BR34E02FVT-W_09 [ROHM]

DDR/DDR2 (For memory module) SPD Memory; DDR / DDR2 (对于内存模块)内存SPD
BR34E02FVT-W_09
型号: BR34E02FVT-W_09
厂家: ROHM    ROHM
描述:

DDR/DDR2 (For memory module) SPD Memory
DDR / DDR2 (对于内存模块)内存SPD

光电二极管 双倍数据速率
文件: 总19页 (文件大小:447K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Memory for Plug & Play  
DDR/DDR2  
(For memory module) SPD Memory  
BR34E02FVT-W, BR34E02NUX-W  
No.09002EAT03  
Description  
BR34E02FVT-W is 256×8 bit Electrically Erasable PROM (Based on Serial Presence Detect)  
Features  
1) 256×8 bit architecture serial EEPROM  
2) Wide operating voltage range: 1.7V-3.6V  
3) Two-wire serial interface  
4) High reliability connection using Au pads and Au wires  
5) Self-Timed Erase and Write Cycle  
6) Page Write Function (16byte)  
7) Write Protect Mode  
Settable Reversible Write Protect Function: 00h-7Fh  
Write Protect 1 (Onetime Rom)  
Write Protect 2 (Hardwire WP PIN)  
: 00h-7Fh  
: 00h-FFh  
8) Low Power consumption  
Write (at 1.7V ) :  
Read (at 1.7V ) :  
Standby ( at 1.7V ) :  
9) DATA security  
0.4mA (typ.)  
0.1mA(typ.)  
0.1µA(typ.)  
Write protect feature (WP pin)  
Inhibit to WRITE at low VCC  
10)Compact package: TSSOP-B8, VSON008X2030  
11)High reliability fine pattern CMOS technology  
12)Rewriting possible up to 1,000,000 times  
13)Data retention: 40 years  
14)Noise reduction Filtered inputs in SCL / SDA  
15)Initial data FFh at all addresses  
BR34E02-W Series  
Capacity  
2Kbit  
Bit format  
256X8  
Type  
BR34E02-W  
Power Source Voltage  
TSSOP-B8  
VSON008X2030  
1.7V3.6V  
Absolute Maximum Ratings (Ta=25)  
Parameter  
Symbol  
VCC  
Rating  
Unit  
V
Supply Voltage  
-0.3+6.5  
330(BR34E02FVT-W)  
300(BR34E02NUX-W)  
-65+125  
*1  
*2  
Power Dissipation  
Pd  
mW  
Storage Temperature  
Operating Temperature  
Terminal Voltage (A0)  
Tstg  
Topr  
-
-
V
-40+85  
-0.310.0  
-0.3VCC+0.3  
Terminal Voltage (etcetera)  
V
* Reduce by 3.3mW(*1), 3.0 mW(*2)/C over 25C  
Recommended operating conditions  
Parameter  
Symbol  
VCC  
IN  
Rating  
1.73.6  
0VCC  
Unit  
V
V
Supply Voltage  
Input Voltage  
www.rohm.com  
2009.04 - Rev.A  
1/18  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
Memory cell characteristics(Ta=25, VCC=1.7V3.6V)  
Specification  
Parameter  
Unit  
Min.  
1,000,000  
40  
Typ.  
-
-
Max.  
-
-
*1  
*1  
Write / Erase Cycle  
Data Retention  
Cycles  
Years  
*1:Not 100% TESTED  
Electrical characteristics - DC(Unless otherwise specified Ta=-40℃~+85, VCC=1.7V3.6V)  
Specification  
Parameter  
Symbol  
Unit  
Test Condition  
Min.  
Typ.  
Max.  
Vcc+0.3  
0.3 VCC  
0.4  
"H" Input Voltage  
"L" Input Voltage  
VIH1  
VIL1  
VOL1  
VOL2  
ILI1  
ILI2  
ILI3  
ILO  
0.7 VCC  
-
-
-
-
-
-
-
-
V
V
V
V
-
-0.3  
-
-1  
-1  
-1  
-1  
"L" Output Voltage 1  
"L" Output Voltage 2  
Input Leakage Current 1  
Input Leakage Current 2  
Input Leakage Current 3  
Output Leakage Current  
IOL=2.1mA2.5VVCC3.6V(SDA)  
IOL=0.7mA1.7VVCC2.5V(SDA)  
0.2  
1
15  
20  
µA VIN=0VVCC(A0,A1,A2,SCL)  
µA VIN=0VVCC(WP)  
µA VIN=VHV(A0)  
1
µA VOUT=0VVCC  
VCC=1.7V,fSCL=100kHztWR=5ms  
Byte Write  
Page Write  
Write Protect  
VCC =3.6V,fSCL=100kHz, tWR=5ms  
Byte Write  
Page Write  
Write Protect  
VCC =3.6V,fSCL=100kHz  
ICC1  
ICC2  
ICC3  
-
-
-
-
-
-
1.0  
3.0  
0.5  
mA  
Operating Current  
mA  
Random Read  
Current Read  
mA  
Sequential Read  
VCC =3.6V,SDA,SCL= VCC  
A0,A1,A2=GND,WP=GND  
VHV-Vcc4.8V  
Standby Current  
A0 HV Voltage  
ISB  
-
-
-
2.0  
10  
µA  
VHV  
7
V
Note: This IC is not designed to be radiation-resistant.  
lectrical characteristics - AC(Unless otherwise specified Ta=-40℃~+85, VCC =1.7V3.6V)  
FAST-MODE  
2.5VVCC5.5V  
STANDARD-MODE  
1.7VVCC5.5V  
Parameter  
Symbol  
Unit  
Min.  
Typ.  
Max.  
Min.  
Typ.  
Max.  
