BD63888MUV_技术文档

Datasheet

36V

2ch Stepping Motor Driver

BD63888MUV

General Description

Key Specifications

BD63888MUV is a bipolar low-consumption driver that

driven by PWM constant current. Rated power supply

voltage of the device is 36 V, and rated output current is

1.2 A. CLK-IN drive mode is adopted for input interface,

and excitation mode is corresponding to FULL STEP

mode, HALF STEP mode (2 types) and QUARTER

STEP mode via a built-in DAC. The power supply can be

driven by one single system, which simplifies the design.

■

Range of Power Supply Voltage

Rated Output Current

Range of Operating Temperature -25 °C to +85 °C

8 V to 28 V

1.2 A

Output ON Resistance

1.0 Ω (Typ)

(total of upper and lower resistors)

Package

VQFN036V6060

W(Typ) x D(Typ)x H(Max)

6.0 mm x 6.0 mm x 1.0 mm

Features

■

Two bipolar stepping motors can be driven

Rated Output Current 1.2 A

Low ON Resistance DMOS Output

CLK-IN Drive Mode Correspondence

PWM Constant Current Control (the other excitation

method)

■

Built-in Spike Noise Blanking Function (external noise

filter is unnecessary)

■

Full-, Half (two kinds)-, Quarter-step Functionality

Free Timing Excitation Mode Switch

Decay Mode Switch Function

Normal Rotation and Reverse Rotation Switching

Function

Typical Application Circuit

OUT1A

■

Power Save Function

Built-in Logic Input Pull-down Resistor

Power-on Reset Function

Thermal Shutdown Circuit (TSD)

Over-current Protection Circuit (OCP)

Under Voltage Lockout Circuit (UVLO)

Over Voltage Lockout Circuit (OVLO)

Ghost Supply Prevention (protects against

malfunction when power supply is disconnected)

CLK1

OUT1B

TEST1

SENSE1

CW_CCW1

MODE01

VBB1

MODE11

ENABLE1

VREF1

OUT2A

OUT2B

SENSE2

OUT3A

TESTPS1

TESTPS2

Application

Monitoring

■

Camera,

WEB

Camera,

PPC,

OUT3B

Multi-function Printer, Laser Beam Printer, Ink-jet

Printer, Sewing Machine, Photo Printer, FAX,

Scanner, Mini Printer, Toy and Robot

SENSE3

CLK2

TEST2

VBB2

CW_CCW2

MODE02

MODE12

ENABLE2

OUT4A

OUT4B

VREF2

SENSE4

PS

GND

Figure 1. BD63888MUV Application Circuit Diagram

○Product structure : Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays

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Pin Configuration

Block Diagram

[TOP VIEW]

PS 11

CLK1 18

CW_CCW1 34

MODE01 29

MODE11 35

ENABLE1 28

TEST1 17

Regulator

RESET

UVLO

OVLO

TSD

Interface

OCP

VREF1 13

2bit DAC

12

TESTPS1

5

VBB1

27 26 25 24 23 22 21 20 19

SENSE1

2

4

OUT1A

OUT1B

SENSE2

ENABLE1

MODE01

28

29

30

18

Blank time

PWM control

3

SENSE1

CLK1

Control

logic

Pre-

driver

17 TEST1

5

VBB1

OSC

GND

16

15

14

13

12

11

10

8

6

OUT2A

OUT2B

N.C. 31

DEC1

VREF2

Mix decay

control

DEC1 32

7

SENSE2

32

DEC2 33

TESTPS2

VREF2 15

2bit DAC

VREF1

TESTPS2 14

23

VBB2

SENSE3

EXP-PAD

CW_CCW1

TESTPS1

34

35

36

26

24

OUT3A

OUT3B

SENSE4

MODE11

PS

Blank time

PWM control

25 SENSE3

CW_CCW2

CLK2

Control

logic

Pre-

driver

23 VBB2

OSC

1

2

3

4

5

6

7

8

9

20 OUT4A

22 OUT4B

Mix decay

control

33

DEC2

21

SENSE4

CLK2 10

CW_CCW2 36

MODE02 27

Interface

MODE12

ENABLE2

TEST2

1

19

16

GND

Figure 2. Pins Configuration Diagram

30

GND

9

Figure 3. BD63888MUV Block Diagram

Pin Description

No.

Pin Name

No.

Function

Pin Name

Function

1

2

MODE12

OUT1A

SENSE1

OUT1B

VBB1

2ch motor excitation mode setting pin

H bridge output pin

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

-

ENABLE2

OUT4A

SENSE4

OUT4B

VBB2

2ch pin for enabling output

H bridge output pin

Connection pin of resistor for output

current detection

Connection pin of resistor for output

current detection

3

4

H bridge output pin

Power supply pin

H bridge output pin

Power supply pin

H bridge output pin

5

6

OUT2B

SENSE2

OUT2A

TEST2

CLK2

OUT3B

SENSE3

OUT3A

MODE02

ENABLE1

MODE01

GND

Connection pin of resistor for output

current detection

Connection pin of resistor for output

current detection

7

8

H bridge output pin

Pin for testing

(Use it connecting with GND)

9

2ch motor excitation mode setting pin

1ch pin for enabling output

1ch motor excitation mode setting pin

Ground pin

10

11

12

13

14

15

16

17

18

-

2ch advancement clock input pin

PS

Power save pin

Pin for testing

(Use it connecting with the PS pin)

TESTPS1

VREF1

TESTPS2

VREF2

GND

Output current value setting pin

N.C.

