

IOUT=0.01mA to 300mA

VDLO

25

Over-current Protection (OCP)

Limit Current

ILMAX

305

50

550

150

-

mA

Vo=VOUT*0.95

Vo=0V

Short Current

ISHORT

300

Standby Block

Discharge Resistor

STBY Pin Pull-down Current

RDSC

ISTB

20

0.1

1.2

-0.3

50

0.9

-

80

Ω

μA

V

VIN=5.5V, STBY=0V, VOUT=2.6V

STBY=1.5V

8.0

5.5

0.3

ON

STBY Control Voltage

OFF

VSTBH

VSTBL

-

V

VIN=2.375V to 2.625V

Output Voltage 2

VOUT2

1.7

1.8

1.9

V

VOUT=1.8V, IOUT=0.01mAto300mA, Ta=-40～85℃

●This product is not designed for protection against radioactive rays.

(*3) VIN=2.5V for VOUT≦1.5V

(*4) VIN=2.5V to 5.5V for VOUT≦1.5V

●Block Diagrams

VIN

4

VREF

VOUT

Cin

1

2

3

OCP

TSD

GND

Co

STBY

Discharge

STBY

Cin･･･1.0μF (Ceramic)

Co ･･･1.0μF (Ceramic)

Fig. 2 Block Diagrams

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Datasheet

BUxxUA3WNVX series

z Reference data BU18UA3WNVX (Ta=25ºC unless otherwise specified.)

LINEꢀREGULATION

1.90

1.88

1.86

1.84

1.82

1.80

1.78

1.76

1.74

1.72

1.70

1.90

1.88

1.86

1.84

1.82

1.80

1.78

1.76

1.74

1.72

1.70

Vout=1.8V

Iout=10mA

Vout=1.8V

Iout=300mA

85℃

25℃

-40℃

85℃

25℃

-40℃

2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6

VIN[V]

2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6

VIN[V]

Fig. 3

Fig. 4

LOAD REGULATION

Vout=1.8V

OUTPUT VOLTAGE vs TEMPERATURE

Vout=1.8V

1.90

1.88

1.86

1.84

1.82

1.80

1.78

1.76

1.74

1.72

1.70

1.90

1.88

1.86

1.84

1.82

1.80

1.78

1.76

1.74

1.72

1.70

10mA

85℃

25℃

-40℃

150mA

300mA

0

50

100

150

200

250

300

-40

-20

0

20

Temperature[℃]

40

60

80

IOUT[mA]

Fig. 5

Fig. 6

GROUND PIN CURRENT vs INPUT VOLTAGE

Vout=1.8V

GROUND PIN CURRENT vs LOAD

70

65

60

55

50

45

40

35

30

25

20

15

10

5

450

400

350

300

250

200

150

100

50

Vout=1.8V

85℃

25℃

-40℃

25℃

-40℃

0

50

100

150

200

250

300

2.3

2.5

2.7

2.9

3.1

3.3

3.5

IOUT[mA]

VIN[V]

Fig. 7

Fig. 8

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Datasheet

BUxxUA3WNVX series

z Reference data BU18UA3WNVX (Ta=25ºC unless otherwise specified.)

GROUND PIN CURRENT vs TEMPERATURE

Vout=1.8V

SHUTDOWN CURRENT vs INPUT VOLTAGE

70

60

50

40

30

20

10

0

100

90

80

70

60

50

40

30

20

10

0

Vout=1.8V

85℃

25℃

-40℃

2.3

2.5

2.7

2.9

3.1

3.3

3.5

-40

-20

0

20

40

60

80

Temperature[℃]

VIN[V]

Fig. 9

Fig. 10

POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY

CURRENT LIMIT vs INPUT VOLTAGE

700

600

500

400

300

200

100

0

100

90

80

70

60

50

40

30

20

10

0

Vout=1.8V

10mA

150mA

85℃

25℃

-40℃

10

100

1000

10000

100000

1000000

2.3

2.5

2.7

2.9

3.1

3.3

3.5

Frequency[Hz]

VIN[V]

Fig. 11

Fig. 12

LOAD TRANSIENT RESPONSE

Trise=Tfall=1us

200mA

0mA

10mA

IOUT

0mA

VOUT

Vout=1.8V

10µs/div

Fig. 13

Fig. 14

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Datasheet

BUxxUA3WNVX series

z Reference data BU18UA3WNVX (Ta=25ºC unless otherwise specified.)

LOAD TRANSIENT RESPONSE

300mA

Trise=Tfall=1us

50mA

IOUT

0mA

VOUT

Vout=1.8V

10µs/div

Fig. 15

Fig. 16

LINE TRANSIENT RESPONSE

Slew Rate = 0.5V/µs

2.9V

VIN

2.3V

VOUT

Vout=1.8V

Iout=1mA

Vout=1.8V

Iout=300mA

1ms/div

Fig. 17

Fig. 18

LINE TRANSIENT RESPONSE

VIN RAMP UP, RAMP DOWN RESPONSE

Slew Rate = 0.5V/µs

Vout=1.8V

Iout=1mA

3.6V

VIN

2.1V

VOUT

Vout=1.8V

Iout=300mA

1ms/div

200ms/div

Fig. 20

Fig. 19

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Datasheet

BUxxUA3WNVX series

z Reference data BU18UA3WNVX (Ta=25ºC unless otherwise specified.)

