BD87007FJ [ROHM]
BD87007FJ是用于二次侧输出端的同步整流型控制器。内置低功耗高精度分流稳压器,可减少待机功耗。另外,在连续模式工作时,无需输入一次侧的开关同步信号即可工作,更加节省空间。工作电源电压宽达2.7V~32.0V,可支持各种输出的应用。另外,采用高耐压120V(Max)工艺,可直接监测漏极电压。;型号: | BD87007FJ |
厂家: | ROHM |
描述: | BD87007FJ是用于二次侧输出端的同步整流型控制器。内置低功耗高精度分流稳压器,可减少待机功耗。另外,在连续模式工作时,无需输入一次侧的开关同步信号即可工作,更加节省空间。工作电源电压宽达2.7V~32.0V,可支持各种输出的应用。另外,采用高耐压120V(Max)工艺,可直接监测漏极电压。 开关 控制器 稳压器 |
文件: | 总23页 (文件大小:1513K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
Built-in Low Consumption and High Accuracy Shunt Regulator
High Efficiency, Low Standby Power and
CCM Corresponding
Secondary Side Synchronous Rectification
Controller IC
BD87007FJ
General Description
Key Specifications
BD87007FJ is synchronous rectification controller to be
used in the secondary side output. It has a built-in low
consumption and high accuracy shunt regulator, which
reduces standby power. At continuous conduction mode
(CCM) operation, further space saving can be realized
when operating without the input switching synchronizing
signal of the primary side.
Supply Voltage
Circuit Current (No Switching):
DRAIN Monitor Pin Absolute Voltage: 120 V (Max)
Operating Temperature Range: -40 °C to +105 °C
2.7 V to 32.0 V
800 µA (Typ)
Package
W(Typ) x D(Typ) x H(Max)
4.90 mm x 6.00 mm x 1.65 mm
SOP-J8
BD87007FJ also features a wide operating supply
voltage of 2.7 V to 32.0 V for various output applications.
In addition, by adopting the high voltage 120 V (Max)
process, it is possible to monitor the drain voltage
directly.
Features
Built-in Low Consumption and High Accuracy Shunt
Regulator, which Reduces Standby Power
120 V (Max) High Voltage Process DRAIN Monitor
Pin
Wide Supply Voltage Range of 2.7 V to 32.0 V
Supports Drive Type: PWM, QR Controller etc.
No Input Required on the Primary-Side at CCM
Built-in Over Voltage Protection for SH_IN and VCC
Pin
Applications
AC/DC Output Power Conversion Applications:
Charger, Adapter, Household Appliance, etc.
Built-in Thermal Shutdown Function
Typical Application Circuits
VOUT
CVCC
RDRAIN1
DRAIN
RDRAIN2
VCC
D1
LFB
SR_GND
SH_IN
Primary
Controler
+
COUT
GATE
SH_OUT
NC
-
R1 C1
MAX_TON
RMAX_TON
GND
M1
Flyback Application Circuit (Low side FET)
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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BD87007FJ
Pin Configuration
(TOP VIEW)
VCC
SH_IN
DRAIN
SR_GND
SH_OUT
GATE
MAX_TON
NC
Pin Description
Pin No.
Pin Name
VCC
Function
1
2
3
4
5
6
7
8
Power supply input pin
SH_IN
Shunt regulator reference input pin
Shunt regulator power supply input / output pin
Non connection (Do not connect this pin to any potential and keep it open.)
