BD6524HFV-TR [ROHM]
Power Supply Support Circuit, Fixed, 1 Channel, PDSO6, HVSOF-6;
| 型号： | BD6524HFV-TR |
| 厂家： | 
ROHM |
| 描述： | Power Supply Support Circuit, Fixed, 1 Channel, PDSO6, HVSOF-6 开关 |
| 文件： | 总10页 (文件大小：324K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PowerManagementSwitchICSeriesforPCs andDigitalConsumerProduct
1ch Small Current Output
Power Managment Switch IC
BD6524HFV
No.09029EAT13
Description
Power switch for memory card Slot (BD6524HFV) is a high side switch IC having one circuit of N-channel Power MOS FET.
The switch realizes 200mΩ (Typ.) ON resistance. Operations from low input voltage (VIN ≥ 3.0V) can be made for use for
various switch applications.
The switch turns on slowly by the built-in charge pump, therefore, it is possible to reduce inrush current at switch on. There is
no parasitic diode between the drain and the source, reverse current flow at switch off is prevented. Further, it has a
discharge circuit that discharges electric charge from capacitive load at switch off.
The BD6524HFV is available in a space-saving HVSOF6 package.
Features
1) Low on resistance (200mΩ, Typ.) N-MOS switch built in
2) Maximum output current : 500mA
3) Soft start circuit
4) Under voltage lockout (UVLO) circuit
5) Discharge circuit built in : operations at switch off, UVLO
6) Reverse current flow blocking at switch off
Applications
Memory card slots of notebook PC, digital still camera, portable music player, compact portable devices such as PDA and so forth
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply Voltage
VIN
VEN
VOUT
TSTG
Pd
-0.3 to 6.0
-0.3 to VIN + 0.3
-0.3 to 6.0
-55 to 150
510 *1
V
V
Control input voltage
Switch output voltage
Storage temperature
Power dissipation
V
℃
mW
*1
*
*
Derating : 4.08mW/℃ for operation above Ta = 25℃.
This product is not designed for protection against radioactive rays.
Operation is not guaranteed.
Operation conditions
Parameter
Symbol
Limit
Unit
Supply voltage
VIN
TOPR
IOUT
3.0 to 5.5
-25 to 75
500
V
Operating Temperature
Switch current
℃
mA
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Technical Note
BD6524HFV
Electrical characteristics
Unless otherwise specified, Ta = 25℃, VIN = 5V,
Limit
Typ.
50
Parameter
Symbol
Unit
Condition
VEN = 5V, VOUT = Open
Min.
Max.
75
Operating current
Standby current
IDD
-
-
µA
µA
ISTB
0.1
1
VEN = 0V, VOUT = Open
VENH
VENL
IEN
-
-
-
2.5
-
V
V
High level input voltage
Low level input voltage
EN input voltage
0.7
-1
EN input leak current
0.01
1
µA
-
-
-
200
250
-
255
335
10
mΩ
mΩ
µA
VIN = 5V
Switch on resistance
Switch leak current
RON
VIN = 3.3V
At switch OFF
ILEAK
Switch rise time
TON1
TON2
-
-
-
-
0.4
0.5
1
0.8
1.0
2
ms
ms
us
RL=10Ω. Refer to the timing diagram in Fig. 2.
RL=10Ω. Refer to the timing diagram in Fig. 2.
RL=10Ω. Refer to the timing diagram in Fig. 2.
RL=10Ω. Refer to the timing diagram in Fig. 2.
