BD9D323QWZ [ROHM]
BD9D323QWZ是内置低导通电阻的功率MOSFET的同步整流降压型开关稳压器。最大可输出3A的电流。是恒定时间控制DC/DC转换器，具有高速负载响应性能，无需外接的相位补偿电路。;
| 型号： | BD9D323QWZ |
| 厂家： | 
ROHM |
| 描述： | BD9D323QWZ是内置低导通电阻的功率MOSFET的同步整流降压型开关稳压器。最大可输出3A的电流。是恒定时间控制DC/DC转换器，具有高速负载响应性能，无需外接的相位补偿电路。 开关 转换器 稳压器 |
| 文件： | 总39页 (文件大小：2199K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
4.5V to 18V Input, 3.0A Integrated MOSFET
1ch Synchronous Buck DC/DC Converter
BD9D323QWZ
General Description
Key Specifications
BD9D323QWZ is a synchronous buck switching regulator
with built-in low on-resistance power MOSFETs. It is
capable of providing current of up to 3 A. External phase
compensation circuit is not necessary for it is a constant
on-time control DC/DC converter with fast transient
response.
Input Voltage Range:
Output Voltage Setting Range:
4.5V to 18.0 V
0.765V to 7V
(VIN×0.07)V to (VIN×0.65)V
3A (Max)
Output Current:
Switching Frequency:
High Side MOSFET On-Resistance: 80mΩ (Typ)
Low Side MOSFET On-Resistance: 50mΩ (Typ)
Standby Current:
700kHz (Typ)
Features
2μA (Typ)
Synchronous Single DC/DC Converter
Constant On-time Control
Over Current Protection
Thermal Shutdown Protection
Under Voltage Lockout Protection
Adjustable Soft Start
UMMP008Z2020 Package (Backside Heat
Dissipation)
Package
W(Typ) x D(Typ) x H(Max)
2.00mm x 2.00mm x 0.40mm
UMMP008Z2020
Applications
Step-down Power Supply for DSPs, FPGAs,
Microprocessors, etc.
Set-top Box
LCD TVs
DVD / Blu-ray Player / Recorder
POL Power Supply, etc.
UMMP008Z2020
Typical Application Circuit
Figure 1. Typical Application Circuit
○Product structure: Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.
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Pin Configuration
(TOP VIEW)
Figure 2. Pin Configuration
Pin Descriptions
Terminal
Symbol
Function
No.
Power supply terminal for the switching regulator.
Connecting 10µF and 0.1µF ceramic capacitors to ground is recommended.
1
VIN
BOOT
SW
Connect a bootstrap capacitor of 0.1µF between this terminal and SW terminal.
The voltage of this capacitor is the gate drive voltage of the high-side MOSFET.
2
3
4
5
6
7
8
-
Switch node. This terminal is connected to the source of the high-side MOSFET and drain of
the low-side MOSFET. Connect a bootstrap capacitor of 0.1µF between this terminal and
BOOT terminal. In addition, connect an inductor considering the direct current
superimposition characteristic.
GND
SS
Ground terminal for the output stage of the switching regulator and the control circuit.
Terminal for setting the soft start time. The rise time of the output voltage can be specified by
connecting a capacitor to this terminal. Refer to page.28 for how to calculate the capacitance.
An inverting input terminal of comparator which compares with reference voltage (VREF).
Refer to page.27 for how to calculate the resistance of the output voltage setting.
FB
Power supply voltage terminal inside IC.
Voltage of 5.25V (Typ) is outputted with more than 2.2V is impressed to EN terminal.
Connect 1µF ceramic capacitor to ground.
VREG
EN
Turning this terminal signal low level (0.3 V or lower) forces the device to enter the shutdown
mode. Turning this terminal signal high level (2.2 V or higher) enables the device. This
terminal must be terminated.
A backside heat dissipation pad. Connecting to the internal PCB ground plane by using
multiple via provides excellent heat dissipation characteristics.
E-PAD
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Block Diagram
Figure 3. Block Diagram
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Description of Blocks
●
EN Logic
The EN Logic block is for control IC shutdown or starts up. It will shut down the IC when EN falls to 0.3V (Max) or lower.
When VEN reaches 2.2 V(Min), the internal circuit is activated and the IC starts up.
●
●
●
5V REG
Block creating internal power supply 5.25V (Typ).
BG
Block creating internal reference voltage.
Main Comparator
When FB terminal voltage becomes lower than REF, it outputs High and reports to the On Time block that the output
voltage has dropped below control voltage.
●
●
On Time Controller Block
This is a block which creates On Time. Desired On Time is created when Main Comparator output becomes High. On
Time is adjusted to restrict frequency change even with I/O voltage change.