No connection

Pin for testing

(Use it connecting with the PS pin)

DEC1

1ch current decay mode setting pin

2ch current decay mode setting pin

Output current value setting pin

DEC2

Ground pin

CW_CCW1 1ch motor rotating direction setting pin

MODE11 1ch motor excitation mode setting pin

CW_CCW2 2ch motor rotating direction setting pin

Pin for testing

(Use it connecting with GND)

TEST1

CLK1

1ch advancement clock input pin

The EXP-PAD of the center of product

connect to GND.

EXP-PAD

-

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Absolute Maximum Ratings (Ta=25 °C)

Item

Symbol

Rated Value

Unit

Supply Voltage

VBB1, VBB2

V_IN

-0.2 to +36.0

-0.2 to +5.5

0.7

V

Input Voltage for Control Pin

SENSE Maximum Voltage

Output Current

V

V_SENSE

I_OUT

1.2^{(Note 1)}

-55 to +150

+150

A/Phase

°C

Storage Temperature Range

Tstg

Maximum Junction Temperature

Tjmax

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) Do not exceed Tjmax=150 °C.

Recommended Operating Conditions

Item

Symbol

Min

-25

+8

-

Typ

+25

+24

-

Max

+85

+28

+1.0

Unit

°C

Operating Temperature

Supply Voltage

Topr

VBB1, VBB2

I_OUT

V

Maximum Output

Current (DC)

A/Phase

(Note 2) Do not exceed Tjmax=150 °C.

Thermal Resistance^{(Note 3)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 5)}

2s2p^{(Note 6)}

VQFN036V6060

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 4)}

θ_JA

103.9

4

24.5

2

°C/W

Ψ_JT

(Note 3) Based on JESD51-2A (Still-Air).

(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 5) Using a PCB board based on JESD51-3.

(Note 6) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

Board Size

Single

FR-4

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70μm

Footprints and Traces

Thermal Via^{(Note 7)}

Layer Number of

Measurement Board

Material

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

FR-4

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Copper Pattern

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

(Note 7) This thermal via connects with the copper pattern of all layers.

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Electrical Characteristics (Unless otherwise specified Ta=25 °C, VBB1, VBB2=24 V)

Limit

Item

Symbol

Unit

Condition

Min

Typ

Max

[Whole]

Circuit Current at Standby

Circuit Current

I_CCST

I_CC

-

0

10

µA

PS=L

5.0

8.0

mA

PS=H, VREFx^{(Note 8)}=1.5 V

[Control Input]

H-level Input Voltage

L-level Input Voltage

H-level Input Current

L-level Input Current

V_INH1

V_INL1

I_INH1

I_INL1

2.0

-

V

0.8

100

-

35

-10

50

0

µA

V_IN=5 V

V_IN=0 V

[Control Input] (TESTPS1, TESTPS2)

H-level Input Voltage

L-level Input Voltage

L-level Input Current

[Output]

V_INH

I_INH

I_INL

2.8

-

0

-

10

-

V

µA

V_IN=5 V

V_IN=0 V

-2.0

-0.1

I_OUT=±1.0 A (total of upper and

lower resistors)

Output ON Resistance

R_ON

-

1.0

1.4

10

Ω

Output Leak Current

[Current Control]

I_LEAK

-

µA

SENSEx^{(Note 9)}Input Current

VREFx Input Current

I_SENSE

I_VREF

-80

-2.0

0

-40

-0.1

-

µA

V

SENSEx=0 V

VREFx=0 V

VREFx Input Voltage Range

V_VREF

1.5

Minimum ON Time

(Blank Time)

t_ONMIN

V_CTH

0.3

1.0

1.5

µs

V

Comparator Threshold

0.48

0.50

0.52

VREFx=1.5 V

(Note 8) x=1 or 2

(Note 9) x=1,2,3 or 4

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Function Explanation

CLKx^{(Note 10)}/Clock input Pin for advancing the electrical angle

CLKx is working on rising edge. The Electrical angle advances by one for each CLK input.

Motor’s misstep will occur if noise gets mixed with the CLKx pin, so design the pattern there is no noise plunging.

(Note 10) x=1 or 2

MODE0x^{(Note 11)}, MODE1x^{(Note 12)}/Motor Excitation Mode Setting Pin

Set the motor excitation mode

MODE0x

MODE1x

Excitation Mode

L

H

L

FULL STEP

HALF STEP A

HALF STEP B

QUARTER STEP

H

(Note 11) x=1 or 2

(Note 12) x=1 or 2

Refer to the P.12, 13 for the timing chart and motor torque vector of various excitation modes.

Unrelated to CLK, change of setting is forcibly reflected. (refer to P.15).

