BD69830FV_技术文档

Datasheet

DC Brushless Motor Drivers for Fans

Standard Single-phase Full wave

Fan Motor Driver

BD69830FV

Description

The BD69830FV is a 24V single-coil brushless DC FAN motor driver. The device incorporates high efficiency DMOS

H-bridge driver, regulated voltage output for hall element, and rotation speed is controlled by input PWM signal.

Features

ꢀ Power DMOS FET integrated

Package

SSOP-B14

W(Typ) x D(Typ) x H(Max)

5.00mm x 6.40mm x 1.35mm

ꢀ Direct PWM speed control

ꢀ Low duty start up function

ꢀ Quick start function

ꢀ Constant voltage output for hall element

ꢀ Lock protection and auto restart

(without external capacitor)

ꢀ Rotating speed pulse signal (FG) output

and ALARM signal output selectable

Applications

ꢀ BD player, Projector, STB etc,.

ꢀ Office equipment, Copier, FAX, Laser Printer, etc,.

SSOP-B14

Absolute Maximum Ratings

Parameter

Supply Voltage

Symbol

Rating

Unit

V_CC

Pd

30

V

W

°C

V

Power Dissipation

Operating Temperature

Storage Temperature

Junction Temperature

Output Voltage

0.87^{(Note 1)}

Topr

Tstg

Tjmax

V_OMAX

I_OMAX

V_H

-40 to +105

-55 to +150

150

30

Output Current

900^{(Note 2)}

mA

V

Hall Input Voltage

PWM Input Voltage

SEL Input Voltage

Signal Output Voltage

Signal Output Current

HB Current Ability

7

V_PWM

V_SEL

V_SIG

I_SIG

V

7

V

30

10

V

mA

I_HB

(Note 1) Reduce by 7.0mW/℃ over 25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board)

(Note 2) This value is not to exceed Pd.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated

over the absolute maximum ratings.

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays

.

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Recommended Operating Conditions

Parameter

Supply Voltage

Symbol

Min

6

Typ

24

-

Max

28

2

Unit

V

V_CC

V_H

Hall Input Voltage

0

V

PWM Input Frequency

f_PWM

2

-

50

kHz

Electrical Characteristics (Unless otherwise specified Ta=25°C, V_CC=24V)

Parameter

Circuit Current

Symbol

I_CC

Min

0.4

Typ

1.2

Max

3.0

Unit

mA

V

Conditions

Characteristics

Figure 1

Hall Bias Voltage

V_HB

I_HB=-3mA

Figure 2, 3

Figure 4

1.1

±5

1.2

1.3

Hall Input Hysteresis

V_HYS

±10

±15

mV

Io=200mA

Upper and Lower total

V_O

0.3

0.6

0.9

V

Figure 5 to 8

Output Voltage

PWM Input H Level

PWM Input L Level

V_PWMH

V_PWML

I_PWMH

I_PWML

V

-

2.5

-0.3

-5

-

5.5

+0.8

+5

µA

V_PWM=5V

V_PWM=0V

0

PWM Input Current

SEL Input L Level

-36

-27

-18

FG:SEL pin open

AL:SEL pin GND short

V_SELL

V

-

-0.3

-

+0.8

SIG L Voltage

V_SIGL

I_SIGL

t_ON

V

µA

s

I_SIG=5mA

V_SIG=30V

Figure 9, 10

-

0.2

-

0.4

5

SIG Leak Current

0

-

Lock Detection ON Time

Lock Detection OFF Time

Figure 11

Figure 12

0.28

8.4

0.40

12

0.52

15.6

t_OFF

s

Truth Table

H+

FG

H-

L

PWM

OUT1

OUT2

H

L

H

L

H

L

H

L（Output Tr : ON）

H（Output Tr : OFF）

L（Output Tr : ON）

H（Output Tr : OFF）

H

L

H

L

OFF

L

H

L

OFF

AL signal normal operation : L(output Tr is ON)

Lock detection : H(output Tr is OFF)

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Reference data

1.4

1.3

1.2

1.1

1.0

5

4

3

2

1

105°C

25°C

-40°C

105°C

25°C

-40°C

Operating Range

0

5

10

15

20

25

30

0

5

10

15

20

25

30

Supply Voltage, Vcc [V]