Soft Start
The Soft Start circuit slows down the rise of output voltage during start-up and controls the current, which allows the
prevention of output voltage overshoot and inrush current.
●
●
Driver Circuit
This block is a DC/DC driver. A signal from On Time Controller Block is applied to drive the MOSFETs.
UVLO
UVLO is a protection circuit that prevents low voltage malfunction. It prevents malfunction of the internal circuit from
sudden rise and fall of power supply voltage. It monitors the VIN power supply voltage and the internal regulator voltage.
If VIN is higher than the threshold voltage 3.8 V (Typ), the soft-start circuit will be restarted. This threshold voltage has a
hysteresis of 300 mV (Typ). If VIN is less than the threshold voltage 3.5 V (Typ), the POWER MOS FET output will turn
OFF.
●
●
TSD
Thermal shutdown block. Usually IC operating in the allowable power dissipation, but when the IC power dissipation
more than rating value, Tj will increase. When the chip temperature exceeds 175C (Typ), the thermal shutdown circuit
is intended for shutting down internal power devices. When Tj decreased to 25C (Typ) , IC will restart automatically. It
is not meant to protect or guarantee the soundness of the application. Do not use the function of this circuit for
application protection design.
OCP
Effective by controlling current which flows in low side MOSFET by 1 cycle each of switching period. With inductor
current exceeding the source current restriction setting value IOCP when low side MOSFET is ON, the high side
MOSFET cannot turn ON even with FB voltage is lower than REF voltage and low side MOSFET continues to be ON
until it is below IOCP. High side MOSFET will turn ON when it goes below IOCP. If low side MOSFET exceed sink current
limited setting value when it is ON, low side MOSFET will turn OFF.
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Absolute Maximum Ratings (Ta = 25C)
Parameter
Input Voltage
Symbol
Rating
Unit
-0.3 ～ 20
-0.3 ～ 27
-0.3 ～ 7
VIN
VBOOT
VBOOT-VSW
VFB
V
V
BOOT-GND Voltage
BOOT-SW Voltage
FB Voltage
V
-0.3 ～ VREG
-0.5 ～ VIN + 0.3
-0.3 ～ 7
V
SW Voltage
VSW
V
VREG Voltage
VREG
VSS
V
SS Voltage
-0.3 ～ 7
V
EN Input Voltage
Maximum Junction Temperature
Storage Temperature Range
VEN
-0.3 ～ VIN
150
V
Tjmax
Tstg
°C
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction
temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
UMMP008Z2020
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
-
-
58.3
11
°C/W
°C/W
ΨJT
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4)Using a PCB board based on JESD51-5, 7
Thermal Via(Note 5)
Layer Number of
Material
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Measurement Board
Pitch
Diameter
4 Layers
FR-4
-
Φ0.30mm
Top
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
35μm
Copper Pattern
Thickness
70μm
Footprints and Traces
70μm
74.2mm x 74.2mm
74.2mm x 74.2mm
(Note 5) This thermal via connects with the copper pattern of all layers.
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Recommended Operating Conditions
Parameter
Input voltage
Symbol
Min
Typ
Max
Unit
VIN
Topr
4.5
12
-
18
+85 (Note 1)
3
V
°C
A
Operating Temperature Range
Output Current
-40
0
IOUT
-
Output Voltage Range
VRANGE
0.765 (Note 2)
-
7 (Note 3)
V
(Note 1) Tj must be lower than 150°C under actual operating environment.
(Note 2) Please use under the condition of VOUT ≥ VIN×0.07 [V].
(Note 3) Please use under the condition of VOUT ≤ VIN×0.65 [V].
(Refer to the page 27 for how to calculate the output voltage setting.)
