BD7931F-E2 [ROHM]
CD Motor Driver, 1 Channel, PDSO8, ROHS COMPLIANT, SOP-8;
| 型号： | BD7931F-E2 |
| 厂家： | 
ROHM |
| 描述： | CD Motor Driver, 1 Channel, PDSO8, ROHS COMPLIANT, SOP-8 驱动 CD 光电二极管 接口集成电路 |
| 文件： | 总16页 (文件大小：947K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
0.5 Amp or Less
Reversible Motor Drivers (Single Motor)
BH6578FVM BD7931F
General Description
Key Specifications
The BH6578FVM and BD7931F are reversible motor
drivers with a wide output dynamic range, with power
MOS used for the output transistor. The motor drivers
can be set to four output modes 1) forward (normal)
rotation, 2) reverse rotation, 3) stop (idling or OFF)
and 4) brake using 2 logic inputs.
Supply Voltage Range:
BH6578FVM
BD7931F
4.5V to 5.5V
4.5V to 14V
Standby Current:
BH6578FVM
0.4mA (Typ)
0µA (Typ)
BD7931F
ON-Resistance(Top + Bottom):
Operating Temperature Range:
BH6578FVM
1.0Ω (Typ)
Features
-35°C to +85°C
-40°C to +85°C
Wide dynamic range loading driver with MOS
output, RON = 1.0Ω (Top + Bottom)
BD7931F
With loading driver voltage setting terminal
Built-in Thermal Shutdown Circuit (TSD)
Packages
W(Typ) x D(Typ) x H(Max)
Applications
Tray loading of CD/DVD,
applications using DC motors
MSOP8 (BH6578FVM)
SOP8 (BD7931F)
2.90mm x 4.00mm x 0.90mm
5.00mm x 6.20mm x 1.71mm
Typical Application Circuit, Block Diagram, Pin Configuration and Pin Descriptions
BH6578FVM, BD7931F (in common)
TOP VIEW
PREGND
REV IN
LDCONT
FWD IN
Pin No.
Pin Name
VCC
Function
1
2
3
4
5
6
7
8
Supply voltage
6
5
8
F
7
OUT+
FWD output
PRE
GND
R
OUT-
REV output
Control
Logic
GND
Power ground
Signal ground
Loading driver voltage setting pin
REV input
LDCONT
+
-
GND_S
LDCONT
INREV
INFWD
TSD
POW CMOS
H-Bridge
POW
GND
FWD input
1
4
2
3
M
0.1μF
Bypass
VCC
POWGND
capacitor
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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BH6578FVM BD7931F
Absolute Maximum Ratings (Ta=25°C)
Rating
Parameter
Symbol
Unit
BH6578FVM
7
0.55 (Note 1)
BD7931F
15
0.69 (Note 2)
Supply Voltage
VCC
Pd
V
W
Power Dissipation
Operating Temperature
Storage Temperature
Output Current
Topr
Tstg
IOUT
-35 to +85
-40 to +85
°C
°C
mA
°C
-55 to +150
500
Junction Temperature
Tjmax
150
(Note 1) When 70 mm x 70 mm x 1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted.
When used at Ta=25°C or higher, derated at 4.4 mW/°C.
(Note 2) When 70 mm x 70 mm x 1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted.