CW_CCWx^{(Note 13)}/Motor Rotating Direction Setting Pin

Set the motor’s rotating direction. Change of setting is reflected by the CLK rising edge immediately after that. (refer to P.14)

CW_CCWx

Rotating Direction

L

Clockwise (CH2’s current is outputted with a phase lag of 90°on the basis of CH1’s current)

Counter Clockwise(CH2’s current is outputted with a phase lead of 90°on the basis of CH1’s current)

H

(Note 13) x=1 or 2

ENABLEx^{(Note 14)}/Output Enable Pin

Turn off forcibly all the output transistors (motor output is open).

When ENABLE=L, input to CLK is blocked, and phase advance operation of internal translator circuit is stopped.

However, when the excitation mode (MODE 0X, MODE 1X) is switched in the ENABLE=L period, the switched mode is valid

as the excitation mode when the ENABLE Pin returns from Low to High. (refer to P.15)

ENABLEx

Motor Output

OPEN (electrical angle maintained)

ACTIVE

L

H

(Note 14) x=1 or 2

PS /Power Save Pin

The PS pin can make circuit standby state and motor output OPEN. In standby state, translator circuit is reset (initialized)

and electrical angle is initialized.

Be careful because there is a delay of 40 µs (Max), as PS=L→H, until it is returned from standby state to normal state and

the motor output becomes ACTIVE (refer to P.11).

PS

Status

Standby State(RESET)

ACTIVE

L

H

The electrical angle (initial electrical angle) of each excitation mode immediately after RESET is as follows.

(refer to P.12, 13)

Excitation Mode

Initial Electrical Angle

FULL STEP

45°

HALFSTEP A

HALFSTEP B

QUARTER STEP

DECx^{(Note 15)}/Current Decay Mode-setting Pin

This is the Pin to set the current decay mode.

DECx

L

Decay mode

SLOW DECAY

MIX DECAY

H

(Note 15) x=1 or 2

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Function Explanation – continued

VBB1, VBB2/Power Supply Pin

The wire is thick, short and has low impedance, because Motor’s drive current is flowing in it. The VBB1 pin and the VBB2

pin voltage may have great fluctuation, so arrange the bypass capacitor of about 100 µF to 470 µF as close to the pin as

possible and adjust the VBB1 pin and the VBB2 pin voltage are stable. Increase the capacity as needed especially, when a

large current is used or those motors that have great back electromotive force are used.

In addition, for the purpose of reducing of power supply’s impedance in wideband, it is recommended to set parallel

connection of multi-layered ceramic capacitor of 0.01µF to 0.1µF etc. Extreme care must be used to make sure that the

VBB1 pin and the VBB2 pin voltage does not exceed the rating even for a moment. The VBB1 pin and the VBB2 pin are

shorted inside the IC, but be sure to short externally the VBB1 pin and the VBB2 pin when using. If used without shorting,

malfunction or destruction may occur because of concentration of current routes etc. Still more, in the power supply pin,

there is built-in clamp component for preventing of electrostatic destruction. When a steep pulse signal or voltage such as a

surge exceeding the absolute maximum rating is applied, this clamp component operates, and the IC might be destroyed as

a result. Be sure that the maximum absolute rating must not be exceeded. It is effective to mount a Zener diode of about the

maximum absolute rating. Moreover, the diode for preventing electrostatic destruction is inserted between the VBB1 pin, the

VBB2 pin and the GND pin. Be careful about the reverse voltage because the IC might be destroyed as a result if reverse

voltage is applied to the VBB1 pin, the VBB2 pin and the GND pin

GND/Ground Pin

In order to reduce the electric noise by switching current and to stabilize the internal reference voltage of the IC, make the

wiring impedance from this pin as low as possible to achieve the lowest electrical potential no matter what operating state it

can be. Moreover, design the patterns not to have any common impedance with other GND patterns.

OUTxA^(Note16), OUTxB^{(Note 17)}/H Bridge Output Pin

Motor’s drive current is flowing in it, so the wire is thick, short and has low impedance. It is also effective to add a Schottky

diode if output has positive or negative great fluctuation when large current is used. For example, counter electromotive

voltage etc. Moreover, in the output Pin, there is built-in clamp component for preventing of electrostatic destruction. When a

steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied, this clamp component

operates, and the IC might be destroyed in the end. Be be sure that the maximum absolute rating must not exceeded.

(Note 16) x=1, 2, 3 or 4

(Note 17) x=1, 2, 3 or 4

SENSEx^{(Note 18)}/Connection Pin of Resistor for Detecting of Output Current

Connect the resistor of 0.1Ω to 0.3Ω for current detection between this pin and GND. Determine the resistor so that power

consumption W=I_OUT²•R [W] of the current-detecting resistor does not exceed the maximum absolute rating of the resistor. In

addition, it has a low impedance and does not have a common impedance with other GND patterns because motor’s drive

current flows in the pattern through the SENSEx pin to current-detecting resistor to GND. Do not exceed the rating because

there is the possibility of circuits’ malfunction etc., if the SENSE pin voltage exceeds the maximum rating (0.7 V). Moreover,

be careful because if the SENSEx pin is shorted to GND, large current flows without normal PWM constant current control,

and OCP or TSD might operate. If there is a possibility of malfunction, such as output does not flow even when the SENSEx

pin is open, please do not to such a state.