Electrical Characteristics (Ta = 25°C, VIN = 12V, VEN = 3V unless otherwise specified)
Parameter
Standby Circuit Current
Operating Circuit Current
Symbol
ISTB
Min
Typ
2
Max
15
2
Unit
µA
Conditions
VEN=GND
-
-
IOUT=0mA
when no switching
IVIN
1
mA
EN Low Voltage
VENL
VENH
GND
-
-
0.3
VIN
10
V
V
EN High Voltage
2.2
EN Input Current
IEN
-
-
3
µA
V
VEN=3V
VREG Standby Voltage
VREG Output Voltage
VREG Output Current
UVLO Threshold Voltage
UVLO Hysteresis Voltage
VVREG_STB
VVREG
-
0.1
5.5
-
VEN=GND
5
5.25
10
3.8
300
V
IREG
-
mA
V
VVREG_UVLO
dVVREG_UVLO
3.4
200
4.2
400
VREG: Sweep up
mV
VREG: Sweep down
VIN=12V,
VOUT=1.8V
Reference Voltage
VREF
0.753
0.765
0.777
V
FB Input Current
IFB
-
-
1
µA
µA
VFB=1V
SS Charge Current
ISSC
1.4
2.0
2.6
VREG=5.25V,
VSS=0.5V
VIN=12V,
SS Discharge Current
On Time
ISSD
Ton
0.1
-
0.2
-
-
mA
ns
215
VOUT=1.8V
Minimum Off Time
Toffmin
RONH
RONL
Iocp
100
200
80
-
ns
mΩ
mΩ
A
High Side FET ON Resistance
Low Side FET ON Resistance
-
-
-
160
100
-
50
5 (Note 4)
Over Current Protection Current Limit
(Note 4) No tested on outgoing inspection.
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Typical Performance Curves
10
9
8
7
6
5
4
3
2
1
0
1200
1000
VIN=12V
800
600
400
200
0
VIN=12V
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature[°C]
Temperature [°C]
Figure 4. Operating Circuit Current vs Temperature
Figure 5. Standby Circuit Current vs Temperature
1.86
1.84
1.82
1.80
1.78
1.76
1.74
100
90
80
70
60
50
40
30
20
10
0
VIN=12V
0
1
2
3
0
5
10
15
20
OUT
I
[A]
EN [V]
Figure 6. EN Input Current vs EN Voltage
Figure 7. Output Voltage vs Output Current
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Typical Performance Curves (Continued)
2.0
1.6
1.2
0.8
0.4
0.0
2.0
1.6
1.2
0.8
0.4
0.0
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature [°C]
Temperature [°C]
Figure 8. EN OFF Threshold Voltage vs Temperature
Figure 9. EN ON Threshold Voltage vs Temperature
10.0
5.78
EN=2V
5.64
5.51
5.38
5.25
5.12
4.99
4.86
4.73
8.0
6.0
4.0
2.0
0.0
VIN=12V
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature [°C]
Temperature [°C]
Figure 10. EN Input Current vs Temperature
Figure 11. VREG Output Voltage vs Temperature
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Typical Performance Curves (Continued)
500
400
300
200
100
4.6
4.4
4.2
4.0
3.8
3.6
3.4
3.2
3.0
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature [°C]
Temperature [°C]
Figure 12. UVLO Threshold Voltage vs Temperature
Figure 13. UVLO Hysteresis Voltage vs Temperature
0.79
1.00
0.80
0.60
0.40
0.20
0.00
0.78
0.77
0.75
0.74
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature [°C]
Temperature [°C]
Figure 14. Reference Voltage vs Temperature
Figure 15. FB Input Current vs Temperature
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Typical Performance Curves (Continued)
315
265
215
165
115
3.2
2.6
2.0
1.4
0.8
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature [°C]
Temperature [°C]
Figure 16. SS Charge Current vs Temperature
Figure 17. On Time vs Temperature
400
300
200
100
0
112
96
80
64
48
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature [°C]
Temperature[°C]
Figure 19. High Side MOSFET On-Resistance vs
Temperature
Figure 18. Minimum Off Time vs Temperature
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Typical Performance Curves (Continued)
70
60
50
40
30
-40
-20
0
20
40
60
80
Temperature [°C]
Figure 20. Low Side MOSFET On-Resistance vs
Temperature
OPERATION RANGE VIN=12V (Tj<150℃)
OPERATION RANGE VIN=12V (Tj<150℃)
3.5
3
3.5
3
2.5
2
2.5
2
1.5
1
1.5
1
0.5
0
0.5
0
-60 -40 -20
0
20
40
60
80 100
-60 -40 -20
0
20 40 60 80 100
Temperature[℃]
Temperature[℃]
Figure 21. Output Current vs Temperature
Figure 22. Output Current vs Temperature
(VIN=12V, VOUT=1V, Measured ON FR-4 board 67.5 mm x 67.5 mm,
Copper Thickness : Top and Bottom 70μm, 2 Internal Layers 35μm)
(VIN=12V, VOUT=5V, Measured ON FR-4 board 67.5 mm x 67.5 mm,
Copper Thickness :Top and Bottom 70μm, 2 Internal Layers 35μm)
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Typical Performance Curves (Continued)
VIN=10V/div
VIN=10V/div
