BD68888MUV [ROHM]
BD68888MUV 是额定电源36 V、额定输出电流1.65 A 的低功耗双极PWM恒流驱动器。输入接口采用PARA-IN 驱动方式,是可驱动2个双极步进电机的电机驱动器。另外,也可使用一个系统电源进行驱动,有助于提高整机设计的便利性。;![BD68888MUV](http://pdffile.icpdf.com/pdf2/p00358/img/icpdf/BD68888MUV_2196948_icpdf.jpg)
型号: | BD68888MUV |
厂家: | ![]() |
描述: | BD68888MUV 是额定电源36 V、额定输出电流1.65 A 的低功耗双极PWM恒流驱动器。输入接口采用PARA-IN 驱动方式,是可驱动2个双极步进电机的电机驱动器。另外,也可使用一个系统电源进行驱动,有助于提高整机设计的便利性。 电机 驱动 驱动器 |
文件: | 总23页 (文件大小:1450K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Datasheet
36V
2ch Stepping Motor Driver
BD68888MUV
General Description
Key Specifications
BD68888MUV is a bipolar low-consumption driver that
driven by PWM constant current. Rated power supply
voltage of the device is 36 V, and rated output current is
1.65 A. PARA-IN drive mode is adopted for input
interface. This motor driver can drive 2ch bipolar
stepping motors.
■
■
■
■
Range of Power Supply Voltage
Rated Output Current
Range of Operating Temperature -25 °C to +85 °C
8 V to 28 V
1.65 A/Phase
Output ON Resistance
1.0 Ω (Typ)
(total of upper and lower resistors)
In addition, the power supply can be driven by one single
system, which simplifies the design.
Package
VQFN036V6060
W (Typ) x D (Typ)x H (Max)
6.0 mm x 6.0 mm x 1.0 mm
Features
■
■
■
■
■
Two bipolar stepping motors can be driven
Rated Output Current 1.65 A/Phase
Low ON Resistance DMOS Output
PARA-IN Drive Mode correspondence
PWM Constant Current control (the other excitation
method)
■
Built-in Spike Noise Blanking Function (external noise
filter is unnecessary)
■
■
■
■
■
■
■
■
Full-, Half (two kinds)-, Quarter-step correspondence
Power Save Function
Built-in Logic Input Pull-down Resistor
Thermal Shutdown Circuit (TSD)
Over-current Protection Circuit (OCP)
Under Voltage Lockout Circuit (UVLO)
Over Voltage Lockout Circuit (OVLO)
Ghost Supply Prevention (protects against
malfunction when power supply is disconnected)
Typical Application Circuit
OUT1A
OUT1B
PHASE1
PHASE2
I01
I11
SENSE1
I02
I12
Application
Monitoring
VBB1
■
Camera,
WEB
Camera,
PPC,
Multi-function Printer, Laser Beam Printer, Ink-jet
Printer, Sewing Machine, Photo Printer, FAX,
Scanner, Mini Printer, Toy and Robot
OUT2A
OUT2B
VREF1
VREF2
VREF3
VREF4
SENSE2
OUT3A
OUT3B
SENSE3
PHASE3
PHASE4
I03
VBB2
OUT4A
I13
I04
I14
OUT4B
SENSE4
PS
GND
GND
○Product structure : Silicon integrated circuit ○This product has no designed protection against radioactive rays
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BD68888MUV
Pin Configuration
Block Diagram
PHASE1
PHASE2
I01
Regulator
[TOP VIEW]
RESET
UVLO
OVLO
TSD
Interface
I11
I02
I12
OCP
VREF1
VREF2
2bit DAC
VBB1
27 26 25 24 23 22 21 20 19
SENSE1
2bit DAC
OUT1A
OUT1B
SENSE2
Blank time
PWM control
SENSE1
I12
I11
28
29
30
18
17
16
15
14
13
12
11
10
PHASE1
PHASE2
GND
Control
logic
Pre-
driver
VBB1
OSC
OUT2A
OUT2B
GND
SENSE2
N.C. 31
Interface
2bit DAC
VREF4
VREF3
PS
VREF3
TEST1
32
VBB2
SENSE3
2bit DAC
VREF4
TEST2 33
VREF2
VREF1
OUT3A
OUT3B
SENSE4
EXP-PAD
I01
34
Blank time
PWM control
SENSE3
Control
logic
Pre-
driver
I02
I03
35
36
PS
VBB2
OSC
PHASE3
OUT4A
OUT4B
SENSE4
1
2
3
4
5
6
7
8
9
PHASE3
PHASE4
I03
Interface
I13
GND
GND
I04
I14
Pin Descriptions
Pin
Pin
No.
