BM64350MUV-E2 [ROHM]
Brushless DC Motor Controller,;
| 型号： | BM64350MUV-E2 |
| 厂家： | 
ROHM |
| 描述： | Brushless DC Motor Controller, 电动机控制 |
| 文件： | 总35页 (文件大小：2771K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
DC Brushless Motor Driver Series
Built-in Speed Control, 3 Hall Sensors
Three-Phase Brushless Motor Pre-Driver
BM64350MUV
General Description
Key Specifications
BM64350MUV is the pre-driver IC of sine wave drive for
three-phase brushless motor driver that supports 48 V
power supply controlling the motor driver constructed in
external FETs. It detects a rotor position by 3 Hall
sensors. In addition, it has a speed feedback control
function, and controls output PWM Duty by adjusting the
rotational frequency characteristics for the input PWM
signal and the rotational frequency affected from motor.
Operating Supply Voltage Range :
Output PWM Frequency :
Standby Current :
28 V to 63 V
40 kHz (Typ)
1.2 mA (Typ)
Operating Temperature Range :
-40 °C to +105 °C
Package
VQFN040V6060
W (Typ) x D (Typ) x H (Max)
6.00 mm x 6.00 mm x 1.00 mm
Features
Speed Control on PWM Duty Input
External Output FET Nch+Nch
Built-in Boost Voltage Circuit
3 Hall Sine Wave Drive
Automatic Lead Angle Control
Motor Pole Select Function
Soft Start Function
Dead Time Setting
Current Limit Function
Power Save Function
Direction of Rotation Setting
Short Brake Control
Speed Feedback Control
Able to set Motor Rotation Speed Table and Various
Parameters with the built-in OTP
Built-in Several Protection Functions (Motor Lock
Protection [MLP], High Speed Rotation Protection,
Over Voltage Lock Out [OVLO], Under Voltage Lock
Out [UVLO], Thermal Shutdown [TSD], Over Current
Protection [OCP])
Application
Fan Motor
Other General Consumer Equipment
Typical Application Circuit
+
0.1µF
0.1µF
48V
0.1µF
0.1µF
VREG15
CP
VG
VCC
PREREGL
TEST
UVLO
VREG
FB50
Charge
Pump
VCC50
REG
VCC50A
VCC50B
TSD
VG
Internal
Reg
VCC50
UH
OVLO
U
Pre
driver
U
PS
HUP
HU
UL
HUN
VG
HVP
HVN
VH
V
HV
V
Pre
driver
CTL
Logic
M
VL
HWP
HWN
HW
VG
WH
W
VCC50B
W
Pre
driver
SPEED
Control
LOGIC
VCC50
PWMB
WL
POLE_SEL
VCC50
Selector
VCC50A
SS_SEL
VCC50
Selector
Selector
RCL
FGO
TDEAD_SEL
FR
External
Power
Supply
BRK
SPI_EN
GND
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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Contents
General Description .............................................................................................................................................................. 1
Features............................................................................................................................................................................... 1
Application............................................................................................................................................................................ 1
Typical Application Circuit...................................................................................................................................................... 1
Key Specifications................................................................................................................................................................. 1
Package............................................................................................................................................................................... 1
Contents............................................................................................................................................................................... 2
Pin Configurations................................................................................................................................................................. 3
Pin Descriptions.................................................................................................................................................................... 4
Block Diagram ...................................................................................................................................................................... 5
Absolute Maximum Ratings................................................................................................................................................... 6
Thermal Resistance.............................................................................................................................................................. 7
Recommended Operating Conditions .................................................................................................................................... 7
Electrical Characteristics ....................................................................................................................................................... 8
Application Example.............................................................................................................................................................10
Board Design Note...............................................................................................................................................................10
Description of Pin Functions.................................................................................................................................................11
Description of Operations.....................................................................................................................................................14
Thermal Resistance Model...................................................................................................................................................26
I/O Equivalence Circuits.......................................................................................................................................................27
Operational Notes................................................................................................................................................................28
Ordering Information............................................................................................................................................................30
Marking Diagram..................................................................................................................................................................30
Physical Dimension and Packing Information........................................................................................................................31
Revision History...................................................................................................................................................................32
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Pin Configurations
(TOP VIEW)
30
29
28
27
26
25
24
23
22
21
31
32
33
34
35
36
37
38
39
40
20
19
18
17
16
15
14
13
12
11
CP
PREREGL
HWN
VL
WH
W
HWP
WL
HVN
FGO
RCL
GND
PS
HVP
HUN
HUP
FB50
SPI_EN
N.C.
EXP-PAD
VREG
1
2
3
4
5
6
7
8
9
10
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Pin Descriptions
Pin No.
Pin Name
Function
Pin No. Pin Name
Function
N.C.
VCC50A
VCC50B
VREG15
BRK
N.C. (Open)
N.C.
V
N.C. (Open)
1
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
Standard voltage input
(to internal analog circuit)
Standard voltage input
(to internal logic circuit)
Internal power supply output for
logic circuit
V phase external FET output
feedback input
V phase
High side pre-driver output
U phase
Low side pre-driver output
U phase external FET output
feedback input
U phase
High side pre-driver output
2
VH
3
UL
4
Brake control / SPI
communication data input-output
U
5
UH
FR
Rotation direction setting
Soft Start setting
6
SS_SEL
VG
Boost output
7
TDEAD_SEL Dead Time setting
VCC
TEST
N.C.
CP
Power supply
8
POLE_SEL
PWMB
N.C.
Motor Pole setting
TEST (Open)
9
PWM input (negative logic)
/ SPI communication clock input
N.C. (Open)
10
11
12
13
14
15
16
17
18
N.C. (Open)
Capacitor connection for boost
Low side Pre-Driver standard
voltage output
SPI_EN
PS
SPI communication setting
Power Save input
Ground
PREREGL
HWN
HWP
W phase Hall input -
W phase Hall input +
GND
Output current detection voltage
input
Rotating speed pulse signal
output
RCL
HVN
HVP
V phase Hall input -
V phase Hall input +
FGO
W phase
WL
W
HUN
HUP
FB50
U phase Hall input -
Low side pre-driver output
W phase external FET output
feedback input
U phase Hall input +
W phase
Standard voltage Feedback input
19
20
WH
VL
39
40
High side pre-driver output
V phase
VREG
Standard voltage output
Low side pre-driver output
Back
Side
Connect the EXP-PAD to the GND.
