BM14270AMUV-LB_技术文档

Datasheet

Magnetic Sensor Series

Current Sensor IC

BM14270AMUV-LB

General Description

Key Specifications

This is the product guarantees long time support in

industrial market.

BM14270AMUV-LB is coreless non-contact type current

sensor of the magnetic detection using MI sensor. It’s

possible to measure the current line in non-contact, and

therefore it’s possible to measure current without loss.

 Input Voltage Range:

2.7 V to 5.5 V

70 μA(Typ)

±280 μT(Typ)

 Operating Current (20 SPS):

 Magnetic Measurable Range:

 Magnetic Sensitivity:

0.045 μT/LSB(Typ)

 Operating Temperature Range: -40 °C to +125 °C

Package

W(Typ) x D(Typ) x H(Max)

3.50 mm x 3.50 mm x 1.00 mm

Features

VQFN20QV3535

 Long Time Support Product for Industrial Applications

 Current Sensor using MI Element

 I²C Interface

 14bit Digital Output

Applications

 Industrial Equipment

 Meter for the Power Measurement

 UPS

VQFN20QV3535

 Power Conditioner

Typical Application Circuit and Block Diagram

VDD

VREG

Regulator

(Internal)

GND

ALERT

SDA

AMP

MI Sensor

ADC

Host

Sginal

Processing

I²C

SCL

Interface

ADDR

TEST

Clock

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays

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Contents

General Description ................................................................................................................................................................1

Features.................................................................................................................................................................................1

Applications............................................................................................................................................................................1

Key Specifications...................................................................................................................................................................1

Package.................................................................................................................................................................................1

Typical Application Circuit and Block Diagram..........................................................................................................................1

Pin Configuration ....................................................................................................................................................................3

Pin Description........................................................................................................................................................................3

Absolute Maximum Ratings.....................................................................................................................................................4

Thermal Resistance................................................................................................................................................................4

Recommended Operating Conditions ......................................................................................................................................5

Magnetic, Electrical Characteristics .........................................................................................................................................5

Example of the Current Measurement Configuration ................................................................................................................6

Typical Performance Curves....................................................................................................................................................7

I²C Bus Timing Characteristics ................................................................................................................................................8

I²C Bus Communication ..........................................................................................................................................................8

I²C Bus Slave Address ............................................................................................................................................................9

Register Map..........................................................................................................................................................................9

Control Sequence ................................................................................................................................................................. 11

Application Example..............................................................................................................................................................14

I/O Equivalence Circuits........................................................................................................................................................15

Operational Notes.................................................................................................................................................................16

Ordering Information.............................................................................................................................................................18

Marking Diagram...................................................................................................................................................................18

Physical Dimension and Packing Information.........................................................................................................................19

Revision History....................................................................................................................................................................20

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Pin Configuration

Top View

Current

direction

ALERT

SCL

TEST

VREG

GND

VDD

NC

16

17

10

9

Magnetic field

Sensing direction

SDA 18

19

8

ADDR

7

EXP-PAD

NC 20

6

Current

direction

Above arrows indicate + output

Pin Description

Pin No.

Pin Name

NC

Function

1

2

No connection (Set to open)

Power supply^{(Note 1)}

NC

3

NC

4

NC

5

NC

6

NC

7

VDD

GND

VREG

TEST

NC

8

Ground

9

Internal regulator output^{(Note 2)}

Test pin^{(Note 3)}

10

11

12

13

14

15

16

17

18

19

20

-

No connection (Set to open)

ALERT output pin

NC

ALERT

SCL

SDA

ADDR

NC

I²C signal clock input

I²C signal data I/O

I²C programmable address bit^{(Note 4)}

No connection (Set to open)

EXP-PAD

The EXP-PAD connect to GND or floating

(Note 1) Dispose a bypass capacitor between VDD and GND as close as possible to the IC.

(Note 2) Dispose a bypass capacitor between VREG and GND as close as possible to the IC.

Set a bypass capacitor of 0.22 μF between VREG and GND.

(Note 3) Connect to GND.

(Note 4) Connect to VDD or GND.

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Absolute Maximum Ratings (Ta=25 °C)

Parameter

Symbol

Rating

Unit

Supply Voltage

V_DD

V_IN

7.0

V

Input Voltage

-0.3 to V_DD+0.3

-40 to +150

150

Storage Temperature Range

Maximum Junction Temperature

Maximum Exposed Field

Tstg

Tjmax

Mef

°C

mT

-1000 to +1000

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance^{(Note 5)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 7)}

2s2p^{(Note 8)}

VQFN20QV3535

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 6)}

θ_JA

181.9

19

50.5

7

°C/W

Ψ_JT

(Note 5) Based on JESD51-2A(Still-Air).

(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 7) Using a PCB board based on JESD51-3.