Pin Name
No.
Function
Pin name
Function
1
2
I04
VREF division ratio setting pin
H bridge output pin
19
20
I14
VREF division ratio setting pin
H bridge output pin
OUT1A
OUT4A
Connection pin of resistor for output
current detection
Connection pin of resistor for output
current detection
SENSE1
SENSE4
3
21
4
5
6
OUT1B
VBB1
H bridge output pin
22
23
24
OUT4B
VBB2
H bridge output pin
Power supply pin
Power supply pin
OUT2B
H bridge output pin
OUT3B
H bridge output pin
Connection pin of resistor for output
current detection
Connection pin of resistor for output
current detection
SENSE2
SENSE3
7
25
8
OUT2A
PHASE4
PHASE3
PS
H bridge output pin
26
27
28
29
30
31
32
33
OUT3A
I13
H bridge output pin
9
Phase selection pin
VREF division ratio setting pin
VREF division ratio setting pin
10
11
12
13
14
15
Phase selection pin
I12
Power save pin
I11
VREF division ratio setting pin
Ground pin
VREF1
VREF2
VREF3
VREF4
Output current value setting pin
Output current value setting pin
Output current value setting pin
Output current value setting pin
Ground pin
GND
NC
Non connection
TEST1
TEST2
Pin for testing
Pin for testing
16
17
18
-
GND
34
35
36
-
I01
I02
I03
-
VREF division ratio setting pin
PHASE2
PHASE1
EXP-PAD
Phase selection pin
VREF division ratio setting pin
Phase selection pin
VREF division ratio setting pin
-
The EXP-PAD connect to GND.
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BD68888MUV
Absolute Maximum Ratings (Ta = 25 °C)
Item
Symbol
VBB1,VBB2
VIN
Rated Value
-0.2 to +36.0
-0.2 to +5.5
0.7
Unit
Supply Voltage
V
Input Voltage for Control Pin(Note 1)
SENSEx(Note 2) Maximum Input Voltage
Output Current
V
V
VSENSE
IOUT
1.65(Note 3)
-55 to +150
+150
A/Phase
°C
Storage Temperature Range
Tstg
Maximum Junction Temperature
Tjmax
°C
(Note 1) Control pin = PHASE1, PHASE2, PHASE3, PHASE4, VREF1, VREF2, VREF3, VREF4, I01, I02, I03, I04, I11, I12, I13, I14.
(Note 2) x = 1, 2, 3 or 4
(Note 3) Do not exceed Tjmax = 150 °C.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Recommended Operating Conditions
Item
Symbol
Min
-25
+8
-
Typ
+25
+24
-
Max
+85
Unit
°C
Operating Temperature
Supply Voltage
Topr
VBB1,VBB2
IOUT
+28
V
Maximum Output
Current (DC)
+1.2(Note 4)
A/ Phase
(Note 4) Do not exceed Tjmax = 150 °C.
Thermal Resistance(Note 5)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 7)
2s2p(Note 8)
VQFN036V6060
Junction to Ambient
Junction to Top Characterization Parameter(Note 6)
θJA
103.9
4
24.5
2
°C/W
°C/W
ΨJT
(Note 5) Based on JESD51-2A (Still-Air).
(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 7) Using a PCB board based on JESD51-3.
(Note 8) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Thermal Via(Note 9)
Layer Number of
Measurement Board
Material
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Pitch
Diameter
4 Layers
FR-4
1.20 mm
Φ0.30 mm
Top
Copper Pattern
Bottom
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Copper Pattern
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
74.2 mm x 74.2 mm
(Note 9) This thermal via connects with the copper pattern of all layers.
