BD7696FJ (新产品) [ROHM]
BD7696FJ is Power Factor Correction ICs for AC/DC supply, which are suitable for all products needing power factor improvement. The PFC adopts boundary conduction mode (BCM) and switching loss reduction and noise reduction are possible by Zero Current Detection (ZCD). This IC incorporates a circuit for reducing total harmonics distortion (THD) and can support IEC61000-3-2 Class-C.;型号: | BD7696FJ (新产品) |
厂家: | ROHM |
描述: | BD7696FJ is Power Factor Correction ICs for AC/DC supply, which are suitable for all products needing power factor improvement. The PFC adopts boundary conduction mode (BCM) and switching loss reduction and noise reduction are possible by Zero Current Detection (ZCD). This IC incorporates a circuit for reducing total harmonics distortion (THD) and can support IEC61000-3-2 Class-C. CD 功率因数校正 |
文件: | 总27页 (文件大小:1355K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
Boundary Conduction Mode
Power Factor Correction Controller IC
BD7695FJ BD7696FJ
General Description
Key Specifications
BD7695FJ and BD7696FJ are Power Factor Correction
ICs for AC/DC supply, which are suitable for all products
needing power factor improvement. The PFC adopts
boundary conduction mode (BCM) and switching loss
reduction and noise reduction are possible by Zero
Current Detection (ZCD). This IC incorporates a circuit for
reducing total harmonics distortion (THD) and can
support IEC61000-3-2 Class-C.
◼ Input VCC Voltage Range:
◼ Operating Current:
◼ Operating Temperature Range: -40 °C to +105 °C
12 V to 38 V
0.60 mA (Typ)
Package
SOP-J8
W (Typ) x D (Typ) x H (Max)
4.9 mm x 6.0 mm x 1.65 mm
Features
◼
◼
◼
◼
◼
◼
◼
◼
◼
Boundary Conduction Mode PFC
Low THD Circuit Incorporation
Low Power Consumption
VCC UVLO Function
ZCD by Auxiliary Winding
Static OVP by the VS Pin
Error Amplifier Input Short Protection
Stable MOSFET Gate Drive
Soft Start
Lineup
Product name
Brown Out
BD7695FJ-E2
BD7696FJ-E2
-
○
Applications
Lighting Equipment, AC Adopter, TV, Refrigerator,
etc.
◼
Typical Application Circuit
400 V
Diode
Bridge
VS
MULT
CS
VCC
6
5
8
7
VCC
OUT
GND
ZCD
VS
EO
MULT
CS
1
2
3
4
VS
MULT
CS
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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Pin Configuration
(TOP VIEW)
6
5
8
7
VCC
OUT
GND
ZCD
VS
EO
MULT
CS
1
2
3
4
Pin Description
ESD Diode
VCC GND
Pin No.
Pin Name
I/O
Function
1
2
3
4
5
6
7
8
VS
EO
MULT
CS
ZCD
GND
OUT
VCC
I
O
I
I
I
-
O
I
Feedback input pin
Error amplifier output pin
Multiplier input pin
Over current detection pin
Zero current detection pin
GND pin
-
-
-
-
-
○
-
-
○
○
○
○
○
-
External MOSFET driver pin
Power supply pin
○
○
Block Diagram
VOUT
FUSE
Diode
Bridge
Filter
Vac
MULT
VS
VCC
GND
ZCD
+
0.67 V / 0.9 V
-
1 shot
Internal
Supply
+
-
UVLO
BGR
Reg
5.0 V
12.5 V / 10.0 V
Timer
30 µs
out reset
TSD
TSD
GCLAMP
(12 V)
VS
SHORT Comp
SP
VS
+
-
ErrAmp
OR
S
R
POUT
0.3 V
-
+
27 µA / 7 µA
SOVP
OUT
UVLO
OVP
Detecter
Q
2.5 V
PRE
Driver
EO
PWM Comp
-
SOVP
AND
Quarter Gain
COMP
NOUT
SP
1.08 V
UVLO
100 k
-
+
MULT
+
MULT
MULTIPLIER
TSD
0.85 V / 0.90 V
BROUT
(BD7696 only)
Brown Out
(BD7696 only)
BROUT
CS
CS
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Description of Blocks
1
VCC Protection
This IC has VCC UVLO (Under Voltage Lock Out) of the VCC pin. Switching stops at the time of the VCC voltage fall.