(Note 18) x=1, 2, 3 or 4

VREFx^{(Note 19)}/Output Current Value Setting Pin

This is the pin to set the output current value. It can be set by the VREF pin voltage and current-detecting resistor (SENSE

resistor).

(Note 19) x=1 or 2

퐼_푂푈푇

=

^푉푅퐸퐹/ 푆ꢀ푁푆ꢀ

[A]

3

Where:

I_OUTis the output current.

VREF is the voltage of output current value-setting pin.

SENSE is the current-detecting resistor.

Avoid using the IC with the VREFx pin is open because if it is open, it may have malfunctions such as flowing a large current

by unstable input, the increased the VREFx pin voltage and increased setting current. The input voltage range must be kept

because a large current might flow to output and OCP or TSD might operate if the voltage of over 1.5 V is applied on the

VREFx pin. Besides, select the resistance value in consideration of the outflow current (Max 2 µA) if it is inputted by

resistance division. The minimum current, which can be controlled by the VREFx pin voltage, is determined by motor coil’s L,

R values and minimum ON time because there is a minimum ON time in PWM drive.

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Function Explanation – continued

TESTx^{(Note 20)}/Pin for Inspection

This pin is used for delivery inspection of the IC, and shall be connected to GND before use.

In addition, malfunctions can be caused by application without grounding.

(Note 20) x=1 or 2

TESTPSx^{Note 21)}Pin/Pin for Inspection

This pin is used for delivery inspection of the IC, and shall be connected to power supplies less than 5.5 V before use.

In addition, malfunctions can be caused by application without pull-up.

(Note 21) x=1 or 2

NC Pin

This pin is unconnected electrically with the IC internal circuit.

EXP-PAD

For VQFN036V6060 package, the heat-radiating metal is mounted on the IC’s backside. It is the precondition that making

the heat-radiating treatment when in use. Therefore, it must be connected by solder with the GND plane on the board and

ensure the sufficient heat-radiation area by taking the GND pattern as wide as possible. Moreover, the backside metal is

shorted with IC chip’s backside and becomes the GND potential, so there is the danger of malfunction and destruction if

shorted with potentials other than GND. Never design any wiring patterns other than GND through the IC's backside.

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Protection Circuits

Thermal Shutdown (TSD)

This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises to 175 °C (Typ)

or more, the motor output becomes OPEN. Also, when the temperature returns to 150 °C (Typ) or less, it automatically

returns to normal operation. However, if heat is continued to be added externally even while TSD is in operation, heat

overdrive can lead to destruction.

Over Current Protection (OCP)

This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted

each other or VBB1, VBB2-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN

condition when the regulated current flows for 4 µs (Typ). It returns with power reactivation by a reset of the PS pin. The

over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor

output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to

take into account this circuit’s functions. After OCP operating, if irregular situations continue and the return by power

reactivation or a reset of the PS pin is carried out repeatedly, then OCP operates repeatedly and the IC may generate heat

or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long of faults, ground faults and

shorting, there is a possibility of destruction after the over current has flowed and the output pin voltage jumps up and the

absolute maximum values can be exceeded. Also, when current which is the output current rating or more and the OCP

detection current or less flows, the IC can heat up to over Tjmax=150 °C and can deteriorate, so current which exceeds

the output rating should not be applied.

Under Voltage Lockout (UVLO)

This IC has a built-in under voltage lockout function to prevent false operation such as IC output during power supply

under voltage. When the applied voltage to the VBB1 pin and the VBB2 pin goes 5 V (Typ) or less, the motor output is set

to OPEN. This switching voltage has a 1 V (Typ) hysteresis to prevent malfunction such as noise etc. Be aware that this

circuit does not operate during power save mode. Also, the electrical angle is reset when the UVLO circuit operates.

Over Voltage Lockout (OVLO)

This IC has a built-in over voltage lockout function to protect the IC output and the motor during power supply over voltage.

When the applied voltage to the VBB1 pin and the VBB2 pin goes 32 V (Typ) or more, the motor output is set to OPEN.

This switching voltage has a 1 V (Typ) hysteresis and a 4 µs (Typ) mask time to prevent malfunction such as noise etc.

Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value

for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Be aware that this

circuit does not operate during power save mode.

Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

If a control signal (logic input, VREFx^{(Note 22)}) is input when there is no power supplied to this IC, there is a function which

prevents a malfunction where voltage is supplied to power supply of this IC or other IC in the set via the electrostatic

destruction prevention diode from these input pins to the VBB1 pin and VBB2 pin. Therefore, there is no malfunction of the

circuit even when voltage is supplied to these input pins while there is no power supply.

(Note 22) x=1 or 2

Operation Under Strong Electromagnetic Field

The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction is

found when using the IC in a strong electromagnetic field.