When used at Ta=25°C or higher, derated at 5.5 mW/°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
BH6578FVM
Min Typ Max Min Typ Max
4.5 5.5 4.5 14
BD7931F
Parameter
Supply Voltage
Symbol
VCC
単位
5
8
V
Truth Table
BH6578FVM, BD7931F
INPUT
OUTPUT
OUT+ OUT-
Function
INFWD
INREV
L
L
L
H
L
Hi-Z
L
Hi-Z
H
High Impedance
REV mode
H
H
L
FWD mode
H
H
L
L
Brake mode
Hi-Z : Hi-impedance
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BH6578FVM BD7931F
Electrical Characteristics
BH6578FVM (Unless otherwise specified, Ta=25°C, VCC=5V)
Limit
Typ
0.4
Parameter
Symbol
ICC
Unit
mA
Conditions
No load
Min
-
Max
0.8
Standby Current
(Loading Driver)
Output Offset Voltage
Input Voltage H Level
VOFSL
VIH
-15
2.0
0
－
－
1.0
6.0
0
+15
VCC
0.5
mV
V
Brake mode
Input Voltage L Level
ON-Resistance
VIL
GND
V
RON
GVLD
ΔGVLD
IINL
1.8
Ω
IOUT=500mA,Top + Bottom
－
4.5
-2.0
－
(Note 1)
Voltage Gain
7.5
dB
dB
µA
nA
Voltage Gain Difference
Input Bias Current
LDCONT Bias Current
+2.0
120
300
86
VFIN=5V,VRIN=5V
VCONT=2V
ILDC
－
－
(Note 1) Let VO1 denote output-to-output voltage when VCONT=1V and VO2 denote output-to-output Voltage when VCONT=3.5V, voltage gain can be expressed
by the following equation: GVLD=20log| (VO2-VO1)/2.5|
BD7931F (Unless otherwise specified, Ta=25°C, VCC=8V)
Limit
Parameter
Symbol
Unit
Conditions
Min
Typ
0
Max
5
ICC1
ICC2
ICC3
-
-
-
µA
mA
mA
Standby Current
1.1
0.8
2.2
1.6
Supply Current 1
VFIN=5V,VRIN=0V
VFIN=VRIN=5V
Supply Current 2
(Loading Driver)
Output Offset Voltage
Input Voltage H Level
Input Voltage L Level
ON-Resistance
VOFSL
VIH
-35
2.0
GND
－
0
－
+35
VCC
0.5
mV
V
Brake mode
VIL
－
V
RON
GVLD
ΔGVLD
IINL
1.0
6.0
0
1.8
Ω
IOUT=500mA,Top+Bottom
(Note 2)
Voltage Gain
4.0
-2.0
－
8.0
dB
dB
µA
nA
Voltage Gain Difference
Input Bias Current
LDCONT Bias Current
+2.0
250
300
165
－
VFIN=5V,VRIN=5V
VCONT=5V
ILDC
－
(Note 2) Let VO1 denote output-to-output voltage when VCONT=1V and VO2 denote output-to-output voltage when VCONT=3.5V, voltage gain can be expressed
by the following equation: GVLD=20log|(VO2-VO1)/2.5|
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BH6578FVM BD7931F
Typical Performance Curves
0.4
0.3
0.2
0.1
0.0
0.4
85°C
85°C
25°C
-35°C
25°C
-35°C
0.3
0.2
0.1
0.0
0
100
200
300
400
500
0
100
200
300
400
500
Load Current [mA]
Load Current [mA]
Figure 2. Output Loss Voltage L vs Load Current
(BH6578FVM)
Figure 1. Output Loss Voltage L vs Load Current
(BH6578FVM)
VCC=5V, LDCONT=OPEN
REV Mode
VCC=5V, LDCONT=OPEN
FWD Mode
5
4
3
2
1
0
0.0
-0.1
-0.2
-0.3
-0.4
-35°C
25°C
85°C
-35°C
25°C
85°C
0
1
2
3
4
5
0
100 200 300 400 500
Load Current [mA]
LDCONT [V]
Figure 3. Output Voltage vs Input Voltage
(Voltage Gain (BH6578FVM))
VCC=5V, LDCONT=SWEEP
RL=8Ω+47µH
Figure 4. Output Voltage H vs Load Current
(BH6578FVM)
VCC=5V, LDCONT=OPEN
FWD Mode
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BH6578FVM BD7931F
Typical Performance Curves – continued
0.0
-0.1
-0.2
0
-1
-2
-3
-4
-5
85℃
25℃
-35℃
-35℃
25℃
85℃
-0.3
-0.4
0
100
200
300
400
500
0
1
2
3
4
5
LDCONT [V]
Load Current [mA]
Figure 5. Output Loss Voltage H vs Load Current
(BH6578FVM)
Figure 6. Output Voltage vs Input Voltage
(Voltage Gain (BH6578FVM))
VCC=5V, LDCONT=OPEN
REV Mode
VCC=5V, LDCONT=SWEEP
0.4
0.4
85℃
25℃
-40℃
85℃
25℃
-40℃
0.3
0.2
0.1
0.0
0.3
0.2
0.1
0.0
0
100 200 300 400 500
Load Current [mA]
0
100 200 300 400 500
Load Current [mA]
Figure 7. Output Loss Voltage L vs Load Current
(BD7931F)
Figure 8. Output Loss Voltage L vs Load Current
(BD7931F)
VCC=8V, LDCONT=OPEN
VCC=8V, LDCONT=OPEN
REV Mode
FWD Mode
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BH6578FVM BD7931F
Typical Performance Curves – continued
10
8
0.0
-0.1
-0.2
-0.3
-0.4
-40℃
25℃
85℃
6
-40°C
25°C
85°C
4
2
0
0
1
2
3
4
5
0
100 200 300 400 500
Load Current [mA]
LDCONT [V]
Figure 9. Output Voltage vs Input Voltage
(Voltage Gain (BD7931F))
VCC=8V, LDCONT=SWEEP
RL=20Ω +47µH
Figure 10. Output Loss Voltage H vs Load Current
(BD7931F)
VCC=8V, LDCONT=OPEN
FWD Mode
0
0.0
-0.1
-0.2
-0.3
-0.4
85°C
25°C
-40°C
-2
-4
-6
-40℃
25℃