In addition, when the VCC voltage becomes higher than the VCC_DIS1 (38 V Typ) voltage, it increases operating current and
suppresses the rise in VCC voltage. When the VCC voltage is lower than the VCC_DIS2 (34 V Typ) voltage, the operating
current becomes usual. This function assumes the case that the VCC voltage rises by startup resistance.
2
PFC: Power Factor Correction
The power factor improvement circuit is a voltage control method in the Boundary Conduction Mode.
The outline of the operation circuit diagram is shown in Figure 1. The switching operation is shown in Figure 2.
Auxiliary winding for zero
IL
Diode
current detection
Bridge
PFC OUT
AC IN
Diode
ZCD
MOSFET
OUT
PFC OUT
Feedback Resistance
MULT
VS
EO
CS
GND
RCS
GND
OCP Detect Resistor
Figure 1. Operation Circuit Outline
OUT
(Gate)
MOSFET
(Vds)
IL
VCS
VZCD
3
2
4
1
Figure 2. Switching Operation Timing Chart
Switching Operation
1. The MOSFET is turned on, and IL increases.
2. The IC compares Multiplier out with VCS slope, and the MOSFET is off when VCS voltage is higher than Multiplier out.
3. The MOSFET is turned off, and IL decreases.
4. The ZCD pin detects the zero point of the IL and turns on the MOSFET.
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Description of Blocks - continued
3
About ErrAMP
3.1
GmAMP
The VS pin monitors a divided point for resistance of the output voltage. The ripple voltage of the AC frequency (50 Hz
/ 60 Hz) overlaps with the VS pin. GmAMP removes this ripple voltage. GmAMP compares VAMP1 (2.500 V Typ) with
the removed voltage, GmAMP controls the EO voltage by this gap. When the EO pin voltage rises, the ON width of the
OUT pin becomes wide. Also, you must set the error amplifier constant so that the AC frequency does not overlap on
the EO pin.
PFC Output
VS
-
2.5 V
+
EO
Figure 3. GmAMP Block Diagram
3.2
VS Short Protection
The VS pin has a short protection function.
When a state of the VS pin voltage < VSHORT (0.3 V Typ) continues for tVS_SH (150 µs Typ) or more, IC stops switching.
Figure 4 shows the operation.
PFC
Output
VOUT
VS
VSHORT
tVS_SH
OUT
Switching Stop
Figure 4. Operation of VS Short Protection
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3
About ErrAMP - continued
3.3
Overvoltage Protection Function (IOVP)
When the PFC output voltage becomes overvoltage, it stops switching by a protection function. It shows below the
setting method of the overvoltage protection voltage.
Figure 5. Overvoltage Protection Operation
When PFC output voltage exceeds 391 V, sink current flows in the EO pin. When this current grows to IOVPDET1 (27
µA_Typ) or more, the IC stops switching and activates protection. In addition, the IC cancels protection when this
current becomes or less IOVPDET2 (7 µA Typ).
The overvoltage protection detection voltage is IOVPDET1 × R1 + PFCOUT voltage. 27 µA × 1.5 MΩ + 391 V = 431.5 V
The release voltage is IOVPDET2 × R1 + PFCOUT voltage. 7 µA × 1.5 MΩ + 391 V = 401.5 V
When output voltage rises, the EO pin voltage falls down, too.
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Description of Blocks - continued
4
ZCD Pin
The zero current detection circuit is a function to detect a zero cross of the inductor current (IL) (Figure 6, 7).