(Note 8) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70 μm

Thermal Via^{(Note 9)}

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70 μm

74.2 mm x 74.2 mm

35 μm

74.2 mm x 74.2 mm

70 μm

(Note 9) This thermal via connects with the copper pattern of all layers.

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Recommended Operating Conditions

Parameter

Symbol

Min

Typ

Max

Unit

Supply Voltage

I²C Clock Frequency

V_DD

f_SCL

2.7

-

5.0

-

5.5

400

V

kHz

°C

Operating Temperature

Topr

-40

+25

+125

Magnetic, Electrical Characteristics (Unless otherwise specified V_DD=5.0 V Ta=25 °C)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

Current Consumption

Operating Average Current

Power Down Mode Current

Logic

I_DD

I_SS

-

70

5

140

10

µA

Output Data Rate = 20 SPS

ALL Power Down

0.3 x

V_DD

Low-level Input Voltage

High-level Input Voltage

V_IL

V_IH

GND

-

V

0.7 x

V_DD

Low-level Input Current

High-level Input Current

I_IL

-10

-

0

µA

V_IL= GND

V_IH= V_DD

I_IH

0

10

0.2 x

V_DD

Low-level Output Voltage

High-level Output Voltage

V_OL

V_OH

GND

-

V

I_LOAD= -0.3 mA

I_LOAD= 0.3 mA

0.8 x

V_DD

Serial Communication

Low-level Input Current

High-level Input Current

I_IL2

I_IH2

-10

0

-

0

µA

V_IL= GND

10

At HiZ, V_IH= V_DD

0.2 x

V_DD

Low-level Output Voltage

V_OL2

GND

-

V

I_LOAD= -3 mA

Magnetic Sensor

Measurable Range

Linearity^{(Note 10)}

Output Offset

R_M

L_IN

-

±280

0.5

0

-

2

-

µT

%FS

LSB

V_OFS

µT/

LSB

ms

Magnetic Sensitivity

D_ELTAV

-

0.045

0.35

-

Measurement Time

t_MS

(Note 10) Linearity = Output Error / R_M= (output – ideal output) / R_M

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Example of the Current Measurement Configuration

This product has two different sensors of the magnetic field detection direction.

It is configuration to output difference of the magnetic field which two sensors detected. (Out = A - B)

Top View

Side View

Sensing

direction

A

Sensing

direction

B

Sensing

direction

Sensing

direction

Sensor Sensor

A

B

Sensor

Figure 1. Sensor Configuration

This product locates on the board pattern such as follows, then the magnetic field of the different direction is applied to two

sensors and can detect magnetic field depending on current. In addition, the disturbance magnetic field is applied to the

same direction for two sensors, and can cancel disturbance magnetic field in the operating range.

Top View

Side View

PCB

BM14270AMUV-LB

B

A

Current

PCB

Board pattern

(Current line)

Board pattern

(Current line)

BM14270AMUV-LB

Figure 2. Example of the Board Pattern

Top View

1.6 mm

Side View

2.5 mm

0.5 mm

Figure 3. Position of the Sensor (Reference)

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Typical Performance Curves

(Unless otherwise specified, V_DD= 5.0 V, GND = 0.0 V, Ta  25 C)

500

400

300

200

100

0

10

8

6

4

2

0

2

3

4

5

6

2

3

4

5

6

SupplyVoltage:V_DD[V]

Supply Voltage:V_DD[V]

Figure 4. Power Down Mode Current vs Supply Voltage

Figure 5. Operating Average Current vs Supply Voltage

(20 SPS)

500

400

300

200

100

0

200

400

600

800

1000

ODR [Hz]

Figure 6. Operating Average Current vs ODR

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I²C Bus Timing Characteristics (Unless otherwise specified V_DD= 5.0 V, Ta = 25 °C)