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BD68888MUV
Electrical Characteristics (Unless otherwise specified Ta = 25 °C, VBB1, VBB2 = 24 V)
Limit
Item
Symbol
Unit
Condition
Min
Typ
Max
[Whole]
Circuit Current at Standby
Circuit Current
ICCST
ICC
-
-
0
10
µA
PS = L
5.0
8.0
mA
PS = H, VREFx = 1.5 V
[Control Logic Input(Note 1)
H-level Input Voltage
L-level Input Voltage
H-level Input Current
L-level Input Current
]
VINH
VINL
IINH
IINL
2.0
-
-
-
-
V
V
0.8
100
-
35
-10
50
0
µA
µA
VIN = 5 V
VIN = 0 V
[Output(Note 2)
]
IOUT = ±1.0 A
Output ON Resistance
Output Leak Current
[Current Control]
RON
-
-
1.0
1.4
10
Ω
(total of upper and lower)
ILEAK
-
µA
SENSEx(Note 3) Input Current
VREFx(Note 3) Input Current
ISENSE
IVREF
-80
-2.0
0
-40
-0.1
-
-
-
µA
µA
V
SENSEx = 0 V
VREFx = 0 V
VREFx(Note 3) Input Voltage Range
VVREF
1.5
Minimum ON Time
(Blank Time)
tONMIN
0.3
1.0
1.5
µs
V
Comparator Threshold
VCTH
0.48
0.50
0.52
VREFx = 1.5 V
(Note 1) Control Logic input = PHASE1, PHASE2, PHASE3, PHASE4, I01, I02, I03, I04, I11, I12, I13, I14
(Note 2) Output = OUT1A, OUT1B, OUT2A, OUT2B, OUT3A, OUT3B, OUT4A, OUT4B
(Note 3) x = 1, 2, 3 or 4
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BD68888MUV
Function Explanation
1
PS/Power Save Pin
The PS pin can make the circuit standby state and make the motor output OPEN. When PS = L→H, be careful because
there is a delay of 40 µs (Max) before it is returned from standby state to normal state and the motor output becomes
ACTIVE.
PS
Status
Standby state
ACTIVE
L
H
2
3
PHASEx (Note 1)/Phase Selection Pin
These pins determine output state.
PHASEx
OUTxA(Note 1)
OUTxB(Note 1)
L
L
H
L
H
H
(Note 1) x = 1, 2, 3 or 4
I0x (Note 2), I1x(Note 2)/VREF Division Ratio Setting Pin
Although VREF pins voltage is input to 2bit-DAC, these pins set the split ratio of 2bit-DAC output voltage.
I0x
L
I1x
L
Output Current Level (%)
100
67
33
0
H
L
L
H
H
H
(I0x, I1x) = (H, H): motor outputs are open.
(Note 2) x = 1, 2, 3 or 4
4
VBB1, VBB2/Power Supply Pin
The wire should be thick, short and has low impedance, because Motor’s drive current is flowing in it. The VBB1 pin and the
VBB2 pin voltage may have great fluctuation, so arrange the bypass capacitor of about 100 µF to 470 µF as close to the pin
as possible and adjust the VBB1 pin and the VBB2 pin voltage is stable. Increase the capacity as needed especially, when
a large current is used or those motors that have great back electromotive force are used.
In addition, for the purpose of reducing of power supply’s impedance in wideband, it is recommended to set parallel
connection of multi-layered ceramic capacitor of 0.01 µF to 0.1 µF etc. Extreme care must be used to make sure that the
VBB1 pin and the VBB2 pin voltage do not exceed the rating even for a moment. The VBB1 pin and the VBB2 pin are
shorted inside the IC, but be sure to short externally the VBB1 pin and the VBB2 pin when using. If used without shorting,
malfunction or destruction may occur because of concentration of current routes etc. Still more, in the power supply pin,
there is built-in clamp component for preventing of electrostatic destruction. When a steep pulse signal or voltage such as a
surge exceeding the absolute maximum rating is applied, this clamp component operates, and the IC might be destroyed
as a result. Be sure that the maximum absolute rating must not be exceeded. It is effective to mount a Zener diode of about
the maximum absolute rating. Moreover, the diode for preventing electrostatic destruction is inserted between the VBB1 pin,
the VBB2 pin and the GND pin. Be careful about the reverse voltage because the IC might be destroyed as a result if
reverse voltage is applied to the VBB1 pin, the VBB2 pin and the GND pin.
5
6
GND/Ground Pin
In order to reduce the electric noise by switching current and to stabilize the internal reference voltage of the IC, make the
wiring impedance from this pin as low as possible to achieve the lowest electrical potential no matter what operating state it
can be. Moreover, design the patterns not to have any common impedance with other GND patterns.