Set maximum on time pin
SH_OUT
NC
MAX_TON
GATE
Secondary side FET GATE drive pin
GND pin
SR_GND
DRAIN
Secondary side FET DRAIN monitor pin
Block Diagram
VOUT
+
-
GND
Primary
Side
Controller
SHUNT
LDO BLOCK
REGULATOR
-
+
DRAIN COMP
-
0.800 V
(Typ)
+
PROTECTION BLOCK
・SH_IN_OVP
・VCC_OVP
Timer
Auto
Restart
VCC x 1.4
(Typ)
SET COMP
-
・TSD
S
Q
+
-100 mV
(Typ)
R
MAX_TON
MAX_TON
BLOCK
RESET COMP
+
-
Compulsion
OFF Time
-6 mV
(Typ)
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Description of Block
1. SET COMP Block
Monitors the DRAIN pin voltage, and outputs a signal to turn on the FET if the DRAIN pin voltage is -100 mV (Typ) or
less.
2. RESET COMP Block
Monitors the DRAIN pin voltage, and outputs a signal to turn off the FET if the DRAIN pin voltage is -6 mV (Typ) or more.
3. Compulsion OFF Time Block
When the FET is turned OFF due to RESET COMP detection, resonance waveforms appear on the DRAIN pin. To
prevent the resonance waveforms from turning on the FET, an OFF state should be forced for a certain time.
Operation sequence of each block is shown on the figure below.
VOUT
Secondary Side
0 V
-6 mV
-100 mV
-6 mV
-6 mV
-100 mV
-6 mV
DRAIN
-100 mV
-100 mV
0 V
0 V
SET COMP
ON
ON
RESET
RESET
RESET COMP
OFF
ON
ON
Secondary side0 V
GATE
Compulsion
OFF Time
0 V
OFF
Time
OFF
Time
Figure 1. Operation Sequence
About Maximum Input Frequency
The Maximum Operating Frequency of the IC depends on the Compulsion OFF Time. For example, BD87007FJ
Compulsion OFF Time is equal to 3.850 μs. Considering a variation of 9.09 %, the maximum input frequency is given by
the following:
1
푓푀퐴푋
=
≈ 2ꢀꢁ
[kHz]
(
)
3.850 µ푠 ×1.0909
However, because the frequency largely fluctuates depending on the input voltage, load conditions, etc., it will be
different for each application.
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Description of Block – continued
4. MAX_TON Block
MAX_TON block sets the maximum ON time. It starts the counting when the DRAIN pin voltage is on the rising edge of
the output voltage VCC x 1.4 V (Typ) or more. In addition, the FET will be forced OFF after the set time has elapsed.
The relationship between the resistance value (RMAX_TON) and set time (tMAX_ON) is described as follows:
푡푀퐴푋_푇푂푁 [ꢂs] × ꢃꢄ [kΩ/ꢂs] = 푅푀퐴푋_푇푂푁 [kΩ]
Calculation Example:
If you want to set the maximum ON time to 10 µs, the value of RMAX_TON is as follows:
ꢃꢄ [ꢂs] × ꢃꢄ [kΩ/ꢂs] = ꢃꢄꢄ [kΩ]
However, the formula above is for an ideal approximation only. It is strongly advised that the operation of the actual
application should be verified.
By setting this time, it becomes possible to prevent the simultaneous ON operation of the primary side and the
secondary side in CCM.
The drive sequence in CCM operation is shown in the figure below:
VOUT
(1)
(1)
(3)
+
-
I2
VF
VG1
0 V
I1
GND
LFB
RDRAIN2
VG1
VG2
Primary
Side
Controller
I1
RDRAIN1
D1
0 A
0 A
VDS2
I2
LDO BLOCK
VCC x 1.4
DRAIN COMP
-
+
VCC x 1.4
(Typ)
0 V
0 V
VDS2
-
SET COMP
-100mV
-100 mV
C1 R1
S
Q
+
-VF
(6)
-100 mV
(Typ)
(4)
R
MAX_TON
MAX_TON
BLOCK
VG2
RMAX_TON
tMAX_ON
tMAX_ON
MAX_TON
timer
RESET COMP
+
-
Compulsion
OFF Time
(2)
-6 mV
(Typ)
(5)
Period allotted for VG1 and VG2
to avoid concurrent ON state
at CCM.