If the voltage at the ZCD pin becomes lower than VZCD2 (0.67 V Typ) after becoming higher than VZCD1 (0.9 V Typ), the
OUT output becomes High after the ZCD output delay time (tZCD 260 ns Typ) has elapsed.
When the ZCD voltage does not reach VZCD1 (0.9 V Typ), it becomes the restart timer operation. After the OUT output
becomes Low, OUT becomes High after tREST (30 μs Typ) progresses (Figure 8).
Diode
T1
ZCD
OUT
Control
Logic
+
-
MOSFET
RCS
Figure 6. Zero Current Detection Circuit
OUT
(Gate)
VZCD1
VZCD2
VZCD
tZCD
Figure 7. Zero Current Detection
OUT
(Gate)
VZCD1
VZCD
tREST
Figure 8. Restart Timer
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Description of Blocks - continued
5
MULTIPLIER
The ON width of the OUT pin is fixed in Multiplier out and VCS as shown in Figure 2.
The VCS can be expressed in the following formula.
푉퐶푆 = 퐾 × 푉푀푈퐿푇(푉퐸푂 − 0.9 푉)
K:
VMULT
VEO
MULTIPLIER GAIN
MULT pin voltage
EO pin voltage
:
:
AC voltage information is input into VMULT. The IC improves the power factor by controlling AC current with the AC
voltage. In addition, VCS in AC voltage of 0 V (VMULT = 0 V) is expressed in the following formula.
(
)
푉퐶푆 = 퐾 × 푉푀푈퐿푇 푉퐸푂 − 0.9 푉 + 푉푂퐹퐹푆퐸푇 = 푉푂퐹퐹푆퐸푇
The ON width of the OUT pin at the age of AC voltage 0 V (VMULT = 0 V) becomes long by adding VOFFSET (30 mV Typ).
Because the ON width gets longer, the diode bridge output voltage is discharged. As a result, the AC current distortion is
improved without the current supply from a diode bridge stopping (Figure 9).
VOFFSET less
VOFFSET case
case
V
IL
Diode
Bridge
V1
V1
AC IN
Remain
voltage
No remain
voltage
t
t
V
OUT
I
Stop
Non stop
->High AC current
distortion
->Improvement of the
AC current distortion
AC
current
Figure 9. Improvement of the AC Current Distortion
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Description of Blocks - continued
For light load conditions (EO < 0.85 V), the gain of the Multiplier block is reduced by a quarter. Decreasing the gain will
prevent early overvoltage protection at light load, which causes non-continuous switching operation. This function continues
switching even at light load, as shown in Figure 11.
Figure 10. Multiplier Gain
Figure 11. Improvement in Light Load Operation
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Description of Blocks - continued
6
MULT Pin
When the state that the MULT pin voltage is lower than VBROUT1 (0.8 V Typ) continues for tBROUT (160 ms Typ) or
more, the IC stops switching by a brownout function (only in BD7696FJ).
When the MULT pin voltage becomes higher than VBROUT2 (0.97 V Typ), the IC switches again.
Switching
Switching
Stop
OUT
VBROUT2
VBROUT1
tBROUT
VMULT
Figure 12. Brown Out
7
CS Pin
In normal operation, the turn-off decides by the ON width of the EO pin and the MULT pin voltage. However, the IC
is off in a pulse by pulse overcurrent protection when the CS pin rises more than VCS (1.08 V Typ). Through this
protection, it prevents an overcurrent to the MOSFET.
The overcurrent protection function limits the ON width. When this protection becomes the working PFC load, PFC
output voltage decreases. You must decide sense resistance of PFC so that this protection does not work in rated
load with the minimum input voltage at the time of the application design.
Control
Logic
OUT
CS
Over Current
Protection
1.08 V
Figure 13. Current Limit
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Operation Mode of Protection Circuit
Table 1 showed the operation mode of each protection function.