OUTxA(Note 3), OUTxB(Note 3)/H Bridge Output Pin
Motor’s drive current is flowing in it, so the wire should be thick, short and has low impedance. It is also effective to add a
schottky diode if output has positive or negative great fluctuation when large current is used. For example, counter
electromotive voltage etc. Moreover, in the output pin, there is built-in clamp component for preventing of electrostatic
destruction. When a steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied, this
clamp component operates, and the IC might be destroyed in the end. Be sure that the maximum absolute rating must not
exceeded.
(Note 3) x = 1, 2, 3 or 4
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BD68888MUV
Function Explanation – continued
7
SENSEx(Note 1)/Connection Pin of Resistor for Detecting of Output Current
Connect the resistor of 0.1 Ω to 0.3 Ω for current detection between this pin and GND. Determine the resistor so that power
consumption W = IOUT2•R [W] of the current-detecting resistor does not exceed the maximum absolute rating of the resistor.
In addition, it has a low impedance and does not have a common impedance with other GND patterns because motor’s
drive current flows in the pattern through the SENSEX pin to current-detecting resistor to GND. Do not exceed the rating
because there is the possibility of circuits’ malfunction etc., if the SENSE pin voltage exceeds the maximum rating (0.7V).
Moreover, be careful because if the SENSEx pin is shorted to GND, large current flows without normal PWM constant
current control, and OCP or TSD might operate. If there is a possibility of malfunction, such as output does not flow even
when the SENSEx pin is open, please do not put to such a state.
(Note 1) x = 1, 2, 3 or 4
8
VREFx(Note 2)/Output Current Value Setting Pin
This is the pin to set the output current value. It can be set by the VREF pin voltage and current-detecting resistor (SENSE
resistor).
퐼푂푈푇
Where
=
푉푅퐸퐹푥 / 푆ꢀ푁푆ꢀꢁ
[A]
3
IOUT : The output current.
VREFx : The voltage of output current value-setting pin.
SENSEx : The current-detecting resistor.
Avoid using the IC with the VREFx pin is open because if it is open, it may have malfunctions such as flowing a large
current by unstable input, the increased the VREFx pin voltage and increased setting current. The input voltage range must
be kept because a large current might flow to output and OCP or TSD might operate if the voltage of over 1.5 V is applied
on the VREFx pin. Besides, select the resistance value in consideration of the outflow current (Max 2 µA) if it is inputted by
resistance division. The minimum current, which can be controlled by the VREFx pin voltage, is determined by motor coil’s
L, R values and minimum ON time because there is a minimum ON time in PWM drive.
(Note 2) x = 1, 2, 3 or 4
9
TESTx(Note 3)/Pin for Inspection
This pin is used for delivery inspection of the IC, and shall be grounded before use.
In addition, malfunctions can be caused by application without grounding.
(Note 3) x = 1 or 2
10 NC Pin
This pin is unconnected electrically with the IC internal circuit.
11 EXP-PAD
For VQFN036V6060 package, the heat-radiating metal is mounted on the IC’s backside. It is the precondition that making
the heat-radiating treatment when in use. Therefore, it must be connected by solder with the GND plane on the board and
ensure the sufficient heat-radiation area by taking the GND pattern as wide as possible. Moreover, the back side metal is
shorted with IC chip’s back side and becomes the GND potential, so there is the danger of malfunction and destruction if
shorted with potentials other than GND. Never design any wiring patterns other than GND through the IC’s backside.
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BD68888MUV
Protection Circuits
1
Thermal Shutdown (TSD)
This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises to 175 °C
(Typ) or more, the motor output becomes OPEN. Also, when the temperature returns to 150 °C (Typ) or less, it
automatically returns to normal operation. However, if heat is continued to be added externally even while TSD is in
operation, heat overdrive can lead to destruction.
2
Over Current Protection (OCP)
This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted
each other or VBB1, VBB2-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN
condition when the regulated current flows for 4 µs (Typ). It returns with power reactivation or a reset of the PS pin. The
over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor
output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to
take into account this circuit’s functions. After OCP operating, if irregular situations continue and the return by power
reactivation or a reset of the PS pin is carried out repeatedly, then OCP operates repeatedly and the IC may generate
heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long of faults, ground faults
and shorting, there is a possibility of destruction after the over current has flowed and the output pin voltage jumps up and
the absolute maximum values can be exceeded. Also, when current which is the output current rating or more and the
OCP detection current or less flows, the IC can heat up to over Tjmax = 150 °C and can deteriorate, so current which
exceeds the output rating should not be applied.
