BDJ0901HFV-TR [ROHM]
Analog Voltage Output Sensor, 1.279V Min, 1.321V Max, 2.50Cel, Rectangular, 5 Pin, Surface Mount, 1.60 X 1.60 MM, 0.60 MM HEIGHT, ROHS COMPLIANT, HVSOF-5;
| 型号： | BDJ0901HFV-TR |
| 厂家： | 
ROHM |
| 描述： | Analog Voltage Output Sensor, 1.279V Min, 1.321V Max, 2.50Cel, Rectangular, 5 Pin, Surface Mount, 1.60 X 1.60 MM, 0.60 MM HEIGHT, ROHS COMPLIANT, HVSOF-5 输出元件 传感器 换能器 |
| 文件： | 总16页 (文件大小：872K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Temperature Sensor ICs
Low Current Thermostat Output
BDJxxx0HFV Series
General Description
Key Specifications
BDJxxx0HFV series is a thermostat output temperature
sensor IC with built-in temperature detection element,
constant current circuit, and a high-accuracy reference
voltage source in one chip. Temperature detection can
be realized at ±2.5°C accuracy without the need for a
complicated design. It is best suited for portable
equipment of micro- and low-current, power down
function, and battery drive. It is possible to use it for a
wide range of applications such as heat detection and
temperature monitors because it provides an analog
output in addition to the thermostat power output.
BDJxxx0HFV series has 5 products at 55°C, 60°C,
65°C, 70°C, and 80°C detection temperature.
Power Supply Voltage Range:
Supply Current:
Normal Function mode
2.4V to 5.5V
7.5µA (Typ)
0.3µA (Typ)
Power Down mode
High Accuracy Thermostat:
±2.5°C (Max) @Ta=55°C to 80°C
Sensing Temperature Hysteresis: 10.0°C (Typ)
High Accuracy Analog Output:
±2.5°C (Max) @Ta=-30°C to +100°C
Analog Output Temperature Sensitivity:
-8.2 mV/°C (Typ)
Operating Temperature Range: -30°C to +100°C
Features
Package
W (Typ) x D (Typ) x H (Max)
Detection Temperature lineup at 55°C, 60°C, 65°C,
70°C, and 80°C (5 products)
Built-in power down control function.
(Min PD Interface Voltage is 1.5V)
Low thermal resistance package (Typ 187°C/W)
ESD Rating of 8kV (HBM)
OS Output Active L
Applications
Cellular Phone, Digital Camera, Thermal Protection for
HVSOF5
1.60mm x 1.60mm x 0.60mm
Electrical Equipment (Notebook PC, FPD-TV, etc.)
Typical Application Circuit
Please adjust Capacitor
according to the noise condition of
the set.
VDD
5
1µF
TEMP
ease adjust bypass
Capacitor according to the
noise condition of the set.
IREF
1
GND
0.1µF
VREF
+
-
2
3
TEMP
SENSOR
OS
4
PD
Please add pull-up of over 10kΩ for
the OS output terminal.
PD
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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BDJxxx0HFV Series
Block Diagram and Pin Configuration
TOP VIEW
IREF
TEMP
1
VDD
5
VREF
GND
PD
2
3
TEMP
SENSOR
OS
4
PD
Pin Descriptions
Pin No.
Pin Name
Function
Comment
Output voltage in inverse proportion to Set to Open state or connect to a high input
1
TEMP
GND
PD
the Temperature
impedance node (over 10MΩ).
2
3
4
5
Ground
Power Down Control
H: Normal Function mode
L: Power Down mode
H: Thermostat and Analog Output operation.
L: Power Down state.
Open-Drain Active-Low.
OS
Digital Thermostat Output
Power Supply Voltage
Use pull-up resistor of more than 10kΩ.
VDD
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BDJxxx0HFV Series
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
VDD
VIN
-0.3 to +7.0 (Note 1)
-0.3 to +VDD+0.3
-0.3 to +7.0 (Note 1)
5.0
V
V
Power Supply Voltage
Input Voltage (PD)
OS Terminal Voltage
OS Terminal Current
Power Dissipation
VOS
IOS
V
mA
W
°C
Pd
0.53 (Note 2)
Tstg
-55 to +150
Storage Temperature Range
(Note 1) However, not exceeding Pd.