Clock Frequency  
fSCL  
tHIGH  
tLOW  
tR  
-
0.6  
1.2  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
400  
-
-
0.3  
0.3  
-
-
-
-
4.0  
4.7  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
100  
-
-
1.0  
0.3  
-
-
-
kHz  
µs  
µs  
µs  
µs  
µs  
µs  
ns  
ns  
µs  
µs  
µs  
µs  
ms  
Data Clock High Period  
Data Clock Low Period  
SDA and SCL Rise Time  
SDA and SCL Fall Time  
Start Condition Hold Time  
Start Condition Setup Time  
Input Data Hold Time  
Input Data Setup Time  
Output Data Delay Time  
Output Data Hold Time  
Stop Condition Setup Time  
Bus Free Time  
*1  
*1  
tF  
-
-
tHD:STA  
tSU:STA  
tHD:DAT  
tSU:DAT  
tPD  
tDH  
tSU:STO  
tBUF  
0.6  
0.6  
0
100  
0.1  
0.1  
0.6  
1.2  
-
4.0  
4.7  
0
250  
0.1  
0.1  
4.0  
4.7  
-
-
-
0.9  
-
-
-
5
3.5  
-
-
-
5
Write Cycle Time  
tWR  
Noise Spike Width (SDA  
and SCL)  
tI  
-
-
0.1  
-
-
0.1  
µs  
WP Hold Time  
WP Setup Time  
WP High Period  
tHDWP  
tSUWP  
tHIGHWP  
0
0.1  
1.0  
-
-
-
-
-
-
0
0.1  
1.0  
-
-
-
-
-
-
ns  
µs  
µs  
*1Not 100TESTED  
www.rohm.com  
2009.04 - Rev.A  
2/18  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
Fast / Standard Modes  
Fast mode and Standard mode differ only in operation frequency. Operations performed at 100kHz are considered in  
"Standard-mode", while those conducted at 400kHz are in "Fast-mode".  
Please note that these clock frequencies are maximum values. At lower power supply voltage it is difficult to operate at high speeds.  
The EEPROM can operate at 400kHz, between 2.5V and 3.6V, and at 100kHz from 1.7V-2.5V.  
Synchronous Data Timing  
tR  
tF  
tHIGH  
SCL  
SCL  
SDA  
tSU:DAT  
tLOW  
tPD  
tHD:STA  
tBUF  
tHD:DAT  
tSU:STA  
tHD:STA  
tSU:STO  
SDA  
(IN)  
tDH  
SDA  
(OUT)  
START BIT  
STOP BIT  
Fig.1-(b) Start/Stop Bit Timing  
Fig.1-(a) Synchronous Data Timing  
SDA data is latched into the chip at the rising edge ○  
of SCL clock.  
Output data toggles at the falling edge of SCL clock.  
SCL  
SCL  
SDA  
DATA(1)  
D1 D0 ACK  
DATA(n)  
ACK  
SDA  
WP  
WR  
D0  
ACK  
Stop Condition  
tWR  
WRITE DATA(n)  
STOP CONDITION  
START CONDITION  
tSUWP  
HDWP  
Fig.1-(d) WP Timing Of The Write Operation  
Fig.1-(c) Write Cycle Timing  
SCL  
SDA  
WP  
DATA(n)  
DATA(1)  
D1 D0 ACK  
ACK  
tHIGH:WP  
tWR  
Fig.1-(e) WP Timing Of The Write Cancel Operation  
For WRITE operation, WP must be "Low" from the rising edge of the  
clock (which takes in D0 of first byte) until the end of tWR. (See  
Fig.1-(d) ) During this period, WRITE operation can be canceled by  
setting WP "High".See Fig.1-(e))  
When WP is set to "High" during tWR, WRITE operation is  
immediately ceased, making the data unreliable. It must then be  
re-written.  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.04 - Rev.A  
3/18  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
Block diagram  
PROTECT_MEMORY_ARRY  
2Kbit_MEMORY_ARRY  
A0 1  
8 VCC  
7 WP  
6 SCL  
5 SDA  
8bit  
8bit  
ADDRESS  
DECODER  
SLAVE , WORD  
DATA  
REGISTE  
A1 2  
A2 3  
8bit  
ADDRESS  
START  
STOP  
CONTOROL LOGIC  
ACK  
HIGH VOLTAGE  
VCC LEVEL  
GND 4  
Fig.2 Blo  
Pinout diagram and description  
Pin Name  
Input/Output  
Functions  
VCC  
GND  
-
Power Supply  
Ground 0V  
A0 1  
8 VCC  
7 WP  
6 SCL  
5 SDA  
-
A0,A1,A2  
SCL  
IN  
IN  
Slave Address Set.  
Serial Clock Input  
A1 2  
BR34E02FVT-W  
BR34E02NUX-W  
A2 3  
*1  
Slave and Word Address,  
SDA  
IN / OUT  
Serial Data Input, Serial Data Output  
GND 4  
*2  
WP  
IN  
Write Protect Input  
*1 Open drain output requires a pull-up resistor.  
*2 WP Pin has a Pull-Down resistor. Please leave unconnected or  
connect to GND when not in use.  
Fig.3 Pin Configuration  
Electrical characteristics curves  
The following characteristic data are typ. value.  