3
4
Under Voltage Lock Out (UVLO)
This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply
under voltage. When the applied voltage to the VBB1 pin and the VBB2 pin goes 5 V (Typ) or less, the motor output is set
to OPEN. This switching voltage has a 1 V (Typ) hysteresis to prevent malfunction due to noise etc. Be aware that this
circuit does not operate during power save mode. Also, the electrical angle is reset when the UVLO circuit operates.
Over Voltage Lock Out (OVLO)
This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over
voltage. When the applied voltage to the VBB1 pin and the VBB2 pin goes 32 V (Typ) or more, the motor output is set to
OPEN. This switching voltage has a 1 V (Typ) hysteresis and a 4 µs (Typ) mask time to prevent malfunction due to noise
etc.
Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value
for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Be aware that this
circuit does not operate during power save mode.
5
6
Ghost Supply Prevention (protects against malfunction when power supply is disconnected)
If a control signal (logic input, VREFx(Note 1)) is input when there is no power supplied to this IC, there is a function which
prevents a malfunction where voltage is supplied to power supply of this IC or other IC in the set via the electrostatic
destruction prevention diode from these input pins to the VBB1 pin and the VBB2 pin. Therefore, there is no malfunction
of the circuit even when voltage is supplied to these input pins while there is no power supply.
(Note 1) x = 1, 2, 3 or 4
Operation Under Strong Electromagnetic Field
The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction is
found when using the IC in a strong electromagnetic field.
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BD68888MUV
PWM Constant Current Control
1
Current control operation
The output current increases due to the output transistor turned on. When the voltage on the SENSEx(Note 1) pin, the output
current is converted voltage due to connect the external resistance to the SENSEx pin, reaches the voltage value set by the
internal 2-bit DAC and the VREFx(Note 1) input voltage, the current limit comparator engages and enters current decay mode.
Thereafter the output turned on again after a period of time determined the internal timer. The process repeats itself
constantly.
(Note 1) x = 1, 2, 3 or 4
2
3
Noise-masking function
In order to avoid misdetection of current detection comparator due to SENSEx spike noise that may occur when the output
turns on, the IC employs the minimum ON-time (tONMIN). It invalids the current detection for the minimum ON-time of 1 µs
(Typ) from the output transistor turned on. This allows constant-current drive without the need for an external filter.
Internal Timer
IC internal voltage repeat charging and discharging between VL to VH.
The detection of the internal comparator is masked while charging from VL to VH. This period defines the minimum
ON-time (tONMIN). The internal voltage begins discharging once the voltage reaches VH. When the output current reaches
the current limit during this period, then the IC enters decay mode. It reaches VL, at which point the IC internal voltage is
switched back ON. The current output and internal terminal begin charging simultaneously.
Spike Noise
Current Limit Value
Output Current
0 mA
Current Limit Value
SENSE Voltage
GND
VH
IC Internal Voltage
VL
GND
Chopping Period
tCHOP
Minimum ON Time
tONMIN
Figure 1. Timing Chart of IC Internal Voltage, the SENSEx pin voltage and Output Current
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BD68888MUV
PWM Constant Current Control – continued
4
Current Decay Mode
The current decay method is SLOW DECAY for PWM Constant Current Control.
The following diagrams show the state of each transistor and the regenerative current path during the current decay for
SLOW DECAY mode:
OFF→OFF
ON→OFF
M
OFF→ON
ON→ON
Output ON Time
Current Decay Time
Figure 2. Route of Regenerated Current during Current Decay
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BD68888MUV
PARALLEL-IN Drive Mode -
Description for CH1 (CH2: same as CH1)-
It is possible to drive stepping motor with FULL STEP, HALF STEP, and QUARTER STEP by inputting the following motor
control signals using PARALLEL-IN drive mode.