EXP-PAD
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Block Diagram
PREREGL
TEST
VREG15
CP
VG
28pin
40pin
VCC
VREG
UVLO
Charge
Pump
39pin
FB50
2pin
3pin
REG
TSD
VCC50A
VCC50B
VG
Internal
Reg
26pin
25pin
24pin
OVLO
UH
U
U
Pre
driver
13pin
38pin
PS
HUP
UL
37pin
HUN
VG
23pin
22pin
VH
V
36pin
35pin
HVP
HVN
V
Pre
driver
CTL
Logic
20pin
VL
34pin
33pin
HWP
HWN
VG
19pin
WH
VCC50B
W
Pre
driver
18pin
17pin
SPEED
Control
LOGIC
W
PWMB
10pin
9pin
WL
Selector
Selector
Selector
POLE_SEL
VCC50A
7pin
SS_SEL
RCL
FGO
15pin
16pin
8pin
6pin
TDEAD_SEL
FR
5pin
BRK
12pin
SPI_EN
14pin
GND
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Absolute Maximum Ratings (Ta=25 °C)
Parameters
Symbol
VCC
Rating
100
Unit
V
Power Supply Voltage (VCC)
VG Voltage
VG
VOH
VOL
100
100
20
V
V
V
Pre-driver High Side Output Voltage (UH, VH, WH)
Pre-driver Low Side Output Voltage (UL, VL, WL)
Pre-driver Output-current (consecutive)
(UH, VH, WH, UL, VL, WL)
IOMAX1
IOMAX2
±10
mA
mA
Pre-driver Output-current(Note 1)
(UH, VH, WH, UL, VL, WL)
±100
External FET Output Feedback Voltage (U, V, W)
FGO Pin Voltage
VFBI
VFGO
IFGO
100
V
V
30
FGO Pin Current
10
mA
mA
V
VREG Pin Current
IVREG
VRCL
VIN1
-15
RCL Pin Voltage
4.5
Control Input Pin Voltage(Note 2)
Hall Input Pin Voltage(Note 3)
Maximum Junction Temperature
Storage Temperature Range
7
V
VIN2
7
V
Tjmax
150
°C
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Pulse Width ≤ 1 µs, Pulse Duty ≤ 10 %.
(Note 2) The TDEAD_SEL, SS_SEL, POLE_SEL, PWMB, PS, BRK, FR, SPI_EN pins.
(Note 3) The HUP, HUN, HVP, HVN, HWP, HWN pins.
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Thermal Resistance(Note 4)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 6)
2s2p(Note 7)
VQFN040V6060
Junction to Ambient
Junction to Top Characterization Parameter(Note 5)
θJA
101.4
5.0
23.7
3.0
°C/W
°C/W
ΨJT
(Note 4) Based on JESD51-2A (Still-Air).
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 6) Using a PCB board based on JESD51-3.
(Note 7) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Thermal Via(Note 8)
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Pitch
Diameter
4 Layers
1.20 mm
Φ0.30 mm
Top
Copper Pattern
Bottom
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 8) This thermal via connects with the copper pattern of all layers.
Recommended Operating Conditions
Parameters
Symbol
Min
Typ
Max
Unit
Operation Temperature
Topr
VCC
VIN1
-40
28.0
0
+25
48.0
-
+105
63.0
°C
V
Operating Supply Voltage (VCC)
Control Input Pin Voltage(Note 9)
VVCC50
V
(Note 9) The TDEAD_SEL, SS_SEL, POLE_SEL, PWMB, BRK, FR, SPI_EN pins.
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Electrical Characteristics (Unless otherwise specified VCC=48 V Ta=25 °C)
Parameters
Symbol
Min
Typ
Max
Unit
Conditions
<Whole>
Circuit Current(Note 10)
Standby Current(Note 10)
VCC50 Voltage
ICC
-
-
13
1.2
20
1.8
mA
mA
V
PS=0 V
PS=5 V
ISTBY
VVCC50
VVREG15
4.5
1.35
5.0
5.5
VREG15 Voltage
<Boost Circuit>
VG Voltage
1.50
1.65
V
VG
VCC+6.5
VCC+9.5
VCC+12.5
V
<Pre-driver Output>
High Side Output High
Voltage
High Side Output Low
Voltage
Low Side Output High
Voltage
Low Side Output Low
Voltage
VOHH
VOHL
VOLH
VG-0.3
0
VG-0.1
0.1
VG
0.3
V
V
V
IO=-5 mA
IO=+5 mA
IO=-5 mA
IO=+5 mA
6.2
9.4
12.5
VOLL
fPWM
0
0.1
40
0.3
44
V
Output PWM Frequency
36
kHz
<Hall Input>
HUP=0 V, HUN=0 V
HVP=0 V, HVN=0 V
HWP=0 V, HWN=0 V
Input Bias Current
IHALL
-2.0
0
-0.1
-
+2.0
μA
Common Mode Input
Voltage Range
VHALLCM
VVCC50-1.7
V
Input Voltage Range
VHALLRNG
VHALLMIN
VHYSP
0
-
-
VVCC50
-
V
50
mVP-P
Minimum Input Voltage
Hall Input Hysteresis
Level +
Hall Input Hysteresis
Level -
2
12
22
-2
mV
mV
VHYSN
-22
-12
<PS>
Input Current
Input High Voltage
Input Low Voltage
<FR>
IPS
-82.5
3.8
0
-55.0
-27.5
5.0
μA
V
PS=0 V
Power Save
Drive
VSTBY
VENA
-
-
0.5
V
Input Current
Input High Voltage
Input Low Voltage
<BRK>
IFR
25
VVCC50-1.2
0
50
-
75
VVCC50
0.8
μA
V
FR=VVCC50
U→V→W
U→W→V
VFRH
VFRL
-
V
Input Current
Input High Voltage
Input Low Voltage
<SPI_EN>
IBRK
25
VVCC50-1.2
0
50
-
75
VVCC50
0.8
μA
V
BRK=VVCC50
Short brake
Drive
VBRKH
VBRKL
-
V
Input High Voltage
Input Low Voltage
VSPI_ENH
VSPI_ENL
VVCC50-1.0
0
-
-
VVCC50
0.8
V
V
OTP write mode
Drive mode
For parameters involving current, positive notation means inflow of current to the IC while negative notation means outflow of current from the IC.