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PWM Constant Current Control

1) Current control operation

The output current increases due to the output transistor turned on. When the voltage on the SENSEx^{(Note 23)}pin, the output

current is converted voltage due to connect the external resistance to the SENSE_Xpin, reaches the voltage value set by the

internal 2-bit DAC and the VREFx^{(Note 24)}input voltage, the current limit comparator engages and enters current decay mode.

Thereafter the output turned on again after a period of time determined the internal timer. The process repeats itself

constantly.

(Note 23) x=1, 2, 3 or 4

(Note 24) x=1 or 2

2) Noise-masking function

In order to avoid misdetection of current detection comparator due to SENSEx spikes noise that may occur when the output

turns on, the IC employs the minimum ON-time (tONMIN). It invalids the current detection for the minimum ON-time of 1 µs

(Typ) from the output transistor turned on. This allows constant-current drive without the need for an external filter.

3) Internal Timer

IC internal voltage repeat charging and discharging between VL to VH.

The detection of the internal comparator is masked while charging from VL to VH in order to cancel noise. This period

defines the minimum ON-time (t_ONMIN) of the motor output transistor. The internal voltage begins discharging once the

voltage reaches VH. When the output current reaches the current limit during this period, then the IC enters decay mode. It

reaches VL, at which point the IC internal voltage is switched back ON. The current output and internal terminal begin

charging simultaneously.

Spike Noise

Current Limit Value

Output Current

0 mA

Current Limit Value

SENSE Voltage

GND

VH

IC Internal Voltage

VL

GND

Chopping Period

t_CHOP

Minimum ON Time

t_ONMIN

Figure 4. Timing Chart of IC Internal Voltage, the SENSE pin voltage and Output Current

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PWM Constant Current Control – continued

Current Decay Mode

PWM Constant Current Control can be optionally set the current decay mode in which the ratio of MIX DECAY and SLOW

DECAY.

The following diagrams show the state of each transistor and the regenerative current path during the current decay for each

decay mode:

SLOW DECAY

FAST DECAY

OFF

ON

OFF

ON

OFF

ON

M

OFF

ON

OFF

ON

When Output ON

When Current Decay

Figure 5. Route of Regenerated Current during Current Decay

The merits of each decay mode are as follows:

SLOW DECAY

The voltage of motor coils is small and the regenerative current decreases slowly. So the output current ripple is small and

this is favorable for motor torque. However, output vibration increase without following the change in the current limit value

according to increase in output current due to deterioration of current controllability in the low-current region and it is easily

influenced by EMF when high-pulse-rate in HALF STEP or QUARTER STEP modes. Thus, this decay mode is most suited

to FULL STEP modes or low-pulse-rate as HALF STEP or QUARTER STEP modes.

FAST DECAY

FAST DECAY decreases the regeneration current much more quickly than slow decay, greatly reducing distortion of the

output current waveform. However, FAST DECAY yields a much larger output current ripple, which decreases the overall

average current running through the motor. This causes two problems: first, the motor torque decreases (increasing the

current limit value can help eliminate this problem, but the rated output current must be taken into consideration); and

second, the power loss within the motor increases and thereby radiates more heat. If neither of these problems is of

concern, then FAST DECAY can be used for high-pulse-rate HALF STEP or QUARTER STEP drive.

Additionally, this IC has MIX DECAY as a method to remedy the problems caused by the above SLOW DECAY and FAST

DECAY. In this IC, SLOW DECAY / MIX DECAY (60 % Typ SLOW DECAY) can be selected.

Switching between SLOW DECAY and FAST DECAY during current decay can improve current control without increasing

current ripple.

t₁

t₂

t₃

1.0 V

IC Internal Voltage

Output Current

0.4 V

GND

Chopping Period

t_CHOP

Current Limit Value

FAST

DECAY

SLOW

DECAY

0 A

Figure 6. Internal Voltage and Output Current during MIX DECAY

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About translator circuit operation in CLK-IN drive system

- Description for CH1 (CH2: same as CH1)-

This series builds in translator circuit and can drive stepping motor in CLK-IN drive mode.

The operation of the translator circuit in CLK-IN drive mode is described as below.

Reset Operation

The translator circuit is initialized by power ON reset function and the PS pin.

Initializing operation when power supply is turned on

(1) If power supply is turned on at PS=L (Use this sequence as a general rule)

When power supply is turned on, the power ON reset function operates in the IC and initialized, but as long as it is

PS=L, the motor output is the OPEN state. After power supply is turned on, because of the changing of PS=L→H, the

motor output becomes the ACTIVE state, and the excitation is started at the initial electrical angle.

But at the time of PS=L→H, it returns from the standby state to the normal state and there is a delay of 40 µs (Max)

until the motor output has become the ACTIVE state.

ACTIVE

Reset is released

(1)

(2)

Delay

PS

CLK1

OUT1A

OUT1B

Motor output OPEN

(2) If power supply is turned on at PS=H

Motor output ON

When power supply is turned on, the power ON reset function operates in the IC and be initialized before the motor

output becomes the ACTIVE state during ENABLE1=H, and the excitation is started at the initial electrical angle.

Initializing operation during motor operating

Input the reset signal to the PS pin when the translator circuit is initialized during motor fundamentally operating.