VREG=5V/div
SW=10V/div
VREG=5V/div
SW=10V/div
VOUT=1V/div
VOUT=1V/div
Time=1ms/div
Time=1ms/div
Figure 23. Power ON (VIN = EN)
(VIN=12V, VOUT=1.8V, IOUT=3A, Css=3300pF)
Figure 24. Power OFF (VIN = EN)
(VIN=12V, VOUT=1.8V, IOUT=3A, Css=3300pF)
EN=5V/div
EN=5V/div
VREG=5V/div
SW=10V/div
VREG=5V/div
SW=10V/div
VOUT=1V/div
VOUT=1V/div
Time=1ms/div
Time=1ms/div
Figure 25. Power ON（EN = 0V→5V）
(VIN=12V, VOUT=1.8V, IOUT=3A, Css=3300pF)
Figure 26. Power OFF (EN = 5V→0V)
(VIN=12V, VOUT=1.8V, IOUT=3A, Css=3300pF)
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Typical Performance Curves (Continued)
VOUT=20mV/div
VIN=100mV/div
SW=5V/div
Time=0.5µs/div
Time=0.5µs/div
SW=5V/div
Figure 27. VOUT Ripple
Figure 28. VIN Ripple
(VIN=12V, VOUT=1.8V, IOUT=3A, L=2.2μH, COUT=22μF x 2)
(VIN=12V, VOUT=1.8V, IOUT=3A, L=2.2μH, COUT=22μF x 2)
SW=2V/div
SW=2V/div
Time=10ns/div
Time=10ns/div
Figure 29. SW Turn ON
Figure 30. SW Turn OFF
(VIN=12V, VOUT=1.8V, IOUT=3A, L=2.2μH, COUT=22μF x 2)
(VIN=12V, VOUT=1.8V, IOUT=3A, L=2.2μH, COUT=22μF x 2)
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Typical Performance Curves (Continued)
840
805
770
735
700
665
630
595
560
840
805
770
735
700
665
630
595
560
0
0.5
1
1.5
2
2.5
3
0
5
10
15
20
Iload[A]
VIN[V]
Figure 32. Switching Frequency vs Output Current
Figure 31. Switching Frequency vs Input Voltage
(VIN=12V, VOUT=1.8V, L=2.2μH, COUT=22μF x 2)
(VOUT=1.8V, IOUT=3A, L=2.2μH, COUT=22μF x 2)
2
1.5
1
2
1.5
1
0.5
0
0.5
0
-0.5
-1
-0.5
-1
-1.5
-2
-1.5
-2
0
0.5
1
1.5
2
2.5
3
0
5
10
15
20
Iload[A]
VIN[V]
Figure 33. VOUT Line Regulation
(VOUT=1.8V)
Figure 34. VOUT Load Regulation
(VIN=12V, VOUT=1.8V)
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Function Explanations
1 Basic Operation
1-1 Constant On Time Control
BD9D323QWZ is a single synchronous buck switching regulator employing a constant on-time control system.
It controls the on-time by using the duty ratio of VOUT /VIN inside IC so that a switching frequency becomes 700
kHz(Typ).Therefore it runs with the frequency of 700kHz(Typ) under the constant on-time decided with VOUT / VIN.
1-2 Enable Control
The IC shutdown can be controlled by the voltage applied to the EN terminal. When VEN reaches 2.2 V (Min), the
internal circuit is activated and the IC starts up.
Figure35. Start-up with EN pin
1-3 Soft Start Function
By turning EN terminal to High, the soft start function operates and it gradually starts output voltage by controlling the
current at start-up. Also soft start function prevents sudden current and over shoot of output voltage. Rising time can
be set by connecting capacitor to SS terminal. For setting the rising time, please refer to page.28.
EN
SS
VTH
VOUT
0.765V
FB
Td
Tss
Figure 36. Soft Start Timing Chart
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2 Protective Functions
The protective circuits are intended for prevention of damage caused by unexpected accidents. Do not use them
for continuous protective operation.
2-1Over Current Protection (OCP)
Over current protection function is effective by controlling current which flows in low side MOSFET by 1 cycle each of
switching period. With inductor current exceeding the current restriction setting value IOCP when LG is ON, the HG
pulse cannot be hit even with FB voltage under REF voltage and LG continues to be ON until it is below IOCP. It hits
HG when it goes below IOCP. As a result both frequency and duty fluctuates and output voltage may decrease.
In a case where output is decreased because of OCP, output may rise after OCP is released due to the action at high
speed load response. This is non-latch protection and after over current situation is released the output voltage will
recover.
VOUT
FB
High side
MOSFET gate
(HG)
Low side
MOSFET gate
(LG)
OCP threshold (Iocp)
Inductor current
OCP signal
inside IC
Output load
current
Over
Current
Normal
Normal
Figure 37. Over Current Protection Timing Chart
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2-2 Under Voltage Lockout Protection (UVLO)
The Under Voltage Lockout Protection circuit monitors the VREG terminal voltage.
