BM2P014-E [ROHM]

PWM type DC/DC converter IC Included 650V MOSFET; 脉宽调制型的DC / DC转换器集成电路包括650V MOSFET的


型号：	BM2P014-E
厂家：	ROHM
描述：	PWM type DC/DC converter IC Included 650V MOSFET 脉宽调制型的DC / DC转换器集成电路包括650V MOSFET的转换器
文件：	总19页 (文件大小：954K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

AC/DC Drivers

PWM type DC/DC converter IC

Included 650V MOSFET

BM2PXX4 Series

●General

The PWM type DC/DC converter (BM2PXX4) for

●Features

PWM frequency : 65kHz

PWM current mode method

AC/DC provide an optimum system for all products

that include an electrical outlet.

BM2PXX4 supports both isolated and non-isolated

devices, enabling simpler design of various types of

low-power electrical converters.

BM2PXX4 built in a HV starter circuit that tolerates

650V, it contributes to low-power consumption.

With current detection resistors as external devices, a

higher degree of design freedom is achieved. Since

current mode control is utilized, current is restricted in

each cycle and excellent performance is demonstrated

in bandwidth and transient response.

Burst operation when load is light

Frequency reduction function

Built-in 650V start circuit

Built-in 650V switching MOSFET

VCC pin under voltage protection

VCC pin overvoltage protection

SOURCE pin Open protection

SOURCE pin Short protection

SOURCE pin Leading-Edge-Blanking function

Per-cycle over current protection circuit

Soft start

The switching frequency is 65 kHz. At light load, the

switching frequency is reduced and high efficiency is

achieved.

A frequency hopping function is also on chip, which

contributes to low EMI.

Secondary Over current protection circuit

●Package

DIP7

9.20mm×6.35mm×4.30mm pitch 2.54mm

(Typ.) (Typ.) (Typ.) (TYP.)

We can design easily, because BM2PXX4 includes

the switching MOSFET.

●Basic specifications

Operating Power Supply Voltage Range:

VCC 8.9V to 26.0V DRAIN：～650V

Operating Current: Normal Mode

BM2P014 :0.950mA (Typ.)

●Applications

BM2P034 :0.775mA(Typ)

AC adapters and household appliances (vacuum

cleaners, humidifiers, air cleaners, air conditioners, IH

cooking heaters, rice cookers, etc.)

BM2P054 : 0.600mA(Typ)

BM2P094 : 0.500mA(Typ)

Burst Mode： 0.400mA(Typ.)

Oscillation Frequency:

Operating Temperature:

MOSFET ON Resistance:

65kHz(Typ.)

- 40deg. to +105deg.

●Line Up

BM2P014:1.4Ω(Typ)

BM2P034:2.4Ω(Typ)

BM2P054:4.0Ω(Typ)

BM2P094:8.5Ω(Typ)

●Application circuit

FUSE

Diode

Bridge

Filter

85265Vac

ERROR

AMP

Figure 1．Application circuit

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

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●Absolute Maximum Ratings（Ta=25°C）

Parameter

Symbol

Vmax1

Vmax2

Rating

-0.3～30

-0.3～6.5

650

Unit

Conditions

Maximum applied voltage 1

Maximum applied voltage 2

Maximum applied voltage 3

VCC

SOURCE, FB

DRAIN

P_W=10us, Duty cycle=1%

(BM2P014)

P_W=10us, Duty cycle=1%

(BM2P034)

P_W=10us, Duty cycle=1%

(BM2P054)

P_W=10us, Duty cycle=1%

(BM2P094)

Drain current pulse

I_DP

10.40

5.20

2.60

I_DP

1.30

2000

Allowable dissipation

Operating

temperature range

^oC

When implemented

Topr

-40 ～ +105

Storage

temperature range

Tstr

-55 ～ +150

^oC

(Note1) DIP7 : When mounted (on 74.2 mm × 74.2 mm, 1.6 mm thick, glass epoxy on single-layer substrate).

Reduce to 16 mW/°C when Ta = 25°C or above.