(Note 2) When mounted on ROHM standard board, derate by 5.36mW/°C for Ta higher than 25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Rating
Parameter
Symbol
Unit
Min
2.4
-30
Typ
2.8
-
Max
5.5
VDD
V
Power Supply Voltage
Operating Temperature Range
Topr
+100
°C
Electrical Characteristics (Unless otherwise specified, VDD = 2.8V, Ta = 25°C)
Limit
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
Supply Current
Normal Function Mode
Power Down Mode
IDD
-
-
7.5
0.3
12.0
1.0
µA
µA
PD=“H”
PD=“L”
IDDPD
PD
Input L Voltage
VIL
VIH
ILPD
GND
1.5
-
-
-
-
0.2
VDD
1.0
V
V
Input H Voltage
PD Leakage Current
Analog Output
µA
PD=2.8V
TEMP Output Voltage
TEMP Temperature Sensitivity
VTEMP
VSE
1.279 1.300 1.321
V
Ta = 30°C
-8.00
-8.20
-8.40 mV/°C
Ta = -30°C to +100°C
Difference Of
IOUT : 0µA / 2µA
TEMP Load Regulation
ΔVTEMPRL
-
-
-
-
1.0
4.0
mV
mV
TEMP VDD Regulation
OS Output Open Drain
OS Leakage Current
OS Output Voltage
ΔVTEMPVDD
VDD=2.4V to 5.5V
IL
-
-
-
-
1.0
0.4
µA
V
VOS =5.0V
VOL
IOS = 1.0mA
Temperature Accuracy (Unless otherwise specified, VDD = 2.8V)
Limit
Typ
Parameter
Symbol
Unit
Conditions
Min
Max
Thermostat
Sensing Temperature Accuracy
Sensing Temperature Hysteresis
Analog Output
Tacc
Thys
-
-
±2.5
12.5
°C
°C
7.5
10.0
VDD = 2.8V
Ta = -30°C to +100°C
TTEMP
-
-
±2.5
°C
TEMP Temperature Accuracy
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BDJxxx0HFV Series
Typical Performance Curves
15
10
5
2.0
1.5
1.0
0.5
0.0
Ta=30°C
PD="H"
Ta=30°C
PD="L"
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
Supply Voltage : VDD [V]
Supply Voltage : VDD [V]
Figure 2. TEMP Voltage vs Supply Voltage
Figure 1. Supply Current vs Supply Voltage
2.0
1.5
1.0
0.5
0.0
2
VDD=2.8V
0
-2
-4
-6
-8
-10
-12
V =2.8V, Ta=30°C
DD
-40 -20
0
20
40
60
80 100
0
1
2
3
4
5
Temperature : Ta [°C]
Output Current : IOUT [µA]
Figure 3. TEMP Voltage vs Temperature
Figure 4. TEMP Voltage vs Output Current
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BDJxxx0HFV Series
Typical Performance Curves – continued
0.8
VDD=2.8V, Ta=25°C
0.6
0.4
0.2
0
0
1
2
3
4
5
Load Current : IOS [mA]
Figure 5. OS Output Voltage vs Load Current
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BDJxxx0HFV Series
Application Information
1. Function Diagram (ex. 80°C detect Active-L type BDJ0800HFV)
The internal IC temperature sensor senses temperature. TEMP terminal output voltage is converted to temperature.
VTEMP value is 1.300[V] at Ta = 30[°C].
The value of VTEMP voltage reduction is inversely proportional to the temperature at a rate of -8.2mV/°C.
3.0
2.5
2.0
VTEMP@30°C
(1.300V)
1.5
1.0
Temperature
Sensitivity
( -8.20mV/°C typ)
0.5
VOS
Detect Point Temperature
Hysteresis
(10°C typ)
0
130
90 110
30
50
70
-50
30
-10
10
Temperature [°C]
If the temperature exceeds the detect point temperature, the internal comparator forces the OS output to change from
“H” to “L”. (ex. Active-L Type)
OS returns to “H” when the temperature becomes 10°C lower than the detect point temperature.
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BDJxxx0HFV Series
2. Operation Sequence
(ex.80°C detect Active-L type BDJ0800HFV)
VDD
H Level 1.5V
L Level 0.2V
PD
7.5µA
7.5µA
0.3µA
0.3µA
0.3µA
IDD
1.300V@Ta=30°C
Ref Voltage
70°C
80°C
TEMP
OS
Hi Z
Hi Z
Hi Z
Hi Z
Hi Z
Hi Z
Hi Z（pull-up）
time
tOS_L
tOS_H
BDJ0800HFV operation starts after PD “H” Input.