(Note 10) Total value of VCC, VCC50A and VCC50B ciruit current.
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Electrical Characteristics – Continued (Unless otherwise specified VCC=48 V Ta=25 °C)
Parameters
Symbol
Min
Typ
Max
Unit
Conditions
<Control Input: SS_SEL, POLE_SEL, TDEAD_SEL>
Input Current
IIN
-1.2
-
+1.2
μA
<Speed Control Input: PWMB>
Input Current
IPWMB
VPWMBH
VPWMBL
fPWMB
-75
-50
-25
VVCC50
0.8
μA PWMB=0 V
Input High Voltage
Input Low Voltage
VVCC50-1.2
-
-
-
V
V
0
1
Input Frequency Range
<FGO Output>
50
kHz
Output Low Voltage
Output Leak Current
<Current limit: RCL>
Input Current
VFGOL
0
-
0.1
-
0.3
1
V
IFGO=+3 mA
IFGLEAK
μA FGO=30 V
IRCL
VCL
-35
-20
-10
μA RCL=0 V
Current Limit Detect Voltage
<UVLO>
0.18
0.20
0.22
V
VCC UVLO Release Voltage
VCC UVLO Lockout Voltage
VG UVLO Voltage
<OVLO>
VUVH
VUVL
18
16
20
18
22
20
V
V
V
VUVVG
VCC+2.0
VCC+3.0
VCC+4.0
OVLO Release Voltage
OVLO Lockout Voltage
VOVL
VOVH
65
68
69
72
73
76
V
V
<Motor Lock Protection, Several Protections>
Motor Lock Protection
Detect Time
tLK_DET
tLK_PRT
0.45
4.5
0.50
5.0
0.55
5.5
s
Protect Time
s
Several Protections(Note 11)
For parameters involving current, positive notation means inflow of current to the IC while negative notation means outflow of current from the IC.
(Note 11) Motor Lock Protection (MLP), High Speed Rotation Protection, Over Voltage Lock Out (OVLO), Thermal Shutdown (TSD), Over Current Protection (OCP).
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Application Example
+
0.1µF
0.1µF
48V
0.1µF
0.1µF
VREG15
CP
VG
VCC
PREREGL
TEST
UVLO
VREG
FB50
Charge
Pump
VCC50
REG
VCC50A
VCC50B
TSD
VG
Internal
Reg
VCC50
UH
OVLO
U
Pre
driver
U
PS
HUP
HU
HV
UL
HUN
VG
HVP
HVN
VH
V
V
Pre
CTL
Logic
M
driver
VL
HWP
HWN
HW
VG
WH
W
VCC50B
W
Pre
driver
SPEED
Control
LOGIC
VCC50
PWMB
WL
POLE_SEL
VCC50
VCC50
Selector
VCC50A
SS_SEL
Selector
Selector
RCL
FGO
TDEAD_SEL
FR
External
Power
Supply
BRK
SPI_EN
GND
Board Design Note
1. The IC power supply, the IC ground, the motor outputs and the motor ground lines are made as wide as possible.
2. The IC ground is arranged to the ground connector of PCB as close as possible.
3. The bypass capacitors connected to the VCC pin and external FETs are placed as close as possible to the VCC pin and
external FETs.
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Description of Pin Functions
1. Power Supply Pin (VCC)
In order to decrease the AC impedance in wide frequency bandwidth, place a ceramic capacitor (0.01 µF to 0.1 µF) in
parallel with the electrolytic capacitor.
The motor’s Back EMF and PWM switching noise may affect the VCC pin voltage. To regulate or stabilize the VCC voltage
supply, place the bypass capacitor to the IC pin as close as possible. Increase the value of the bypass capacitor if the IC
needs to drive higher current or if it is experiencing higher Back EMF. VCC must not exceed the absolute maximum ratings.
It is effective to add a zener diode not exceeding the absolute maximum ratings. Take note that reversing the voltages of
the VCC and the GND may destroy the IC.
2. Ground Pin (GND)
The GND must have impedance as low as possible and must always be maintained as the lowest voltage potential. This is
to reduce the noise caused by the switching current, and to make the internal standard voltages stable. Avoid having
common impedance with other devices' GND line.
3. Boost Pins (CP, VG)
Built-in charge pump circuit (for High side external FET drive) generates boost voltage VG=VCC+9.5 V (Typ) by connecting
capacitors and diodes to the CP pin, the VCC pin and the VG pin. It is recommended to use capacitor 0.1 µF or more. And it
is recommended to use diode absolute maximum voltage 100 V or more, 1.0 A and reverse recovery time trr ≤ 100 ns.
4. High Side Pre-driver Output Pins (UH, VH, WH)
The external FET high side gate drive voltage is VCC+9.5 V (Typ). Note that 500 kΩ (Typ) resistor is built between these pins
(UH, VH, WH) and the FET output feedback pins (U, V, W) on each phase.
5. Low Side Pre-driver Output Pins (UL, VL, WL)
The external FET low side gate drive voltage is 9.5 V (Typ). Note that 200 kΩ (Typ) resistor is built between these pins (UL,
VL, WL) and the GND on each phase.