(Refer to P.14) But at the time of PS=L→H, it returns from the standby state to the normal state and there is a delay of

40 µs (Max) until the motor output has become the ACTIVE state, so be careful.

Control Input Timing

Please observe the following input timing because basically the translator circuit operates at the rising edge of CLK signal. If

you disobey this timing and input, then there is the possibility that the translator circuit does not operate as expected. In

addition, at the time of PS=L→H, it returns from the standby state to the normal state and there is a delay of 40 µs (Max) until

the motor output has become the ACTIVE state. Be careful that the phase advance operation does not work even if CLK is

input within this delay interval.

A

PS

B

C

CLK1

MODE01

MODE11

D

E

F

G

F

G

CW_CCW1

ENABLE1

A: PS minimum input L pulse width • • • • 20 µs

B: PS rising edge to CLK rising edge input possible maximum delay time • • • • 40 µs

C: CLK1 minimum period • • • • 4 µs

D: CLK1 minimum input H pulse width • • • • 2 µs

E: CLK1 minimum input L pulse width • • • • 2 µs

F: MODE01, MODE11, CW_CCW1, ENABLE1 set-up time • • • • 1 µs

G: MODE01, MODE11, CW_CCW1, ENABLE1 hold time • • • • 1 µs

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About translator circuit operation in CLK-IN drive system – continued

FULL STEP (MODE01=L, MODE11=L, CW_CCW1=L, ENABLE1=H)

1

2

3

4

1

OUT1A

100%

PS

67%

33%

CLK1

1

2

4

3

OUT1A

OUT1B

OUT2A

OUT2B

OUT2A

OUT2B

OUT1B

100%

67%

33%

4CLK = Electrical angle 360°

I_OUT(CH1)

-33%

-67%

-100%

100%

67%

33%

I_OUT(CH2)

-33%

-67%

-100%

HALF STEP A (MODE01=H, MODE11=L, CW_CCW1=L, ENABLE1=H)

1

2

3

4

5

6

7

8

1

2

OUT1A

8

100%

67%

PS

CLK1

7

5

1

3

33%

OUT1A

OUT1B

OUT2A

OUT2B

OUT2A

2

6

4

100%

67%

33%

OUT1B

8CLK = Electrical angle 360°

I_OUT(CH1)

-33%

-67%

-100%

100%

67%

33%

I_OUT(CH2)

-33%

-67%

-100%

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About translator circuit operation in CLK-IN drive system – continued

HALF STEP B (MODE01=L, MODE11=H, CW_CCW1=L, ENABLE1=H)

OUT1A

8

1

2

3

4

5

6

7

8

1

2

100%

67%

PS

CLK1

33%

1

3

7

5

OUT1A

OUT1B

OUT2A

OUT2B

OUT2A

2

6

4

OUT1B

100%

67%

33%

8CLK = Electrical angle 360°

I_OUT(CH1)

-33%

-67%

-100%

100%

67%

33%

I_OUT(CH2)

-33%

-67%

-100%

QUARTER STEP (MODE01=H, MODE11=H, CW_CCW1=L, ENABLE1=H)

OUT1A

1

2

3

4

5

6

7

8

9

10 11 12 13 14 15 16

1

2

3

4

100%

67%

33%

PS

15

2

16

14

CLK1

13

1

5

12

11

2

3

4

OUT1A

OUT1B

OUT2A

OUT2B

OUT2A

OUT2B

1

10

9

8

6

7

OUT1B

16CLK = Electrical angle 360°

100%

67%

33%

I_OUT(CH1)

-33%

-67%

-100%

100%

67%

33%

I_OUT(CH2)

-33%

-67%

-100%

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About translator circuit operation in CLK-IN drive system – continued

Reset Timing Chart (QUARTER STEP, MODE01=H, MODE11=H, CW_CCW1=L, ENABLE1=H)

To reset the translator circuit while the motor is working, input the PS pin to L. The reset operation works regardless of other

input signals. At this time, the IC internal circuit turns to the standby mode and makes the motor output OPEN.

RESET

1

2

3

4

5

6

7

8

9

10

1

2

3

4

5

6

7

8

PS

CLK1

OUT1A

OUT1B

OUT2A

OUT2B

100%

67%

33%

I_OUT(CH1)

-33%

-67%

-100%

100%

67%

33%

I_OUT(CH2)

-33%

-67%

-100%

CW_CCW Switch Timing Chart (FULL STEP, MODE01=L, MODE11=L, ENABLE1=H)

The switch of CW_CCW is reflected by the rising edge of CLK1 that comes immediately after the changes of the CW_CCW 1

signal. However, even if the control on driver IC side supports, the motor cannot follow and might make a step-out or a

misstep depending on the state of operation of the motor at the switching. Evaluate the switching sequence sufficiently.

CW

CCW

1

2

3

2

1

PS

CW_CCW1

CLK1

OUT1A

OUT1B

OUT2A

OUT2B

100%

I_OUT(CH1)

I_OUT(CH2)

-100%

100%

-100%

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About translator circuit operation in CLK-IN drive system – continued

ENABLE Switch Timing Chart (FULL STEP, MODE01=L, MODE11=L)

The switch of the ENABLE signal is reflected by the change in the ENABLE signal with regardless of other input signals.