The operation enters standby when the VREG terminal voltage is 3.5 V (Typ) or lower.
The operation starts when the VREG terminal voltage is 3.8 V (Typ) or higher.
Figure 38. UVLO Timing Chart
※Load at Startup
Ensure that the respective output has light load at startup of this IC. Also, restrain the power supply line noise at start-up and
voltage drop generated by operating current within the hysteresis width of UVLO. Noise exceeding the hysteresis noise width
may cause the IC to malfunction.
2-3 Thermal Shutdown Function
When the chip temperature exceeds Tj = 175°C (Typ), the DC/DC converter is stopped. The thermal shutdown circuit is
intended for shutting down the IC from thermal runaway in an abnormal state with the temperature exceeding Tjmax =
150°C. Do not use this function for application protection design. This is non-latch protection.
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Application Example
Parameter
Input Voltage
Output Voltage
Switching Frequency
Maximum Output Load
Operating Temperature Range
Symbol
VIN
VOUT
FOSC
IOMAX
Topr
Specification Example
12 V
5.0 V
700kHz(Typ)
3A
-40 °C ~ +75°C
Figure 39. Application Circuit
Table 1. Recommendation Circuit constants
Part No
U1
Value
Company
ROHM
TOKO
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
ROHM
ROHM
ROHM
ROHM
-
Part name
BD9D323QWZ
L1
3.3μH
0.1μF
10μF
10μF
22μF
22μF
3300pF
0.1μF
1μF
22pF
0Ω
22kΩ
120kΩ
1.8kΩ
OPEN
FDSD0518-H-3R3M
GRM188R71H104KA93D
GRM32DB31E106KA75L
GRM32DB31E106KA75L
GRM32EB31E226ME15L
GRM32EB31E226ME15L
GRM155B11H332KA01
GRM188R71H104KA93D
GRM188B11A105KA61D
GRM1552C1E220JA01
MCR01MZPJ000
C1(Note 1)
C2(Note 2)
C3(Note 2)
C5(Note 3)
C6(Note 3)
C7
C8
C9
C10
R0
R1
R2
R3
R4
MCR01MZPF2202
MCR01MZPF1203
MCR01MZPF1801
-
(Note 1) In order to reduce the influence of high frequency noise, arrange the 0.1μF ceramic capacitor as close as possible to the VIN pin and GND pin.
(Note 2) For capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no less
than 4.7μF. When VIN is lower than 7V at normal state, add capacitor same as C2 to C3.
(Note 3) In case capacitance value fluctuates due to temperature characteristics, DC bias characteristics, etc. of output capacitor, Loop Response may
fluctuate. Please confirm on actual equipment. When selecting a capacitor, confirm the characteristics of the capacitor in its datasheet, Please use
capacitors such as ceramic type are recommended for output capacitor.
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Figure 41. Loop Response IOUT=3A
(VIN=12V, VOUT=5V)
Figure 40. Efficiency vs Output Current
(VIN=12V, VOUT = 5V)
VOUT=100mV/div
VOUT=50mV/div
SW=6V/div
IOUT=1A/div
Time=100μs/div
Time=2μs/div
Figure 42. Load Transient Response IOUT=1.5A - 3A
(VIN=12V, VOUT=5V)
Figure 43. VOUT Ripple IOUT=3A
(VIN = 12V, VOUT = 5V)
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Application Example
Parameter
Input Voltage
Output Voltage
Switching Frequency
Maximum Output Load
Operating Temperature Range
Symbol
VIN
VOUT
FOSC
IOMAX
Topr
Specification Example
12 V
3.3 V
700kHz(Typ)
3A
-40 °C ~ +85°C
Figure 44. Application Circuit
Table 2. Recommendation Circuit constants
Part No
U1
Value
Company
ROHM
TOKO
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
ROHM
ROHM
ROHM
ROHM
-
Part name
BD9D323QWZ
FDSD0518-H-2R2M
GRM188R71H104KA93D
GRM32DB31E106KA75L
GRM32DB31E106KA75L
GRM31CB31A226ME19L
GRM31CB31A226ME19L
GRM155B11H332KA01
GRM188R71H104KA93D
GRM188B11A105KA61D
GRM1552C1E270JA01
MCR01MZPJ000
L1
2.2μH
0.1μF
10μF
10μF
22μF
22μF
3300pF
0.1μF
1μF
27pF
0Ω
22kΩ
68kΩ
5.1kΩ
OPEN
C1(Note 1)
C2(Note 2)
C3(Note 2)
C5(Note 3)
C6(Note 3)
C7
C8
C9
C10
R0
R1
R2
R3
R4
MCR01MZPF2202
MCR01MZPF6802
MCR01MZPF5101
-
(Note 1) In order to reduce the influence of high frequency noise, arrange the 0.1μF ceramic capacitor as close as possible to the VIN pin and GND pin.