Table 1. Operation Mode of Each Protective Circuit
Protection Mode
Parameter
VCC UVLO
Contents
Detection
Method
Detection
Operation
Cancellation
Method
Cancellation
Operation
Under Voltage Lock Out VCC < 10 V (Typ)
on the VCC pin (VCC fall)
OUT OFF
EO discharge
VCC > 12.5 V (Typ)
Startup
Operation
(VCC rise)
Over Current Protection CS > 1.08 V (Typ)
CS < 1.08 V (Typ)
Normal
Operation
CS OCP
OUT OFF
on the CS pin
(CS rise)
(CS fall)
VS Short
Protection
Short Protection
on the VS pin
VS < 0.3 V (Typ)
OUT OFF
EO discharge
VS > 0.3 V (Typ)
Normal
Operation
(VS fall)
(VS rise)
EO > 27 µA (Typ)
EO < 7 µA (Typ)
Normal
Operation
IOVP
Over Voltage Protection
OUT OFF
(EO rise)
(EO fall)
Brown Out
(Only
BD7696FJ)
MULT < 0.8 V
(Typ)
(MULT fall)
MULT > 0.97 V
(Typ)
(MULT rise)
Low Voltage Protection
on the MULT pin
OUT OFF
EO discharge
Normal
Operation
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Condition
Maximum Voltage 1
Maximum Voltage 2
Maximum Voltage 3
Maximum Current
OUT Pin Output Peak Current 1
OUT Pin Output Peak Current 2
Maximum Junction Temperature
Storage Temperature Range
VMAX1
VMAX2
VMAX3
IZCD
IOUT1
IOUT2
Tjmax
Tstg
-0.3 to +40
-0.3 to +14
-0.3 to +6.5
-10 to +10
-0.5
+1
+150
-55 to +150
V
V
V
mA
A
A
VCC
OUT
CS, MULT, VS, EO
ZCD current
Source current
Sink current
°C
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties
of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size
and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
SOP-J8
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
149.3
18
76.9
11
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of
the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
Recommended Operating Conditions
Parameter Symbol
Supply Voltage
Operating Temperature
Min
Typ
Max
Unit
Condition
VCC Voltage
VCC
Topr
12
-40
15
+25
38
+105
V
°C
Recommended Range of the External Component (Ta = 25 °C)
Parameter
Symbol
CVCC
Rating
Unit
μF
VCC Pin Connection Capacity
22 or more
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Electrical Characteristics (Unless otherwise specified VCC = 15 V, Ta = -40 °C to +105 °C)
Parameter
Symbol
Min
Typ
Max
Unit
Condition
[Circuit Current]
Circuit Current (ON) 1
Circuit Current (ON) 2
ION1
ION2
-
-
0.60
0.95
1.20
2.00
mA
mA
VS = 0 V
50 kHz switching
VCC discharge
Switching stop
VCC = 11 V
Circuit Current (ON) 3
ION3
4.5
-
9.0
60
13.5
110
mA
µA
Start Up Current
ISTART
[VCC Pin Protection]
VCC UVLO Voltage1
VCC UVLO Voltage2
VCC UVLO Hysteresis
VCC Discharge Voltage1
VCC Discharge Voltage2
[Gm Amplifier Block]
VS Pin Pull up Current
Gm Amplifier
VUVLO1
VUVLO2
VUVLO3
VCC_DIS1
