BD63130AFM_技术文档

Datasheet

Driver IC for PPC

High Performance, High Reliability

50V DC Brush Motor Driver

for PPC's others

BD63130AFM

General Description

Key Specifications

BD63130AFM is one H-bridge motor driver for DC brush

motor. This driver can facilitate low power consumption by

direct PWM or PWM constant current control. There are

built in protection circuits in this IC. It is possible to output

an abnormal detection signal for Wired-OR that notifies

each protection circuit operation, which contributes to set

high reliability.

 Power Supply Voltage Range:

 Rated Output Current:

 Rated Output Current (Peak):

 Operating Temperature Range:

 Output ON-Resistance:

8.0V to 46.2V

3.0A

4.0A

-25°C to +85°C

0.55Ω(Typ)

(Total of upper and lower resistors)

Features

Package

HSOP-M36

W(Typ) x D(Typ)x H(Max)

18.50mm x 9.90mm x 2.40mm

 Single Power Supply Input (rated voltage of 50V)

 Rated Output Current (peak): 3.0A(4.0A)

 Low ON-Resistance DMOS Output

 Forward, Reverse, Brake, Open

 Power Save Function

 External PWM Control

 PWM Constant Current Control (current limit function)

 Built-in Spike Noise Cancel Function (external noise

filter is unnecessary)

 Driver for DC Brush Motor

 Built-in Logic Input Pull-down Resistor

 Cross-conduction Prevention Circuit

 Output Detection Signal during Abnormal states

(Wired-OR)

Figure 1. HSOP-M36

Typical Application Circuit

 Thermal Shutdown Circuit (TSD)

 Over-current Protection Circuit (OCP)

 Under Voltage Lock out Circuit (UVLO)

 Over Voltage Lock out Circuit (OVLO)

 Ghost Supply Prevention (protects against malfunction

when power supply is disconnected)

 HSOP-M36 package

GND

VREF

IN1

IN2

PS

FAILA

Application

 Plain Paper Copier (PPC), Multi-function Printer, Laser

Printer, Inkjet Printer, Photo Printer, FAX, Mini Printer

and etc.

VCC

OUT1

OUT2

TEST

RNF

RNFS

GND

TEST1

Figure 2. Application Circuit

○Product structure：silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

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BD63130AFM

Pin Configuration

Block Diagram

(TOP VIEW)

36

35

34

33

NC

1

2

OUT1

＋

20

FAILA

16

＋

－

VREF

1/3

－

Regulator

RNF

OUT1

NC

OUT2

RNFS

3

4

5

32 RNFS

31 NC

30

29

6

7

TSD

OCP

Blank time

NC

GND

PWM control

UVLO

OVLO

8

9

OUT2

NC

28 NC

OSC

FIN

26

VCC

10

27

26

25

NC

VCC

OUT1

OUT2

NC

IN1

IN2

PS

NC

TEST

FAILA

NC

1

6

Forward

Reverse

BRAKE

Open

11

12

13

14

15

16

17

18

11

12

IN1

IN2

35

32

29

RNF

24 VCC

23

22

PS 13

15

RNFS

GND

NC

GND

NC

VREF

TEST

TEST1

18

21

20

19

TEST1

NC

Figure 3. Pin Configuration

Figure 4. Block Diagram

Pin Descriptions

Pin No. Pin Name

Function

Pin No. Pin Name

Function

Non-connection

1

2

3

4

5

6

7

8

9

OUT1

NC

19

20

21

22

23

24

25

26

27

NC

VREF

NC

H bridge output pin

Current limit setting pin

Non-connection

Ground pin

Non-connection

GND

NC

Non-connection

OUT2

NC

VCC

NC

H bridge output pin

Power supply pin

Non-connection

Fin pin

FIN

(used by connecting with GND)

10

11

12

13

NC

IN1

IN2

PS

Non-connection

28

29

30

31

NC

GND

NC

Non-connection

H bridge control pin

Power save pin

Ground pin

Non-connection

NC

Non-connection

Input pin of current detection

comparator

14

15

NC

Non-connection

32

33

RNFS

RNF

Pin for testing

TEST

(used by connecting with GND)

Output signal to detect abnormal

states

Connection pin of resistor for output

current detection

16

17

FAILA

NC

34

35

RNF

Non-connection

Pin for testing

(used by connecting with GND)

18

TEST1

36

NC

Non-connection

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BD63130AFM

Absolute Maximum Ratings (Ta=25°C)

Parameter

Symbol

V_CC

Rating

-0.2 to +50.0

-0.2 to +5.5

0.7

Unit

V

Supply Voltage

Input Voltage for Control Pin

RNF Maximum Voltage

Output Current

V_IN

V

V_RNF

V

I_OUT

3.0^{(Note 1)}

4.0^{(Note 1)}

6.0^{(Note 1)}

-55 to +150

+150

A/ch

°C

Output Current (PEAK) ^{(Note 2)}

Output Current (BRAKE) ^{(Note 3)}

Storage Temperature Range

Maximum Junction Temperature

I_OUTPEAK

I_OUTBRAKE

Tstg

Tjmax

°C

(Note 1) Do not, however exceed Tjmax=150°C.