Examples of control sequence and torque vector
FULL STEP
Controlled by 2 logic signals of PHASE1 and PHASE2
1
2
3
4
OUT1A
100%
67%
PHASE1
PHASE2
I01
4
3
1
2
33%
I11
OUT2A
OUT2B
I02
I12
100%
67%
33%
IOUT(CH1)
OUT1B
-33%
-67%
-100%
100%
67%
33%
IOUT(CH2)
-33%
-67%
-100%
HALF STEP A
Controlled by 4 logic signals of PHASE1, PHASE2, I01 (I11), and I02 (I12)
OUT1A
1
1
2
3
4
5
6
7
8
100%
67%
PHASE1
PHASE2
I01
8
6
2
4
33%
OUT2B
OUT2A
I11
7
3
I02
I12
100%
67%
33%
5
IOUT(CH1)
OUT1B
-33%
-67%
-100%
100%
67%
33%
IOUT(CH2)
-33%
-67%
-100%
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PARALLEL-IN Drive Mode – continued
HALF STEP B
Controlled by 6 logic signals of PHASE1, PHASE2, I01, I11, I02 and I12
OUT1A
1
1
2
3
4
5
6
7
8
100%
67%
PHASE1
PHASE2
I01
2
4
33%
8
6
I11
OUT2B
OUT2A
7
3
I02
I12
100%
67%
33%
5
IOUT(CH1)
OUT1B
-33%
-67%
-100%
100%
67%
33%
IOUT(CH2)
-33%
-67%
-100%
QUARTER STEP
Controlled by 6 logic signals of PHASE1, PHASE2, I01, I11, I02 and I12
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16
OUT1A
100%
67%
33%
PHASE1
PHASE2
I01
1
2
16
2
15
3
7
14
4
I11
OUT2A
OUT2B
13
12
5
6
I02
I12
11
8
100%
67%
33%
10
9
IOUT(CH1)
IOUT(CH2)
-33%
-67%
OUT1B
-100%
100%
67%
33%
-33%
-67%
-100%
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BD68888MUV
Power Dissipation
Confirm that the IC’s chip temperature Tj is not over 150 °C in consideration of the IC’s power consumption (W), thermal
resistance (°C/W) and ambient temperature (Ta). When Tj = 150 °C is exceeded, the functions as a semiconductor do not
operate and problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration
and eventually destruction of the IC. Tjmax = 150 °C must be strictly obeyed under all circumstances.
1
Thermal Calculation
The IC’s consumed power can be estimated roughly with the power supply voltage (VBB1 and VBB2), circuit current
(ICC), output ON resistance (RONH, RONL) and motor output current value (IOUT).
The calculation method during FULL STEP drive, SLOW DECAY mode is shown here:
푊푉퐵퐵 = ꢂꢃꢃ × 퐼퐶퐶
[W]
where:
WVBB is the consumed power of the VBB.
VBB is the power supply voltage.
ICC is the circuit current.
푊퐷푀푂ꢄ = 푊푂ꢅ + 푊퐷퐸퐶퐴푌 [W]
푊푂ꢅ = ꢆ푂ꢅ퐻 + ꢆ푂ꢅ퐿 × 퐼푂푈푇2 × ꢇ × 표푛_푑푢푡푦 [W]
(
)
2
(
)
(
)
푊퐷퐸퐶퐴푌 = ꢇ × ꢆ푂ꢅ퐿 × 퐼푂푈푇 × ꢇ × 1 − 표푛_푑푢푡푦 [W]
where:
WDMOS is the consumed power of the output DMOS.
WON is the consumed power during output ON.
WDECAY is the consumed power during current decay.
RONH is the upper P-channel DMOS ON-resistance.
RONL is the lower N-channel DMOS ON-resistance.
IOUT is the motor output current value.
on_duty PWM on duty=푡_ꢈ푁 ⁄ 푡_ꢉꢊꢈ푃
“ ꢇ ” is the H bridge A and B.
tON varies depending on the L and R values of the motor coil and the current set value. Confirm by actual measurement,
or make an approximate calculation.
tCHOP is the chopping period, which is determined by the internal timer. Refer to P.8, 9 for details.
Upper Pch DMOS ON Resistance
Lower Nch DMOS ON Resistance
IC number
RONH[Ω] (Typ)
RONL[Ω] (Typ)
BD68888MUV
0.70
0.30
푊_푡표푡푎푙 = 푊푉퐵퐵 + 푊퐷푀푂ꢄ [W]
ꢋ푗 = ꢋ푎 + 휃푗푎 × 푊_푡표푡푎푙 [°C]
where:
W_total is the consumed total power of IC.
Tj is the junction temperature.