(Note 2) For capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no less
than 4.7μF. When VIN is lower than 7V at normal state, add capacitor same as C2 to C3.
(Note 3) In case capacitance value fluctuates due to temperature characteristics, DC bias characteristics, etc. of output capacitor, Loop Response may
fluctuate. Please confirm on actual equipment. When selecting a capacitor, confirm the characteristics of the capacitor in its datasheet, Please use
capacitors such as ceramic type are recommended for output capacitor.
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Figure 45. Efficiency vs Output Current
(VIN=12V, VOUT = 3.3V)
Figure 46. Loop Response IOUT=3A
(VIN=12V, VOUT=3.3V)
VOUT=100mV/div
VOUT=50mV/div
IOUT=1A/div
SW=6V/div
Time=100μs/div
Time=2μs/div
Figure 47. Load Transient Response IOUT=1.5A - 3A
(VIN=12V, VOUT=3.3V)
Figure 48. VOUT Ripple IOUT=3A
(VIN = 12V, VOUT = 3.3V)
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Application Example
Parameter
Input Voltage
Output Voltage
Switching Frequency
Maximum Output Load
Operating Temperature Range
Symbol
VIN
VOUT
FOSC
IOMAX
Topr
Specification Example
12 V
1.8 V
700kHz(Typ)
3A
-40 °C ~ +85°C
Figure 49. Application Circuit
Table 3. Recommendation Circuit constants
Part No
U1
Value
Company
ROHM
TOKO
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
ROHM
ROHM
ROHM
ROHM
-
Part name
BD9D323QWZ
FDSD0518-H-2R2M
GRM188R71H104KA93D
GRM32DB31E106KA75L
GRM32DB31E106KA75L
GRM21BB30J226ME38L
GRM21BB30J226ME38L
GRM155B11H332KA01
GRM188R71H104KA93D
GRM188B11A105KA61D
GRM1552C1E470JA01
MCR01MZPJ000
L1
2.2μH
0.1μF
10μF
10μF
22μF
22μF
3300pF
0.1μF
1μF
47pF
0Ω
22kΩ
30kΩ
0Ω
C1(Note 1)
C2(Note 2)
C3(Note 2)
C5(Note 3)
C6(Note 3)
C7
C8
C9
C10
R0
R1
R2
R3
R4
MCR01MZPF2202
MCR01MZPF3002
MCR01MZPJ000
OPEN
-
(Note 1) In order to reduce the influence of high frequency noise, arrange the 0.1μF ceramic capacitor as close as possible to the VIN pin and GND pin.
(Note 2) For capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no less
than 4.7μF. When VIN is lower than 7V at normal state, add capacitor same as C2 to C3.
(Note 3) In case capacitance value fluctuates due to temperature characteristics, DC bias characteristics, etc. of output capacitor, Loop Response may
fluctuate. Please confirm on actual equipment. When selecting a capacitor, confirm the characteristics of the capacitor in its datasheet, Please use
capacitors such as ceramic type are recommended for output capacitor.
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Figure 50. Efficiency vs Output Current
(VIN=12V, VOUT = 1.8V)
Figure 51. Loop Response IOUT=3A
(VIN=12V, VOUT=1.8V)
VOUT=100mV/div
VOUT=50mV/div
IOUT=1A/div
SW=6V/div
Time=100μs/div
Time=2μs/div
Figure 52. Load Transient Response IOUT=1.5A - 3A
(VIN=12V, VOUT=1.8V)
Figure 53. VOUT Ripple IOUT=3A
(VIN = 12V, VOUT = 1.8V)
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Application Example
Parameter
Input Voltage
Output Voltage
Switching Frequency
Maximum Output Load
Operating Temperature Range
Symbol
VIN
VOUT
FOSC
IOMAX
Topr
Specification Example
12 V
1.2 V
700kHz(Typ)
3A
-40 °C ~ +85°C
Figure 54. Application Circuit
Table 4. Recommendation Circuit constants
Part No
U1
Value
Company
ROHM
TOKO
Part name
BD9D323QWZ
FDSD0518-H-1R5M
L1
1.5μH
0.1μF
10μF
10μF
22μF
22μF
3300pF
0.1μF
1μF
220pF
0Ω
10kΩ
4.7kΩ
1kΩ
C1(Note 1)
C2(Note 2)
C3(Note 2)
C5(Note 3)
C6(Note 3)
C7
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
ROHM
ROHM
ROHM
ROHM
ROHM
GRM188R71H104KA93D
GRM32DB31E106KA75L
GRM32DB31E106KA75L
GRM31CB31A226ME19L
GRM31CB31A226ME19L
GRM155B11H332KA01
GRM188R71H104KA93D
GRM188B11A105KA61D
GRM155B11H221KA01
MCR01MZPJ000
C8
C9
C10
R0
R1
R2
R3
R4
MCR01MZPF1002
MCR01MZPF4701
MCR01MZPF1001
MCR01MZPF3003
300kΩ
(Note 1) In order to reduce the influence of high frequency noise, arrange the 0.1μF ceramic capacitor as close as possible to the VIN pin and GND pin.
