BM2LB150FJ-C [ROHM]
2ch Low Side Switch IC;
| 型号： | BM2LB150FJ-C |
| 厂家： | 
ROHM |
| 描述： | 2ch Low Side Switch IC |
| 文件： | 总17页 (文件大小：899K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Automotive IPD Series
2ch Low Side Switch IC
BM2LB150FJ-C
Features
Product Summary
■ Built-in overcurrent limiting circuit(OCP)
■ Built-in thermal shutdown circuit (TSD)
■ Direct control enabled from CMOS logic IC, etc.
■ Low On resistance RDS(ON) up to 150 m
(when VIN=5V, ID=0.5A, Tj=25°C)
On-state resistance (Tj =25°C, Typ)
Overcurrent limit (Tj =25°C, Typ)
Output clamp voltage (Min)
150mΩ
10A
42V
Active clamp energy (Tj =25°C)
165mJ
■ Monolithic power management IC with the control
block (CMOS) and power MOS FET mounted on a
single chip
■ Surface mount package SOP-J8
(Note 1)
■ AEC-Q100 Qualified
Package
W(Typ) x D(Typ) x H(Max)
4.90mm x 6.00mm x 1.65mm
(Note 1) Grade1
SOP-J8
General Description
The BM2LB150FJ-C is an automotive 2ch low side
switch IC, which has built-in overcurrent limiting circuit,
thermal shutdown circuit, and overvoltage (active clamp)
protection circuit.
Applications
2ch low side switch for driving resistive, inductive load,
Capacitive load
Block Diagram
Active Clamp
Circuit
Thermal
Shutdown
Circuit
Overcurrent
Limiting
Circuit
Active Clamp
Circuit
Overcurrent
Limiting
Circuit
Thermal
Shutdown
Circuit
Product structure: Silicon monolithic integrated circuit
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Pin Descriptions
Pin No.
Symbol
GND1
IN1
Function
1
2
3
4
5
6
7
8
GND pin1
Input pin1 (Note1)
GND pin2
GND2
IN2
Input pin2 (Note1)
Output pin2
Output pin2
Output pin1
Output pin1
OUT2
OUT2
OUT1
OUT1
(Note1) Input pin is used to internally connect a pull-down resistor.
Pin Configurations
BM2LB150FJ
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Absolute Maximum Ratings (Tj =25°C)
Parameter
Symbol
VDS
VIN
Rating
-0.3 to +42 (Note1)
-0.3 to +7
Unit
V
Drain-Source voltage in output block
Input voltage
V
(Note2)
Output current (DC)
ID
6.5(internally limited)
A
Active clamp energy (Single pulse)
T
EAS(25°C)
165
60
j(start) = 25°C (Note3)
mJ
Active clamp energy (Single pulse)
j(start) = 150°C (Note3) (Note4)
EAS(150°C)
T
Operating temperature range
Storage temperature range
Maximum junction temperature
Tj
-40 to +150
-55 to +150
150
°C
°C
°C
Tstg
Tjmax
(Note1) Please refer to P.12 “Operation Notes”, when is used at less than -0.3V.
(Note2) Internally limited by the overcurrent limiting circuit.
(Note3) Min Active clamp energy, using single non-repetitive pulse of 1.0A.
(Note4) No00% ted.
Thermal resistance
Parameter
Symbol
PD(1)
Rating
Unit
W
(1ch ON)
Power dissipation (Note5)
1.47
2.00
(2ch ON at once)
PD(2)
W
(Note5) When mounted on a PCB (two-layer glass epoxy board measuring 76.2 114.3 [mm], 1.6 [mm] thick, with a copper foil area of 74.2 74.2 [mm])
Heat Dissipation Characteristic
3.00
2.50
2.00
1.50
1.00
0.50
0.00
(1) 1ch ON
(2) 2ch ON at once
(2)2.00 W
(1)1.47 W
0
25
50
75
Tj [°C]
100
125
150
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Electrical Characteristics (Unless otherwise specified, 40CTj150C and VIN3.0V to 5.5V)
Limit
Parameter
Symbol
Unit
Conditions
VIN=0V,ID=1mA
Min
42
Typ
48
Max
54
Output clamp voltage
VCL
V
mΩ
mΩ
mΩ
mΩ
μA
μA
μs
On-state resistance 1 (at 25C)
RON1
-
150
260
200
340
0
190
320
250
420
4
VIN=5V,ID=0.5A,Tj=25°C
VIN=5V,ID=0.5A,Tj=150°C
VIN=3V,ID=0.5A, Tj=25°C
VIN=3V,ID=0.5A,Tj=150°C
VIN=0V,VDS=18V,Tj=25°C
VIN=0V,VDS=18V,Tj=150°C
On-state resistance 1 (at 150C) RON2
On-state resistance 2 (at 25C) RON3
On-state resistance 2 (at 150C) RON4
-
-
-
Leakage current (at 25C)
Leakage current (at 150C)
Turn-ON time
VIL1
-
VIL
-
2
25
２
VIN=0V/5V, RL=15Ω, VB=12V,