6
5
4
3
2
1
0
1
0.8  
0.6  
0.4  
0.2  
0
SPEC  
Ta=85℃  
Ta=-40℃  
Ta=25℃  
SPEC  
Ta=85℃  
Ta=85℃  
Ta=-40℃  
Ta=25℃  
Ta=25℃  
SPEC  
Ta=-40℃  
0
1
2
3
4
0
1
2
3
4
VCC[V]  
IOL1[mA]  
Fig.5 "L" Input Voltage VIL  
Fig.4 "H" Input Voltage VIH  
(A0,A1,A2,SCL,SDA,WP)  
Fig.6 "L" Output Voltage VOL1-IOL1  
(VCC=2.5V)  
(A0,A1,A2,SCL,SDA,WP)  
1
0.8  
0.6  
1.2  
1
16  
SPEC  
SPEC  
12  
0.8  
0.6  
0.4  
0.2  
0
8
Ta=85℃  
0.4  
Ta=25℃  
SPEC  
Ta=85℃  
Ta=25℃  
Ta=-40℃  
4
0.2  
0
Ta=85℃  
Ta=25℃  
Ta=-40℃  
Ta=-40℃  
0
0
1
2
3
4
0
1
2
3
4
0
1
2
3
4
IOL2[mA]  
VCC[V]  
VCC[V]  
Fig.7 "L" Output Voltage VOL2-IOL2  
(VCC=1.7V)  
Fig.9 Input Leakage Current ILI2  
(WP)  
Fig.8 Input Leakage Current ILI1  
(A0,A1,A2,SCL,SDA)  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.04 - Rev.A  
4/18  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
3.5  
2.5  
2
SPEC1  
SPEC  
SPEC  
3
2.5  
SCL=400kHz(VCC2.5V)  
fSCL=100kHz(1.7VVcc<2.5V)  
fSCL=100kHz  
DATA=AAh  
1.5  
1
2
1.5  
1
DATA=AA  
Ta=85℃  
SPEC2  
Ta=25℃  
Ta=25℃  
Ta=85℃  
Ta=-40℃  
0.5  
0
Ta=85℃  
Ta=25℃  
Ta=-40℃  
0.5  
0
Ta=40℃  
0
1
2
3
4
0
1
2
3
4
0
1
2
3
4
VCC[V]  
VCC[V]  
VCC[V]  
Fig.11 Read Operating Current ICC3  
(fSCL=400kHz)  
Fig.12 Standby Current ISB  
Fig.10 Write Operating Current ICC1,2  
(fSCL=100kHz,400kHz)  
5
10000  
5
4
3
2
1
0
Ta=85℃  
Ta=25℃  
SPEC2  
SPEC2  
Ta=-40℃  
4
1000  
3
SPEC1  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
100  
SPEC2  
2
Ta=85℃  
Ta=-40℃  
Ta=25℃  
Ta=25℃  
Ta=-40℃  
SPEC1  
10  
1
0
Ta=85℃  
SPEC1  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
1
0
1
2
3
4
0
1
2
3
4
0
1
2
3
4
VCC[V]  
VCC[V]  
VCC[V]  
Fig.15 Data Clock Low Period tLow  
Fig.13 Clock Frequency fSCL  
Fig.14 Data Clock High Period tHigh  
5
50  
5
SPEC2  
SPEC1,2  
SPEC2  
4
4
0
=85℃  
Ta=25℃  
Ta=-40℃  
3
3
-50  
-100  
-150  
-200  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
2
2
Ta=-40℃  
Ta=25℃  
Ta=85℃  
Ta=-40℃  
Ta=25℃  
Ta=85℃  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
1
0
1
SPEC1  
SPEC1  
0
0
1
2
3
4
0
1
2
3
4
0
1
2
3
4
VCC[V]  
VCC[V]  
VCC[V]  
Fig.16 Start Condition Hold Time  
tHD:STA  
Fig.17 Start Condition Setup Time  
tSU:STA  
FiagmDag.18 ck DiTarata  
HoldimtHD:DAT(High)  
300  
300  
50  
SPEC2  
SPEC2  
SPEC1  
200  
200  
100  
0
0
-50  
SPEC1,2  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
100  
Ta=85℃  
SPEC1  
Ta=25℃  
Ta=-40℃  
Ta=85℃  
-100  
-150  
-200  
0
Ta=85℃  
Ta=25℃  
-100  
-200  
Ta=-40℃  
-100  
-200  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
Ta=25℃  
Ta=-40℃  
0
1
2
3
4
0
1
2
3
4
0
1
2
3
4
VCC[V]  
VCC[V]  
VCC[V]  
Fig.19 Data Hold Time  
tHD:DAT(LOW)  
Fig.20 Input Data Setup Time  
tSU:DAT(HIGH)  
Fig.21 Input Data Setup Time  
tSU:DAT(LOW)  
www.rohm.com  
2009.04 - Rev.A  
5/18  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
4
3
2
1
0
4
5
4
3
2
1
0
SPEC2  
SPEC2  
3
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
2
Ta=85℃  
Ta=25℃  
Ta=-40℃  
Ta=85℃  
SPEC1  
Ta=85℃  
Ta=25℃  
Ta=-40  
SPEC2  
Ta=25℃  
Ta=-40℃  
SPEC1  
2
1
0
SPEC2  
SPEC1  
1
SPEC1  
1
0
1
3
4
0
2
3
4
0
2
3
4
VCC[V]  
VCC[V]  
VCC[V]  
Fig.23 Output Data Hold Time  
tDH  
Fig.24 Stop Condition Setup Time  
tSU:STO  
Fig.22 Output Data Delay Time  
tPD  
0.6  
5
6
SPEC1:FAST-MODE  
SPEC2  
SPEC2:STANDARD-MODE  
SPEC1,2  
0.5  
5
4
Ta=-40℃  
0.4  
4
Ta=-40℃  
Ta=25℃  
Ta=25℃  
3
0.3  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
3
Ta=85℃  
Ta=85℃  
2
0.2  
2
Ta=85℃  
SPEC1,2  
1
0
SPEC1  
2
0.1  
Ta=25℃  
Ta=-40℃  
1
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
0
0
0
1
2
3
4
0
1
3
4
0
1
2
3
4
VCC[V]  
VCC[V]  
VCC[V]  
Fig.27 Noise Spike Width  
tI(SCL H)  
Fig.25 Bus Free Time  
tBUF  
Fig.26 Write Cycle Time  
tWR  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
Ta=-40℃  
Ta=25℃  
Ta=-40℃  
Ta=25℃  
Ta=-40℃  
Ta=85℃  
Ta=85℃  
Ta=25℃  
Ta=85℃  
SPEC1,2  
SPEC1,2  
SPEC1,2  
3
0
1
2
3
4
0
1
2
4
0
1
2
3
4
VCC[V]  
VCC[V]  
VCC[V]  
Fig.28 Noise Spike Width  
tI(SCL L)  
Fig.29 Noise Spike Width  
tI(SDA H)  
Fig.30 Noise Spike Width  
tI(SDA L)  
1.2  
1
0.2  
SPEC1,2  
SPEC1,2  
0
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
0.8  
0.6  
0.4  
0.2  
0
SPEC1:FAST-MODE  
SPEC2:STANDARD-MODE  
-0.2  
Ta=25℃  
Ta=85℃  
-0.4  
Ta=-40℃  
Ta=25℃  
Ta=85℃  
Ta=-40℃  
-0.6  
0
1
2
3
4
0
1
2
3
4
VCC[V]  
VCC[V]  
Fig.32 WP High Period  
tHigh:WP  
Fig.31 WP Setup Time  
tSU:WP  
www.rohm.com  
2009.04 - Rev.A  
6/18  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
Data transfer on the I2C BUS  
Data transfer on the I2C BUS  
The BUS is considered to be busy after the START condition and free a certain time after the STOP condition.  
