BM1Z102FJ [ROHM]
本产品是检测交流电压过零时序和高精度输出二极管整流后的DC电压的IC。无需以往用途中所需的光电耦合器和外接零部件，大幅度减少了部件个数，可实现小型、高可靠性的电源应用。而且，与以往的光电耦合器控制相比，有助于大幅度降低待机功耗。;
| 型号： | BM1Z102FJ |
| 厂家： | 
ROHM |
| 描述： | 本产品是检测交流电压过零时序和高精度输出二极管整流后的DC电压的IC。无需以往用途中所需的光电耦合器和外接零部件，大幅度减少了部件个数，可实现小型、高可靠性的电源应用。而且，与以往的光电耦合器控制相比，有助于大幅度降低待机功耗。 光电 二极管 |
| 文件： | 总23页 (文件大小：1291K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
AC Voltage Zero Cross Detection IC
BM1Z102FJ BM1Z103FJ
General Description
Key Specifications
VCC Input Power Supply Voltage Range:
-0.3 V to +29.0 V
VH_AC1 and VH_AC2 Pins Operation Voltage:
600 V (Max)
This IC outputs the AC voltage zero cross timing
detection and the DC voltage after diode rectification with
high accuracy.
By eliminating the need for photocoupler and external
components required in conventional applications, it is
possible to reduce the number of parts drastically and
realize compact and highly reliable power supply
applications. In addition, this IC can reduce standby
power largely in comparison with an existing
photocoupler control.
VH_DC Pin Operation Voltage:
Circuit Current at Standby:
Circuit Current at Operation:
Operating Temperature Range:
600 V (Max)
50 µA (Typ)
160 µA (Typ)
-40 °C to +105 °C
Package
SOP-J11
W (Typ) x D (Typ) x H (Max)
8.65 mm x 6.0 mm x 1.65 mm
Pitch (Typ): 1.27 mm
Features
AC Zero Cross Detection Function
Eliminates Photocoupler
600 V High Voltage Monitor
Modifiable Zero Cross Delay Time
n Channel Open Drain Output
DC Voltage Monitor Function
600 V High Voltage Monitor
VCC Under Voltage Locked Out (VCC UVLO)
Applications
Household Appliances such as Rice Cooker and
Lineup
Product Name
Dryer, etc.
ACOUT Pin Output Waveform
BM1Z102FJ
BM1Z103FJ
Pulse
Edge
Typical Application Circuit
Motor
AC/DC
BM2P Series
Filter
DC/DC
BD9E Series
Motor
Driver
BM1Z10xFJ
Others
μ-Com
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
.
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Pin Configuration
(TOP VIEW)
11
10
9
1
2
3
4
5
6
7
N. C.
N. C.
VH_AC1
VH_AC2
ACOUT
DCOUT
GND
VH_DC
N. C.
DSET
8
VCC
Pin Descriptions
Pin No.
Pin Name
Function
1
2
N.C.
N.C.
Non connection
Non connection
3
ACOUT
DCOUT
GND
AC voltage zero cross timing output pin
DC voltage output pin
4
5
Ground pin
6
DSET
VCC
AC voltage zero cross delay time setting pin
Power supply pin
7
8
N.C.
Non connection (Do not connect to any pins.)
DC voltage input pin
9
VH_DC
10
11
VH_AC2 AC voltage input 2 pin
VH_AC1 AC voltage input 1 pin
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Block Diagram
Motor
AC/DC
Filter
Motor
Driver
DC/DC
Others
VH_DC
VCC
Internal
Reg.
UVLO
DCOUT
DSET
600 V
DC Monitor
Output
Block
VH_AC2
VH_AC1
μ-Com
ACOUT
Zero
Cross
Detection
Timing
Adjustment
600 V
AC Monitor
GND
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Description of Blocks
1. AC Voltage Zero Cross Detection
By monitoring the voltage between the VH_AC1 and VH_AC2 pins, this IC outputs the zero cross point of AC voltage
from the ACOUT pin. These pins have a built-in monitor circuit that tolerates 600 V and they realize high reliability and
low power consumption.
The ACOUT pin performs an n channel open drain output and this makes it possible to support various applications.
It is necessary for the VH_AC1 pin to be connected to the N side of the AC input and for the VH_AC2 pin to be
connected to the L side of the AC input.