Tj=25°C
tON
tOFF
SRON
SROFF
VTH
-
-
-
80
VIN=0V/5V, RL=15Ω, VB=12V,
Tj=25°C
Turn-OFF time
-
μs
80
VIN=0V/5V, RL=15Ω, VB=12V,
Tj=25°C
Slew rate on
0.5
1.0
-
V/μs
V/μs
V
-
1.0
2.0
2.7
300
450
10
VIN=0V/5V, RL=15Ω, VB=12V,
Tj=25°C
Slew rate off
-
ID=1mA
VIN=5V
Input threshold voltage
High-level input current
1.1
-
IINH1
IINH2
IINL
150
250
0
μA
μA
μA
A
High-level input current
(in abnormal operation)
-
VIN=5V
Low-level input current
VIN=0V
-10
6.5
150
130
-
Overcurrent detection current
TSD detection temperature(Note1)
TSD release temperature(Note1)
TSD hysteresis(Note1)
IOCP
Tjd
10.0
175
-
13.5
-
VIN=5V, Tj=25°C
VIN=5V
°C
Tjr
-
°C
VIN=5V
⊿Tjd
15
-
°C
VIN=5V
(Note1) Not 100% tested.
Terms
Figure 1. Terms
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Measuring circuit
ID=1.0mA
ID =0.5A
OUT
GND
OUT
GND
VCL
RON = VDS / ID
V
V
IN
IN
VIN
Figure 3. On-state resistance measuring circuit
Figure 2. Output clamp voltage measuring circuit
VB=12V
15
R
L
=
Ω
OUT
GND
V
IN
VIN 0V/ 5V
=
Figure 4. tON・tOFF measuring circuit
I/O Pin Truth Table
Operating Status
Input Signal
Output Level
Output Status
H
L
L
ON
OFF
Normal
Overcurrent
Overheat
H
H
L
Clamp
Current Limiting
OFF
H
H
H
H
L
OFF
OFF
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Typical Performance Curves (Unless otherwise specified, Tj=25°C, VIN=5.0V)
250
200
150
100
50
300
250
200
150
100
50
0
0
0
1
2
3
4
5
6
7
-40 -10
20
50
80 110 140 170
Input Voltage V [V]
Channel Temperature Tj [ ]
℃
IN
Figure 6. On-state Resistance Characteristics
[Temperature Characteristics]
Figure 5. On-state Resistance Characteristics
[Input Voltage Characteristics]
250
200
150
100
50
250
200
150
100
50
0
0
0
1
2
3
4
5
6
7
-40 -10
20
50
80 110 140 170
Input Voltage V [V]
IN
Channel Temperature Tj [
]
℃
Figure 8. Input Current Characteristics
[Temperature Characteristics]
Figure 7. Input Current Characteristics
[Input Voltage Characteristics]
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12
10
8
12
10
8
VIN =7V
6V
5V
4V
6
6
3V
4
4
2
2
0
0
0
1
2
3
4
5
6
-40 -10
20
50
80 110 140 170
Output Voltage VDS [V]
Channel Temperature Tj [
]
℃
Figure 10. Overcurrent Detection Current Characteristics
[Temperature Characteristics]
Figure 9. Overcurrent Detection Current Characteristics
[Input Voltage Characteristics]
175
70
60
150
125
100
75
50
tOFF
40
tON
tON
30
50
20
10
0
tOFF
25
0
0
1
2
3
4
5
6
7
-40 -10
20
50
80 110 140 170
Input Voltage V [V]
INꢀ
Channel Temperature Tj [
]
℃
Figure 11. Turn-ON/Turn-OFF Time Characteristics
[Input Voltage Characteristics]
Figure 12. Turn-ON/Turn-OFF Time Characteristics
[Temperature Characteristics]
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2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
-40 -10
20
50
80 110 140 170
Channel Temperature Tj [
]
℃
Figure 13. Input Threshold Voltage Characteristics
[Temperature Characteristics]
Timing Chart
Figure 14. Behavior Sequence
Figure 15. Inductive Load Operation
Figure 16. Switching Time
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Ordering Information
B
M
2
L
B
1
5
0
F
J
-
CE2
Package
FJ：SOP-J8
Packaging and forming specification
C: High-reliability product
E2: Embossed tape and reel
Marking Diagram
SOP-J8(TOP VIEW)
Part Number Marking
LOT Number
2 L B 1 5
1PIN MARK
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Physical Dimension Tape and Reel Information
Package Name
SOP-J8
<Packaging Specification>
Packaging style
Embossed carrier tape
Quantity packaged
Direction of
Pin 1 should come to the top left when you hold the reel with your
left hand and feed the tape with your right hand.
feed
Direction of feed
Pin 1
Reel
Note: An order should be placed in multiples of the quantity packaged.