Figure 1. Circuit Current

Figure 2. Hall Bias Voltage

1.4

1.3

1.2

1.1

30

20

10

0

105°C

25°C

-40°C

105°C

25°C

-40°C

Operating Range

-10

-20

-30

-40°C

25°C

105°C

1.0

0

2

4

6

8

10

0

5

10

15

20

25

30

Supply Voltage, Vcc [V]

Output Current, I_HB[mA]

Figure 3. Hall Bias Voltage Current Ability (Vcc=24V)

Figure 4. Hall Input Hysteresis

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Reference data

2.4

2.0

1.6

1.2

0.8

0.4

2.4

2.0

1.6

1.2

0.8

0.4

0.0

105°C

6V

24V

29V

25°C

-40°C

0.0

0.2

0.4 0.6

Output Current, Io [A]

0.8

1.0

0.0

0.2

0.4 0.6

Output Current, Io [A]

0.8

1.0

Figure 5. Output H Voltage （Ta=25°C）

Figure 6. Output H Voltage （Vcc=24V）

1.2

1.0

0.8

0.6

0.4

0.2

0.0

1.2

1.0

0.8

0.6

0.4

0.2

0.0

105°C

6V

24V

29V

25°C

-40°C

0.0

0.2

0.4

0.6

0.8

1.0

0.0

0.2

0.4

0.6

0.8

1.0

Output Current, Io [A]

Figure 7. Output L Voltage （Ta=25°C）

Figure 8. Output L Voltage (Vcc=24V）

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Reference data

0.4

0.3

0.2

0.1

0.0

0.4

0.3

0.2

0.1

105°C

6V

25°C

24V

29V

-40°C

0.0

0

2

4

6

8

10

0

2

4

6

8

10

Output Current, I_SIG[mA]

Figure 9. SIG L Voltage（Vcc=24V）

Figure 10. SIG L Voltage（Ta=25°C）

0.6

0.5

15

14

13

12

11

10

9

-40°C

25°C

105°C

0.4

0.3

0.2

0.1

0.0

-40°C

25°C

105°C

Operating Range

0

5

10

15

20

25

30

0

5

10

15

20

25

30

Supply Voltage, Vcc [V]

Figure 11. Lock Detection ON Time

Figure 12. Lock Detection OFF Time

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Block Diagram, Application Circuit, and Pin Assignment

M

GND

1

GND

14

VCC

OUT2

OUT1

13

Constant voltage output for hall

Consider protection against

voltage rise due to reverse

connection of power supply

and back electromotive force.

2

element. Pull up resistor to VCC,

it enables to reduce heat

generation of HB output

transistor.

VCC

3

N.C.

12

GND

5V

OSC

P.8

P. 12

VCC

4

SEL

11

Lock

Protection

VCC

Changeable regeneration

section at phase change

timing by hall signal

amplitude.

0.1µF

Pre-drive

Control

～1µF

N.C.

5

H+

10

5kΩ～15kΩ

TSD

5V

+

-

P. 9

PWM

6

HB

9

Hall

Bias

HALL

H-

8

SIG

7

Enables speed control

by applying external

PWM signal directly.

0Ω～500Ω

P.10

OSC : Internal reference oscillation circuit

TSD : Thermal shut down circuit

Pin Description

Pin No.

Pin Name

Function

1

2

GND

OUT2

VCC

N.C.

PWM

SIG

GND

Motor output 2

Power supply

-

3

4

5

6

PWM signal Input

7

Signal output (FG/AL signal)

Hall Input -

8

H-

9

HB

Constant voltage output for hall element

10

11

12

13

14

H+

Hall Input +

FG/AL select pin

-

SEL

N.C.

OUT1

GND

Motor output1

GND

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Description of Operations

1) Lock Protection and Automatic Restart

Motor rotation is detected by hall signal period. IC detects motor rotation is stop when the period becomes longer than

the time set up at the internal counter, and IC turns off the output. Lock detection ON time (t_ON) and lock detection OFF

time (t_OFF) are set by the digital counter based on internal oscillator. Therefore the ratio of ON/OFF time is always

constant. Timing chart is shown in Figure 13.

Idling

H+

OUT1

t_OFF

t_ON

OUT2

Output Tr OFF

ON

Depends on hall signal

(H in ths figure)

（at SEL=open）

（at SEL=GND）

FG

AL

t_ON

Recovers normal

operation

Lock

release

Lock

detection

Motor

lock

SIG (7pin) output : FG signal output at SEL=open

AL signal output at SEL=GND

Figure 13. Lock Protection Timing Chart

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2) Constant Voltage Output for Hall Element

By connecting a hall element to HB pin directly, hall signal amplitude does not depend on temperature change.