(Note 2) For capacitance of input capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no less
than 4.7μF. When VIN is lower than 7V at normal state, add capacitor same as C2 to C3.
(Note 3) In case capacitance value fluctuates due to temperature characteristics, DC bias characteristics, etc. of output capacitor, Loop Response may
fluctuate. Please confirm on actual equipment. When selecting a capacitor, confirm the characteristics of the capacitor in its datasheet, Please use
capacitors such as ceramic type are recommended for output capacitor.
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Figure 56. Loop Response IOUT=3A
(VIN=12V, VOUT=1.2V)
Figure 55. Efficiency vs Output Current
(VIN=12V, VOUT = 1.2V)
VOUT=100mV/div
VOUT=50mV/div
SW=6V/div
IOUT=1A/div
Time=100μs/div
Time=2μs/div
Figure 57. Load Transient Response IOUT=1.5A - 3A
(VIN=12V, VOUT=1.2V)
Figure 58. VOUT Ripple IOUT=3A
(VIN = 12V, VOUT = 1.2V)
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Selection of Components Externally Connected
About the application except the recommendation, please contact us.
(1) Output LC Filter Constant
The DC/DC converter requires an LC filter for smoothing the output voltage in order to supply a continuous current to the
load. Selecting an inductor with a large inductance causes the ripple current ∆IL that flows into the inductor to be small.
However, decreasing the ripple voltage generated in the output is not advantageous in terms of the load transient
response characteristic. An inductor with a small inductance improves the load transient response characteristic but
causes the inductor ripple current to be large which increases the ripple voltage in the output voltage, showing a trade-off
relationship. Please use recommended inductor values.
IL
Inductor saturation current > IOUTMAX +∆IL /2
∆IL
Average inductor current
(Output Current：IOUT)
t
Figure 59. Waveform of current through inductor
Figure 60. Output LC filter circuit
Here, select an inductance so that the size of the ripple current component of the inductor will be 20% to 50% of the Max
output current (3A).
Now calculating with VIN = 12V, VOUT = 1.8V, switching frequency FOSC = 700kHz, ꢀIL is 1.0A, inductance value, that can
be used is calculated as follows:
1
L ꢀVOUT ꢁ ꢃVIN ‐VOUT ꢂ ꢁ
ꢀ 2.19 ≒2.2 [μH]
VIN ꢁ FOSC ꢁ ΔIL
Also for saturation current of inductor, select the one with larger current than maximum output current added by 1/2 of
inductor ripple current ∆IL.
Output capacitor COUT affects output ripple voltage characteristics. Select output capacitor COUT so that necessary ripple
voltage characteristics are satisfied.
The output ripple voltage can be represented by the following equation.
1
[V]
ꢂ
ΔVRPL ꢀ ΔIL ꢁ ꢃRESR
ꢄ
8 ꢁCOUT ꢁFOSC
RESR is the Equivalent Series Resistance (ESR) of the output capacitor.
With COUT = 44µF, RESR = 10mΩ the output ripple voltage is calculated as follows:
1
ΔVRPL ꢀ 1.0 ꢁ ꢃ10mꢄ
ꢂ ꢀ 14.06 [mV]
8 ꢁ 44μ ꢁ 700k
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※The capacitor rating must allow a sufficient margin with respect to the output voltage.
The output ripple voltage is decreased with a smaller ESR capacitor.
Considering temperature and DC bias characteristics, please use ceramic capacitor with 22 µF to 100 µF capacity.
※Pay attention to total capacitance value, when additional capacitor CLOAD is connected in addition to output capacitor
COUT. Then, please determine CLOAD and soft start time Tss (Refer to (4) Soft Start Setting) as satisfying the following
equation.