VCC_DIS2
11.5
12.5
10
2.5
38
13.5
11
3.0
-
V
V
V
V
V
VCC rise
VCC fall
VUVLO3 = VUVLO1 -VUVLO2
VCC rise
VCC fall
9
2.0
-
-
34
-
IVS
-
0.1
0.5
µA
V
VS = 0 V
VAMP1
2.465
2.500
2.535
Ta = 25 °C
Reference Voltage1
Gm Amplifier
Reference Voltage2
VAMP2
2.44
-
2.54
V
Ta = -40 °C to +105 °C
Gm Amplifier Line Regulation
Gm Amplifier Source Current
Gm Amplifier Sink Current
[EO Block]
VAMP_LINE
IEO_SOURCE
IEO_SINK
-
50
50
1
130
130
10
200
200
mV
µA
µA
VCC = 10 V to 38 V
VS = 2.3 V
VS = 2.7 V
EO Low Voltage
VEOL
VQGAIN1
VQGAIN2
IEO
-
0.80
-
0.4
0.85
0.90
1.8
0.8
-
0.95
3.0
V
V
V
VS = 2.7 V
Quarter Gain Detect Voltage1
Quarter Gain Detect Voltage2
EO Discharge Current
[MULT Block]
MULT = 50 mV, CS = 20 mV
MULT = 50 mV, CS = 20 mV
VCC = 12 V, EO = 1.0 V
0.8
mA
MULT Pin Pull up Current
MULT Pin Dynamic Range
IMULT
VMULT
-
0 to 2.5
0.9
0.1
0 to 3.5
0.9
0.5
-
µA
V
MULT = 0 V
EO Pin Dynamic Range
VEOD
to
to
-
V
2.9
3.4
MULTIPLIER Gain
MULTIPLIER Quarter Gain
K
K/4
0.33
-
0.42
0.11
0.51
-
1/V
1/V
MULT = 1 V, EO = 2.5 V
MULT = 1 V, EO = 0.8 V
MULT fall
BD7696FJ Only
MULT rise
Brown Out Detect Voltage1
Brown Out Detect Voltage2
VBROUT1
0.7
0.8
0.9
V
VBROUT2
tBROUT
0.87
80
0.97
160
1.07
320
V
BD7696FJ Only
BD7696FJ Only
Brown Out Detect Timer
[ZCD Block]
ms
ZCD Threshold Voltage1
ZCD Threshold Voltage2
ZCD Output Delay
Input H Clamp Voltage
Input L Clamp Voltage
Restart Timer
VZCD1
VZCD2
tZCD
VIH
VIL
0.8
0.55
-
6.1
-0.3
15
0.9
0.67
260
6.7
-0.1
30
1.0
0.79
520
-
-
45
V
V
ns
V
V
µs
ZCD rise
ZCD fall
Isink = 3 mA
Isource = -3 mA
tREST
[Protection Block]
VS Short Protection
Detection Voltage
VS Shortstop Protection
Detection Time
IOVP
Detection Current 1
IOVP
Detection Current 2
VSHORT
tVS_SH
IOVPDET1
IOVPDET2
0.2
50
0.3
150
27.0
7
0.4
300
30.5
-
V
µs
µA
µA
19.5
-
IEO_SINK rise Ta = 25 °C
IEO_SINK fall Ta = 25 °C
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Electrical Characteristics (Unless otherwise specified VCC = 15 V, Ta = -40 °C to +105 °C) - continued
Parameter
Symbol
Min
Typ
Max
Unit
Condition
[CS Block]
CS Threshold Voltage
Output Delay Time
CS Pin Pull up Current
CS Offset Voltage
[OUT Block]
VCS
tDELAY
ICS
1.00
1.08
150
0.15
30
1.16
300
1.00
-
V
ns
µA
mV
-
-
-
CS = 0 V
MULT = 0 V
VOFFSET
OUT H Voltage
OUT L Voltage
VPOUTH
VPOUTL
9.0
-
10.2
-
11.4
0.8
V
V
OUT = -20 mA
OUT = +20 mA
OUT load capacitor = 1000 pF
OUTL Voltage to 5 V
OUT load capacitor = 1000 pF
OUTH Voltage to 5 V
Rise Time
tr
-
50
-
ns
Fall Time
tf
-
50
-
ns
OUT Pull down Resistance
RPDOUT
50
100
150
kΩ
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Typical Performance Curves
(Reference data)
1.2