Figure 2. The Drive Sequence in CCM Operation
(1) Primary side FET = ON. Current I1 flows to the primary side FET. Secondary side drain voltage VDS2 rises.
(2) The VDS2 = VCC x 1.4 detects the rise edge of the threshold, MAX_TON timer start.
(3) Primary side FET = OFF. Current I2 flows through the Body Diode of the secondary side FET (OFF state).
(4) Secondary side drain voltage VDS2 ≤ -100 mV by current I2, Secondary side FET = ON.
(5) Elapsed the set time in the MAX_TON pin, the secondary side FET = compulsion OFF.
(6) Since the I2 current flows through the Body Diode, VF voltage occurs.
In order to reduce the influence of the switching noise as much as possible, capacitor C1 and resistor R1 in series should
be connected to the MAX_TON pin. It is recommended that the capacitance be about 1000 pF and the resistance value
be about 1 kΩ. This also serves as phase compensation of the MAX_TON pin and therefore should be connected.
For quasi-resonance (QR) application, this function is unnecessary because it basically does not operate in CCM. At
this time, the setting method of the MAX_TON pin is invalidated by setting RMAX_TON which is sufficiently large (300 kΩ or
less) so that the minimum time of one period on the primary side including variation etc. << MAX_TON timer setting
time.
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Description of Block – continued
5. SHUNT REGULATOR Block
It is a low consumption, high accuracy shunt regulator that controls the AC/DC output voltage.
6. PROTECTION Block
When protection is detected, the timer starts counting. After completion, drive the photo coupler from the SH_OUT pin to
stop the primary side drive operation.
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BD87007FJ
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
V
VCC Input Pin
VMAX_VCC
-0.3 to +40
MAX_TON Output Pin
SH_IN Input Pin
VMAX_MAX_TON
VMAX_SH_IN
VMAX_SH_OUT
VMAX_GATE
VMAX_DRAIN
Tjmax
-0.3 to +VMAX_VCC
-0.3 to +40
V
V
V
V
SH_OUT Input / Output Pin
Gate Output Pin
-0.3 to +40
-0.3 to +15.5
+120 (Note 1)
Drain Input Pin
V
Maximum Junction Temperature
+150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) When a negative voltage is applied, current flows through the ESD protection device. This current value is about 6 mA or less and will require a current
limiting resistor to the DRAIN pin.
Thermal Resistance (Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s (Note 4)
2s2p (Note 5)
SOP-J8
Junction to Ambient
Junction to Top Characterization Parameter (Note 3)
θJA
149.3
18
76.9
11
°C/W
°C/W
ΨJT
(Note 2) Based on JESD51-2A(Still-Air)
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 µm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 µm
Copper Pattern
Thickness
35 µm
Thickness