85℃
-8
-10
0
1
2
3
4
5
0
100 200 300 400 500
Load Current [mA]
LDCONT [V]
Figure 11. Output Loss Voltage H vs Load Current
Figure 12. Output Voltage vs Input Voltage
(Voltage Gain (BD7931F))
VCC=8V, LDCONT=SWEEP
RL=20Ω +47µH
(BD7931F)
VCC=8V, LDCONT=OPEN
REV Mode
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TSZ22111・15・001
BH6578FVM BD7931F
Power Dissipation
BH6578FVM
0.8
BD7931F
0.8
0.6
0.6
0.4
0.2
0.4
0.2
0
0
0
85
100 125 150 175
0
25
7585 100 125
Ambient Temperature : Ta [°C]
175
25
50
75
50
150
Ambient Temperature : Ta [°C]
(Note) When 70 mm x 70 mm x 1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted.
I/O Equivalent Circuits
BH6578FVM
BD7931F
LDCONT
LDCONT
VCC
10KΩ
10KΩ
6
6
39KΩ
49.6KΩ
OUT+/OUT-
OUT+/OUT-
INFWD/INREV
INFWD/INREV
VCC
VCC
VCC
VCC
VCC
200KΩ
50KΩ
200KΩ
7
8
7
8
50KΩ
50KΩ
50KΩ
2
3
2
3
50KΩ
50KΩ
Control and Operation
1. OUTPUT MODE CONTROL AND OPERATION
Control and operation of each output mode is described as follows:
When INFWD is “HIGH” and INREV is “LOW”, the output is at normal rotation mode. In normal rotation mode, current
flows from OUT+ to OUT-. When both INFWD and INREV are “HIGH”, the output is at brake mode. In brake mode,
the top-side transistor is OFF to stop the supply of motor drive current while the bottom-side transistor is ON to absorb
the reverse EMF of motor and apply brake to the motor. When both INFWD and INREV are “LOW”, OUT+ and OUT-
become high-impedance and the motor stops.
2. OUTPUT VOLTAGE CONTROL
Controlling the output voltage can vary the voltage applied to the motor and thus control motor speed. The output HIGH
voltage can be controlled (gain 6dB Typ), using the voltage applied to the CONT terminal. The output voltage never
exceeds the power supply voltage even if the voltage applied to CONT terminal exceeds (VCC Max).
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BH6578FVM BD7931F
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go
below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages
going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors
and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
5.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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BH6578FVM BD7931F
Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 13. Example of monolithic IC structure
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
TSD ON temperature [°C]
Hysteresis temperature [°C]
(typ)
175
(typ)
25
BH6578FVM, BD7931F
15. Capacitor Across Output and GND
In the event a large capacitor is connected across output and GND, when VCC and IN are short-circuited with 0V or
GND for some reason, the charge stored in the capacitor flows into the output and may destroy the IC. Use a
capacitor smaller than 0.1 µF between output and GND.
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BH6578FVM BD7931F
Ordering Information
B
H
6
5
7
3
8
F
V M -
T R
Package
FVM : MSOP8
Packaging and forming specification
TR: Embossed tape and reel
Part number
B
D
7
9
1
F
-
E 2
Part number
Package
Packaging and forming specification
E2: Embossed tape and reel
F : SOP8
Marking Diagrams
MSOP8 (TOP VIEW)
SOP8 (TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
H
7
6
5
8
7
9
3
1
1PIN MARK
1PIN MARK
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BH6578FVM BD7931F
Physical Dimension, Tape and Reel Information
Package Name
MSOP8
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BH6578FVM BD7931F
Physical Dimension, Tape and Reel Information – continued
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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BH6578FVM BD7931F
Revision History
Date
Revision
001
Changes
04.Nov.2015
New Release
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13/13
TSZ22111・15・001
Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.002
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.002
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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