6. External FET Output Feedback Input Pins (U, V, W)
Connect these pins to the source side of external High side FET. High side FET driver circuit generates High side pre-driver
output voltage based on this pin. Do not leave this pin open, because the voltage higher than expected can be applied to
the High side FET and cause destruction. Also, this pin can swing the GND potential or less under the influence of Back
EMF by the motor, and cause malfunction or destruction if it reaches -2 V or less. Preventive measures, such as inserting
schottky diodes to the GND, can avoid such unexpected IC destruction.
7. Regulator Input Pins (FB50, VCC50A, VCC50B) / Output Pins (VREG15, VREG)
The VREG15 pin is 1.5 V (Typ) for internal power supply output for logic circuit. And the VREG pin and the FB50 pin make
VCC50 voltage (Standard voltage) 5 V (Typ) by connecting external NPN transistor. Refer to P. 25 for circuit configuration.
the VCC50A pin is 5 V input to internal analog circuit. And the VCC50B pin is 5 V input to internal logic circuit. Connect both
pins to VCC50 voltage. It is recommended to connect 0.1 µF to 1 µF capacitor to the VCC50A, VCC50B and VREG15 pins.
And connect nothing to the VREG15 pin except a capacitor.
8. Power Save Pin (PS)
The PS pin controls ON/OFF state on each phase output (Negative logic).
The Power Save state has priority of turning off regulator output (VREG, VREG15) over other control input signals.
Furthermore, the PS pin is pulled up to internal power supply by 101 kΩ (Typ) resistor.
Table 1. PS Pin Setting Table
PS pin Setting
Function
Low
Drive
High / Open
Power Save
9. Motor Pole Setting Pin (POLE_SEL)
Motor Pole can be set at the POLE_SEL pin by applying the appropriate voltage via resistive voltage dividers from VCC50
(5 V [Typ]). High accuracy is needed for setting, and it is recommended to use 5 % or less precision resistors. Refer to P. 19
regarding the Motor Pole setting method.
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Description of Pin Functions – Continued
10. Soft Start Setting Pin (SS_SEL)
This IC sets Soft Start step time at the SS_SEL pin by applying the appropriate voltage via resistive voltage dividers from
VCC50 (5 V [Typ]). High accuracy is needed for setting, and it is recommended to use 1 % or less precision resistors. Refer
to P. 17 regarding the time setting method of Soft Start.
11. Dead Time Setting Pin (TDEAD_SEL)
Dead Time can be set at the TDEAD_SEL pin by applying the appropriate voltage via resistive voltage dividers from VCC50
(5 V [Typ]). High accuracy is needed for setting, and it is recommended to use 1 % or less precision resistors. Refer to P. 19
regarding the time setting method of Dead Time.
12. Speed Control PWM Input Pin (PWMB)
The PWM signal Duty for the PWMB pin can control motor speed (Negative logic).The PMWB pin is pulled up to VCC50B
by 100 kΩ (Typ) resistor. Refer to P. 21 regarding the rotation speed setting of Speed feedback control.
13. Hall Input Pins (HUP, HUN, HVP, HVN, HWP, HWN)
Hall comparator is designed with hysteresis (±12 mV [Typ]) in order to prevent malfunction due to noise.
Case of Hall element: Set the bias current for the Hall element so that the amplitude of Hall input voltage is the minimum
input voltage (VHALLMIN) or more. It is recommended to connect a ceramic capacitor with about 100 pF to 0.01 µF value
between the differential input pins of the Hall comparator. Hall comparator has common mode input voltage range
(VHALLCM). Set the bias voltage within the VHALLCM
.
Case of Hall IC: Connect the HUP pin, the HVP pin and the HWP pin to each output of Hall ICs and input within the input
voltage range (VHALLRNG). If the output of the Hall IC is an open drain, pull up it to VCC50 voltage by external resistance.
Input a reference voltage within VHALLCM into the HUN pin, the HVN pin and the HWN pin (e.g., input a half voltage of
VCC50 voltage).
14. Output Current Detect Pin (RCL)
The RCL pin is an input pin for the current limit comparator. Take into consideration the wiring pattern on the PCB to reduce
noise when designing PCB layout. Note that the RCL pin is pulled up to VCC50A by 250 kΩ (Typ) resistor.
15. FG Output Pin (FGO)
The FGO pin outputs FG signal that is generated by Hall signal. No output in Power Save mode. The FGO pin is open drain
output, so this pin must be pulled up to external voltage by 10 kΩ to 100 kΩ resistor. Note that FGO voltage and current
should not exceed the maximum absolute ratings.
16. SPI Communication Setting Pin (SPI_EN)
When the SPI_EN pin is connected to VREG50, the BRK pin and the PWMB pin are switched to SPI communication pins.
Refer to the Application Note about OTP Writing Application Circuit using SPI communication. When you do not use SPI
communication, connect the SPI_EN pin to the GND. The SPI_EN pin is pulled down by 61.5 kΩ (Typ) resistor.
17. Rotation Direction Setting Pin (FR)
The FR pin controls rotational direction change. Phase driving sequence is U→V→W when FR=High, and U→W→V when
FR=Low or Open. Changing the rotational direction during motor rotation is not recommended. If the rotational direction is
changed, outputs will shift to short brake mode until the rotational speed becomes 500 rpm or less. The FR pin is pulled
down by 100 kΩ (Typ) resistor.
Table 2. FR Pin Setting Table
FR pin Setting
Low / Open
High
Function
U→W→V
U→V→W
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Description of Pin Functions – Continued
18. Brake Control Pin (BRK)
The BRK pin can stop a rotation. It enters short brake mode with BRK=High, wherein all high side external FETs are
turned off and all low side external FETs are turned on. It cancels short brake mode when BRK=Low or Open. The BRK
pin is pulled down by 100 kΩ (Typ) resistor.
Short brake has higher priority than other protection functions. That is why the protection function is cancelled and short
brake operation is enabled when the short brake starts operation during other protection function is operating.