Ta is the air temperature.
θja is the thermal resistance value.
However, the thermal resistance value θja [°C/W] differs greatly depending on circuit board conditions. The calculated
values above are only theoretical. For actual thermal design, perform sufficient thermal evaluation for the application
board used, and create the thermal design with enough margin not to exceed Tjmax = 150 °C. Although unnecessary
with normal use, if the IC is to be used under especially strict heat conditions, consider externally attaching a Schottky
diode between the motor output pin and GND to abate heat from the IC.
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Power Dissipation – continued
2
Temperature Monitoring
In respect of BD68888MUV, there is a way to directly measure the approximate chip temperature by using the LOGIC
pin (I0x(Note 1 or I1x(Note 1)) with a protection diode for prevention from electrostatic discharge. However, temperature
monitor using this LOGIC pin is only for evaluation and experimenting, and must not be used in actual usage
conditions.
(Note 1) x = 1, 2, 3 or 4
Process 1 Measure the pin voltage when a current of IDIODE = 50 μA flows from the LOGIC pin to the GND, without
supplying VBB1 and VBB2 to the IC. This measurement is of the VF voltage inside the diode.
Process 2 Measure the temperature characteristics of this pin voltage. (VF has a linear negative temperature factor
against the temperature.) With the results of these temperature characteristics, chip temperature may be
calibrated from the LOGIC pin voltage.
Process 3 Supply VBB1 and VBB2, confirm the LOGIC pin voltage while running the motor, and calculate
approximately the chip temperature from the results of Process 2.
-VF[mV]
LOGIC pin
Internal Circuit
IDIODE
VF
25
150
Chip Temperature Tj[°C]
Figure 3. Model Diagram for Measuring Chip Temperature
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BD68888MUV
Application Example
Logic input pin
See P.5 PHASEx for detail.
Bypass capacitor.
Setting range is
Regulator
PHASE1
PHASE2
I01
100 μF to 470 μF (electrolytic)
0.01 μF to 0.1 μF (multilayer
ceramic etc.)
Refer to P.5 VBB1,VBB2 for detail.
Be sure to short VBB1 & VBB2.
RESET
UVLO
OVLO
TSD
Interface
I11
I02
I12
OCP
VREF1
VREF2
2bit DAC
VBB1
SENSE1
OUT1A
0.1 µF
100 µF
2bit DAC
SENSE2
OUT1B
SENSE1
Set the output current.
Input by resistor divider.
Refer to P.6 VREFx for detail.
Blank time
PWM control
Control
logic
Pre-
driver
VBB1
OSC
OUT2A
OUT2B
SENSE2
PS
Interface
VREF3
2bit DAC
VBB2
SENSE3
VREF4
2bit DAC
OUT3A
SENSE4
OUT3B
SENSE3
Blank time
PWM control
Control
logic
Pre-
driver
VBB2
OSC
OUT4A
Logic input pin
See P.5 PHASEx for detail.
OUT4B
SENSE4
Resistor for current
detection
Setting range is
0.1 Ω to 0.3 Ω.
Refer to P.6 SENSEx
for detail.
PHASE3
PHASE4
I03
Interface
I13
I04
I14
GND
GND
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BD68888MUV
I/O Equivalence Circuit
PHASEx(Note 1)
PS
Internal
Circuit
I0x(Note 1)
I1x(Note 1)
10 kΩ
VREFx(Note 1)
SENSEx(Note 1)
215 kΩ
5 kΩ
5 kΩ
100 kΩ
VBB1, VBB2
OUTxA(Note 1)
OUTxB(Note 1)
SENSEx
Internal
Circuit
5 kΩ
(Note 1) x = 1, 2, 3 or 4
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BD68888MUV
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 4. Example of monolithic IC structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD68888MUV
Ordering Information
M U V
B D 6 8 8 8 8
-
E 2
Package
MUV:VQFN036V6060
Packing and Forming specification
E2 : Embossed tape and reel
Part Number
Marking Diagram
VQFN036V6060 (TOP VIEW)
Part Number Marking
BD68888
LOT Number
Pin 1 Mark
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BD68888MUV
Physical Dimension and Packing Information
Package Name
VQFN036V6060
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BD68888MUV
Revision History
Date
Revision
001
Changes
14.Sep.2020
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
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Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
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Other Precaution
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3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
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4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
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