(Note 2) 2s or under and duty 20% over 3A.

(Note 3) This current is flowed switching from forward rotation and reverse rotation to the brake mode.

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Recommended Operating Conditions

Range

Unit

°C

Parameter

Operating Temperature Range

Supply Voltage

Symbol

Topr

-25 to +85

8.0 to 46.2

2.0^{(Note 4)}

V_CC

V

Maximum Output Current (Continuous)

I_OUT

A/ch

(Note 4) Do not, however exceed Tjmax=150°C.

Thermal Resistance^{(Note 5)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 7)}

2s2p^{(Note 8)}

HSOP-M36

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 6)}

θ_JA

53.9

3

26.4

2

°C/W

Ψ_JT

(Note 5) Based on JESD51-2A(Still-Air).

(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 7) Using a PCB board based on JESD51-3.

(Note 8) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

70μm

Footprints and Traces

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

4 Layers

Top

Copper Pattern

Bottom

Copper Pattern

74.2mm x 74.2mm

Thickness

70μm

Copper Pattern

Thickness

35μm

Thickness

70μm

Footprints and Traces

74.2mm x 74.2mm

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BD63130AFM

Electrical Characteristics (Unless otherwise specified Ta=25°C, V_CC=24V)

Limit

Parameter

【Whole】

Symbol

Unit

Conditions

Min

Typ

Max

Circuit Current at Standby

Circuit Current

I_CCST

I_CC

-

10

µA

PS=L

2.5

5.0

mA

PS=H, VREF=2V

【Control Input】

H Level Input Voltage

L Level Input Voltage

H Level Input Current

L Level Input Current

【Output (OUT1, OUT2)】

Output ON-Resistance

Output Leak Current

【Current Control】

RNF Input Current

V_INH

V_INL

I_INH

I_INL

2.0

-

V

0.8

100

-

35

-10

50

0

µA

V_IN=5V

V_IN=0V

I_OUT=±2.0A

(Sum of upper and lower)

R_ON

-

0.55

-

0.72

10

Ω

I_LEAK

µA

I_RNF

I_VREF

V_VREF

t_ONMIN

V_CTH

-80

-2.0

-

-40

-0.1

-

µA

V

RNF=0V

VREF Input Current

VREF Input Voltage Range

VREF=0V

2.0

3.0

0.525

Minimum on Time

(Blank Time)

0.7

1.5

µs

V

Comparator Threshold

0.475

0.500

VREF=1.5V

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BD63130AFM

Application Information

Points to Notice for Pin Description and PCB Layout

(1) PS/ Power Save Pin

PS can make circuit into standby state and make motor outputs OPEN.

Be careful because there is a delay of 40μs(Max), as PS=L→H, until it is returned from standby state to normal state

and the motor output becomes ACTIVE.

PS

L

State

POWER SAVE (STANDBY)

ACTIVE

H

(2) IN1, IN2/ H Bridge Control Pin

It decides output logic for H bridge.

Input

Output

State

PS

IN1

x

IN2

x

OUT1

OPEN

H

OUT2

OPEN

L

POWER SAVE (STANDBY)

STOP

H

L

H

L

FORWARD

H

L

H

REVERSE

H

L

BRAKE

x : H or L

(3) TEST, TEST1/ Pin for Testing

This is the pin used at the time of distribution test. Connect to GND. Be careful because there is a possibility of

malfunction if it is not connected to GND.

(4) VCC/ Power Supply Pin

Motor’s drive current is flowing in it, so the wire is thick, short and has low impedance. Voltage VCC may have great

fluctuation, so arrange the bypass capacitor of about 100μF to 470μF as close to the pin as possible and adjust the

voltage VCC is stable. Increase the capacity as needed especially, when a large current is used or those motors that

have great back electromotive force are used.

In addition, for the purpose of reducing of power supply’s impedance in wideband, it is recommended to set parallel

connection of multi-layered ceramic capacitor of 0.01μF to 0.1μF etc. Extreme care must be used to make sure that

the voltage VCC does not exceed the rating even for a moment. Still more, in the power supply pin, there is built-in

clamp component for preventing of electrostatic destruction. When a steep pulse signal or voltage such as a surge

exceeding the absolute maximum rating is applied, this clamp component operates, as a result there is the danger of

destruction, so be sure that the absolute maximum rating must not be exceeded. It is effective to mount a Zener diode

of about the absolute maximum rating. Moreover, the diode for preventing of electrostatic destruction is inserted

between VCC pin and GND pin, as a result there is the danger of IC destruction if reverse voltage is applied between

VCC pin and GND pin, so be careful.