Table 3. BRK Pin Setting Table
BRK pin Setting
Function
Low / Open
High
Drive
Short Brake
19. Voltage Output for Low Side Pre-driver Pin (PREREGL)
The PREREGL pin is 9.5 V (Typ) for internal power supply output for low side pre-driver circuit. It is recommended to
connect 0.1 µF or more to the PREREGL pin. And connect nothing to the PREREGL pin except a capacitor.
20. Non Connection Pin (N.C.)
No electrical connection with IC internal circuit.
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Description of Operations
1. Timing Chart
It detects the rotor position by 3 Hall sensors. In addition, silent and low vibration are implemented by making the output
current a sine waveform.
1.1 Timing chart of the sine wave drive on 3 Hall sensors
The timing chart of the 3 Hall sensor signals and external FET output signals are shown below.
FR=High (U→V→W, lead angle 0°)
(1)
0° 30°
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9) (10) (11) (12) (1)
(2)
(3)
(4)
(5)
STAGE
Position
60° 90° 120° 150° 180° 210° 240° 270° 300° 330° 360° 390° 420° 450° 480°
3 HALL Sensor signal
HU=HUP-HUN
HV=HVP-HVN
HW=HWP-HWN
Coil Current
I_U
I_V
I_W
U
External FET
Output signal
(2 Phase Modulation
Sine drive)
V
W
FGO signal
FGO
Position
0° 30°
60° 90° 120° 150° 180° 210° 240° 270° 300° 330° 360° 390° 420° 450° 480°
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
V
W V
WV
W V
W V
W V
WV
W V
W V
W V
W V
WV
W V
W V
W V
W V
WV
W
PWM Operation
Figure 1. Timing Chart for Sine Wave Drive (FR=High)
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1.1 Timing chart of the sine wave drive on 3 Hall sensors – Continued
FR=Low (U→W→V, lead angle 0°)
(1)
0° 30°
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9) (10) (11) (12) (1)
(2)
(3)
(4)
(5)
STAGE
Position
60° 90° 120° 150° 180° 210° 240° 270° 300° 330° 360° 390° 420° 450° 480°
3 HALL Sensor signal
HU=HUP-HUN
HV=HVP-HVN
HW=HWP-HWN
Coil Current
I_U
I_V
I_W
U
External FET
Output signal
(2 Phase Modulation
Sine drive)
V
W
FGO signal
FGO
: PWM Operation
Figure 2. Timing Chart for Sine Wave Drive (FR=Low)
Adjustment of the Hall Sensor
When the Hall sensor is used, the amplitude adjustment of the Hall signal is important for a stable drive. It is
necessary to detect the correct position of a motor that the amplitude of Hall signal is larger enough than the Hall input
hysteresis level+ (VHYSP) and Hall input hysteresis level- (VHYSN). About Selections of Hall element or Hall IC, it is
necessary to fully consider the sensitivity and temperature characteristics.
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1. Timing Chart – Continued
1.2 Energizing Logic
FR=High (U→V→W, lead angle 0°)
Table 4. Energizing Logic Table
Input Condition
HV
=(HUP)-(HUN) =(HVP)-(HVN) =(HWP)-(HWN)
Output State
V
HU
HW
STAGE
U
W
1
2
Middle
High
High
High
High
High
Middle
Low
Low
Low
High
High
Middle
Low
PWM
PWM
Low
Low
PWM
PWM
3
Low
PWM
Low to PWM PWM to Low
4
Low
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
Low
Low
5
Middle
High
High
High
High
High
Middle
Low
Low
PWM
6
Low
PWM
Low
7
Low
PWM to Low
Low
Low to PWM
PWM
8
Low
9
Low
Middle
High
High
High
Low
PWM
10
11
12
Low
Low
PWM
Low
Low to PWM PWM to Low
PWM Low
PWM
Low
PWM
2. Lock Protection Function (MLP: Motor Lock Protection)
When the motor is locked due to disturbance factors, the IC has a protection function that turns off all external FETs for a
certain period (lock protection time tLK_PRT: 5.0 s [Typ]) so that the current will not continue to flow in the coil current. In
addition, it has a function that automatically restarts after lock protection time. Hall signal transitions are detected as the
motor rotates. But when the motor is locked, they are not detected. When they are not detected for a certain period (lock
protection detect time tLK_DET: 0.5 s [Typ]), the IC judges as the motor is locked. The timing chart of the Hall signal and each
output phase during lock protection is shown in Figure 3.
Motor Lock
Re-Start
V Hall Sensor
Comparator
Output Signal
External FET
Output U
External FET
Output V
Output Hi-Z section
External FET
Output W
Start-up Section
Look Detect OFF Section tLK_PRT (5.0 s)
Hall Driving Section
(normal driving)
Look Detect Section tLK_DET (0.5 s)
Figure 3. Timing Chart during Lock Protection
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Description of Operations – Continued
3. Current Limit Setting (the RCL pin)
When the IC detects the coil current the current setting value or more, all high side external FETs are turned off and cut off
the current. When the current is less than the current value setting in the timing of next PWM (ON) after that, it returns to
normal drive. Setting current value IO that operates the current limit is determined on the current limit setting voltage (VCL)
0.2 V (Typ) in the IC and the resistance R1 to use for the coil current detection. Please refer to the formula shown below in
the case of R1=0.2 Ω.
[ ]
[ ]
[ ]
퐼푂 A = 푉퐶퐿 [V] / 푅1 [Ω]
푃퐶 W = 푉퐶퐿 V × 퐼푂 [A]
= 0.2 × ꢀ.0
= 0.2 / 0.2
= 0.2 W
= ꢀ.0 A
When the current limit function is not used, short the RCL pin with the GND. A large current flows through the resistor R1 to
detect the coil current. Because the power consumption PC is calculated with the formula shown above, please pay
attention to the power dissipation.