S: Restart

S: Start

P: Stop

V_IH

V_IL

V_IH

V_IL

SDA

V_IL

t_BUF

t_HD;STA

t_SU;DAT

V_IH

V_IL

V_IH

SCL

V_IL

t_HIGH

t_LOW

t_HD;STA

t_HD;DAT

t_SU;STA

t_SU;STO

Figure 7. I²C Timing Chart

Parameter

Symbol

f_SCL

Min

0

Typ

Max

Unit

Conditions

SCL Clock Frequency

-

400

kHz

µs

ns

µs

‘L’ Period of the SCL Clock

‘H’ Period of the SCL Clock

t_LOW

1.3

0.6

100

0

-

t_HIGH

Setup Time for Repeated START Condition

Hold Time (Repeated) START Condition

Data Setup Time

t_SU;STA

t_HD;STA

t_SU;DAT

t_HD;DAT

t_SU;STO

Data Hold Time

Setup Time for STOP Condition

0.6

Bus Free Time between a STOP and START

Condition

t_BUF

1.3

-

µs

I²C Bus Communication

1. Main write format

(1) Indicate register address

W

0

S

Slave Address

ACK

Indicate register address

ACK

P

(2) Write to data register after indicating register address

W

S

Slave Address

ACK

0

Data specified at register

address field

Data specified at register

address field + N

ACK

ˑ ˑ ˑ

ACK

P

2. Main read format

(1) Read data after indicate register address

W

0

S

Slave Address

ACK

ˑ ˑ ˑ

Indicate register address

ACK

R

1

Data specified at register

address field

Data specified at register

address field + 1

Data specified at register

address field + N

NACK

P

ACK

(2) Read data from the specified register

R

1

Data specified at register

address field

S

Slave Address

ACK

Data specified at register

address field + 1

Data specified at register

address field + N

ACK

ˑ ˑ ˑ

ACK

from master to slave

from slave to master

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I²C Bus Slave Address

Selectable 2 I²C Slave Addresses by setting ADRR pin

(ADDR=L: 0001110, ADDR=H: 0001111)

Register Map^{(Note 11)}

Address

Register Name

R/W

R

D7

RD_

DRDY

D6

0

D5

0

D4

0

D3

0

D2

0

D1

0

D0

0

0x0F

STA1

0x10

0x11

R

DATA [7:0]

DATA

DATA [15:8]

ODR [1:0]

RST_

LV

0x1B

0x1C

CNTL1

RW

PC1

0

FS1

0

ALERT

_EN

CNTL2

CNTL3

0

0x1D

0x5C

0x5D

RW

W

FORCE

0

RSTB_LV [7:0]

RSTB_LV [15:8]

CNTL4

W

(Note 11) Do not write any commands to other addresses except above. Do not write ‘1’ to the fields in which value is ‘0’ in above table.

It is the following conditions to be able to access each register.

Condition

Accessible Register

CNTL1

CNTL4

Supply Power

(CNTL1) PC1=1

(CNTL1) RST_LV=0

(CNTL4) RSTB_LV=1

STA1

CNTL2

CNTL3

Supply Power

(CNTL1) PC1=1

(CNTL1) RST_LV=0

(CNTL4) RSTB_LV=1

(CNTL3) FORCE=1 after first access

DATA

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Register Map - continued

(0x0F) Status Register

Fields

Function

This bit informs the preparation status of the measured data

0: Waiting for end of measurement

1: Ready OK

RD_DRDY

default value 0x00

(0x10/0x11) Output Data Register

Fields

Function

Output value LSB

DATA [7:0]

DATA [15:8]

Output value MSB

default value 0xXXXX

signed 16 bit -8192d(0xE000) to +8191d(0x1FFF)

(0x1B) Control setting1 Register

Fields

Function

Power Control

0: Power Down 1: Active

PC1

Logic reset control

RST_LV

0: Reset release 1: Reset

Reset release at RST_LV(CNTL1)=0 & RSTB_LV(CNTL4)=1

Measurement output data rates

00: 20 Hz Mode 01: 100 Hz Mode 10: 200 Hz Mode 11: 1 kHz Mode

ODR [1:0]

FS1

Measurement mode setting

0: Continuous mode 1: Single mode

default value 0x22

(0x1C) Control setting2 Register

Fields

Function

Select output signal of ALERT pin

0: No output

ALERT_EN

1: DRDY signal(Output RD_DRDY from pin)

default value 0x00

(0x1D) Control setting3 Register

Fields

Function

AD start measurement trigger at continuous mode (FS1=0)

and single mode (FS1=1)

1: Start measurement

FORCE

Register is automatic clear “0” after write data “1”

Write data “0” is invalid

If write data “1” on measurement way, stop and restart measurement

default value 0x00

(0x5C/0x5D) Control setting4 Register

Fields

Function

RSTB_LV [7:0]

Reserved (ignore write data)

RSTB_LV=1 by write access (ignore write data)

Reset release at RST_LV(CNTL1)=0 & RSTB_LV(CNTL4)=1

RSTB_LV=0 by write PC1(CNTL1)=0

RSTB_LV [15:8]

default value 0x00

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Control Sequence

1. Control Sequence

1.1 Power supply start-up sequence

Do the command control by I²C after all powers are supplied.

2.7 V

VDD

> 0.1 ms

command

Address: 0x5C,

0x5D

I²C

command

Address: 0x1B

Data[7] = 1

command

Data: 0x00

> 1 ms

Figure 8. Timing Chart at Power ON

1.2 Power supply end sequence

VDD

2.7 V

0.4 V

> 0 ms

> 1 ms

command

Address: 0x1B

Data[7] = 0

I²C

Data[5] = 1

Figure 9. Timing Chart at Power OFF

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Control Sequence - continued

2. Measurement sequence

There are the following two kinds of measurement modes

Continuous Mode

Single Mode

BM14270AMUV-LB is measured at specified cycle (ODR=20 Hz, 100 Hz, 200 Hz, 1 kHz) .