Switch rise delay time
Switch fall time
TOFF1
TOFF2
Switch fall delay time
2
4
us
1.9
1.8
2.2
2.1
2.5
2.4
V
V
VIN increasing
VIN decreasing
UVLO threshold voltage
VUVLO
Discharge resistance
Discharge current
RDISC
IDISC
-
200
1.8
350
-
Ω
VEN = 0V, IL = 1mA
0.8
mA
VEN = 0V,VIN = VOUT = 1.8V
Measurement circuit
VIN
VIN
EN
VOUT
VOUT
GND
CL
RL
Fig.1 Measurement circuit
Timing diagram
OFF1
T
ON1
T
VOUT
90%
90%
10%
10%
ON2
T
OFF2
T
VEN
50%
50%
Fig.2 Timing diagram
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Technical Note
BD6524HFV
Typical characteristics
2.5
2.0
1.5
1.0
0.5
0.0
0.10
0.08
0.06
0.04
0.02
0.00
50
45
40
35
30
25
20
15
10
From above: VIN=5.5V,5.0V,3.0V
From above :VIN=3.0V,5.0V,5.5V
5
0
-25
0
25
AMBIENT TEMPETRATURE:Ta[ ]
℃
50
75
-25
0
25
50
75
-25
0
25
50
75
AMBIENT TEMPERATURE:Ta[
]
℃
AMBIENT TEMPERATURE:Ta[
]
℃
Fig.4 Standby current
Fig.5 EN threshold voltage
Fig.3 Operating current
(High level input voltage)
350
300
250
200
150
100
50
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
2.5
2.0
1.5
1.0
0.5
0.0
From above: VIN=3.0V,5.0V,5.5V
From above: VIN=5.5V,5.0V,3.0V
From above: VIN=3.0V,4.0V,5.0V,5.5V
0
-25
0
25
50
75
-25
0
25
50
75
-25
0
25
50
75
AMBIENT TEMPERATURE:Ta[
]
℃
AMBIENT TEMPERATURE:Ta[
]
℃
AMBIENT TEMPERATURE:Ta[
]
℃
Fig.6 EN threshold voltage
(Low level input voltage)
Fig.7 Switch on resistance
Fig.8 Switch rise time
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
From above: VIN=3.0V,4.0V,5.0V,5.5V
From above: VIN=3.0V,5.0V,5.5V
From above: VIN=3.0V,4.0V,5.0V,5.5V
-25
0
25
50
75
-25
0
25
50
75
-25
0
25
50
75
AMBIENT TEMPERATURE:Ta[
]
℃
AMBIENT TEMPERATURE:Ta[
]
℃
AMBIENT TEMPERATURE:Ta[
]
℃
Fig.9 Switch rise delay time
Fig.10 Switch fall time
Fig.11 Switch fall delay time
250
3.0
2.5
2.0
1.5
1.0
0.5
0.0
200
150
100
50
VIN increasing
VIN decreasing
From above: VIN=3.0V,4.0V,5.0V,5.5V
0
-25
0
25
50
75
-25
0
25
50
75
AMBIENT TEMPERATURE:Ta[
]
℃
AMBIENT TEMPERATURE:Ta[
]
℃
Fig.12 UVLO threshold voltage
Fig.13 Discharge resistance
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Technical Note
BD6524HFV
50
45
40
35
30
25
20
15
10
5
2.5
2.0
1.5
1.0
0.5
0.0
350
300
250
200
150
100
50
VENH
VENL
0
0
3.0
3.5
4.0
4.5
5.0
5.5
3
3.5
4
4.5
5
5.5
3.0
3.5
4.0
4.5
5.0
5.5
INPUT VOLTAGE:VIN[V]
INPUT VOLTAGE:VIN[V]
INPUT VOLTAGE:VIN[V]
Fig.14 Operating current
Fig.15 EN threshold voltage
Fig.16 Switch on resistance
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
250
200
150
100
50
TOFF2
TON2
TON1
TOFF1
0
3
3.5
4
4.5
5
5.5
3
4
5
5.5
3
4
5
5.5
INPUT VOLTAGE:VIN[V]
INPUT VOLTAGE:VIN[V]
INPUT VOLTAGE:VIN[V]
Fig.17 Switch rise time
Fig.18 Switch fall time
Fig.19 Discharge resistance
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Technical Note
BD6524HFV
Waveform data
RL=10Ω, CL=10uF
RL=10Ω, CL=10uF
RL=10Ω, CL=10uF
VIN = 5V
VIN = 3V
VIN = 5V
0.74ms
1.05ms
0.42ms
Time (200us/div)
Time (500us/div)
Time (200us/div)
Fig.22 Switch rise time
Fig.21 Switch fall time
Fig.20 Switch rise time
RL=10Ω, CL=10uF
VIN = 3V
VIN = 5V
CL = 10uF
VIN = 3V
CL = 4.7uF
CL = 10uF
CL = 4.7uF
CL = 1uF
1.10ms
CL = 1uF
Time (500us/div)
Time (100us/div)
Time (100us/div)
Fig.23 Switch fall time
Fig.24 Inrush current
Fig.25 Inrush current
50ms
5ms
Time (20ms/div)
Time (20ms/div)
Fig.26 UVLO
CL = 10uF
Fig.27 UVLO
CL = 1uF
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Technical Note
BD6524HFV
Block diagram
VIN
1,2
GND
4
charge
pump
VIN 1
VOUT
VOUT
GND
6
5
4
VIN
EN
2
3
VOUT
5,6
control
logic
EN
3
Fig.28 Pin configuration
Fig.29 Block diagram
Pin description
Pin No.