ꢃIOCP ‐ IOUT ꢂ ꢁ TSS
COUT CLOAD
[F]
VOUT
IOCP is Over Current Protection Current limit value.
(2) Output Voltage Setting
The output voltage value is set by the feedback resistance ratio.
R1 R2
VOUT
ꢀ
0.765 [V]
R2
BD9D323QWZ operates under the condition which satisfies
the following equation.
VOUT
VIN
0.07
0.65
Figure 61. Feedback Resistor Circuit
(3) Input capacitor configuration
For input capacitor, use a ceramic capacitor. It is more effective, the closer it is to the VIN pin and GND pin. Please
consider temperature and DC bias characteristics when usage. For normal setting, 10μF is recommended, but with larger
value, input ripple voltage can be further reduced. Also, considering temperature and DC bias characteristics, do not use
capacity less than 4.7μF. In order to reduce the influence of high frequency noise, place 0.1μF ceramic capacitor close to
VIN pin and GND pin as much as possible. When VIN is lower than 7V at normal state, double the value of input capacitor.
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(4) Soft Start Setting
Turning the EN terminal signal High activates the soft start function. This makes output voltage to rise gradually while
controlling current at start-up. This prevents output voltage overshoot and inrush current. The rise time depends on the
value of the capacitor connected to the SS terminal.
CSS VTH
[s]
Td ꢀ
ISS
CSS VFB 1.15
[s]
TSS ꢀ
ISS
Td
: Soft Start Delay Time
Tss : Soft Start Time
Css : Capacitor connected to Soft Start Time Terminal
VFB : FB Terminal Voltage (0.765V Typ)
VTH : Internal MOS threshold voltage (0.7V Typ)
Iss
: Soft Start Terminal Source Current (2.0µA Typ)
With Css = 3300pF,
Td = ( 3300 pF x 0.7 V ) / 2.0 µA
= 1.16ms
Tss= ( 3300 pF x 0.765 V x 1.15 ) / 2.0 µA
= 1.45ms
(5) Bootstrap capacitor
Connect 0.1μF ceramic capacitor between SW pin and BOOT pin.
(6) VREG capacitor
Connect 1µF ceramic capacitor to ground.
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PCB Layout Design
In the step-down DC/DC converter, a large pulse current flows into two loops. The first loop is the one into which the current
flows when the high side FET is turned ON. The flow starts from the input capacitor CIN, runs through the FET, inductor L
and output capacitor COUT and back to ground of CIN via ground of COUT. The second loop is the one into which the current
flows when the low side FET is turned on. The flow starts from the low side FET, runs through the inductor L and output
capacitor COUT and back to ground of the low side FET via ground of COUT. Route these two loops as thick and as short as
possible to allow noise to be reduced for improved efficiency. It is recommended to connect the input and output capacitors
directly to the ground plane. The PCB layout has a great influence on the DC/DC converter in terms of all of the heat
generation, noise and efficiency characteristics.
VIN
VOUT
L
MOS FET
CIN
COUT
Figure 62. Current Loop of Buck Converter
Accordingly, design the PCB layout considering the following points.
Connect an input capacitor as close as possible to the IC VIN terminal and GND terminal on the same plane as the IC.
If there is any unused area on the PCB, provide a copper foil plane for the ground node to assist heat dissipation from
the IC and the surrounding components.
Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the coil pattern as
thick and as short as possible.
Provide lines connected to FB and SS far from the SW nodes.
Place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input.
TOP Layer
Bottom Layer
Figure 63. Example of PCB layout
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I/O Equivalent Circuit
2. BOOT
3. SW
VREG
VIN
BOOT
SW
5. SS
6. FB
VREG
VREG
15kΩ
FB
SS
2.3kΩ
7. VREG
8. EN
Figure 64. I/O equivalence circuit
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
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Operational Notes – continued
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 65. Example of hic IC scture
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
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Operational Notes – continued
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
16. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip
from being exposed to light.
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Ordering Information
B D 9 D 3
2
3 Q W Z -
E 2
Parts Number
Package
QWZ: UMMP008Z2020
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
UMMP008Z2020
2.00mm x 2.00mm x 0.40mm
UMMP008Z2020 (TOP VIEW)
Part Number Marking
LOT Number
D 9 D
3 2 3
1PIN MARK
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111•15•001
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Physical Dimension, Tape and Reel Information
Package Name
UMMP008Z2020
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111•15•001
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Revision History
Date
Revision
Changes
-
001
002
003
Not Release
New
09.Dec.2016
06.Feb.2017
Added note in Recommended Operating Conditions.
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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