70 µm
Footprints and Traces
74.2 mm x 74.2 mm
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VCC
Topr
2.7
-40
56
20.0
+25
-
32.0
+105
300
V
Supply Voltage
°C
kΩ
kΩ
pF
Operating Temperature
MAX_TON RMAX_TON Resistor Range
RMAX_TON
R1
MAX_TON R1
MAX_TON C1
0.5
680
1.0
2.0
C1
1000
2200
Electrical Characteristics (Unless otherwise specified VCC =20 V, VSH_OUT = 20 V, Ta = 25 °C)
Parameter
Circuit Current
Symbol
Min
Typ
Max
Unit
Conditions
fSW = 50 kHz at Switching Mode
(GATE = OPEN)
Circuit Current1
ION
0.5
1.0
2.0
mA
Circuit Current2
IACT
IOFF
350
18
800
35
1400
60
µA
µA
Switching Stop Mode
Circuit Current3
VCC = 1.9 V, UVLO Mode
VCC Item
VCC UVLO Threshold Voltage1
VCC UVLO Threshold Voltage2
VCC OVP Detection Voltage1
VCC OVP Detection Voltage2
SR Controller BLOCK
GATE Turn ON Threshold Voltage
GATE Turn OFF Threshold Voltage
Compulsion OFF Time
MAX_TON BLOCK
VUVLO1
VUVLO2
VOVP1
VOVP2
2.00
1.95
32.5
31.5
2.30
2.25
35.0
34.0
2.65
2.60
37.5
36.5
V
V
V
V
VCC Sweep Up
VCC Sweep Down
VCC Sweep Up
VCC Sweep Down
VGON
VGOFF
tCOFF
-150
-10
-100
-6
-50
-1
mV
mV
µs
VDRAIN = +300 mV to -300 mV
VDRAIN = -300 mV to +300 mV
3.50
3.85
4.20
MAX_TON Timer Start Threshold
Voltage
VCC = 20 V
Pulse Input to DRAIN Pin
VMAX_ON_START
24
28
32
V
RMAX_TON = 100 kΩ
VCC = 3 V
VDRAIN = -0.3 V↔+7 V
MAX_TON Timer
tMAX_ON
9.4
10.0
0.40
10.6
0.56
µs
V
MAX_TON Output Voltage
Drain Monitor BLOCK
VMAX_ON
0.24
Drain Pin Sink Current
ID_SINK
130
-23
270
-11
550
-5
µA
µA
µA
VDRAIN = 120 V
VDRAIN = 0.1 V
VDRAIN = -0.2 V
Drain Pin Source Current1
Drain Pin Source Current2
Driver BLOCK
IDRAIN_SO1
IDRAIN_SO2
-3.0
-1.0
-0.3
GATE Pin High Voltage
VGATE_H1
RHIONR1
11
12.0
6.0
4.0
1.1
0.9
-
12
23.0
12.0
9.0
14
50.0
24.0
18.0
4.4
3.6
-
V
Ω
VCC = 20 V
High Side FET ON-Resistance1
High Side FET ON-Resistance2
High Side FET ON-Resistance3
Low Side FET ON-Resistance1
Low Side FET ON-Resistance2
Delay Time GATE Pin Turn ON
Delay Time GATE Pin Turn OFF
VCC = 2.7 V, IOUT = -10 mA
VCC = 5.0 V, IOUT = -10 mA
VCC = 10 V, IOUT = -10 mA
VCC = 2.7 V, IOUT = +10 mA
VCC = 5.0 V, IOUT = +10 mA
VDRAIN = +300 mV to -300 mV
VDRAIN = -300 mV to +300 mV
RHIONR2
Ω
RHIONR3
Ω
RLOWONR1
RLOWONR2
tDELAY_ON
tDELAY_OFF
2.2
Ω
1.8
Ω
50
ns
ns
-
100
-
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BD87007FJ
Electrical Characteristics - continued
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Shunt Regulator BLOCK
VSH_OUT = 5 V
SH_OUT Sink Current = 100 µA
VSH_OUT = 5 V
SH_OUT Sink Current = 100 µA
Ta = +25 °C to +105 °C
VSH_OUT = 2.7 V to 5 V
Reference Voltage
VSHREF
∆VSHEMP
∆VSHREF1
0.792 0.800 0.808
V
Reference Voltage
Changing Ratio by Temperature
-
-
-8
1
-
-
mV
mV
SH_OUT Coefficient
of the Reference Voltage1
SH_OUT Sink Current = 100 µA
SH_OUT Coefficient