Symbol
VIN
Pin Function
1
2
Switch input pin.
At use, connect each pin outside.
Switch control input pin (hysteresis input)
Switch ON at High.
3
4
EN
GND
VOUT
Ground
5
6
Switch output pin
At use, connect each pin outside.
I/O circuit
VIN
VIN
EN
VOUT
Fig.30 I/O circuit
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Technical Note
BD6524HFV
Functional description
1. Input / output
VIN pin and VOUT pin are connected to the drain and the source of N-MOS switch respectively. And the VIN pin is used
also as power source input to internal control circuit.
When EN input is set to High level and the switch is turned on, VIN pin and VOUT pin are connected by a 200mΩ switch.
In a normal condition, current flows from VIN to VOUT. If voltage of VOUT is higher than VIN, current flows from VOUT to
VIN, since the switch is bidirectional. There is not a parasitic diode between the drain and the source, it is possible to
prevent current from flowing reversely from VOUT pin to VIN pin when the switch is disabled.
2. Discharge circuit
When the switch between the VIN and the VOUT is OFF, the 200Ω(Typ.) discharge switch between VOUT and GND turns
on. By turning on this switch, electric charge at capacitive load is discharged.
3. Under voltage lockout (UVLO)
The UVLO circuit monitors the voltage of the VIN pin, when the EN input is active. UVLO circuit prevents the switch from
turning on until the VIN exceeds 2.2V(Typ.). If the VIN drops below 2.1V(Typ.) while the switch turns on, then UVLO shuts
off the switch.
While the switch between the VIN pin and VOUT pin is OFF owing to UVLO operations, the switch of the discharge circuit
turns on. However, when the voltage of VIN declines extremely, then the VOUT pin becomes Hi-Z.
2.1V(Typ.)
2.2V(Typ.)
VIN
VEN
VOUT
Discharge circuit
ON
OFF
ON
OFF
ON
OFF
Fig.31 Operation timing
Typical application circuit
VIN
VIN
EN
VOUT
VOUT
GND
LOAD
0.1～1uF
EN
Fig.32 Typical application circuit
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Technical Note
BD6524HFV
Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown
due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply
terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to
be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the
constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
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Technical Note
BD6524HFV
Ordering part number
B
D
6
5
2
4
H
F
V
- T
R
Part No.
Part No.
6524
Package
HFV: HVSOF6
Packaging and forming specification
TR: Embossed tape and reel
(HVSOF6)
HVSOF6
<Tape and Reel information>
1.6 0.1
(MAX 1.8 include BURR)
Tape
Embossed carrier tape
3000pcs
Quantity
6
5 4
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
(1.2)
(1.4)
1pin
1
2 3
0.145 0.05
S
0.1
S
0.22 0.05
0.5
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
Reel
(Unit : mm)
∗
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Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
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shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
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