VCC

HB

IC

Hall

element

GND

Figure 14. Normal Connection of Hall Element

The output voltage of HB is 1.2V (Typ).

If the resistance of hall element is 300Ω, current value which flows into a hall element is

1.2V / 300Ω= 4mA

Power supply voltage = 24V, HB output voltage = 1.2V, current to hall element = 4mA, in this condition, the heat

generation of HB output is

(24V - 1.2V) x 4mA = 91.2mW ・・・(1)

If motor driving current is less, and there are some margins to power dissipation, the above-mentioned connection

method is the simplest. In the case which motor driving current is large and it needs to reduce heat generation of IC,

the application of following Figure 15 is recommended to suppress heat generation at HB output part.

VCC

R1

R_H

HB

IC

GND

Figure 15. Dividing Heat Generation into Resistor

Resistance of hall element R_H[Ω], Pull-up resistor R1[Ω], the heat generation of IC can be suppressed by choosing the

resistance of R1 so that it may be applied to this condition.

V_CCx R_H/ (R1 + R_H) < V_HB

The current supplied to a Hall element is mainly supplied from the resistance side, and only current for a voltage to

become fixed value is supplied from HB pin.

e.g. V_CC= 24V, R_H= 300Ω, R1 = 6kΩ

V_CCx R_H/ (R1 + R_H) = 24V x 0.0476 = 1.143V < V_HB=1.2V

Current supply source from HB is

(1.2V / 300Ω) – {(24V – 1.2V) / 6kΩ} = 0.2mA

And then, power consumption at HB output part is

(24V -1.2V) x 0.2mA = 4.56mW

It is clear that heat generation decreases greatly compared with the calculated value of (1).

HB pin has only current source ability.

If ambient temperature becomes high, the resistance of hall element becomes small. The voltage which supplies for a

hall element at the condition of low temperature may exceed the maximum rating of a hall element, if the value of R1 is

set up on the basis of the hall resistance at the condition of high temperature.

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3) Hall Input Setting

2V

GND

Figure 16. Hall Input Voltage Range

The input voltage of a hall signal is input in "Hall Input Voltage" including signal amplitude.

In order to detect rotation of a motor, the amplitude of hall signal more than "Hall Input Hysteresis" is required.

Input the hall signal more than 30mVpp at least.

○Reducing the Noise of Hall Signal

Hall element may be affected by Vcc noise or the like depending on the wiring pattern of board. In this case, place

a capacitor like C1 in Figure 17. In addition, when wiring from the hall element output to IC hall input is long, noise

may be loaded on wiring. In this case, place a capacitor like C2 in Figure 17.

H-

H+

HB

C2

C1

RH

R2

Hall element

Bias current

= HB / (RH+ R2)

Figure 17. Application near of Hall Signal

○Regeneration adjustment by hall signal level

The amplitude of hall signal can be adjusted by putting in resistor like R2 of Figure 17. There is the regeneration

section of back electromotive force at phase change timing (refer to Figure 18)

The section is determined by "Hall Input Hysteresis" and hall input signal amplitude.

In large back electromotive force (Back EMF) motor, output voltage may overshoot at the time of phase change, and

it may exceed the maximum rating voltage. In that case, set to lower the hall signal amplitude by R2, and make the

wide recirculation section.

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4) PWM Speed Control

Rotation speed of motor can be changed by controlling ON/OFF of upper output depending on the duty of the input

signal to PWM pin.

When the voltage input to PWM pin applies

When PWM pin is open, H logic is applied.

H logic : normal operation

L logic : H side output is off, L side output is ON

Hall input

hysteresis

H+

PWM

OUT1

OUT2

FG

Figure 18. Timing Chart of PWM Control and Hall Signal

5) Quick Start Function

When PWM signal is input, the motor starts rotation at once regardless of the lock detection time.

Lock protection function is turned off when the time of PWM=L has elapsed more than 1ms in order to disable lock

protection function when the motor is stopped by PWM signal. When H level duty of PWM input signal is close to 0%,

lock protection function does not work if input frequency is slower than 1kHz. Therefore enter a frequency faster than

2kHz.

6) Low Duty Start up Function

Even if the input duty of PWM signal is low, the motor can start rotation by this function.