Every SDA byte must be 8-bits long and requires an ACKNOWLEDGE signal after each byte. The devices have Master  
and Slave configurations. The Master device initiates and ends data transfer on the BUS and generates the clock signals  
in order to permit transfer.  
The EEPROM in a slave configuration is controlled by a unique address. Devices transmitting data are referred to as the  
Transmitter. The devices receiving the data are called Receiver.  
START Condition (Recognition of the START bit)  
All commands are proceeded by the start condition, which is a High to Low transition of SDA when SCL is High.  
The device continuously monitors the SDA and SCL lines for the start condition and will not respond to any command  
until this condition has been met. (See Fig.1-(b) START/STOP Bit Timing)  
STOP Condition (Recognition of STOP bit)  
All communications must be terminated by a stop condition, which is a Low to High transition of SDA when SCL is High.  
(See Fig.1-(b) START/STOP Bit Timing)  
Write Protect By Soft Ware  
Set Write Protect command and permanent set Write Protect command set data of 00h7Fh in 256 words write  
protection block. Clear Write Protect command can cancel write protection block which is set by set write Protect  
command. Cancel of write protection block which is set by permanent set Write Protect command at once is  
impossibility. When these commands are carried out, WP pin must be OPEN or GND.  
Acknowledge  
Acknowledge is a software used to indicate successful data transfers. The Transmitter device will release the BUS after  
transmitting eight bits. When inputting the slave address during write or read operation, the Transmitter is the µ-COM.  
When outputting the data during read operation, the Transmitter is the EEPROM.  
During the ninth clock cycle the Receiver will pull the SDA line Low to verify that the eight bits of data have been  
received. (When inputting the slave address during write or read operation, EEPROM is the receiver. When outputting  
the data during read operation the receiver is the µ-COM.)  
The device will respond with an Acknowledge after recognition of a START condition and its slave address (8bit).  
In WRITE mode, the device will respond with an Acknowledge after the receipt of each subsequent 8-bit word (word  
address and write data).  
In READ mode, the device will transmit eight bits of data, release the SDA line, and monitor the line for an Acknowledge.  
If an Acknowledge is detected and no STOP condition is generated by the Master, the device will continue to transmit  
the data. If an Acknowledge is not detected, the device will terminate further data transmissions and await a STOP  
condition before returning to standby mode.  
Device Addressing  
Following a START condition, the Master outputs the Slave address to be accessed. The most significant four bits of the  
slave address are the “device type indentifier.” For this EEPROM it is “1010.  
” (For WP register access this code is "0110".)  
The next three bits identify the specified device on the BUS (device address).  
The device address is defined by the state of the A0,A1 and A2 input pins. This IC works only when the device address  
input from the SDA pin corresponds to the status of the A0,A1 and A2 input pins. Using this address scheme allows up  
to eight devices to be connected to the BUS.  
The last bit of the stream (R/WREAD/WRITE) determines the operation to be performed.  
R/W=0 ・・・・  
R/W=1 ・・・・  
WRITE (including word address input of Random Read)  
READ  
Read Write  
Slave Address Set Pin Device Type Device Address  
Access Area  
2kbit Access to Memory  
Mode  
A2  
A2  
A1  
A1  
A0  
A0  
1010  
0110  
A2 A1 A0  
A2 A1 A0  
R/W  
Access to Permanent Set Write Protect Memory  
Access to Set Write Protect Memroy  
R/W  
GND  
GND  
GND VHV  
Vcc VHV  
0
0
0
1
1
1
R/W  
Access to Clear Write Protect MEmory  
R/W  
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2009.04 - Rev.A  
7/18  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
WRITE PROTECT PIN(WP)  
When WP pin set to Vcc (H level), write protect is set for 256 words (all address). When WP pin set to GND (L level),  
it is enable to write 256 words (all address).  
If permanent protection is done by Write Protect command, lower half area (007Fh address) is inhibited writing  
regardless of WP pin state.  
WP pin has a Pull-Down resistor. Please be left unconnected or connect to GND when WP feature is not in use.  
Confirm Write Protect Resistor by ACK  
According to state of Write Protect Resistor, ACK is as follows.  
State of Write  
Protect Registor  
Write  
Cycle(tWR)  
No  
WP Input  
-
Input Command  
ACK  
Address  
-
ACK  
No ACK  
ACK  
Data  
ACK  
PSWP, SWP, CWP No ACK  
Page or Byte Write  
No ACK  
In case,  
protect by PSWP  
ACK  
WA7WA0  
D7D0 No ACK  
No  
(007Fh)  
SWP  
CWP  
PSWP  
No ACK  
ACK  
ACK  
-
-
-
No ACK  
ACK  
ACK  
-
-
-
No ACK  
ACK  
ACK  
No  
Yes  
Yes  
0
1
Page or Byte Write  
(007Fh)  
ACK  
WA7WA0  
ACK  
D7D0 No ACK  
No  
In case,  
protect by SWP  
SWP  
CSP  
PSWP  
No ACK  
ACK  
ACK  
ACK  
ACK  
ACK  
ACK  
ACK  
-
-
-
No ACK  
ACK  
ACK  
ACK  
ACK  
ACK  
ACK  
ACK  
-
-
-
No ACK  
No ACK  
No ACK  
No  
No  
No  
Page or Byte Write  
PSWP, SWP, CWP  
Page or Byte Write  
PSWP, SWP, CWP  
Page or Byte Write  
WA7WA0  
D7D0 No ACK  
No  
-
-
ACK  
ACK  
Yes  
Yes  
No  
0
1
WA7WA0  
-
WA7WA0  
D7D0  
In case,  
Not protect  
-
No ACK  
D7D0 No ACK  
No  
*- is Don’t Care  
State of Write Protect Registor  
In case, protect by PSWP  
Command  
PSWP, SWP, CWP  
SWP  
CWP  
PSWP  
PSWP, SWP, CWP  
ACK  
Address  
ACK  
No ACK  
No ACK  
No ACK  
No ACK  
No ACK  
Data  
ACK  
No ACK  
No ACK  
ACK  
ACK  
ACK  
-
-
-
-
-
-
-
-
-
-
No ACK  
No ACK  
No ACK  
No ACK  
No ACK  
In case, protect by SWP  
In case, Not protect  
Write Cycle  
During WRITE CYCLE operation data is written in the EEPROM. The Byte Write Cycle is used to write only one byte. In  
the case of writing continuous data consisting of more than one byte, Page Write is used. The maximum bytes that can  
be written at one time is 16 bytes.  