●Operating Conditions（Ta=25°C）

Parameter

Power supply voltage range 1

Power supply voltage range 2

Symbol

VCC

V_DRAIN

Rating

8.9～26.0

～650

Unit

Conditions

VCC pin voltage

DRAIN pin voltage

●Electrical Characteristics of MOSFET part (Unless otherwise noted, Ta = 25°C, VCC = 15 V)

Specifications

Standard

Parameter

Symbol

Unit

Conditions

Minimum

Maximum

[MOSFET Block ]

Between drain and

source voltage

Drain leak current

V_(BR)DDS

I_DSS

650

Ω

I_D=1mA / V_GS=0V

100

2.0

V_DS=650V / V_GS=0V

I_D=0.25A / V_GS=10V

(BM2P014)

I_D=0.25A / V_GS=10V

(BM2P034)

I_D=0.25A / V_GS=10V

(BM2P054)

I_D=0.25A / V_GS=10V

(BM2P094)

On resistance

R_DS(ON)

1.4

R_DS(ON)

2.4

4.0

8.5

3.6

5.5

Ω

12.0

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●Electrical Characteristics (Unless otherwise noted, Ta = 25°C, VCC = 15 V)

Specifications

Parameter

[Circuit current]

Symbol

Unit

Conditions

Minimum

Standard Maximum

BM2P014, FB=2.0V

( at pulse operation)

BM2P034, FB=2.0V

(at pulse operation)

BM2P054, FB=2.0V

(at pulse operation)

BM2P094, FB=2.0V

(at pulse operation)

Circuit current (ON) 1

I_ON1

I_ON2

700

550

410

350

950

775

600

500

400

1200

1050

790

µA

650

Circuit current (ON) 2

500

FB=0.0V(at burst operation)

[VCC protection function]

VCC UVLO voltage 1

VCC UVLO voltage 2

VCC UVLO hysteresis

VCC OVP voltage 1

VCC OVP voltage 2

Latch released VCC voltage

VCC Recharge start voltage

VCC Recharge stop voltage

Latch mask time

V_UVLO1

V_UVLO2

V_UVLO3

V_OVP1

V_OVP2

V_LATCH

V_CHG1

V_CHG2

T_LATCH

T_SD

12.50

7.50

13.50

8.20

5.30

27.5

23.5

V_UVLO2-0.5

8.70

13.00

100

14.50

8.90

°C

VCC rise

VCC drop

V_UVLO3=V_UVLO1-V_UVLO2

VCC rise

VCC drop

26.0

29.0

7.70

12.00

9.70

14.00

150

Thermal shut down temperature

110

Control IC

[PWM type DCDC driver block]

Oscillation frequency 1

Oscillation frequency 2

Frequency hopping width 1

Hopping fluctuation frequency

Soft start time 1

Soft start time 2

Soft start time 3

Soft start time 4

Maximum duty

F_SW1

F_SW2

F_DEL1

F_CH

T_SS1

T_SS2

T_SS3

T_SS4

D_max

R_FB

4.0

125

0.50

1.00

2.00

8.00

75.0

175

0.70

1.40

2.80

11.20

82.0

KHz FB=2.00V

KHz FB=0.40V

KHz FB=2.0V

0.30

0.60

1.20

4.80

68.0

FB pin pull-up resistance

ΔFB / ΔCS gain

FB burst voltage

kΩ

V/V

Gain

V_BST

4.00

0.400

0.300

0.500

FB drop

FB voltage of

V_DLT

1.100

1.250

1.400

starting Frequency reduction mode

FB OLP voltage 1a

FB OLP voltage 1b

FB OLP ON timer

FB OLP Start up timer

FB OLP OFF timer

V_FOLP1A

V_FOLP1B

T_FOLP1

T_FOLP1b

T_FOLP2

2.60

358

2.80

2.60

512

3.00

666

Overload is detected (FB rise)

Overload is detected (FB drop)

[Over current detection block]

Overcurrent detection voltage

V_CS

0.380

0.400

0.100

0.150

0.200

0.300

250

0.420

Ton=0us

Overcurrent detection voltage SS1

Overcurrent detection voltage SS2

Overcurrent detection voltage SS3

Overcurrent detection voltage SS4

Leading Edge Blanking Time

V_{CS_SS1}

V_{CS_SS2}

V_{CS_SS3}

V_{CS_SS4}

T_LEB

0[ms] ~ Tss1[ms]

TSS1 [ms] ~ TSS2 [ms]

TSS2 [ms] ~ TSS3[ms]

TSS3 [ms] ~ TSS4 [ms]

Over current detection AC Voltage

compensation factor

SOURCE pin

K_CS

mV/us

V_CSSHT

0.020

0.050

0.080

short protection voltage

[ Start circuit block ]

Start current 1

Start current 2

I_START1

I_START2

0.100

1.000

0.500

3.000

1.000

6.000

VCC= 0V

VCC=10V

Inflow current from Drain pin

after UVLO released UVLO.