of the Reference Voltage2
VSH_OUT = 5 V to 20 V
SH_OUT Sink Current = 100 µA
∆VSHREF2
-
2
-
mV
µA
Reference Input Current
ISH_IN
-0.2
0.0
+0.2
VSH_IN = 2 V
SH_OUT Sink Current
= 100 µA to 300 µA
(VSH_OUT = 2.7 V)
SH_OUT Sink Current
= 100 µA to 300 µA
(VSH_OUT = 20 V)
Dynamic Impedance1
RSH_OUT1
-
-
0.3
0.2
-
-
Ω
Ω
Dynamic Impedance2
RSH_OUT2
SH_OUT Current at SH_IN = Low
ISH_OUT
ISH_OUT_REG
VSHI_OVP1
5
10
-
18
-
µA
mA
V
VSH_IN = 0 V, VSH_OUT = 5 V
VSH_IN = 0.85 V, VSH_OUT = 5 V
VSH_IN Sweep Up
SH_OUT Regulation Current
SH_IN OVP Detection Voltage1
SH_IN OVP Detection Voltage2
Protection Detect Timer
1
0.90
0.85
500
1.00
0.95
900
1.10
1.05
1500
VSHI_OVP2
V
VSH_IN Sweep Down
tPROTECTION
µs
SH_OUT Pull Down Current
at Protection Detect Mode
IPROTECTION
1.3
2.5
5.0
mA
VSH_IN = 0 V, VSH_OUT = 5 V
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BD87007FJ
Typical Performance Curves
(Reference Data)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.4
Ta = +105 °C
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Ta = +25 °C
Ta = +105 °C
Ta = +25 °C
Ta = -40 °C
Ta = -40 °C
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Supply Voltage : VCC[V]
0
5
10
15
20
25
30
Supply Voltage : VCC[V]
Figure 3. Circuit Current2 vs Supply Voltage
(Switching Stop Mode)
Figure 4. Circuit Current2 vs Supply Voltage
(Switching Stop Mode VCC Zoom)
5000
4000
20
18
16
14
12
10
8
Ta = +105 °C
Ta = +25 °C
3000
Ta = +105 °C
Ta = +25 °C
2000
Ta = -40 °C
Ta = -40 °C
6
1000
4
2
0
0
740
760
780
800
820
840
860
0
5
10
15
20
25
30
SH_IN Voltage : VSH_IN [mV]
SH_OUT Voltage : VSH_OUT[V]
Figure 5. SH_OUT Current at SH_IN = L vs SH_OUT Voltage
(VSH_IN = 0 V)
Figure 6. SH_OUT Regulation Current vs SH_IN Voltage
(VSH_OUT = 5 V)
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BD87007FJ
Typical Performance Curves - continued
(Reference Data)
0.820
0.815
11.0
10.8
10.6
10.4
10.2
10.0
9.8
VCC = 20 V
VSH_OUT = 20 V
0.810
0.805
0.800
0.795
0.790
0.785
0.780
VCC = 5 V
VSH_OUT = 5 V
VCC = 3 V
VSH_OUT = 3 V
9.6
9.4
9.2
9.0
-40 -20
0
20
40
60
80 100
-40 -20
0
20
40
60
80 100
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 7. Reference Voltage vs Temperature
(SH_OUT Sink Current = 100 µA)
Figure 8. MAX_TON Timer vs Temperature
(RMAX_TON = 100 kΩ, VDRAIN = -0.3 V↔+7 V)
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-90
-95
-100
-105
-110
VCC = 20 V
VCC = 5 V
VCC = 20 V
VCC = 5 V
VCC = 3 V
VCC = 3 V
-10
-40 -20
0
20
40
60
80 100
-40 -20
0
20
40
60
80 100
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 9. GATE Turn On Threshold vs Temperature
(DRAIN Sweep Down)
Figure 10. GATE Turn Off Threshold vs Temperature
(DRAIN Sweep Up)
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BD87007FJ
Timing Chart
The startup sequence is shown below.