S
T
A
R
T
W
R
I
T
E
S
T
O
P
SLAVE  
ADDRESS  
WORD  
ADDRESS  
DATA  
SDA  
LINE  
WA  
7
WA  
0
1
0
1
0 A2A1A0  
D7  
D0  
A
C
K
A
C
K
R
/
W
A
C
K
Fig.33 Byte Write Cycle Timing  
S
T
A
R
T
W
R
I
T
E
S
T
O
SLAVE  
ADDRESS  
W ORD  
ADDRESS(n)  
DATA(n)  
DATA(n+15)  
P
SDA  
LINE  
W A  
7
W A  
0
1
0 1 0 A2A1A0  
D7  
D0  
D0  
A
C
K
R A  
A
C
K
A
C
K
/
C
W K  
Fig.34 Page Write Cycle Timing  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.04 - Rev.A  
8/18  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
With this command the data is programmed into the indicated word address.  
When the Master generates a STOP condition, the device begins the internal write cycle to the nonvolatile memory  
array.  
Once programming is started no commands are accepted for tWR (5ms max.).  
This device is capable of sixteen-byte Page Write operations.  
If the Master transmits more than sixteen words prior to generating the STOP condition, the address counter will “roll  
over” and the previously transmitted data will be overwritten.  
When two or more byte of data are input, the four low order address bits are internally incremented by one after the  
receipt of each word, while the four higher order bits of the address (WA7WA4) remain constant.  
Read Cycle  
During Read Cycle operation data is read from the EEPROM. The Read Cycle is composed of Random Read Cycle and  
Current Read Cycle. The Random Read Cycle reads the data in the indicated address.  
The Current Read Cycle reads the data in the internally indicated address and verifies the data immediately after the  
Write Operation. The Sequential Read operation can be performed with both Current Read and Random Read. With the  
Sequential Read Cycle it is possible to continuously read the next data.  
It is necessary to input  
“High” at last ACK timing.  
W
R
I
T
E
S
T
A
R
T
S
T
A
R
T
R
E
A
D
S
T
O
SLAVE  
ADDRESS  
SLAVE  
ADDRESS  
W ORD  
ADDRESS(n)  
DATA(n)  
P
SDA  
LINE  
W A  
7
W A  
0
1
0
1
0 A2A1A0  
1
0 1 0 A2A1A0  
D7  
D0  
A
C
K
R A  
/ C  
W K  
A
C
K
R A  
/
C
W K  
Fig.35 Random Read Cycle Timing  
S
T
A
R
T
S
T
O
R
E
A
D
SLAVE  
ADDRESS  
It is necessary to input  
“High” at last ACK timing.  
DATA  
P
SDA  
LINE  
1
0
1
0 A2A1A0  
D7  
D0  
A
C
K
R
/
W
A
C
K
Fig.36 Current Read Cycle Timing  
Random Read operation allows the Master to access any memory location indicated by word address.  
In cases where the previous operation is Random or Current Read (which includes Sequential Read), the internal  
address counter is increased by one from the last accessed address (n). Thus Current Read outputs the data of the  
next word address (n+1).  
If an Acknowledge is detected and no STOP condition is generated by the Master (µ-COM), the device will continue to  
transmit data. (It can transmit all data (2kbit 256word))  
If an Acknowledge is not detected, the device will terminate further data transmissions and await a STOP condition  
before returning to standby mode.  
If an Acknowledge is detected with the "Low" level (not "High" level), the command will become Sequential Read, and  
the next data will be transmitted. Therefore, the Read command is not terminated. In order to terminate Read input  
Acknowledge with "High" always, then input a STOP condition.  
S
T
A
R
T
R
E
A
D
S
T
O
P
It is necessary to  
input “High” at  
last ACK timing.  
SLAVE  
ADDRESS  
DATA(n)  
DATA(n+x)  
SDA  
LINE  
1
0
1
A2A1A0  
D7  
D0  
D7  
D0  
0
A
C
K
R A  
A
C
K
A
C
K
/
C
W K  
Fig.37 Sequential Read Cycle Timing With Current Read)  
www.rohm.com  
2009.04 - Rev.A  
9/18  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
Write Protect Cycle  
W
R
I
T
E
S
T
A
R
T
S
T
O
W ORD  
ADDRESS  
SLAVE  
ADDRESS  
DATA  
P
SDA  
LINE  
0
1
1
A2A1A0  
*
*
*
*
0
A
C
K
R A  
A
C
K
/
C
W P  
W K  
*:DON’T CARE  
Fig. 38 Permanent Write Protect Cycle  
Permanent set Write Protect command set data of 00h7Fh in 256 words write protection block. Clear Write Protect  
command can cancel write protection block which is set by set write Protect command. Cancel of write protection block  
which is set by permanent set Write Protect command at once is impossibility. When these commands are carried out,  
WP pin must be OPEN or GND.  
Permanent Set Write Protect command needs tWR from stop condition same as Byete Write and Page Write, During  
tWR, input command is canceled.  
Refer to P8/19 about reply of ACK in each protect state.  
W
R
I
T
E
S
T
A
R
T
S
T
O
W ORD  
ADDRESS  
SLAVE  
ADDRESS  
DATA  
P
SDA  
LINE  
0
1
1
0
0
0 1  
*
*
*
*
A
C
K
R A  
A
C
K
/
C
W P  
W K  
*:DON’T CARE  
Fig. 39 Set Write Protect Cycle  
Permanent set Write Protect command set data of 00h7Fh in 256 words write protection block. Clear Write Protect  
command can cancel write protection block which is set by set write Protect command. Cancel of write protection block  
which is set by permanent set Write Protect command at once is impossibility. When these commands are carried out,  
WP pin must be OPEN or GND.  