When MOSFET is OFF

OFF current

I_START3

V_SC

Start current switching voltage

0.800

1.500

2.100

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●PIN DESCRIPTIONS

Table 1 Pin Description

Function

ESD Diode

VCC GND

NO.

Pin Name

I/O

SOURCE

N.C.

I/O

MOSFET SOURCE pin

○

GND

I/O

GND pin

Feedback signal input pin

Power supply input pin

MOSFET DRAIN pin

○

VCC

DRAIN

I/O

●I/O Equivalent Circuit Diagram

Figure 2 I/O Equivalent Circuit Diagram

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●Block Diagram

FUSE

Diode

Bridge

Filter

VCC UVLO

13.5V

/8.2V

Starter

4.0V

Line Reg

VCC OVP

100us

Filter

10uA

12V Clamp

Circuit

27.5V

Internal Block

DRIVER

PWM Control

4.0 V

30k

OLP

64ms

Timer

Current

Limiter

Leading Edge

Blanking

Burst

Comparator

(typ=250ns)

AC Input

Compensation

Soft Start

PWM

Comparator

MAX

DUTY

Frequency

Hopping

OSC

(65kHz)

Slope

Compensation

FeedBack

With

Isolation

Figure 3. Block Diagram

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●Description of Blocks

( 1 ) Start circuit (DRIAN : 6,7pin)

This IC built in Start circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting.

After starting, consumption power is idling current I_START3（typ=10uA） only.

Reference values of Starting time are shown in Figure-7. When Cvcc=10uF it can start less than 0.1 sec.

FUSE

Diode

Bridge

85-265 Vac

DRAIN

SW1

VCC

Cvcc

VCCUVLO

Figure 4. Block diagram of start circuit

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

Cvcc [uF]

Figure 5. Start current vs VCC voltage

* Start current flows from the DRAIN pin

Figure 6. Start time( reference value)

ex) Consumption power of start circuit only when the Vac=100V

PVH＝100V*√2*10uA=1.41mW

ex) Consumption power of start circuit only when the Vac=240V

PVH＝240V*√2*10uA=3.38mW

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(2 ) Start sequences

(Soft start operation, light load operation, and auto recovery operation during overload protection)

Start sequences are shown in Figure 7. See the sections below for detailed descriptions.

VCC=13.5V

VCC(1pin)

VCC=8.2V

Within

32ms

Within

32ms

Within

32ms

Internal REF

Pull Up

FB(8pin)

Vout

Iout

Over Load

Normal Load

Light LOAD

Burst mode

Switching

stop

Switching

Soft

Start

G H

I J

Figure 7. Start sequences Timing Chart

A : Input voltage VH is applied

B : This IC starts operating VCC pin voltage rises when VCC > V_UVLO1(13.5 V typ).

Switching function starts when other protection functions are judged as normal.

Between the secondary output voltage become constant level, because the VCC pin consumption current causes the VCC

value to drop, IC should set to start switching until VCC<V_UVLO2(8.2V typ).

C : With the soft start function, overcurrent limit value is restricted to prevent any excessive rise in voltage or current.

D : When the switching operation starts, VOUT rises.

Once the output voltage starts, set the rated voltage within the T_FOLPperiod (32ms typ).

E : When there is a light load it reaches FB voltage < V_BST(= 0.4Vtyp, burst operation is used to keep power consumption

down.

During burst operation, it becomes low-power consumption mode.

F : When the FB Voltage＞V_FOLP1A（=2.8V.typ）, it becomes a overload

G: When FB pin voltage keeps V_FOLP1A(= 2.8V typ) at or above T _FOLP(32ms typ), the overload protection function is triggered

and switching stops. During the T_FOLPperiod (32ms typ) if the FB pin voltage becomes FB<V_FOLP1Beven once, the IC’s

internal timer is reset.

H : If the VCC voltage drops to VCC < V_UVLO2(7.7Vtyp) or below, restart is executed.

I : The IC’s circuit current is reduced and the VCC pin value rises. (Same as B)

J : Same as F

K : Same as G

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(3) VCC pin protection function

BM2PXX4 built in VCC low voltage protection function of VCCUVLO (Under Voltage Lock Out), over voltage protection

function of VCC OVP (Over Voltage Protection) and VCC charge function that operates in case of dropping the VCC

voltage.

