BD8641EFV [ROHM]

Synchronous rectification with built-in FET type DC/DC converter IC; 同步整流用内置FET型的DC / DC转换器集成电路


型号：	BD8641EFV
厂家：	ROHM
描述：	Synchronous rectification with built-in FET type DC/DC converter IC 同步整流用内置FET型的DC / DC转换器集成电路转换器
文件：	总5页 (文件大小：254K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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STRUCTURE ：

Silicon Monolithic Integrated Circuit

PRODUCT NAME ：

Synchronous rectification with built-in FET type DC/DC converter IC

MODEL NAME：

B D 8 6 4 1 E F V

FEATURES ：

・Synchronous rectification with built-in FET type DC/DC converter

・Reference voltage accuracy FB 0.8V±1%

・Switching frequency 250kHz～2.3MHz（Synchronizable with external clock.）

・Over current protection circuit

・Thermal shutdown

・Output voltage watch （VDET） function

・Input low voltage detection （UVLO） function

・Soft start / Start delay circuit

◎ABSOLUTE MAXIMUM RATING （Ta=25℃）

Parameter

Symbol

Limits

V_IN

Unit

Ｗ

Input supply voltage

Input terminal voltage

Output terminal voltage

Output current

PV_IN, SV_IN

V_INP

V_OUT

*２

V_IN

I_OUT

3.2^*３

Power dissipation

-40 ～ 85

-55 ～ 150

Operating temperature

Storage temperature

Topr

Tstg

℃

＊1 V_INPApplication terminal： SYNCLK, EN, SS/DELAY, FB

＊2 V_OUTApplication terminal：SW, VDET, FC, RT

＊3 (70mm×70mm, thickness 1.6mm, and four layer glass epoxy substrates)When mounting substrate and the package

back exposure part are connected with solder.

Operating at higher than Ta=25℃, 25.6mW shall be reduced per 1

◎Operation condition

Parameter

Input supply voltage

Output current

Symbol

V_IN

I_OUT

MIN

3.0

TYP

MAX

5.5

Unit

Ｖ

This product is not designed for protection against radioactive rays.

Status of this document

The Japanese version of this document is the formal specification.

A customer may use this translation version only for a reference to help reading the formal version.

If there are any differences in translation version of this document, formal version takes priority.

Be careful to handle because the content of the description of this material might correspond to the labor

(technology in the design, manufacturing, and use) in foreign country exchange and Foreign Trade Control Law.

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◎Electrical characteristic

(Unless otherwise noted Ta=25℃, PV_IN, SV_IN=3.3V, GND=0V)

Specification value

Parameter

Symbol

UNIT

Condition

MIN

TYP

380

0.8

-60

2.3

2.50

MAX

570

VIN supply current (operating)

VIN supply current (standby)

Reference voltage (VREF)

Output rise detection voltage

Output decrease detection voltage

Terminal VDET output current

Oscillation frequency

Pch FET ON resistance

Nch FET ON resistance

UVLO voltage

I_{Q_active}

I_{Q_stby}

V_REF

V_OVP

V_LVP

I_VDET

f_OSC

R_PFET

R_NFET

V_UVLO

I_LSW

V_ENH

V_ENL

I_FCSI

I_FCSO

I_SSSO

μA

MHz

mΩ

μA

V_FB= 0.83V, V_FC= 1V

V_EN= 0V

0.792

-90

0.4

2.0

0.808

Monitoring FB terminal

V_VDET< 0.3V

R_RT= 43kΩ

I_SW= 1A

-30

2.6

110

2.65

I_SW= -1A

2.35

1.1

SW leak current

V_EN= 0V, V_IN= 5.5V

EN terminal H threshold voltage

EN terminal L threshold voltage

FC sink current

FC source current

SS/DELAY terminal source current

0.4

-5

-10

●V_FB:FB terminal voltage、V_EN:EN terminal voltage、V_FC:FC terminal voltage、V_VDET: VDET terminal voltage

●Current capability should not exceed Pd.

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◎BLOCK DIAGRAM

◎PIN ASSIGNMENT

No. Symbol

Description

No.

Symbol

Description

Power supply input terminal

SGND Signal GND terminal

VDET Output abnormality detection terminal

PVIN

SVIN

Frequency adjustment resistance connection terminal 12

Power supply input terminal

Switching output terminal

Signal system power supply input terminal

SYNCLK Input terminal for external clock synchronization

PGND Power GND terminal

Enable input terminal

18 SS/DELAY Soft start adjustment capacity connection terminal

Switching output terminal

Phase amends terminal

Feedback terminal

◎PACKAGE OUTLINE

Product number

BD8641

1PIN MARK

Lot No.