L
D1
D3
VP
AC Input
N
D2
D4
L > N D2, D3 ON
L < N D1, D4 ON
VH_AC2
Power Supply
VH_AC1
ACOUT
BM1Z10xFJ
GND
Figure 1. Example of Circuit Diagram
AC Voltage × 1.41
AC Voltage × 1.41
0 V
0 V
L - N
L - N
Voltage
Voltage
VH_AC1 – GND
VH_AC1 – GND
AC Voltage × 1.41
AC Voltage × 1.41
Voltage
Voltage
VH_AC2 – GND
VH_AC2 – GND
Voltage
Voltage
0 V
0 V
ACOUT – GND
ACOUT – GND
Voltage
Voltage
tWIDTH
Figure 2. Output Waveform (BM1Z102FJ)
Figure 3. Output Waveform (BM1Z103FJ)
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1. AC Voltage Zero Cross Detection – continued
1.1 Startup Sequence
Show a start sequence in Figure 4.
Zero Cross Points
L - N
0 V
Voltage
VP
VUVLO1
VCC pin
Voltage
1st cycle
2nd cycle
3rd cycle
VH_AC1 – GND
Voltage
VH_AC2 – GND
Voltage
ACOUT – GND
Voltage
A
B
C
D
E
Figure 4. Start Sequence
A: AC Input voltage is applied.
B: When the VCC pin voltage becomes more than VUVLO1, the IC starting operation.
C: The VH_AC1 and VH_AC2 pins voltage in 1st cycle is detected after the starting operation.
D: The VH_AC1 and VH_AC2 pins voltage in 2nd cycle is detected and the internal arithmetic of IC is completed.
E: After the arithmetic, the first positive edge point of the ACOUT pin voltage is detected. After that, the IC repeats
the high to low pulse operation at the zero cross point. (The zero cross detection starts to operate at 3rd cycle
from starting IC’s operation.)
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1. AC Voltage Zero Cross Detection – continued
1.2 VH_AC1 Pin UVLO
In case that the peak voltage of the VH_AC1 pin is VACUVLO or less, the ACOUT pin voltage is defined as Hiz.
VACUVLO
VH_AC1 – GND
0 V
Voltage
HiZ
ACOUT – GND
Voltage
Low
Figure 5. VH_AC1 Pin UVLO
1.3 VH_AC1 and VH_AC2 Pins Noise Filter
This IC has two noise filters.
Noise Filter 1 (tAC1): In case of the ACOUT pin voltage = Hiz, signals of pulse width < tAC1 is not accepted.
<tAC1
VH_AC1 – GND
Voltage
VH_AC2 – GND
Voltage
0 V
HiZ
ACOUT – GND
Voltage
Low
Figure 6. VH_AC1 and VH_AC2 Pins Noise Filter 1
Noise Filter 2 (tAC2): In case of the ACOUT pin voltage = Low, signals of pulse width < tAC2 is not accepted.
<tAC2
VH_AC1 – GND
Voltage
VH_AC2 – GND
Voltage
0 V
HiZ
ACOUT – GND
Voltage
Low
Figure 7. VH_AC1 and VH_AC2 Pins Noise Filter 2
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1
AC Voltage Zero Cross Detection – continued
1.4 DSET Pin Setting
The DSET pin is connected to internal power supply VREF and the DSET pin voltage is depended on the value of
RDSET. The zero cross delay time is set by the level of DSET pin. Set it to one of the values in Table 1.
VREF
DSET
Internal Control
Circuit
RDSET
Figure 8. Circuit Diagram of DSET Pin
L – N
Voltage
L – N
Voltage
tDELAY
tDELAY
tDELAY
tDELAY
ACOUT – GND
ACOUT – GND
Voltage
Voltage
Figure 9. Zero Cross Delay Time (BM1Z102FJ)
Figure 10. Zero Cross Delay Time (BM1Z103FJ)
Table 1. Zero Cross Delay Time by Adjusting RDSET
RDSET
Open
330 kΩ
68 kΩ
GND
Zero Cross Delay Time tDELAY (μs)
0
+200
-200
-480
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Description of Blocks – continued
2. DC Voltage Monitor Circuit
This IC monitors the voltage between the VH_DC and GND pins. It converts the voltage and outputs analog voltage
from the DCOUT pin. The VH_DC pin has a built-in 600 V withstand voltage monitor circuit. It realizes high reliability and
low power consumption.
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
50
100 150 200 250 300 350 400 450 500 550 600
VH_DC Pin Voltage: VVH_DC [V]
Figure 11. DCOUT Pin Voltage vs VH_DC Pin Voltage
When a capacitor is connected to the DCOUT pin as an external component, it is necessary to attach a resistance like
Figure 9.