VCC50A
Current Detection Resistor
VCL
Open Setting
(Prohibit mode)
NG
GND short Setting
(Current Limit disable)
OK
Connection
(Current Limit enable)
OK
CL COMP
GND
RCL
R1
RCL
RCL
RCL
Io
R1
IC small signal GND line
motor large current GND line
Figure 4. RCL Pin Process
Figure 5. Small Signal and Large Current
GND Line Separation
When design a PCB layout, separate the IC small signal GND line from the motor large current GND line connected to R1
as shown in Figure 5.
4. Soft Start Time Setting (the SS_SEL pin)
When it starts from a motor stop state, there is a function to increase the VCC current gradually (Soft Start function) for
controlling the inrush current. In the start-up command to start from the motor stop state, there are the start by the power
supply injection, the start by the torque input (the PWMB pin), the start by the power save cancellation (the PS pin), the
return from lock protection, the return from the short brake mode at the time of the rotational direction change (the FR pin),
and the return from the motor stop state by each protection function (High Speed Rotation Protection, Over Voltage Lock
Out, Under Voltage Lock Out and Thermal Shutdown). About the current limit during Soft Start, it maintains the sine wave
drive by gradually increasing the output duty of the external FET.
ON
Start-up Command
OFF
Current limit (VCL
VCC Current
)
0A
Figure 6. Timing Chart of the Coil Current Waveform at Soft Start
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4. Soft Start Time Setting (the SS_SEL pin) – Continued
The Soft Start function can gradually increase the current limit setting voltage in the IC. The Time for 1 step is set on the
voltage of the SS_SEL pin as shown in Table 5. In addition, set it in consideration of ±10 % tolerance of the Time for 1 step.
The current limit setting voltage in the IC increases for 1 step voltage 5.16 mV (Typ). Therefore, the soft start time can be
calculated as follows.
(
)
Soft Start time = Time for ꢀ step × 푉 − 5ꢀ.6 mV / 5.ꢀ6 mV
퐶퐿
For example, when SS_SEL=0 V, it is calculated as below.
(
)
Soft Start time = 49 ms × 200 mV − 5ꢀ.6 mV / 5.ꢀ6 mV = ꢀ.4 s
Start-up
command
V
CL: 200 mV (Typ)
Current limit voltage setting
of the internal IC
1Step Voltage: 5.16 mV (Typ)
51.6 mV (Typ)
Time for 1Step
Soft Start Time
Figure 7. Timing Chart of the Current Limit Voltage Setting during Soft Start
Table 5. SS_SEL Pin Setting Table
SS_SEL pin Setting
Time for 1 step (Typ)
0.000
0.069
0.131
0.194
0.256
0.319
0.381
0.444
0.506
0.569
0.631
0.694
0.756
0.819
0.881
0.944
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
0.056
0.119
0.181
0.244
0.306
0.369
0.431
0.494
0.556
0.619
0.681
0.744
0.806
0.869
0.931
1.000
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
49 ms
98 ms
147 ms
197 ms
246 ms
295 ms
344 ms
393 ms
442 ms
491 ms
541 ms
590 ms
639 ms
688 ms
737 ms
786 ms
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Description of Operations – Continued
5. Dead Time Setting (the TDEAD_SEL pin)
It can perform Dead Time setting with the TDEAD_SEL pin. Dead Time is set on the voltage of the TDEAD_SEL pin as
shown in Table 6. Set it in consideration of ±10 % tolerance of the Dead Time.
ꢀ07
32
ꢀ
64
TDEAD_SEL voltage = ꢁ
× Dead Time +
ꢂ × 푉
ꢃ퐶퐶ꢄꢅ
Table 6. TDEAD_SEL Pin Setting Table
TDEAD_SEL pin Setting
to 0.028
to 0.060
Dead Time (Typ)
0.000
0.034
0.063
0.094
0.125
0.156
0.191
0.222
0.253
0.281
0.313
x
x
x
x
x
x
x
x
x
x
x
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
x
x
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
0.1 µs
0.1 µs
0.2 µs
0.3 µs
0.4 µs
0.5 µs
0.6 µs
0.7 µs
0.8 µs
0.9 µs
1.0 µs
…
to
to
to
to
to
to
to
to
to
…
to
to
to
0.091
0.122
0.153
0.185
0.216
0.247
0.278
0.310
0.341
x
x
x
x
x
x
x
x
x
0.909
0.941
0.972
x
x
x
VVCC50
VVCC50
VVCC50
0.935
0.966
1.000
x
x
x
VVCC50
VVCC50
VVCC50
2.9 µs
3.0 µs
3.1 µs
6. Motor Pole Setting (the POLE_SEL pin)
Set the POLE_SEL pin voltage based on the motor poles. Refer to Table 7 for setting. For other motor poles setting, refer to
the Application Note.
Table 7. POLE_SEL Pin Setting Table
POLE_SEL pin Setting
Motor Pole (poles)
0.00
0.16
0.30
0.44
0.59
0.73
0.87
x
x
x
x
x
x
x
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
to
to
to
to
to
to
to
0.13
0.27
0.41
0.56
0.70
0.84
1.00
x
x
x
x
x
x
x
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
VVCC50
4
6
8
2
12
14
10
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Description of Operations – Continued
7. Under Voltage Lock Out (UVLO)
In extremely low supply voltage domain deviating from normal operation, it is a protection function that prevents the
unexpected operations such as large current flow in drive FET by turning off all external FETs intentionally. UVLO works
and all external FETs are turned off when VCC reaches 18 V (Typ) or less in the domain less than 28 V of the recommended
operating minimum voltage. And the regulator outputs (VREG, VREG15) are turned off. UVLO circuit has hysteresis of 2 V
(Typ), and UVLO is cancelled when VCC reaches 20 V (Typ) or more.
8. VG Under Voltage Lock Out (VG UVLO)
When VG reaches VCC+3.0 V (Typ) or less, VG UVLO works and all external FETs are turned off. VG UVLO circuit has no
hysteresis.