HTSSOP-B20 (UNIT：mm)

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◎NOTE ON USE

1．About the absolute maximum rating

Attention is brushed off enough to the quality control, it is likely to destroy when the absolute maximum rating such as impressed voltages

(VCC_IN,DCIN) and ranges (Topr) of the operating temperature as it is exceeded, the mode of breakings of the short or the opening, etc. cannot

be specified, and examine it in this IC to give physical measures for safety such as fuses when a special mode that exceeds the absolute

maximum rating is assumed.

2．About the reverse-connection of the power supply connector

IC might destroy it by reversely connecting the power supply connector. Give measures such as putting the diode between power supply

terminals of power supply and IC outside for the reverse-touching destruction protection.

3．Power supply line

Please do measures such as putting the bypass capacitor in power supply-GND nearest pin of this IC as the route of the resurrection current to

cause the return of the current in which it resurrected it by the counter electromotive force of the coil.

Please confirm the characteristic of the electrolytic capacitor enough as the capacity omission etc. at the low temperature never happen, and

decide it.

4．About grand potential

Any state of operation must become the lowest potential about the potential of the terminal GND. Moreover, confirm whether there is terminal that

is actually the voltage of GND or less including transients.

5．About the heat design

Think about permissible loss (Pd) in an actual state of use, and do the heat design with the margin enough.

6．About the short and the miss-installation between terminals

Note the direction and the miss-registration of IC enough when you install it in the set substrate. IC might destroy it as well as reversely connecting

the power supply connector when installing it by mistake. Moreover, there is fear of destruction when the foreign body enters between terminals,

the terminal, the power supply, and grandeur and it is short-circuited.

7．About operation in strong electromagnetic field

In use in strong electromagnetic field, note that there is a possibility of malfunctioning.

8．About the capacitor during output-GND

The current charged the capacitor with when VCC is 0V or is GND and is short-circuited when a big capacitor is connected between GND output

by some factors flows into the output and it is likely to destroy it. Give the capacitor between GND output to 0.1μF or less.

9．About the inspection by the set substrate

It is likely to suffer stress to IC and discharge electricity every one process when you connect the capacitor with the pin with low impedance when

inspecting it in the set substrate. Moreover, detach it after connecting after the power supply is turned off without fail when detaching it to G in the

inspection process, inspecting, and turning off the power supply. n addition, be give the earth to the assembly process as a static electricity

measures, and careful enough when it transports and you preserve it.

10．About each input terminal

This IC is a monolithic IC which has a P⁺isolations and P substrate to isolate elements each other.

This P layer and an N layer in each element form a PN junction to construct various parasitic elements.

For instance, the potential difference operates in resistance as shown in the figure below when resistance and the transistor connect it with the

terminal and the playground (GND) >(terminal B) joint of PN operates as a parasitic diode in playground (GND) >(terminal A) transistor (NPN). In

addition, the NPN transistor of parasitism works with N layer of the element of the above-mentioned parasitic diode and the neighborhood and

others in transistor (NPN). A parasitic element in IC composition is inevitably formed because of the potential relation.

A parasitic element can operate, the interference with the circuit operation be caused, it malfunction, and, consequently, it cause destruction.

Therefore, do not do the usage that a parasitic element operates as a voltage that is lower than the playground (GND;P substrate) is impressed to

the input terminal enough. Moreover, do not impress the voltage to the input terminal when you do not impress the power-supply voltage to IC.

Give each input terminal to me the voltage below the power-supply voltage or in the guarantee value of an electric characteristic when you

similarly impress the power-supply voltage.

Example of IC of simple structure

11．Earth wiring pattern

If small signal GND and large current GND exist, disperse their pattern. In addition, for voltage change by pattern wiring impedance and large

current not to change voltage of small signal GND, each ground terminal of IC must be connected at the one point on the set circuit board. As for

GND of external parts, it is similar to the above-mentioned.

12．Thermal Shut-Down

When a thermal shutdown operates, the DC/DC converter controller of all Ch is turned off. When a thermal shutdown is released, the DC/DC

converter controller of all Ch becomes an operation beginning from turning off.

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Appendix

Notes

No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM

CO.,LTD.

The content specified herein is subject to change for improvement without notice.

The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you

wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM

upon request.

Examples of application circuits, circuit constants and any other information contained herein illustrate the

standard usage and operations of the Products. The peripheral conditions must be taken into account

when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specified in this document. However, should

you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no re-

sponsibility for such damage.

The technical information specified herein is intended only to show the typical functions of and examples

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sponsibility whatsoever for any dispute arising from the use of such technical information.

The Products specified in this document are intended to be used with general-use electronic equipment

or devices (such as audio visual equipment, office-automation equipment, communication devices, elec-

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The Products are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or

malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard against the

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Appendix-Rev4.0

BD8641EFV [ROHM]

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