Motor
AC/DC
BM2P Series
Filter
DC/DC
BD9E Series
Motor
Driver
BM1Z10xFJ
Others
μ-Com
Figure 12. How to Connect Capacitor to the DCOUT Pin
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
-0.3 to +29
-0.3 to +600
-0.3 to +600
-0.3 to +600
-0.3 to +29
-0.3 to +7
-0.3 to +7
0.79
VCC Input Power Supply Voltage
VH_AC1 Pin Voltage
VCC
VVH_AC1
VVH_AC2
VVH_DC
VACOUT
VDSET
VDCOUT
Pd
V
V
VH_AC2 Pin Voltage
V
VH_DC Pin Voltage
V
ACOUT Pin Voltage
V
DSET Pin Voltage
V
DCOUT Pin Voltage
V
Allowable Dissipation(Note 1)
Storage Temperature Range
Maximum Junction Temperature
W
°C
°C
-55 to +150
Tstg
150
Tjmax
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) SOP-J11: At mounted on a glass epoxy single layer PCB (114.3 mm x 76.2 mm x 1.6 mm). Derate by 6.32 mW/°C if the IC is used in the ambient
temperature 25 °C or above.
Thermal Loss
Make the thermal design so that the IC operates in the following conditions.
(Because the following temperature is guarantee value, it is necessary to consider margin.)
1. The ambient temperature must be 105 °C or less.
2. The IC’s loss must be the allowable dissipation Pd or less.
The thermal abatement characteristics are as follows.
(At mounting on a glass epoxy single layer PCB which size is 114.3 mm x 76.2 mm x 1.6 mm.)
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0
25
50
75
100
125
150
Ta [°C]
Figure 13. SOP-J11 Thermal Abatement Characteristic
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VCC Input Power Supply Voltage
VH_AC1 Pin Operation Voltage
VH_AC2 Pin Operation Voltage
VH_DC Pin Operation Voltage
VCC
10
-
15
-
28
V
V
V
V
VVH_AC1
VVH_AC2
VVH_DC
300(Note 2)
300(Note 2)
500
-
-
-
-
VH_AC1 and VH_AC2 Pins
Input Frequency
fVH_AC
45
-
65
Hz
Operating Temperature
Topr
-40
-
+105
°C
(Note 2) The recommendation maximum operating voltage shows AC 300 V which is input AC voltage in the application.
Apply the input AC voltage which is half-wave-rectified to the VH_AC1 and VH_AC2 pins.
Electrical Characteristics
(Unless otherwise specified VCC = 15 V, Ta = 25 °C)
Parameter
Symbol
Min
Typ
Max
Unit
Condition
VCC Block
Circuit Current at Standby
ISTBY
ICC
20
100
5.0
6.0
0.5
50
160
6.0
7.0
1.0
90
500
7.0
8.0
1.5
µA VCC = 5 V
µA VCC = 15 V
Circuit Current at Operation
VCC Pin UVLO Detected Voltage
VCC Pin UVLO Released Voltage
VCC Pin UVLO Hysteresis Voltage
VUVLO1
VUVLO2
VUVLO_HYS
V
V
V
at VCC pin voltage falling
at VCC pin voltage rising
AC Voltage Zero Cross Detection Block
VH_AC1 Pin Consumption Current
VH_AC2 Pin Consumption Current
VH_AC1 Pin UVLO Detection Voltage
VH_AC1 and VH_AC2 Pins Noise Filter 1
VH_AC1 and VH_AC2 Pins Noise Filter 2
ACOUT Pin Leak Current
IVH_AC1
IVH_AC2
VACUVLO
tAC1
15
15
10
1.00
1.38
-
30
30
45
45
µA VVH_AC1 = 300 V
µA VVH_AC2 = 300 V
20
30
V
1.27
1.73
0.0
50
1.54
2.08
1.0
100
ms
tAC2
ms
IACOUT
RACOUT
µA VACOUT = 5 V
ACOUT Pin On Resistance
-
Ω
DC Voltage Monitor Block
VH_DC Pin Consumption Current
DCOUT Pin Voltage 1
IVH_DC
VDCOUT1
VDCOUT2
VDCOUT3
15
30
45
µA VVH_DC = 300 V
0.915
2.790
4.700
0.990
2.970
4.800
1.070
3.150
4.900
V
V
V
VVH_DC = 100 V
VVH_DC = 300 V
VVH_DC = 600 V
DCOUT Pin Voltage 2
DCOUT Pin Clamp Voltage
ACOUT Output Block
Zero Cross Delay Time 1
Zero Cross Delay Time 2
Zero Cross Delay Time 3
Zero Cross Delay Time 4
Zero Cross Edge Width
tDELAY1
tDELAY2
tDELAY3
tDELAY4
tWIDTH
-40
150
-250
-540
0.9
0
+40
250
-150
-420
1.1
µs RDSET = open
µs RDSET = 330 kΩ
µs RDSET = 68 kΩ
µs RDSET = GND
ms BM1Z103FJ Only
200
-200
-480
1.0
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Typical Performance Curves
(Reference data)
90
80
70
60
50
40
30
20
260
210
160
110
60
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Figure 14. Circuit Current at Standby vs Temperature