(5) GND/ Ground Pin

In order to reduce the noise caused by switching current and to stabilize the internal reference voltage of IC, the wiring

impedance from this pin is made as low as possible to achieve the lowest electrical potential no matter what operating

state it may be. Moreover, design patterns not to have any common impedance with other GND patterns.

(6) OUT1, OUT2/ H Bridge Output Pin

Motor’s drive current is flowing in it, so the wire is thick, short and has low impedance. It is also effective to add a

Schottky diode if output has positive or negative great fluctuation when large current is used. For example, counter

electromotive voltage etc. Moreover, in the output pin, there is built-in clamp component for preventing of electrostatic

destruction. When a steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied,

this clamp component operates, as a result there is the danger of even destruction, so be sure that the absolute

maximum rating must not exceeded.

(7) RNF/ Connection Pin of Resistor for Detecting of Output Current

Connect the resistor of 0.1Ω to 0.3Ω for current detection between this pin and GND. Determine the resistor so that

power consumption W=I_OUT²･R [W] of the current-detecting resistor does not exceed the power dissipation of the

resistor. In addition, it has a low impedance and does not have a common impedance with other GND patterns because

motor’s drive current flows in the pattern through RNF Pin to current-detecting resistor to GND. Do not exceed the

rating because there is the possibility of circuits’ malfunction etc., if RNF voltage has exceeded the maximum rating

(0.7V). If RNF pin is open, then there is the possibility of such malfunction as output current does not flow either, so do

not let it open.

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Application Information – continued

(8) RNFS/ Input Pin of Current detection Comparator

In this series, RNFS pin, which is the input pin of current detection comparator, is independently arranged in order to

decrease the lowering of current-detecting accuracy caused by the wire impedance inside the IC of RNF pin. Therefore,

be sure to connect RNF pin and RNFS pin together when using in the case of PWM constant current control. In addition,

because the wires from RNFS pin is connected near the current-detecting resistor in the case of interconnection, the

lowering of current-detecting accuracy, which is caused by the impedance of board pattern between RNF pin and the

current-detecting resistor, can be decreased. Moreover, design the pattern there is no noise plunging.

(9) VREF/ Output Current limit setting Pin

[When to use current limit]

This is the pin to set the current limit value. It can be set by VREF voltage and current-detecting resistor (RNF resistor).

퐼_푂푈푇

=

^푉푅퐸퐹/ ꢀ푁ꢁ

[A]

3

Where:

I_OUT

is the output current.

VREF

RNF

is the voltage of output current limit setting.

is the current-detecting resistor.

Avoid using it with VREF pin open because if VREF pin is open, the input is unsettled, and the VREF voltage increases,

and then there is the possibility of such malfunctions as the setting current increases and a large current flows etc.

Keep to the input voltage range because if the voltage of 2V or more is applied on VREF pin, then there is also the

danger that a large current flows in the output and so OCP or TSD will operate. Besides, select the resistance value in

consideration of the outflow current (Max 2μA) if it is inputted by resistance division. The minimum current, which can

be controlled by VREF voltage, is determined by motor coil’s L, R values and minimum ON time because there is a

minimum ON time in PWM drive.

[When not to use current limit]

Short RNF pin with the GND. However, there is a possibility of PWM constant current control depending on the

impedance of board pattern. For the reason, when not to use PWM constant current control, input 1V to 2V to VREF

pin (Refer to figure 8.).

(10) FAILA/ Fault Signal Output Pin

FAILAoutputs abnormality detection signal when Over-Current Protection (OCP) or Thermal Shutdown (TSD) operates.

Even if Under Voltage Lock Out (UVLO) or Over Voltage Lock Out (OVLO) operates, FAILA signal doesn’t turn

abnormality detection signal (i.e. high). This signal can be connected to the microcomputer and the system can be shut

down.

This pin is an open drain type, so set the pull up resistor (5kΩ to 100kΩ) to power supply 7V or less (i.e. 5V or 3.3V).

If not using this pin, connect it to GND.

OCP

OFF

ON

TSD

OFF

ON

FAILA

H (OFF)

M (ON)

L (ON)

OFF

ON

(11) NC Pin

This pin is unconnected electrically with IC internal circuit.

(12) FIN Pin

HSOP-M36 package is mounted with the heat-radiating FIN pin, and be sure to connect the metal by solder with the

GND on the board and get as wide GND pattern as possible. Be careful because Thermal Resistance is increasing if

not connected by solder.