DRAIN
2.3 V
VOUT(VCC)
VCC=2.3 V
0.4 V
VCC UVLO
MAX_TON
DRAIN
9COUNT
GATE
Figure 11. Startup Sequence
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BD87007FJ
Application Examples
VOUT
CVCC
PC1
RDRAIN2
LFB
DRAIN
VCC
RFB1
D1
RDRAIN1
SR_GND
SH_IN
+
-
COUT
CFB1
RFB2
GATE
SH_OUT
NC
CFB2
RMAX_TON
MAX_TON
R1 C1
GND
M1
Figure 12. Flyback Application Circuit
(Low Side FET)
D2
M1
VOUT
LFB
CVCC
RFB1
PC1
CFB1 RFB3
DRAIN
VCC
+
-
COUT
SR_GND
SH_IN
RFB2 CFB2
GATE
SH_OUT
NC
RMAX_TON
MAX_TON
R1 C1
GND
Figure 13. Flyback Application Circuit
(High Side FET)
The built-in shunt regulator block is connected in the IC with SR_GND of the synchronous rectification controller. Therefore,
do not use the shunt regulator for high side FET type flyback application. Connect the SH_IN pin to the SR_GND pin. Set the
SH_OUT pin open.
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BD87007FJ
Selection of Components Externally Connected
1. MAX_TON Pin Setting
A resistance value which is connected to the MAX_TON pin is used to set the timer to force the GATE output OFF. (For
detailed operation, please see "Description of Block Operation / MAX_TON Block")
Set timer is proportional to the resistance value which can be set in the range of 56 kΩ to 300 kΩ. This IC is capable of
an accuracy of 10 μs ±6 % at 100 kΩ. However, accuracy deteriorates as the resistance value gets further away from
100 kΩ. For example, 5.6 µs ±0.9 µs at 56 kΩ, 30 µs ±4.5 µs at 300 kΩ. (See graph below)
tP
34.5
30.0
25.5
Jitter
G1
G2
Set the MAX_TON timer so that
the FET of the primary side (G1)
and the secondary side (G2) is not
simultaneously ON.
10.6
10.0
9.4
tMAX_ON
6.5
5.6
4.7
MAX_TON
timer
56
100
300
MAX_TON Resistor (RMAX_TON) [kΩ]
Figure 15. Primary FET and Secondary FET Sequence
at CCM
Figure 14. MAX_TON Timer vs MAX_TON Resistor
To prevent destruction due to surge current in CCM, set the MAX_TON timer before turning on the primary side FET
(G1) to forcibly OFF the secondary side FET (G2). Including such variations, select a resistance value of the MAX_TON
pin (RMAX_TON) so that the MAX_ON timer setting time is less than one cycle in the primary side (tP > tMAX_ON).
ꢅ
10×10
푅푀퐴푋_푇푂푁
<
[kΩ]
ꢆ1+훥ꢇ
+훥ꢍ+훥ꢎ
ꢏ×ꢆꢎ
+ꢎ
ꢏ
ꢈꢉꢊ_ꢋꢌ
ꢈꢉꢊ
ꢈꢉꢊ
퐽퐼ꢐꢐ퐸ꢑ
Frequency Variation Ratio
Maximum Frequency Value
where:
fMAX is the primary side of the maximum frequency [kHz]
∆fMAX is the primary side of the maximum frequency accuracy [%]
fJITTER is the primary side of the jitter frequency [kHz]
∆tMAX_ON is Secondary side MAX_TON timer time accuracy [%]
∆R is Secondary side MAX_TON When the connection resistance accuracy [%]
2. Calculation Example
ꢅ
10×10
푅푀퐴푋_푇푂푁
<
= ꢁ2.ꢒ7
) ( )
1+0.06+0.01+0.05 × 100+8
[kΩ]
(
fMAX is the primary side of the maximum frequency 100[kHz]
∆fMAX is the primary side of the maximum frequency accuracy 5[%]
fJITTER is the primary side of the jitter frequency 8[kHz]
∆tMAX_ON is Secondary side MAX_TON timer time accuracy 6[%]
∆R is Secondary side MAX_TON When the connection resistance accuracy 1[%]
With these conditions, MAX_TON Resistor (RMAX_TON) should be set to 82 kΩ or less. In addition, it is recommended that
the temperature characteristics of each component should also be taken into account.