This function monitors VCC pin and prevent VCC pin from destroying switching MOSFET at abnormal voltage.

VCC charge function stabilizes the secondary output voltage to be charged from the high voltage line by start circuit at

dropping the VCC voltage.

(3-1) VCC UVLO ／ VCC OVP function

VCCUVLO is auto recovery comparator. VCCOVP is auto recovery comparator that has voltage hysteresis.

Refer to the operation figure-8.

VCCOVP operates detection in case of continuing VCC pin voltage > V_OVP（typ=27.5V）.

This function built in mask time T_LATCH（typ=100us）.By this function, this IC masks pin generated surge etc.

Vovp1=27.5Vtyp

Vovp1=23.5Vtyp

VCCuvlo1=13.5Vtyp

Vchg1=13.0Vtyp

Vchg2= 8.7Vtyp

VCCuvlo2 8.2Vtyp

OFF

Figure 8. VCC UVLO / OVP Timing Chart

A:DRAIN voltage input, VCC pin voltage starts rising.

B:VCC>Vuvlo1, DC/DC operation starts

C:VCC< V_CHG1, VCC charge function operates and the VCC voltage is rise.

D:VCC > V_CHG2,VCC charge function is stopped.

E:VCC > V_OVP1continues T_LATCH(typ =100us), switching is stopped by the VCCOVP function.

F:VCC < V_OVP2, DC/DC operation restarts

G:VH is OPEN.VCC Voltage is fall.

H:Same as C.

I:Same as D.

J: VCC<Vuvlo2, DC/DC operation stops

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（3-2）VCC Charge function

VCC charge function operates once the VCC pin >V_UVLO1and the DC/DC operation starts then the VCC pin voltage drops

to <V_CHG1. At that time the VCC pin is charged from DRAIN pin through start circuit.

By this operation, BM2PXX4 doesn’t occur to start failure.

VCC pin voltage is rise, then VCC >V_CHG2,charge is stopped. The operations are shown in figure-10.

V_UVLO1

V_CHG2

VCC

V_CHG1

V_UVLO2

Switching

VH charge

charge

OUTPUT

voltage

B C D E

F G H

Figure 9. Charge operation VCC pin charge operation

A:DRAIN pin voltage rises, charge starts to VCC pin by the VCC charge function.

B:VCC > V_UVLO1,VCC UVLO function releases, VCC charge function stops, DC/DC operation starts.

C:When DC/DC operation starts, the VCC voltage drops.

D:VCC < V_CHG1,VCC recharge function operates.

E:VCC > V_CHG2,VCC recharge function stops.

F:VCC < V_CHG1,VCC recharge function operates.

G:VCC < V_CHG1,VCC recharge function stops.

H:After start of output voltage finished, VCC is charged by the auxiliary winding VCC pin stabilizes.

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( 4 ) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)

BM2PXX4 is current mode PWM control.

An internal oscillator sets a fixed switching frequency (65kHz typ).

BM2PXX4 is integrated switching frequency hopping function which changes the switching frequency to fluctuate as

shown in Figure 11 below.

The fluctuation cycle is 125 Hz typ.

Switching Frequency

[kHz]

500us

125 Hz(8ms)

Time

Figure 10. Frequency hopping function

Max duty cycle is fixed as 75% (typ) and MIN pulse width is fixed as 400 ns (typ).

With current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur.

As a countermeasure to this, BM2PXX4 is built in slope compensation circuits.

BM2PXX4 is built in burst mode circuit and frequency reduction circuit to achieve lower power consumption, when the load

is light.

FB pin is pull up by R_FB(30 kΩ typ).

FB pin voltage is changed by secondary output voltage (secondary load power).

FB pin is monitored, burst mode operation and frequency detection start.

Figure 11 shows the FB voltage, and switching frequency, DCDC operation

・mode1 : Burst operation

・mode2: Frequency reduction operation.

・mode3 : Fixed frequency operation.(operate at the max frequency)

・mode4 : Over load operation.(detect the over load state and stop the pulse operation)

Figure 11. Switching operation state changes by FB pin voltage

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(5) Over Current limiter

BM2PXX4 is built in Over Current limiter per cycle. If the SOURCE pin over a certain voltage, switching is stopped. It is also

built in AC voltage compensation function. The function is rise over current limiter level by time to compensate AC voltage.

Shown in figure-12,13, 14.

Figure 12. No AC voltage compensation function

Figure13. buit-in AC compensation voltage

Primary peak current is decided as the formula below.