9. Over Voltage Lock Out (OVLO)
When VCC reaches 72 V (Typ) or more, OVLO works and it enters short brake mode, wherein all high side external FETs
are turned off and all low side external FETs are turned on for a certain period (protect time tLK_PRT: 5.0 s [Typ]). In addition,
the boost function for VG voltage is turned off. OVLO circuit has hysteresis of 3 V (Typ), and OVLO is cancelled when VCC
reaches 69 V (Typ) or less after the protect time. This circuit has mask time of 4 µs (Typ) to prevent malfunctions.
10. High Speed Rotation Protection
When a rotating speed reaches 40,300 rpm (Typ) or more due to boost up by uncontrollable motor, it has the protection
function which turn off all external FETs for a certain period (protect time tLK_PRT: 5.0 s [Typ]). After the Protect time, the High
Speed Rotation Protection is cancelled when a rotating speed reaches less than 40,300 rpm (Typ).
11. Thermal Shutdown (TSD)
When the chip temperature reaches 175 °C (Typ) or more, TSD works and all external FETs are turned off for a certain
period (protect time tLK_PRT: 5.0 s [Typ]). TSD circuit has hysteresis of 25 °C (Typ), and TSD is cancelled when the chip
temperature drops after the protect time. Moreover, the purpose of the TSD circuit is to protect driver IC from thermal
breakdown, therefore, temperature of this circuit will be over working temperature when it is started up. Thus, thermal
design should have sufficient margin, so do not take continuous use and action of the circuit as a precondition.
12. Over Current Protection (OCP)
Built-in Over Current Protection circuit is possible to protect from power supply short fault only. When the specified current
or more is detected, OCP works and all external FETs are turned off for a certain period (protect time tLK_PRT: 5.0 s [Typ]).
When it is not detected after the protect time, OCP is canceled.
13. Hall input error protection (HALL ERROR)
When Hall input is abnormal, the Hall input error protection works and all external FETs are turned off. This protection has
the mask time of 1.0 ms (Typ). Once protection is operated, it continues until it is cancelled by restart from the operation of
Power Save, Speed Control Non-input or VCC off.
14. Priority of Protection
This IC has a priority order in each protection operation as shown below. The protection with higher priority will be activated
during the protection with lower priority.
Table 8. Priority Order of Protect Operation
Priority Order
Protection
1st
2nd
3rd
4th
VCC UVLO
OCP
TSD
OVLO
MLP, High Speed Rotation Protection,
Hall Error Protection, VG UVLO
5th
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Description of Operations – Continued
15. Auto Lead Angle Control
It has the auto lead angle function which enables a high efficiency drive by matching the phase of the coil current to the
phase of the Back EMF voltage generated to the coil automatically while driving the motor. To do that, place Hall sensors in
reference to Figure 8 so that the timing of the Hall sensor signal and the coil current at the lead angle 0° becomes Figure 1
(U→V→W) or Figure 2 (U→W→V). The lead angle adjustment range is from 0° to 45°.
Y. connection
U
H2
H1
N
S
V
W
H3
Figure 8. The Placement of Hall sensors
16. Speed Feedback Control
It has a speed feedback control to keep the motor rotation speed constant. It controls a drive duty so that the target motor
rotation speed that set by an input PWMB signal and the frequency of internal FG signal are equal. It sets various
parameters that are most suitable for the target rotation speed and characteristics of the motor. These setting parameters
can be written to the OTP. The data written on the OTP are set to registers when the IC is powered on. If the data is not
written on the OTP, registers are set default value shown in the register map. Refer to the Application Note about OTP
setting. In this document, default value is described. The block diagram of speed feedback control is shown in Figure 9.
Speed control Logic
PWM Duty
Capture
RPM
Converter
PWMB
Duty Ramp
PI
Drive
Control
Generator
FG
Counter
Internal FG
From motor
Motor drive Logic
Motor
Drive
generater
Drive Control duty
UH, VH, WH
UL, VL, WL
Pre_
Driver
Figure 9. The Block Diagram of Speed Feedback Control
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16. Speed Feedback Control – Continued
16.1 Relations of the Input PWMB Duty and the Target RPM
In the case that the POLE_SEL pin setting is 10 poles, the relations of the input PWMB Duty and the Target RPM
become like Figure 10. The relation of the maximum Target RPM when input PWMB Duty=0 % (Note that this is
negative logic) and the motor poles is calculated below.
4
(
)
(
)
T푎푟푔푒푡 푅푃푀 푀푎푥 = ꢀ,024 × 80 + ꢀ × 0.256 ×
푝표푙푒푠
Where poles=10, then,
4
ꢀ0
(
)
(
)
T푎푟푔푒푡 푅푃푀 푀푎푥 = ꢀ,024 × 80 + ꢀ × 0.256 ×
= 8493 rpm
In addition, it is equipped with a function that can perform Drive Off judgment and stops (Hi-z output) the motor when
the Target RPM is 84.9 rpm or less (PWMB Duty is 99 % or more). And it restarts the motor in a timing that the Target
RPM is 424.6 rpm or more (PWMB Duty is 95 % or less).
8493
424.6
84.9
0
PWMIN DUTY [%]
100
95 99
0
Figure 10. PWMB Duty and Target RPM (10 poles Setting)
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16. Speed Feedback Control – Continued
16.2 Motor RPM Measurement
For the motor RPM, a half period of the internal FG signal is measured. This measured value is compared with a half
target period which is calculated from the Target RPM. And this difference is the speed error value. When the half
period of the internal FG signal is longer (the motor rotation speed is slow), the speed error value becomes minus. On
the other hand, when it is shorter (the motor rotation speed is fast), the speed error value becomes plus.
16.3 Setting of Motor Speed control
Built-in RAMP control drive and PI control drive. The setting method is shown in Table 9.
Table 9. The Motor Speed Control Setting
Start and Acceleration /
Deceleration Operation
Stable Operation
RAMP control drive
PI control drive
16.4 PI Control
It drives the closed-loop speed feedback control using the PI control. The Drive Control Duty (Drive control) is
calculated from the proportional gain (KP=1.0) and the integral gain (KI=0.0117) regarding the speed error value
(ERROR VALUE) measured in Internal FG Signal Period Measurement. The PI control block diagram is shown in
Figure 11.