Permanent Set Protect command needs tWR from stop condition same as Byete Write and Page Write, During tWR,  
input command is canceled.  
Refer to P8/19 about reply of ACk in each protect state.  
W
R
I
T
E
S
T
A
R
T
S
T
O
W ORD  
ADDRESS  
SLAVE  
ADDRESS  
DATA  
P
SDA  
LINE  
0
1
1
0
0
1 1  
*
*
*
*
A
C
K
R A  
A
C
K
/
C
W P  
W K  
*:DON’T CARE  
Fig. 40 Clear Write Protect Cycle  
Clear Write Protect command can cancel write protection block which is set by set write Protect command. Cancel of  
write protection block which is set by permanent set Write Protect command at once is impossibility. When these  
commands are carried out, WP pin must be OPEN or GND.  
Permanent Clear Write Protect command needs tWR from stop condition same as Byete Write and Page Write, During  
tWR, input command is canceled.  
Refer to P8/19 about reply of ACk in each protect state.  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.04 - Rev.A  
10/18  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
Software Reset  
Execute software reset in the event that the device is in an unexpected state after power up and/or the command input  
needs to be reset. Below are three types(Fig.39 –(a), (b), (c)) of software reset:  
During dummy clock, release the SDA BUS (tied to VCC by a pull-up resistor). During this time the device may pull the SDA  
line Low for Acknowledge or the outputting of read data.If the Master sets the SDA line to High, it will conflict with the device  
output Low, which can cause current overload and result in instantaneous power down, which may damage the device.  
DUMMY CLOCK×14  
13  
START×2  
COMMAND  
COMMAND  
2
14  
1
SCL  
SDA  
Fig.39-(a) DUMMY CLOCK×14 + START+START  
START  
START  
DUMMY CLOCK×9  
1
COMMAND  
COMMAND  
2
8
9
SCL  
SDA  
Fig.39-(b) START + DUMMY CLOCK×9 + START  
START×9  
3
7
COMMAND  
COMMAND  
2
8
9
1
SCL  
SDA  
Fig.39-(c) START×9  
* COMMAND starts with start condition.  
Acknowledge polling  
Since the IC ignores all input commands during the internal write cycle, no ACK signal will be returned.  
When the Master sends the next command after the Write command, if the device returns an ACK signal it means that the  
program is completed. No ACK signal indicates that the device is still busy.  
Using Acknowledge polling decreases the waiting time by tWR=5ms.  
When operating Write or Current Read after Write, first transmit the Slave address (R/W is"High" or "Low"). After the device  
returns the ACK signal continue word address input or data output.  
During the internal write cycle,  
THE FIRST WRITE COMMAND  
no ACK will be returned.  
(ACK=High)  
S
T
A
R
T
S
T
A
R
T
S
T
A
R
T
S
T
O
P
A
C
K
H
A
C
K
H
SLAVE  
SLAVE  
ADDRESS  
WRITE COMMAND  
・・・  
ADDRESS  
tWR  
THE SECOND WRITE COMMAND  
S
T
A
R
T
S
T
A
R
T
A
C
K
L
A
C
K
A
C
K
L
A
C
K
L
S
T
O
P
SLAVE  
SLAVE  
WORD  
DATA  
ADDRESS  
H
ADDRESS  
ADDRESS  
・・・  
tWR  
After the internal write cycle  
is completed, ACK will be returned  
(ACK=Low). Then input next  
Word Address and data.  
Fig.40 Successive Write Operation By Acknowledge Polling  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.04 - Rev.A  
11/18  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
WP effective timing  
WP is normally fixed at "H" or "L". However, in case WP needs to be controlled in order to cancel the Write command, pay  
attention to “WP effective timing” as follows:  
The Write command is canceled by setting WP to "H" within the WP cancellation effective period.  
The period from the START condition to the rising edge of the clock (which takes in the data DO - the first byte of the Page  
Write data) is the ‘invalid cancellation period’. WP input is considered inconsequential during this period. The setup time for  
the rising edge of the SCL, which takes in DO, must be more than 100ns.  
The period from the rising edge of SCL (which takes in the data D0) to the end of internal write cycle (tWR) is the ‘effective  
cancellation period’. When WP is set to "H" during tWR, Write operation is stopped, making it necessary to rewrite the data.  
It is not necessary to wait for tWR (5ms max.) after stopping the Write command by WP because the device is in standby  
mode.  
The rising edge of the clock  
which take in D0  
The rising edge  
of SDA  
SCL  
SCL  
SDA  
ACK  
AN ENLARGEMENT  
SDA D0  
D1  
D0  
ACK  
AN ENLARGEMENT  
S
T
A
R
T
A
C
K
L
A
C
K
L
A
C
K
L
S
T
O
P
A
C
K
L
tWR  
SLAVE  
ADDRESS  
WORD  
SDA  
WP  
DATA  
D7 D6 D5  
D2 D1 D0  
D4 D3  
ADDRESS  
WP cancellation  
effective period  
Stop of the write  
operation  
WP cancellation  
invalid period  
Data is not  
guaranteed  
No data will be written  
Fig.41 WP effective timing  
Command cancellation from the START and STOP conditions  
Command input is canceled by successive inputs of START and STOP conditions. (Refer to Fig.42)  
However, during ACK or data output, the device may set the SDA line to Low, making operation of the START and STOP  
conditions impossible, and thus preventing reset. In this case execute reset by software. (Refer to Fig.39)  
The internal address counter will not be determined when operating the Cancel command by the START and STOP  
conditions during Random, Sequential or Current Read. Operate a Random Read in this case.  