VEO = 4.5 V
VEO = 1.5 V
1.0
0.8
0.6
0.4
0.2
VEO = 4 V
VEO = 2.5 V
VEO = 2 V
VEO = 3 V
VEO = 1.1 V
VEO = 0.8 V
0.0
0
1
2
3
4
VMULT[V]
Figure 14. VCS vs VMULT
0.05
0.04
0.03
0.02
0.01
0.00
0
1
2
3
4
VMULT[V]
Figure 15. VCS vs VMULT at Quarter Gain Operation
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Typical Performance Curves – continued
2.535
2.530
2.525
2.520
2.515
2.510
2.505
2.500
2.495
2.490
2.485
2.480
2.475
2.470
2.465
2.535
2.530
2.525
2.520
2.515
2.510
2.505
2.500
2.495
2.490
2.485
2.480
2.475
2.470
2.465
10
15
20
25
30
35
40
-40
-10
20
50
80
110
VCC Supply Voltage: VCC[V]
Temperature: Ta[˚C]
Figure 16. Gm Amplifier Reference Voltage1 vs Temperature
Figure 17. Gm Amplifier Reference Voltage1 vs VCC
30.0
29.0
28.0
27.0
26.0
25.0
24.0
23.0
22.0
21.0
20.0
200
180
160
140
120
100
80
60
40
20
0
-40
-10
20
50
80
110
-40
-10
20
50
80
110
Temperature: Ta[˚C]
Temperature: Ta[˚C]
Figure 18. Overvoltage Protection Detection
Current 1 vs Temperature
Figure 19. Start Up Current vs Temperature
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BD7695FJ BD7696FJ
Typical Performance Curves – continued
14
14
12
10
8
13
VUVLO1
12
11
VUVLO2
10
6
9
8
7
4
2
0
-40
-10
20
50
80
110
10
16
22
28
34
40
Temperature: Ta[˚C]
VCC Supply Voltage: VCC[V]
Figure 20. VCC UVLO Voltage vs Temperature
Figure 21. OUT H Voltage vs VCC
1.000
0.975
0.950
0.925
VQGAIN2
0.900
0.875
VQGAIN1
0.850
0.825
0.800
-40
-10
20
50
80
110
Temperature: Ta[˚C]
Figure 22. Quarter Gain Detect Voltage vs Temperature
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BD7695FJ BD7696FJ
Application Example
F1
D3
L
DB1
R1
R2
R3
LF1
VOUT +
D4
T1
C3
C4
ZNR1
R16
C16
N
R7
C1
C2
D2
R4
R17
D1
R9
C5
M1
R15
C15
R10
R11
R12
C14
R18
R5
VCC OUT GND ZCD
BD7695FJ/BD7696FJ
IC1
C6
C17
VS
EO
CS
MULT
R13
C12
C11
R8
R19
R20
R6 C7
C8
C9
C13
R14
GND
Figure 23. Application Example
1
Output Voltage Setting
The output voltage is decided on feedback resistance by the VS pin.
(푅 ꢂ푅
푉푂푈푇 = ꢀ1 + (푅 //푅 ))ꢅ × 푉
= ꢀ1 + ꢆ5ꢇꢈ 푘훺ꢅ × ꢊ.ꢋ 푉 = 39ꢌ [V]
ꢁ7
ꢁ8
퐴푀푃
ꢆꢉ 푘훺
ꢁꢃ
2ꢄ
ꢍꢆꢎ + ꢍꢆꢇ:
ꢍꢆꢏ//ꢍꢈꢉ:
Upper side resister of the output feedback
Bottom side resister of the output feedback
Gm amplifier reference voltage1
푉
:
퐴푀푃
2
3
Calculation of the Inductance
Reference value in case of VOUT = 400 V, Output power = 200 W
ꢐ = ꢊꢋ0 [μH]
Setting a large value of inductance will reduce the THD but increase the component size.
External Parts of VCC
The VCC pin can reduce the VCC voltage change at the time of the switching by attaching a capacitor.
The VCC capacitor recommends electric field capacitor of 22 µF or more withstand pressure of 50 V or more.