BM14270AMUV-LB is measured by the measurement request from the host.

(Power Off)

·Supply V_DDVoltage

Power Down

·Send "Logic OFF" Command

·Send "Logic ON" Command

Ready

·Finish Measurement @ Signal Mode

·Send "Select Signal Mode" Command

@ Continuous Mode

·Send Setting Command

·Send "Measurement Start" Command

Measurement

Figure 10. State Transition of Each Mode

2.1 Continuous Mode

BM14270AMUV-LB

Host

Start

(Send command example)

CNTL1

Start

Register Name Address

Data

0x80

0x00

0x08

0x40

Supply Power

0x1B

0x5C

0x5D

0x1C

0x1D

0x0F

0x10

0x11

Step1

POR

CNTL4

Power Down

Step2

Step3

CNTL2

CNTL3

STA1

Write CNTL1 : PC1=1, RST_LV=0

Write CNTL1 : ODR=00

Step1

Write CNTL1 : FS1=0

Step4

Read

DATA

Write CNTL4 : RSTB_LV=1

Active

Timer=20SPS

Continuous Mode

Step2

Step3

Write CNTL2 : ALERT_EN=1

ALERT_EN=1

Write CNTL3 : FORCE=1

Measurement

ALERT High

Does ALERT output

the rising edge?

No

Yes

Step4

Read DATA

ALERT Low

Timer (wait)

Figure 11. Sequence of Continuous Mode

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Control Sequence - continued

2.2 Single Mode

(Send command example)

BM14270AMUV-LB

Host

Start

Register Name Address

Data

0x82

0x00

0x08

0x40

Supply Power

CNTL1

0x1B

0x5C

0x5D

0x1C

0x1D

0x0F

0x10

0x11

Step1

CNTL4

POR

Power Down

Step2

Step3

CNTL2

CNTL3

STA1

Write CNTL1 : PC1=1, RST_LV=0

Write CNTL1 : FS1=1

Step1

Write CNTL4 : RSTB_LV=1

Step4

Read

DATA

Active

Write CNTL2 : ALERT_EN=1

Step2

Step3

ALERT_EN=1

Write CNTL3 : FORCE=1

Measurement

ALERT High

Does ALERT output

the rising edge?

No

Yes

Step4

Read DATA

ALERT Low

Figure 12. Sequence of Single Mode

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Application Example

0.22 μF

VDD

VREG

GND

Regulator

(Internal)

ALERT

AMP

MI Sensor

ADC

SDA

SCL

Host

Sginal

Processing

I²C

Interface

ADDR

TEST

Clock

Figure 13. Example of Application Circuit

(Note) Sensor property may change due to around magnetic parts. We recommend calibrating

the sensitivity and origin point of magnetic sensors after mounting.

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I/O Equivalence Circuits

Pin Name

Equivalent Circuit Diagram

Pin Name

Equivalent Circuit Diagram

SCL

SDA

VDD

ALERT

ADDR

VDD

TEST

VREG

VDD

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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Operational Notes – continued

10. Regarding the Input Pin of the IC

This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N

junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or

transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 14. Example of IC Structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

.

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TSZ02201-0M2M0F919020-1-2

10.Oct.2019 Rev.001

TSZ22111 • 15 • 001

17/20

BM14270AMUV-LB

Ordering Information

B M 1

4

2

7

0 A M U V

-

L B E 2

Package

Product Class

MUV:VQFN20QV3535

LB for Industrial Applications

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagram

VQFN20QV3535 (TOP VIEW)

Part Number Marking

M1427

LOT Number

0AMUV

Pin 1 Mark

.

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TSZ02201-0M2M0F919020-1-2

10.Oct.2019 Rev.001

18/20

TSZ22111 • 15 • 001

BM14270AMUV-LB

Physical Dimension and Packing Information

Package Name

VQFN20QV3535

.

www.rohm.com

TSZ02201-0M2M0F919020-1-2

10.Oct.2019 Rev.001

19/20

TSZ22111 • 15 • 001

BM14270AMUV-LB

Revision History

Date

Revision

001

Changes

10.Oct.2019

New Release

.

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TSZ02201-0M2M0F919020-1-2

10.Oct.2019 Rev.001

20/20

TSZ22111 • 15 • 001

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BM14270AMUV-LB
厂家：	ROHM
描述：	本产品是面向工业设备市场的产品，保证可长期稳定供货。适用于工业设备、电力测量用电表、UPS、功率调节器等应用的产品。BM14270AMUV-LB是使用MI传感器的磁性无铁芯非接触型电流传感器。可非接触式测量电流线路，测量电流没有损耗。传感器调节器
文件：	总23页 (文件大小：1434K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BM14270AMUV-LB [ROHM]

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