Figure 15. Circuit Current at Operation vs Temperature
7.0
6.5
6.0
5.5
5.0
8.0
7.5
7.0
6.5
6.0
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 16. VCC Pin UVLO Detected Voltage vs Temperature
Figure 17. VCC Pin UVLO Released Voltage vs Temperature
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Typical Performance Curves – continued
(Reference data)
1.5
1.3
1.1
0.9
0.7
0.5
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 18. VCC Pin UVLO Hysteresis Voltage
vs Temperature
Figure 19. VH_AC1 Pin Consumption Current
vs Temperature
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
0.0
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 20. VH_AC2 Pin Consumption Current vs Temperature
Figure 21. ACOUT Pin Leak Current vs Temperature
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Typical Performance Curves – continued
(Reference data)
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 22. ACOUT Pin On Resistance vs Temperature
Figure 23. VH_DC Pin Consumption Current vs Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 24. DCOUT Pin Voltage 1 vs Temperature
Figure 25. DCOUT Pin Voltage 2 vs Temperature
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Typical Performance Curves – continued
(Reference data)
200
150
100
50
5.4
5.2
5.0
4.8
4.6
4.4
4.2
4.0
0
-50
-100
-150
-200
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [℃]
Temperature [°C]
Figure 26. DCOUT Pin Clamp Voltage vs Temperature
Figure 27. Zero Cross Delay Time 1 vs Temperature
400
350
300
250
200
150
100
50
0
-50
-100
-150
-200
-250
-300
-350
-400
0
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [℃]
Temperature [℃]
Figure 28. Zero Cross Delay Time 2 vs Temperature
Figure 29. Zero Cross Delay Time 3 vs Temperature
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Typical Performance Curves – continued
(Reference data)
-300
-350
-400
-450
-500
-550
-600
-650
-700
-40 -20
0
20 40 60 80 100 120
Temperature [℃]
Figure 30. Zero Cross Delay Time 4 vs Temperature
I/O Equivalence Circuit
-
-
-
-
VH_AC1
VH_DC
VH_AC2
9
N. C.
11
8
10
-
VH_AC2
VH_AC1
VH_DC
Internal
Circuit
Internal
Circuit
Internal
Circuit
-
-
-
Non Connetion
GND
GND
GND
N. C.
N. C.
ACOUT
GND
DSET
VCC
7
1
2
3
5
6
4
DCOUT
Internal
Circuit
Internal
Circuit
VCC
GND
ACOUT
VCC
DCOUT
DSET
Non Connetion
Non Connetion
GND
GND
GND
GND
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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BM1Z102FJ BM1Z103FJ
Operational Notes – continued
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 31. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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12.Mar.2020 Rev.001
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TSZ22111 • 15 • 001
BM1Z102FJ BM1Z103FJ
Ordering Information
B M 1 Z 1
0
x
F
J
-
E 2
ACOUT Output Waveform
2: Pulse
3: Edge
Package
FJ: SOP-J11
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP-J11 (TOP VIEW)
Part Number Marking
LOT Number
Pin 1 Mark
Orderable Part Number
Part Number Marking
ACOUT Pin Output Waveform
BM1Z102FJ-E2
BM1Z103FJ-E2
BM1Z102FJ
BM1Z103FJ
Pulse
Edge
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18/20
TSZ22111 • 15 • 001
BM1Z102FJ BM1Z103FJ
Physical Dimension and Packing Information
Package Name
SOP-J11
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TSZ22111 • 15 • 001
TSZ02201-0F1F0A200610-1-2
12.Mar.2020 Rev.001
19/20
BM1Z102FJ BM1Z103FJ
Revision History
Date
Revision
001
Changes
12.Mar.2020
New Release
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TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号：
BM1Z103FJ
本产品是检测交流电压过零时序和高精度输出二极管整流后的DC电压的IC。无需以往用途中所需的光电耦合器和外接零部件，大幅度减少了部件个数，可实现小型、高可靠性的电源应用。而且，与以往的光电耦合器控制相比，有助于大幅度降低待机功耗。
ROHM
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