In addition, you must confirm the VCC voltage evaluation at the time of startup and the protection detection with an actual
board when VCC is generated by startup resistance and the auxiliary winding of the transformer.
Because the consumption current of the IC decreases when an IC becomes the switching stop state after startup, the VCC
voltage may rise by startup resistance. The overvoltage destruction of VCC is prevented by VCC voltage discharge function.
The startup resistor value is made small by this function, so boot-time becomes fast.
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BD7695FJ BD7696FJ
Attention in the Board Design
About parts placement
You must locate the parts in the Figure 24 inside dot line near the IC. In addition, it is necessary to parts placement to avoid
the interference with switching lines and high current lines such as inductor, DRAIN.
F1
D3
L
DB1
R1
R2
R3
LF1
VOUT +
D4
T1
C3
C4
ZNR1
R16
C16
N
R7
C1
C2
D2
R4
R17
D1
R9
C5
M1
R15
C15
R10
R11
R12
C14
R18
R5
VCC OUT GND ZCD
BD7695FJ/BD7696FJ
IC1
C6
C17
VS
EO
CS
MULT
R13
C12
C11
R8
R19
R20
R6 C7
C8
C9
C13
R14
GND
Figure 24. Parts Placement
About GND wiring guidance
The red line in Figure 25 is the GND lines which large current flows. Draw each line as an independent wire. In addition, pull
the wiring thick and short. The blue line is the GND of the IC. Make the GND of the IC and the GND of the peripheral parts
common.
F1
D3
L
DB1
R1
R2
R3
LF1
VOUT +
D4
T1
C3
C4
ZNR1
R16
C16
N
R7
C1
C2
D2
R4
R17
D1
R9
C5
M1
R15
C15
R10
R11
R12
C14
R18
R5
VCC OUT GND ZCD
BD7695FJ/BD7696FJ
IC1
C6
C17
VS
EO
CS
MULT
R13
C12
C11
R8
R19
R20
R6 C7
C8
C9
C13
R14
C12
GND
Figure 25. GND Line Layout
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BD7695FJ BD7696FJ
Attention in the Board Design – continued
About a large current line
Large circuit current flows through the part of the red line in Figure 26. You must wire it short and thickly. Do not place the IC
and high impedance line near the red line because it has large noise.
F1
D3
L
DB1
R1
R2
R3
LF1
VOUT +
D4
T1
C3
C4
ZNR1
R16
C16
N
R7
C1
C2
D2
R4
R17
D1
R9
C5
M1
R15
C15
R10
R11
R12
C14
R18
R5
VCC OUT GND ZCD
BD7695FJ/BD7696FJ
IC1
C6
C17
VS
EO
CS
MULT
R13
C12
C11
R8
R19
R20
R6 C7
C8
C9
C13
R14
GND
Figure 26. High Current Line Layout
I/O Equivalence Circuits
1
VS
2
EO
3
MULT
4
CS
Internal Reg
Internal Reg
Internal Reg
5
ZCD
6
GND
7
OUT
8
VCC
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BD7695FJ BD7696FJ
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a
voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD7695FJ BD7696FJ
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 27. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD7695FJ BD7696FJ
Ordering Information
B D 7
6
9
x
F
J
-
E 2
x: Brown out Package
Packaging and forming specification
E2: Embossed tape and reel
5: None-
6: With
FJ: SOP-J8
Marking Diagram
SOP-J8 (TOP VIEW)
Part Number Marking
LOT Number
Pin 1 Mark
Part Number Marking
D7695
Product name
BD7695FJ-E2
BD7696FJ-E2
D7696
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TSZ02201-0F1F0A200740-1-2
15.Jul.2022 Rev.001
22/24
BD7695FJ BD7696FJ
Physical Dimension and Packing Information
Package Name
SOP-J8
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15.Jul.2022 Rev.001
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BD7695FJ BD7696FJ
Revision History
Date
Revision
001
Changes
15.Jul.2022
New Release
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15.Jul.2022 Rev.001
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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