Primary peak current: Ipeak = Vcs/Rs + Vdc/Lp*Tdelay

Vcs：Over current limiter voltage internal IC, Rs：Current detection resistance, Vdc input DC voltage, Lp：Primary inductance,

Tdelay：delay time after detection of over current limiter

Figure 14. Over current limiter voltage

（6）L.E.B blanking period

When the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current.

Therefore, when SOURCE pin voltage rises temporarily, the detection errors may occur in the over current limiter circuit.

To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250 ns by the on-chip

LEB (Leading Edge Blanking) function.

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(7) SOURCE pin (1pin) short protection function

When the SOURCE pin (1pin) is shorted, BM2PXX4 is over heat.

BM2PXX4 built in short protection function to prevent destroying.

(8) SOURCE pin (1pin) open protection

If the SOURCE pin becomes OPEN, BM2PXX4 may be damaged.

To prevent to be damaged, BM2PXX4 built in OPEN protection circuit（auto recovery protection）.

(9) Output over load protection function （FB OLP Comparator）

The output overload protection function monitors the secondary output load status at the FB pin, and stops switching when

an overload occurs. When there is an overload, the output voltage is reduced and current no longer flows to the photo

coupler, so the FB pin voltage rises.

When the FB pin voltage > V_FOLP1A(2.8 V typ) continuously for the period T_FOLP(32ms typ), it is judged as an overload and

stops switching.

When the FB pin > V_FOLP1A(2.8 V typ), if the voltage goes lower than V_FOLP1B(2.6V typ) during the period T_FOLP(32ms typ),

the overload protection timer is reset. The switching operation is performed during this period T_FOLP(32ms typ).

At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of V_FOLP1A(2.8 V typ) or

above. Therefore, at startup the FB voltage must be set to go to V_FOLP1B(2.6 Vtyp) or below during the period T_FOLP(32ms

typ), and the secondary output voltage’s start time must be set within the period T_FOLP(32ms typ) following startup of the IC.

Recovery from the once detection of FBOLP, after the period T_FOLP2(512 ms typ)

Figure 15. Over load protection (Auto recovery)

A: The FBOLP comparator detects over load for FB>V_FOLP1A

B: States of A continuously for the period T_FOLP(32ms typ), it is judged as an overload and stops switching.

C: While switching stops for the over load protection function, the VCC pin voltage drops and VCC pin voltage reaches

< V_CHG, the VCC charge function operates so the VCC pin voltage rises.

D: VCC charge function stops when VCC pin voltage > V_CHG2

E: If T_OLPST（typ =512ms） go on from B point, Switching function starts on soft start.

F: If T_FOLP（typ=32ms） go on from E point to continues a overload condition (FB>V_FOLP1A),Switching function stops at F point.

G: While switching stops VCC pin voltage drops to < V_CHG1,VCC charge function operates and VCC pin voltage rises.

H: If VCC pin (1pin) voltage becomes over V_CHG2by the VCC charge function, VCC charge function operation stops

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●Operation mode of protection circuit

Operation mode of protection functions are shown in table2.

Table2 Operation mode of protection circuit

Function

Operation mode

VCC Under Voltage Locked Out

VCC Over Voltage Protection

TSD

Auto recovery

Latch（with 100us timer）

Auto recovery（with 64ms timer）

FB Over Limited Protection

SOURCE Short Protection

SOURCE Open Protection

Auto recovery

●Sequence

The sequence diagram is show in Fig 16.

All condition transits OFF Mode VCC<8.2V

VCC<8.2V

ALL MODE

OFF MODE

13.5V

Soft Start 1

Time>0.5ms

Soft Start 2

Time>1.0ms

Soft Start3

Time>2.0ms

VCC<7.7V

VCC OVP

(Pulse Stop)

Soft Start

SOURCE OPEN

(Pulse Stop )

Time>8.0ms

VCC<23.5V

NORMAL

FBOLP

OFF TIMER

(512ms)

OPEN

VCC>27.5V

Temp>145℃

LATCH OFF MODE

(Pulse Stop)

Normal MODE

FB>2.80V

NORMAL

SHORT

FB<0.40V

FB>0.40V

FB>2.80V

(32ms)

FB<2.60V

SOURCE SHORT

(Pulse Stop)

OLP MODE

(Pulse Stop)

PULSE OFF

Burst MODE

(Pulse OFF )

Figure 16. The sequence diagram

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● Thermal loss

The thermal design should set operation for the following conditions.