SCL  
SDA  
1
1
0
0
STOP  
START  
CONDITION  
CONDITION  
Fig.42 Command cancellation by the START and STOP conditions during input of the Slave Address  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.04 - Rev.A  
12/18  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
I/O Circuit  
SDA Pin Pull-up Resistor  
A pull-up resistor is required because SDA is an NMOS open drain. Determine the resistor value of (RPU) by considering  
the VIL and IL, and VOL-IOL characteristics. If a large RPU is chosen, the clock frequency needs to be slow. A smaller  
RPU will result in a larger operating current.  
Maximum RPU  
The maximum of RPU can be determined by the following factors.  
The SDA rise time determined by RPU and the capacitance of the BUS line(CBUS) must be less than tR.  
In addition, all other timings must be kept within the AC specifications.  
A
When the SDA BUS is High, the voltage at the SDA BUS is determined from the total input leakage(IL) of all  
devices connected to the BUS. RPU must be higher than the input High level of the microcontroller and the device,  
including a noise margin 0.2VCC.  
Microcontroller  
BR34E02  
VCC-ILRPU-0.2 VCC VIH  
0.8V -V  
CC IH  
IL  
RPU  
R
PU  
SDA PIN  
A
Examples: When VCC =3V, IL=10µA, VIH=0.7 VCC  
According to ②  
IL  
IL  
0.8x3-0.7x3  
10x10-6  
RPU  
THE CAPACITANCE OF BUS  
LINE (CBUS)COMPUTER  
300 [k]  
Fig.43 I/O Circuit  
Minimum RPU  
The minimum value of RPU is determined by following factors.  
Meets the condition that VOLMAX=0.4V, IOLMAX=3mA when the output is Low.  
VCC-VOL  
RPU  
IOL  
VCC-VOL  
IOL  
RPU  
VOLMAX=0.4V must be lower than the input Low level of the microcontroller and the EEPROMincluding the  
recommended noise margin of 0.1VCC.  
VOLMAX VIL-0.1 VCC  
Examples: VCC=3V, VOL=0.4V, IOL=3mA, the VIL of the controller and the EEPROM is VIL=0.3VCC, According to ①  
3-0.4  
3×10  
RPU  
-3  
867  
[ ]  
and  
and  
VOL=0.4V]  
VIL=0.3×3  
=0.9V]  
o that condition is met  
SCL Pin Pull-up Resistor  
When SCL is controlled by the CMOS output the pull-up resistor at SCL is not required.  
However, should SCL be set to Hi-Z, connection of a pull-up resistor between SCL and VCC is recommended.  
Several kare recommended for the pull-up resistor in order to drive the output port of the microcontroller.  
A0, A1, A2, WP Pin connections  
Device Address Pin (A0, A1, A2) connections  
The status of the device address pins is compared with the device address sent by the Master. One of the devices that is  
connected to the identical BUS is selected. Pull up or down these pins or connect them to VCC or GND. Pins that are not  
used as device address (N.C.Pins) may be High, Low, or Hi-Z.  
WP Pin connection  
The WP input allows or prohibits write operations. When WP is High, only Read is available and Write to all address is  
prohibited. Both Read and Write are available when WP is Low.  
In the event that the device is used as a ROM, it is recommended that the WP input be pulled up or connected to VCC.  
When both READ and WRITE are operated, the WP input must be pulled down or connected to GND or controlled.  
www.rohm.com  
2009.04 - Rev.A  
13/18  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
Microcontroller connection  
Concerning Rs  
The open drain interface is recommended for the SDA port in the I2C BUS. However, if the Tri-state CMOS interface is  
applied to SDA, insert a series resistor (Rs) between the SDA pin of the device and the pull up resistor RPU is  
recommended, since it will serve to limit the current between the PMOS of the microcontroller, and the NMOS of the  
EEPROM. Rs also protects the SDA pin from surges. Therefore, Rs is able to be used though open drain inout of the  
SDA port.  
ACK  
SCL  
RPU  
RS  
'H'OUTPUT OF  
SDA  
CONTROLLER  
“L” OUTPUT OF EEPROM  
The “H” output of controller and the “L” output of  
EEPROM may cause current overload to SDA line.  
CONTROLLER  
EEPROM  
Fig.44 I/O Circuit  
Fig.45 Input/Output Collision Timing  
Rs Maximum  
The maximum value of Rs is determined by following factors.  
SDA rise time determined by RPU and the capacitance value of the BUS line (CBUS) of SDA must be less than tR. In  
addition, the other timings must be within the timing conditions of the AC.  
A
When the output from SDA is Low, the voltage of the BUS at is determined by RPU, and Rs must be lower than the  
input Low level of the microcontroller, including recommended noise margin (0.1VCC).  
VCC  
(VCC-VOL)×RS  
+
VOL+0.1VCC  
V
IL  
A
R
PU+RS  
RPU  
RS  
VOL  
V -VOL-0.1VCC  
IL  
RS  
×
RPU  
IOL  
1.1VCC-V  
IL  
BUS  
CAPACITANCE  
Examples : When VCC=3V V =0.3VCC  
VOL=0.4V RPU=20k  
ꢀ ꢀ  
IL  
VIL  
EEPROM  
0.3×3-0.4-0.1×3  
1.1×3-0.3×3  
CONTROLLER  
20×103  
According to  
RS  
×
Fig.46 I/O Circuit  
1.67 kΩ  
Rs Minimum  
The minimum value of Rs is determined by the current overload during BUS conflict.  
Current overload may cause noises in the power line and instantaneous power down.  
The following conditions must be met, where “I” is the maximum permissible current, which depends on the Vcc line  
impedance as well as other factors. “I” current must be less than 10mA for EEPROM.  
Vcc  
R
S
I
RPU  
"L" OUTPUT  
Vcc  
I
R
S
RS  
Examples: When V =3V, I=10mA  
CC  
MAXIMUM  
CURRENT  
"H" OUTPUT  
3
R
S
10×10-3  
CONTROLLER  
EEPROM  
[ ]  
300  
Fig.47 I/O Circuit  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.04 - Rev.A  
14/18  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
I2C BUS Input / Output equivalent circuits  
Input (A0,A2,SCL)  
Fig.48 Input Pin Circuit  
Input / Output (SDA)  
Fig.49 Input / Output Pin Circuit  
Input (A1)  
Fig.50 Input Pin Circuit  
Input (WP)  
Fig.51 Input Pin Circuit  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.04 - Rev.A  
15/18  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
Power Supply Notes  
VCC increases through the low voltage region where the internal circuit of IC and the microcontroller are unstable. In order  
to prevent malfunction, the IC has P.O.R and LVCC functionality. During power up, ensure that the following conditions are  
met to guaranty P.O.R. and LVCC operability.  