Please refer to the OS terminal signal table below for the wait time after PD “H” Input.
Ta
Symbol
tOS_L
Wait Time
200µs
Under detect Temp.
Over detect Temp.
tOS_H
1000µs
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BDJxxx0HFV Series
I/O Equivalent Circuits
PD
OS
VDD
PD
OS
GND
GND
VDD
Use pull-up resistor of more than 10kΩ.
TEMP
TEMP
GND
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BDJxxx0HFV Series
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BDJxxx0HFV Series
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 6. Example of monolithic IC structure
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BDJxxx0HFV Series
Ordering Information
B
D
J
x
x
x
0
H
F
V
-
T R
Detect Temp.
080: 80°C
070: 70°C
065: 65°C
060: 60°C
055: 55°C
Output Format
0 : Active-L
Package
HFV:HVSOF5
Packaging and forming specification
TR: Embossed tape and reel
Lineup
Detect
Temp.
(°C)
Detect
Temp.
(°C)
Product
Name
OS Output
Format
Product
Name
OS Output
Format
80
70
65
Open-Drain Active-L
Open-Drain Active-L
Open-Drain Active-L
60
55
Open-Drain Active-L
Open-Drain Active-L
BDJ0800HFV
BDJ0700HFV
BDJ0650HFV
BDJ0600HFV
BDJ0550HFV
Marking Diagram
HVSOF5(TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
Orderable Part Number
BDJ0800HFV-TR
BDJ0700HFV-TR
BDJ0650HFV-TR
BDJ0600HFV-TR
BDJ0550HFV-TR
ff
fh
fk
fm
fn
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BDJxxx0HFV Series
Physical Dimension, Tape and Reel Information
Package Name
HVSOF5
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BDJxxx0HFV Series
Revision History
Date
Revision
001
Changes
06.Nov.2015
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
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Notice – WE
Rev.001
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相关型号：
BDJ0FC0WEFJ
BDJ0FC0WEFJ是可提供最大1A电流的低饱和型稳压器。BDxxFC0WEFJ系列有可通过外部电阻设定输出电压的可变型和固定型产品。封装组件采用HTSOP-J8。本系列内置防止因输出短路等发生IC破坏的过电流保护、以及防止因过负荷状态等使IC发生热破坏的过热保护电路。
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BDJ0FC0WFP
BDJ0FC0WFP是可提供最大1A电流的低饱和型稳压器。输出电压固定型。封装是TO252-5。BDJ0FC0WFP内置防止因输出短路等发生IC破坏的过电流保护、以及防止因过负荷状态等使IC发生热破坏的过热保护电路。
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BDJ0GA3MEFJ-M
BDxxGA3MEFJ-M系列是可提供0.3A输出电流的稳压器。输出精度为±1%。有可使用外接电阻在1.5V～13.0V范围内任意设置输出电压的可变型以及1.5V/1.8V/2.5V/3.0V/3.3V/5V/6V/7V/8V/9V/10V/12V固定输出型两种。封装组件采用散热性优良的HTSOP-J8。本机型内置用于防止因输出短路等发生IC破坏的过电流保护电路、关断时使电路电流为0µA的ON/OFF开关、以及防止因过负荷状态等使IC发生热破坏的温度保护电路。另外，采用了陶瓷电容器，有助于整机的小型化和长寿化。
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BDJ0GA3VEFJ-M (新产品)
BDxxGA3VEFJ-M is a LDO regulator with output current 0.3A. The output accuracy is ±1% of output vo
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BDJ0GA3WEFJ
BDxxGA3WEFJ系列是可提供0.3A输出电流的稳压器。输出精度为±1%。有可使用外接电阻在1.5V～13.0V范围内任意设置输出电压的可变型以及1.5V/1.8V/2.5V/3.0V/3.3V/5V/6V/7V/8V/9V/10V/12V固定输出型两种。封装组件采用散热性优良的HTSOP-J8。可用于数字家电等广泛用途。本机型内置用于防止因输出短路等发生IC破坏的过电流保护电路、关断时使电路电流为0µA的ON/OFF开关、以及防止因过负荷状态等使IC发生热破坏的温度保护电路。另外，采用了陶瓷电容器，有助于整机的小型化和长寿化。
ROHM
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