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TSZ22111 • 15 • 001
BD87007FJ
I/O Equivalence Circuits
Pin 1: VCC / Pin 6: GATE / Pin 7: SR_GND
Pin 8: DRAIN
Internal
REG
8.DRAIN
1.VCC
SR
6.GATE
block
7.SR_GND
7.SR_GND
Pin 2: SH_IN / Pin 3: SH_OUT
Pin 5: MAX_TON
1.VCC
Internal
REG
3.SH_OUT
2.SH_IN
7.SR_GND
5.MAX_TON
7.SR_GND
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TSZ22111 • 15 • 001
BD87007FJ
Notes on the Layout
VOUT
(1)
(5)
CVCC
PC1
(6)
(2)
DRAIN
VCC
RFB1
SH_IN
SR_GND
+
-
COUT
CFB1
RFB2
GATE
SH_OUT
NC
CFB2
RMAX_TON
MAX_TON
(5)
R1
C1
M1
(3)
LFB
(8)
GND
Rsnb
Csnb
(7)
(4)
Figure 16. Flyback Application Circuit
(Low Side FET)
(1) VCC line may malfunction under the influence of switching noise.
Therefore, it is recommended to insert a capacitor CVCC between the VCC and SR_GND pin.
(2) The SH_IN pin is a high impedance line. To avoid crosstalk, electrical wiring should be as short as possible and not in
parallel with the switching line.
(3) The MAX_TON pin has a 0.4 V output. Therefore, there is a possibility that compulsion OFF time is affected by the
switching operation. We recommend connecting RMAX_TON, R1, C1 just before the MAX_TON pin output as much as
possible and connecting to the SR_GND pin with independent wiring. It is also recommended to use an independent
electrical wiring in connection with the SR_GND pin.
(4) The synchronous rectification controller IC must accurately monitor the VDS generated in the FET. Accordingly, the
electrical wiring between the DRAIN to DRAIN and SR_GND to SOURCE of the IC and FET respectively should be
connected independently.
(5) The feedback resistors of VOUT are recommended to be connected to the GND of the output with an independent
electrical wiring.
(6) The DRAIN pin is a switching line. Use a narrow wiring and connect as short as possible.
(7) Use an independent wiring if connecting a snubber circuit between the DS of the FET. The connection of the
transformer output and the SOURCE of the FET should be thick and short as possible.
(8) Due to the DRAIN pin detects the small voltage, a malfunction which the switch turns ON/OFF caused by the surge
voltage may occur. So that, the filters such as the ferrite bead are recommended for alleviating the surge voltage.
Select LFB with high impedance type in the frequency range (1 MHz to 10 MHz). If the ferrite bead is unnecessary, short
the wiring.
Configuration example(Note 6)
:
D1 (a schottky barrier diode): RB751VM-40 (ROHM)
RDRAIN1 (a filter resistor for the FET turn off): 0.3 kΩ to 2 kΩ
RDRAIN2 (a current limiting resistor to the DRAIN pin): 150 Ω
(Note 6) The value is not a guaranteed value, but for reference. Please choose the optimum values of the components after sufficient evaluations based
on the actual application.
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BD87007FJ
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a
voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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TSZ22111 • 15 • 001
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BD87007FJ
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 17. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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BD87007FJ
Ordering Information
B D 8 7 0 0 7 F J
-
E 2
Package
FJ:
SOP-J8
Part Number
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP-J8 (TOP VIEW)
Part Number Marking
LOT Number
8 7 0 0 7
Pin 1 Mark
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18/20
TSZ22111 • 15 • 001
BD87007FJ
Physical Dimension and Packing Information
Package Name
SOP-J8
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TSZ22111 • 15 • 001
TSZ02201-0F2F0A200350-1-2
11.Jul.2019 Rev.001
19/20
BD87007FJ
Revision History
Date
Revision
001
Changes
11.Jul.2019
New Release
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TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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