1. "SDA='H'" and "SCL='L' or 'H'".  
2. Follow the recommended conditions of tR, tOFF, Vbot so that P.O.R. will be activated during power up.  
tR  
VCC  
Recommended conditions of tR, tOFF, Vbot  
tR  
tOFF  
Vbot  
tOFF  
Below 10ms Above 10ms  
Below 100ms Above 10ms  
Below 0.3V  
Below 0.2V  
Vbot  
0
Fig.52 VCC rising wavefrom  
3. Prevent SDA and SCL from being "Hi-Z".  
In case that condition 1. and/or 2. cannot be met, take following actions.  
A) If unable to keep Condition 1 (SDA is "Low" during power up)  
Make sure that SDA and SCL are "High" as in the figure below.  
VCC  
tLOW  
SCL  
SDA  
After Vcc becomes stable  
After Vcc becomes stable  
tDH tSU:DAT  
tSU:DAT  
Fig.53 SCL="H" and SDA="L"  
Fig.54 SCL="L" and SDA="L"  
B) If unable to keep Condition 2  
After the power stabilizes, execute software reset. (See page 9,10)  
C) If unable to keep either Condition 1 or 2  
Follow Instruction A first, then B  
LVCC Circuit  
The LVCC circuit prevents Write operation at low voltage and prevents inadvertent writing. A voltage below the LVCC voltage  
(1.2V typ.) prohibits Write operation.  
VCC Noise  
Bypass Capacitor  
Noise and surges on the power line may cause abnormal function. It is recommended that bypass capacitors (0.1µF) be  
attached between VCC and GND externally.  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.04 - Rev.A  
16/18  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
Notes for Use  
1) Descrived numeric values and data are design representative values, and the values are not guaranteed.  
2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further  
sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin  
in consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI.  
3) Absolute maximum ratings  
If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, LSI  
may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear  
exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that  
conditions exceeding the absolute maximum ratings should not be impressed to LSI.  
4) GND electric potential  
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of  
GND terminal.  
5) Heat design  
In consideration of permissible dissipation in actual use condition, carry out heat design with sufficient margin.  
6) Terminal to terminal short circuit and wrong packaging  
When to package LSI on to a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may  
destruct LSI. And in the case of short circuit between LSI terminals and terminals and power source, terminal and GND  
owing to foreign matter, LSI may be destructed.  
7) Use in a strong electromagnetic field may cause malfunction, therfore, evaluate design sufficiently.  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.04 - Rev.A  
17/18  
Technical Note  
BR34E02FVT-W, BR34E02NUX-W  
Ordering part number  
B R  
3 4  
E
0
2
F
V
T
-
W E 2  
ROHM type  
BUS type  
34I2C  
Priduct type Capacity  
02= 2K  
Packagr  
W : Double cell  
Packaging and forming specification  
E2: Embossed tape and reel  
(TSSOP-B8)  
FVT:TSSOP-B8  
NUX:VSON008X2030  
TR: Embossed tape and reel  
(VSON008X2030)  
SSOP-B8  
<Tape and Reel information>  
3.0 0.2  
(MAX 3.35 include BURR)  
Tape  
Embossed carrier tape  
2500pcs  
Quantity  
8
7 6  
5
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
1
2 3  
4
0.15 0.1  
S
0.1  
0.22  
+0.06  
0.04  
-
M
0.08  
Direction of feed  
1pin  
(0.52)  
0.65  
Reel  
(Unit : mm)  
Order quantity needs to be multiple of the minimum quantity.  
VSON008X2030  
<Tape and Reel information>  
2.0 0.1  
Tape  
Embossed carrier tape  
Quantity  
4000pcs  
TR  
1PIN MARK  
Direction  
of feed  
S
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
0.08  
S
1.5 0.1  
0.5  
C0.25  
1
4
8
5
0.25  
+0.05  
–0.04  
Direction of feed  
Order quantity needs to be multiple of the minimum quantity.  
1pin  
0.25  
Reel  
(Unit : mm)  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.04 - Rev.A  
18/18  
Notice  
N o t e s  
No copying or reproduction of this document, in part or in whole, is permitted without the  
consent of ROHM Co.,Ltd.  
The content specified herein is subject to change for improvement without notice.  
The content specified herein is for the purpose of introducing ROHM's products (hereinafter  
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,  
which can be obtained from ROHM upon request.  
Examples of application circuits, circuit constants and any other information contained herein  
illustrate the standard usage and operations of the Products. The peripheral conditions must  
be taken into account when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document.  
However, should you incur any damage arising from any inaccuracy or misprint of such  
information, ROHM shall bear no responsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and  
examples of application circuits for the Products. ROHM does not grant you, explicitly or  
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and  
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the  
use of such technical information.  
The Products specified in this document are intended to be used with general-use electronic  
equipment or devices (such as audio visual equipment, office-automation equipment, commu-  
nication devices, electronic appliances and amusement devices).  
The Products specified in this document are not designed to be radiation tolerant.  
While ROHM always makes efforts to enhance the quality and reliability of its Products, a  
Product may fail or malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard  
against the possibility of physical injury, fire or any other damage caused in the event of the  
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM  
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed  
scope or not in accordance with the instruction manual.  
The Products are not designed or manufactured to be used with any equipment, device or  
system which requires an extremely high level of reliability the failure or malfunction of which  
may result in a direct threat to human life or create a risk of human injury (such as a medical  
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,  
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of  
any of the Products for the above special purposes. If a Product is intended to be used for any  
such special purpose, please contact a ROHM sales representative before purchasing.  
If you intend to export or ship overseas any Product or technology specified herein that may  
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to  
obtain a license or permit under the Law.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact us.  
ROHM Customer Support System  
http://www.rohm.com/contact/  
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© 2009 ROHM Co., Ltd. All rights reserved.  
R0039  
A

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