In the section of ENABLE1=L, because the motor output becomes OPEN and the CLK input is cut off, the phase advance

operation of the internal translator circuit stops. Therefore, the progress of ENABLE1=L to H is completed before the input of

ENABLE1=L. Switching of the excitation mode (MODE01, MODE11) is performed even in the ENABLE1=L section. If

excitation mode is switched in ENABLE1=L interval, it returns ENABLE1=L to H with the excitation mode which is after

switched.

Output off and Translator stop

1

2

3

PS

ENABLE1

CLK1

OUT1A

OUT1B

OUT2A

OUT2B

100%

I_OUT(CH1)

I_OUT(CH2)

-100%

100%

-100%

Returning in the state prior to input of ENABLE1=L

About the Switch of the Motor Excitation Mode

The switch of the excitation mode be done at the same time as changing of the signal MODE01 and MODE11 regardless of

the CLK signal. This product has a function which prevents the motor step-out caused by discrepancies of torque vector of

transitional excitations while excitation mode switching. However, even if the control on driver IC side supports, the motor

cannot follow and might make a step-out or a misstep depending on the state of operation of the motor at the switching.

Evaluate the switching sequence sufficiently.

Cautions of Bidirectional Switch of CW_CCW1 and Excitation Modes (MODE01, MODE11)

As shown in the figure below, the area between the end of reset discharge (PS=L→H) and beginning of the first CLK signal

input is defined as interval A, while the area from the end of the first CLK signal input is defined as interval B.

Interval A

=> For CW_CCW1, no limitation is applied on switch of excitation mode.

Interval B

=> In CLK 1 period, or in ENABLE1=L interval, CW_CCW1 and excitation mode cannot be switched together.

Violation of this restriction may lead to misstep (with one extra leading phase) or step-out.

Therefore, in case that CW_CCW1 and excitation modes are switched simultaneously, the PS pin must be input reset

signal. Then start to operate in interval A before carrying out such bidirectional switch.

Interval A

Interval B

PS

CLK1

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Power Dissipation

Confirm that the IC’s chip temperature Tj is not over 150 °C in consideration of the IC’s power consumption (W), thermal

resistance (°C/W) and ambient temperature (Ta). When Tj=150 °C is exceeded, the functions as a semiconductor do not

operate and problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration

and eventually destruction of the IC. Tjmax=150 °C must be strictly obeyed under all circumstances.

Thermal Calculation

The IC’s consumed power can be estimated roughly with the power supply voltage (VBB₎, circuit current (I_CC), output ON

resistance (RONH, RONL) and motor output current value (I_OUT).

The calculation method during FULL STEP drive, SLOW DECAY mode is shown here:

푊_푉퐵퐵= ꢁ_퐵퐵× 퐼_퐶퐶

[W]

where:

W_VBBis the consumed power of the VBB.

V_BBis the power supply voltage.

I_CCis the circuit current.

푊_퐷푀푂ꢂ= 푊_푂ꢃ+ 푊_{퐷퐸퐶퐴푌}[W]

푊_푂ꢃ= ꢄ_푂ꢃ퐻+ ꢄ_푂ꢃ퐿× 퐼_푂푈푇²× ꢅ × 표푛_푑푢푡푦 [W]

(

)

2

(

)

(

)

푊_{퐷퐸퐶퐴푌}= ꢅ × ꢄ_푂ꢃ퐿× 퐼_푂푈푇× ꢅ × 1 − 표푛_푑푢푡푦 [W]

where:

W_DMOSis the consumed power of the output DMOS.

W_ONis the consumed power during output ON.

W_DECAYis the consumed power during current decay.

R_ONHis the upper P-channel DMOS ON-resistance.

R_ONLis the lower N-channel DMOS ON-resistance.

I_OUTis the motor output current value.

푡_푂ꢃ

on_duty is PWM on duty=

“ ꢅ ” is the H bridge A and B.

⁄

푡_퐶퐻푂푃

t_ONvaries depending on the L and R values of the motor coil and the current set value. Confirm by actual measurement, or

make an approximate calculation.

t_CHOPis the chopping period, which is determined by the internal timer. Refer to P.9, 10 for details.

Upper Pch DMOS ON Resistance

Lower Nch DMOS ON Resistance

IC number

R_ONH[Ω] (Typ)

R_ONL[Ω] (Typ)

BD63888MUV

0.70

0.30

푊_푡표푡푎푙 = 푊_푉퐶퐶+ 푊_퐷푀푂ꢂ[W]

ꢆ푗 = ꢆ푎 + 휃푗푎 × 푊_푡표푡푎푙 [°C]

where:

W_total is the consumed total power of IC.

Tj is the junction temperature.

Ta is the air temperature.

Θja is the thermal resistance value.

However, the thermal resistance value θja [°C/W] differs greatly depending on circuit board conditions. The calculated values

above are only theoretical. For actual thermal design, perform sufficient thermal evaluation for the application board used,

and create the thermal design with enough margin not to exceed Tjmax=150°C. Although unnecessary with normal use, if

the IC is to be used under especially strict heat conditions, consider externally attaching a Schottky diode between the motor

output pin and GND to abate heat from the IC.