(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)

1. The ambient temperature Ta must be 105℃ or less.

2. The IC’s loss must be within the allowable dissipation Pd.

The thermal abatement characteristics are as follows.

(PCB: 74.2 mm × 74.2mm × 1.6 mm, mounted on glass epoxy substrate)

3000

2500

2000

1500

1000

500

100

125

150

Ta[℃]

Figure 17. DIP7 Thermal Abatement Characteristics

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BM2PXX4 Series

●Ordering Information

B M

Package

None: DIP7

Product

name

Packaging and forming specification

None: Tube

●Physical Dimension Tape and Reel Information

DIP7

Container

Quantity

Tube

2000pcs

Direction of feed Direction of products is fixed in a container tube

Order quantity needs to be multiple of the minimum quantity.

∗

●Making Diagram

●Line-Up

DIP7

Product name (BM2PXX4)

BM2P014

BM2P034

BM2P054

BM2P094

www.rohm.com

TSZ22111・15・001

TSZ02201-0F2F0A200070-1-2

28.NOV.2012.Rev.003

15/16

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BM2PXX4 Series

● Use-related cautions

(1) Absolute maximum ratings

Damage may occur if the absolute maximum ratings such as for applied voltage or operating temperature range are

exceeded, and since the type of damage (short, open circuit, etc.) cannot be determined, in cases where a particular

mode that may exceed the absolute maximum ratings is considered, use of a physical safety measure such as a

fuse should be investigated.

(2) Power supply and ground lines

In the board pattern design, power supply and ground lines should be routed so as to achieve low impedance. If there

are multiple power supply and ground lines, be careful with regard to interference caused by common impedance in

the routing pattern. With regard to ground lines in particular, be careful regarding the separation of large current routes

and small signal routes, including the external circuits. Also, with regard to all of the LSI’s power supply pins, in

addition to inserting capacitors between the power supply and ground pins, when using capacitors there can be

problems such as capacitance losses at low temperature, so check thoroughly as to whether there are any problems

with the characteristics of the capacitor to be used before determining constants.

(3) Ground potential

The ground pin’s potential should be set to the minimum potential in relation to the operation mode.

(4) Pin shorting and attachment errors

When attaching ICs to the set board, be careful to avoid errors in the IC’s orientation or position. If such attachment

errors occur, the IC may become damaged. Also, damage may occur if foreign matter gets between pins, between a pin

and a power supply line, or between ground lines.

(5) Operation in strong magnetic fields

Note with caution that these products may become damaged when used in a strong magnetic field.

(6) Input pins

In IC structures, parasitic elements are inevitably formed according to the relation to potential. When parasitic

elements are active, they can interfere with circuit operations, can cause operation faults, and can even result in damage.

Accordingly, be careful to avoid use methods that enable parasitic elements to become active, such as when a voltage

that is lower than the ground voltage is applied to an input pin. Also, do not apply voltage to an input pin when there is no

power supply voltage being applied to the IC. In fact, even if a power supply voltage is being applied, the voltage applied

to each input pin should be either below the power supply voltage or within the guaranteed values in the electrical

characteristics.

(7) External capacitors

When a ceramic capacitor is used as an external capacitor, consider possible reduction to below the nominal

capacitance due to current bias and capacitance fluctuation due to temperature and the like before determining

constants.

(8) Thermal design

The thermal design should fully consider allowable dissipation (Pd) under actual use conditions.

Also, use these products within ranges that do not put output Tr beyond the rated voltage and ASO.

(9) Rush current

In a CMOS IC, momentary rush current may flow if the internal logic is undefined when the power supply is turned ON,

so caution is needed with regard to the power supply coupling capacitance, the width of power supply and GND pattern

wires, and how they are laid out.

(10) Handling of test pins and unused pins

Test pins and unused pins should be handled so as not to cause problems in actual use conditions, according to the

descriptions in the function manual, application notes, etc. Contact us regarding pins that are not described.

(11) Document contents

Documents such as application notes are design documents used when designing applications, and as such their

contents are not guaranteed. Before finalizing an application, perform a thorough study and evaluation, including for

external parts.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority

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TSZ02201-0F2F0A200070-1-2

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28.NOV.2012.Rev.003

TSZ22111・15・001

Daattaasshheeeett

Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Notice - Rev.003

Daattaasshheeeett

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2) You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Property Rights

1) All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Notice - Rev.003

Daattaasshheeeett

●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - Rev.003

BM2P014-E [ROHM]

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