START UP TIME

DISCHARGE TIME

1.5V

0V

STBY

0V

STBY

VOUT

Vout=1.8V

Iout=0mA

Cout=1.0uF

Vout=1.8V

Iout=0mA

Cout=1.0uF

40µs/div

20µs/div

Fig. 21

Fig. 22

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Datasheet

BUxxUA3WNVX series

z About power dissipation (Pd)

As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of

IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the

implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is

recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the

original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability.

Therefore, be sure to prepare sufficient margin within power dissipation for usage.

Calculation of the maximum internal power consumption of IC (PMAX)

PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)

{ Measurement conditions

Standard ROHM Board

Top Layer (Top View)

Bottom Layer (Top View)

Evaluation Board 1

Layout of Board for

Measurement

Top Layer (Top View)

IC

Implementation

Position

Bottom Layer (Top View)

Measurement State

Board Material

Board Size

With board implemented (Wind speed 0 m/s) With board implemented (Wind speed 0 m/s)

Glass epoxy resin (Double-side board)

70 mm x 70 mm x 1.6 mm

Glass epoxy resin (Double-side board)

40 mm x 40 mm x 1.6 mm

Top layer

Wiring

Metal (GND) wiring rate: Approx. 0%

Metal (GND) wiring rate: Approx. 50%

Bottom

Rate

Metal (GND) wiring rate: Approx. 50%

layer

Through Hole

Diameter 0.5mm x 6 holes

0.56W

Diameter 0.5mm x 25 holes

0.39W

Power Dissipation

Thermal Resistance

θja=178.6°C/W

θja=256.4°C/W

0.6

0.56W

0.5

0.4

0.39W

0.3

0.2

0.1

0

* Please design the margin so that

PMAX becomes is than Pd (PMAX<Pd)

within the usage temperature range

0

25

50

75

100

125

85

Ta [

]

℃

Fig. 23 SSON004X1010 Power dissipation heat reduction characteristics (Reference)

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Datasheet

BUxxUA3WNVX series

●Operation Notes

1.) Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in

damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage

issuffered. Ifoperationalvaluesareexpectedtoexceedthemaximumratingsforthedevice, consideraddingprotectivecircuitry

(such as fuses) to eliminate the risk of damaging the IC.

2.) GND potential

The potential of the GND pin must be the minimum potential in the system in all operating conditions.

Never connect a potential lower than GND to any pin, even if only transiently.

3.) Thermal design

Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating

conditions.

4.) Inter-pin shorts and mounting errors

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or

shorts between pins may result in damage to the IC.

5.) Operation in strong electromagnetic fields

Strong electromagnetic fields may cause the IC to malfunction. Caution should be exercised in applications where strong

electromagnetic fields may be present.

6.) Common impedance

Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should

be use to keep ripple to a minimum.

7.) Voltage of STBY pin

To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting

STBY to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and

low (or vice versa) to a minimum.

Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing

a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may

occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged

before turning the IC on.

8.) Over-current protection circuit (OCP)

This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when

the output is shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output

shorts) and is not designed to be used as an active security device for the application. Therefore, applications should not

be designed under the assumption that this circuitry will engage.

9.) Thermal shutdown circuit (TSD)

This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the

IC exceeds about 150℃. This feature is intended to protect the IC only in the event of thermal overload and is not designed

to guarantee operation or act as an active security device for the application. Therefore, applications should not be designed

under the assumption that this circuitry will engage.

10.) Input/output capacitor

Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as

closetotheICpinsaspossible(refertofigure4). Theinputcapacitorhelpstocounteractincreasesinpowersupplyimpedance,

and increases stability in applications with long or winding power supply traces. The output capacitance value is directly

Unstable region

related to the overall stability and transient response of the regulator, and should be set to the largest possible value for

the application to increase these characteristics. During design, keep in mind that in general, ceramic capacitors have a wide

range of tolerances, temperature coefficients and DC bias characteristics, and that their capacitance values tend to decrease

over time. Confirm these details before choosing appropriate capacitors for your application.(Please refer the technical note,

regarding ceramic capacitor of recommendation)

11.) About the equivalent series resistance (ESR) of a ceramic capacitor

Capacitors generally have ESR (equivalent series resistance)

and it operates stably in the ESR-IOUT area shown on the right.

Since ceramic capacitors, tantalum capacitors, electrolytic

capacitors, etc. generally have different ESR, please check

the ESR of the capacitor to be used and use it within the

stability area range shown in the right graph for evaluation

of the actual application.

Cout=1.0uF Cin=1.0uF Temp=25℃

100

10

1

Unstable

0.1

Stable

0.01

0

100

200

300

400

IOUT[mA]

Fig. 24 Stable region (example)

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Datasheet

BUxxUA3WNVX series

●Revision History

Date

Revision

Changes

31.Jan.2013

20.Feb.2013

001

002

New Release

Package size is changed.

Adding a revision history

Adding a lineup

21.Mar.2013

003

The condition of drop voltage is changed.

The range of SHUTDOWN CURRENT vs INPUT VOLTAGE is changed.

The minimum value of Limit Current is changed.

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Daattaasshheeeett

Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Notice - Rev.004

Daattaasshheeeett

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2) You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Property Rights

1) All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Notice - Rev.004

Daattaasshheeeett

●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - Rev.004


型号：	BU19UA3WNVX-TL
厂家：	ROHM
描述：	Versatile Package FULL CMOS LDO Regulator 多功能包全CMOS LDO稳压器稳压器
文件：	总14页 (文件大小：682K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BU19UA3WNVX-TL [ROHM]

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