During the motor starts up from stop condition, outputs are driven by a PWM signal of 100% duty until detecting motor

rotation (max 200ms). It doesn't depend on input PWM duty (except 0% duty).

VCC

Input duty=10%

Input duty=80%

PWM

Output duty=100%

Output

Output duty=80%

Duty assist section

Power

ON

Figure 19. Low Duty Start up Function

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Equivalent Circuit

1) Hall input

2) Motor output

VCC

1kΩ

H+, H-

OUT1

OUT2

GND

3) HB output

4) SIG output

SIG

HB

50kΩ

5) PWM input

6) SEL input

5.2V internal voltage

200kΩ

SEL

200kΩ

PWM

10kΩ

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Safety Measure

1) Reverse Connection Protection Diode

Reverse connection of power results in IC destruction as shown in Figure 20. When reverse connection is possible,

reverse connection protection diode must be added between power supply and VCC.

In normal energization

VCC

Reverse power connection

VCC

After reverse connection

destruction prevention

VCC

Circuit

block

Each

Circuit

block

Each

Circuit

block

Each

GND

Internal circuit impedance high

Large current flows

ꢁThermal destruction

No destruction

ꢁamperage small

Figure 20. Flow of Current when Power is Connected Reversely

2) Protection against VCC Voltage Rise by Back Electromotive Force

Back EMF generates regenerative current to power supply. However, when reverse connection protection diode is

connected, VCC voltage rises because the diode prevents current flow to power supply.

ON

Phase

switching

ON

Figure 21. VCC Voltage Rise by Back Electromotive Force

When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place

(A) Capacitor or (B) Zener diode between VCC and GND. It necessary, add both (C).

(B) Zener Diode

(A) Capacitor

ON

(C) Capacitor and Zener Diode

ON

Figure 22. Protection against VCC Voltage Rise

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3) Problem of GND Line PWM Switching

Do not perform PWM switching of GND line because GND potential cannot be kept to a minimum.

VCC

Motor

Driver

Controller

M

GND

PWM input

Prohibited

Figure 23. GND Line PWM Switching Prohibited

4) SIG Output

SIG is an open drain outuput and requires pull-up resistor. VCC voltage that is beyond its absolute maximum rating

when SIG pin is directly connected to power supply, could damage the IC. The IC can be protected by adding

resistor R1. (as shown in Figure 24)

VCC

Pull-up

resistor

SIG

Protection

Resistor R1

Connector

of board

Figure 24. Protection of SIG Pin

Thermal Derating Curve

Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that

can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal

resistance θja.

Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,

wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured

at a specified condition. Figure 25 shows a thermal derating curve.

Pd(W)

1.0

0.87

0.8

0.6

0.4

0.2

0

25

50

75 100 105 125

150

Ta(°C)

Reduce by 7.0 mW/°C over 25°C.

(70.0mm x 70.0mm x 1.6mm glass epoxy board)

Figure 25. Thermal Derating Curve

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,

pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground

due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below

ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions

such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.

4.

5.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

6.

7.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

8.

9.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 26. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

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BD69830FV

Ordering Information

B D 6

9

8

3

0

F

V

-

GE2

Part Number

Package

FV: SSOP-B14

Packaging and forming specification

G: Halogen free

E2: Embossed tape and reel

Marking Diagrams

SSOP-B14(TOP VIEW)

Part Number Marking

69830

LOT Number

1PIN MARK

www.rohm.com

TSZ22111・15・001

TSZ02201-0H1H0B101050-1-2

5.Jun.2014 Rev.001

16/17

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BD69830FV

Physical Dimension, Tape and Reel Information

Package Name

SSOP-B14

Tape

Embossed carrier tape

2500pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

www.rohm.com

TSZ22111・15・001

TSZ02201-0H1H0B101050-1-2

5.Jun.2014 Rev.001

17/17

Daattaasshheeeett

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice – GE

Rev.002

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Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice – GE

Rev.002

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General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BD69830FV
厂家：	ROHM
描述：	BD69830FV是适用于24V电源的单相全波风扇电机驱动器。支持通过PWM信号输入的速度控制、内置无需外置电容器的锁定保护及自动恢复电路，附带转速脉冲信号/锁定警报信号输出切换功能。电机驱动脉冲电容器风扇驱动器
文件：	总20页 (文件大小：615K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD69830FV [ROHM]

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