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Operational Notes
1. Grounding Interconnection Pattern
When a small-signal ground and a high-current ground are used, it is recommended to isolate the high-current
grounding interconnection pattern and the small-signal grounding interconnection pattern and establish a single
ground at the reference point of a set so that voltage changes due to the resistance and high current of patterned
interconnects will not cause any changes in the small-signal ground voltage. Pay careful attention to prevent changes
in the interconnection pattern of ground for external components.
The ground lines must be as short and thick as possible to reduce line impedance.
2. Thermal Design
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd)
in actual operating conditions.
3. Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit
protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
4. Inspections on Set Board
If a capacitor is connected to a low-impedance pin in order to conduct inspections of the IC on a set board, stress may
apply to the IC. To avoid that, be sure to discharge the capacitor in each process. In addition, to connect or disconnect
the IC to or from a jig in the testing process, be sure to turn OFF the power supply prior to connecting the IC, and
disconnect it from the jig only after turning OFF the power supply. Furthermore, in order to protect the IC from static
electricity, establish a ground for the IC assembly process and pay utmost attention to transport and store the IC.
5. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
6. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
7. Thermal Shutdown Circuit
This IC has a built-in thermal shutdown circuit as an overheat-protection measure. The circuit is designed to turn
OFF output when the temperature of the IC chip exceeds 175C (Typ) and return the IC to the normal operation
when the temperature falls below 150C (Typ).
The thermal shutdown circuit is a circuit absolutely intended to protect the IC from thermal runaway, not intended
to protect or guarantee the IC. Consequently, do not operate the IC based on the subsequent continuous use or
operation of the circuit.
8. Overcurrent Limiting Circuit
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
9. Overvoltage (Active Clamp) Protection Function
This IC has a built-in overvoltage protection function in order for the IC to absorb counter-electromotive
force energy generated when inductive load is turned OFF. Since the input voltage is clamped at 0V
when the active clamp circuit is activated, the thermal shutdown circuit is disabled. Design a thermal
solution so that the chip temperature will definitely come to less than 150C.
10. Counter-electromotive Force
Fully ensure that the counter-electromotive force presents no problems
in the operation or the IC.
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Operational Notes – continued
11. Negative Current of Output
When supply a negative current from DRAIN terminal in the state that supplied the voltage to IN terminal. The current
pass from IN terminal to DRAIN terminal through a parasitic transistor and voltage of IN terminal descend as shown in
figure.17 and figure.18.
As shown in figure.17 power MOS is turned on, set the DRAIN terminal is more than -0.3V. Because a negative current
may be passed to DRAIN terminal from a power supply of the connection of the IN terminal (MCU, and so on).
As shown in figure.18 power MOS is turned off, add a restriction resistance higher than 330 Ω to IN terminal. Because
a negative current may be passed to DRAIN terminal from GND of the connection of the IN terminal.
The restriction resistance value, set up in consideration of the voltage descent caused by the IN terminal current.
MCU
SOURCE
P+
330Ω
IN
N+
N+
N+
N+
N+
P－
Parasitic Element
P－
N-epi
N+sub
DRAIN
Figure 17. Negative current pass(when power MOS is turned on)
MCU
SOURCE
P+
330Ω
IN
N+
N+
N+
N+
N+
P－
Parasitic Element
P－
N-epi
N+sub
DRAIN
Figure 18. Negative current pass(when power MOS is turned off)
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Revision History
Date
Revision
Changes
New Release
09.Jan.2014
001
002
・General Description
“BM2LB180” → “BM2LB150”
・Ordering Information is change.
“BM2LB180” → “BM2LB150”
25.Dec.2015
01.Aug.2016
P.1 “Features” Add “AECQ100-012 Grade”
P.1 “Applications” Add “Capacitive load”
P.1 “Package” Add “W(Typ) x D(Typ) x H(Max)”
P.4 ”Electrical Characteristics” Turn-ON(OFF) time UNIT change
P.12 “Operational Notes” Modify some sentence.
003
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
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Datasheet
Buy
BM2LB150FJ-C - Web Page
Distribution Inventory
Part Number
Package
BM2LB150FJ-C
SOP-J8
Unit Quantity
2500
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
2500
Taping
inquiry
Yes
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