KP
Drive control
ERROR VALUE
1/S
KI
Figure 11. The PI Control Block Diagram
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16. Speed Feedback Control – Continued
16.5 RAMP Control
The Drive Control Duty increases gradually when the speed error value is minus (the motor rotation speed is slow),
and decreases gradually when the speed error value is plus (the motor rotation speed is fast). So the real motor
rotation speed approaches the target motor rotation speed. An increase/decrease step width of the Drive Control Duty
is 0.49 % every 41.6 ms as shown in Figure 13.
Acceleration
Deceleration
Target Motor
Rotation Speed
Drive Control Duty
0.49 % Duty
Increase Gradually
41.6 ms
Decrease Gradually
time
Figure 12. The RAMP Control Function Summary
Figure 13. The RAMP Step
About shifting from the RAMP control to the PI control, the state shifts to the PI control when the speed error value is
settled with 1.57 % or less. In the large domain of the speed error value, the real motor rotation speed approaches the
target motor rotation speed operating the RAMP control. So the speed error value becomes small, it starts the PI
control. It facilitates parameter adjustment.
±1.57%
Target RPM
Change RAMP to PI Control
time
RAMP Control
PI Control
Figure 14. The State Switch from the RAMP Control to the PI Control
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Description of Operations – Continued
17. VCC50 Voltage
It is recommended to use the reference voltage circuit using an external NPN transistor about countermeasures for heat
generation. This circuit is shown in Figure 15. VCC50 voltage is 5 V (Typ) by this circuit. Current of 2.6 mA (Typ) to the VCC
pin and total current 10.4 mA (Typ) to the VCC50A and VCC50B pin flow.
VCC
VREG
FB50
VCC50A
VCC50B
VCC50
IC
Hall U
Hall V
Hall W
Figure 15. The Reference voltage circuit using external NPN transistor
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Thermal Resistance Model
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which
indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. Thermal resistance from
the chip junction to the ambient is represented in θJA (°C/W), and thermal characterization parameter from junction to the
top center of the outside surface of the component package is represented in ΨJT (°C/W). Thermal resistance is divided
into the package part and the substrate part. Thermal resistance in the package part depends on the composition materials
such as the mold resins and the lead frames. On the other hand, thermal resistance in the substrate part depends on the
substrate heat dissipation capability of the material, the size, and the copper foil area etc. Therefore, thermal resistance
can be decreased by the heat radiation measures like installing a heat sink etc. in the mounting substrate. The equations
are shown below and the thermal resistance model is shown in Figure 16.
Equation
푇푗ꢆ푇ꢇ
휃퐽퐴 =
휓퐽푇 =
[°C/W]
[°C/W]
ꢈ
푇푗ꢆ푇ꢉ
ꢈ
Where:
휃퐽퐴 is the thermal resistance from junction to ambient (°C/W)
휓퐽푇 is the thermal characterization parameter from junction
to the top center of the outside surface of the component package (°C/W)
ꢊꢋ is the junction temperature (°C)
ꢊ푎 is the ambient temperature (°C)
ꢊ푡 is the package outside surface (top center) temperature (°C)
푃
is the power consumption (W)
Ambient temperature: Ta (°C)
Package outside surface (top center)
temperature: Tt (°C)
ƟJA (°C/W)
Junction temperature: Tj (°C)
ΨJT (°C/W)
Mounting Substrate
Figure 16. Thermal Resistance Model of Surface Mount
Even if it uses the same package, θJA and ΨJT are changed depending on the chip size, power consumption and the
measurement environments of the ambient temperature, the mounting condition and the wind velocity, etc.
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I/O Equivalence Circuits
1) VREG, FB50 pin
2) VREG15 pin
3) PS pin
VCC50B
VREG15
VCC
Internal Reg
VCC50B
100 kΩ
VREG
FB50
1 kΩ 10 kΩ
10 kΩ
PS
5 kΩ
156 kΩ
50 kΩ
49 kΩ
80 kΩ
60 kΩ
24.4 kΩ
4) BRK pin
5) FR pin
6) SPI_EN pin
VCC50B
VCC50B
VCC50B
5 kΩ
5 kΩ
BRK
5 kΩ
10 kΩ
FR
SPI_EN
100 kΩ
200 kΩ
100 kΩ
10 kΩ
61.5 kΩ
×2
7) POLE_SEL, PWMB pin
8) SS_SEL pin
9) TDEAD_SEL pin
VCC50B
VCC50B
VCC50B
5 kΩ
PWMB
POLE_SEL
90 kΩ
90 kΩ
90 kΩ
90 kΩ
90 kΩ
90 kΩ
SS_SEL
10 kΩ
10 kΩ
TDEAD_SEL
10 kΩ
20 Ω
20 Ω
20 Ω
10) VG, UH, U, VH, V, WH, W pin
11) UL, VL, WL pin
12) FGO pin
VG
FGO
PREREGL
5 Ω
UH
VH
WH
UL
VL
WL
500 kΩ
500 kΩ
U
V
W
200 kΩ
120 kΩ 360 kΩ
24 kΩ
360 kΩ
360 kΩ
24 kΩ
13) CP pin
14) RCL pin
VCC50A
15) PREREGL pin
16) HUP, HUN, HVP,
HVN, HWP, HWN pin
HUP
Internal Reg
VCC
10 kΩ
250 kΩ
2 kΩ
HUN
HVP
HVN
HWP
HWN
25 Ω
2 kΩ
RCL
CP
PREREGL
×2
1000 kΩ
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 17. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Ordering Information
M U
V
B M 6
4
3
5
0
-
E 2
Part Number
Package
MUV: VQFN040V6060
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
VQFN040V6060 (TOP VIEW)
Part Number Marking
LOT Number
M 6 4 3 5 0
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
VQFN040V6060
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BM64350MUV
Revision History
Date
Revision
001
Changes
23.Jan.2019
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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