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Power Dissipation – continued

Temperature Monitoring

In respect of BD63888MUV, there is a way to directly measure the approximate chip temperature by using the TESTx^{(Note 25)}

pin with a protection diode for prevention from electrostatic discharge. However, temperature monitor using this TESTx pin is

only for evaluation and experimenting, and must not be used in actual usage conditions.

(Note 25) x=1 or 2

(1) Measure the pin voltage when a current of I_DIODE=50 µA flows from the TESTx pin to the GND, without supplying VBB1,

VBB2 to the IC. This is measurement of the V_Fvoltage inside the diode.

(2) Measure the temperature characteristics of this pin voltage. (V_Fhas a linear negative temperature factor against the

temperature.) With the results of these temperature characteristics, chip temperature can calibrate from the TESTx pin

voltage.

(3) Supply VBB1, VBB2, confirm the TESTx pin voltage while running the motor, and calculate approximately the chip

temperature from the results of (2).

-V_F[mV]

TESTx

Internal Circuit

I_DIODE

V

25

150

Chip Temperature Tj[°C]

Figure 7. Model Diagram for Measuring Chip Temperature

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Application Example

Bypass capacitor.

Setting range is

100 μF to 470μF (electrolytic)

0.01 μF to 0.1μF (multilayer

ceramic etc.)

Refer to P.6 for detail.

Be sure to short VBB1 and VBB2.

PS

CLK1

Regulator

Logic input pin

See P5 for detail.

RESET

CW_CCW1

MODE01

MODE11

ENABLE1

TEST1

UVLO

OVLO

TSD

Interface

Set the output current.

Input by resistor divider.

Refer to P.6 for detail

OCP

VREF1

2bit DAC

TESTPS1

0.1μF 100μF

VBB1

SENSE1

OUT1A

OUT1B

SENSE2

SENSE1

Blank time

PWM control

About “TESTPSx”,

Please input the voltage

(over 2.8 V).

Control

logic

Pre-

driver

VBB1

OSC

OUT2A

Resistor for current detection

Setting range is

0.1 Ω to 0.3 Ω.

Set the current decay mode.

1. SLOW DECAY

→Connect to GND.

2. MIX DECAY

OUT2B

SENSE2

Mix decay

control

DEC1

Refer to P.6 for detail.

→Input by resistor divider.

Refer to P.5, 10 for detail.

VREF2

2bit DAC

TESTPS2

VBB2

SENSE3

OUT3A

SENSE4

OUT3B

SENSE3

Blank time

PWM control

Control

logic

Pre-

driver

VBB2

OSC

OUT4A

OUT4B

SENSE4

Mix decay

control

DEC2

CLK2

CW_CCW2

MODE02

MODE12

ENABLE2

TEST2

Interface

GND

Figure 8. BD63888MUV Block Diagram and Applied Circuit Diagram

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I/O Equivalence Circuit

CW_CCWx^{(Note 26)}

MODE0x^{(Note 27)}

MODE1x^{(Note 28)}

CLKx^{(Note 29)}

ENABLEx^{(Note 30)}

PS

VREFx^{(Note 32)}

10 kΩ

TESTPSx^{(Note 33)}

5 kΩ

DECx^{(Note 31)}

10 kΩ

100 kΩ

VBB1, VBB2

OUTxA^{(Note 34)}

OUTxB^{(Note 35)}

SENSEx^{(Note 36)}

Internal

Circuit

(Note 26) x=1 or 2

(Note 27) x=1 or 2

(Note 28) x=1 or 2

(Note 29) x=1 or 2

(Note 30) x=1 or 2

(Note 31) x=1 or 2

(Note 32) x=1 or 2

(Note 33) x=1 or 2

(Note 34) x=1, 2, 3 or 4

(Note 35) x=1, 2, 3 or 4

(Note 36) x=1, 2, 3 or 4

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

7.

8.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 9. Example of monolithic IC structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

13. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. The IC should

be powered down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the

OFF state even if the Tj falls below the TSD threshold.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

14. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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Ordering Information

M U

V

B

D

6

3

8

-

E 2

Package

MUV : VQFN036V6060

Packing and Forming specification

E2 : Embossed tape and reel

Part Number

Marking Diagram

VQFN036V6060 (TOP VIEW)

Part Number Marking

BD63888

LOT Number

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

VQFN036V6060

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Revision History

Date

Revision

001

Changes

27.Apr.2018

New Release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

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2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BD63888MUV
厂家：	ROHM
描述：	BD63888MUV是额定电源36V、额定输出电流1.2A的低功耗双极PWM恒流驱动器。输入接口采用CLK-IN驱动方式，通过内置DAC，励磁模式可适用FULL STEP、HALFSTEP(2种)、QUATER STEP模式，是可驱动2个双极型步进电机的电机驱动器。另外，也可使用一个系统电源进行驱动，有助于提高整机设计的便利性。电机驱动驱动器
文件：	总27页 (文件大小：1913K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD63888MUV [ROHM]

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