Moreover, the FIN pin is shorted with IC chip’s back side and becomes the GND potential, so there is the danger of

malfunction and destruction if shorted with potentials other than GND. Therefore, absolutely do not connect with

potentials other than GND.

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BD63130AFM

Protection Circuits

Thermal Shutdown (TSD)

This IC has a built-in Thermal Shutdown circuit for thermal protection. When the IC’s chip temperature rises 175°C (Typ)

or more, the motor output becomes OPEN. Also, when the temperature returns to 150°C (Typ) or less, it automatically

returns to normal operation. However, even when TSD is in operation, if heat is continued to be applied externally, heat

overdrive can lead to destruction.

Over-Current Protection (OCP)

This IC has a built in Over-Current Protection circuit as a provision against destruction when the motor outputs are shorted

to each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN condition

when the regulated current flows for 4μs (Typ). It returns with power reactivation or a reset of the PS pin. The over-current

protection circuit aims to prevent the destruction of the IC only from abnormal situations such as when motor output is

shorted and it is not meant to be used as protection or security for the device. Therefore, the device should not be designed

to make use of the function of this circuit. After OCP operation, if abnormal situations continue and returned by power

reactivation or reset of the PS pin happens repeatedly, then OCP operates constantly. The IC may generate heat or

otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, if the output pin voltage jumps

up and the absolute maximum values may be exceeded after the over current has flowed, there is a possibility of destruction.

Also when current which is the output current rating or more and the OCP detection current or less flows, the IC can heat

up to Tjmax=150°C or more and can deteriorate, so current which exceeds the output rating should not be applied.

Under Voltage Lock Out (UVLO)

This IC has a built-in Under Voltage Lock Out function to prevent false operation such as IC output during power supply

under voltage. When the applied voltage to the VCC pin goes 5V (Typ) or less, the motor output is set to OPEN. This

switching voltage has a 1V (Typ) hysteresis to prevent false operation by noise etc. Be aware that this protection circuit

does not operate during power save mode.

Over Voltage Lock Out (OVLO)

This IC has a built-in Over Voltage Lock Out function to protect the IC output and the motor during power supply over

voltage. When the applied voltage to the VCC pin goes 52V (Typ) or more, the motor output is set to OPEN. This switching

voltage has a 1V (Typ) hysteresis and a 4μs (Typ) mask time to prevent false operation by noise etc. Although this over

voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power supply

voltage is exceeded. Therefore, the absolute maximum value should not be exceeded. Be aware that this protection circuit

does not operate during power save mode.

Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

If a control signal (IN1, IN2, PS, and VREF) is applied when there is no power supplied to the IC, there is a function which

prevents a malfunction where voltage is supplied to power supply of this IC or other IC in the set via the electrostatic

destruction prevention diode from these input pins to the VCC. Therefore, there is no malfunction in the circuit even when

voltage is supplied to these input pin while there is no power supply.

Operation Under Strong Electromagnetic Field

The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction is

found when using the IC in a strong electromagnetic field.

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Direct PWM Control

This series can control PWM by IN1, IN2 input directly from the microcomputer (up to100kHz).

Decay mode can be SLOW DECAY or FAST DECAY.

Below are examples of control sequence and current decay path.

SLOW DECAY (forward rotation)

Input

IN1

H

Output

State

PS

H

IN2

L

OUT1

OUT2

H

L

ON

SLOW DECAY

ON

H

L

H

L

H

L

SLOW DECAY

ON

H

FAST DECAY (synchronous rectification, forward rotation)

Input

IN1

H

Output

State

PS

H

IN2

L

OUT1

OUT2

H

L

H

L

ON

FAST DECAY

ON

H

L

H

L

H

L

H

L

H

L

H

L

FAST DECAY

ON

H

FAST DECAY

SLOW DECAY

OFF to OFF

OFF to ON

ON to OFF

OFF to ON

M

ON to ON

OFF to ON

Output ON

Current decay

Figure 5. Route of Regenerative Current during Current Decay

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BD63130AFM

PWM Constant Current Control

This function can limit the peak current such as switching current in driving DC brush motor.

(1) Current Control Operation

The output current increases due to the output transistor turned on. When the voltage on the RNF pin, the output

current is converted it due to connect the external resistance to RNF pin, reaches the voltage value set by the VREF

input voltage, the current limit comparator engages and enters current decay mode. Thereafter the output turned on

again after a period of time determined the CR pin. The process repeats itself constantly.

(2) Blank Time (Fixed in Internal Circuit)

In order to avoid misdetection of current detection comparator due to RNF spikes that occur when the output turns ON,

the internal voltage between 0.4V and 0.8V is provided as minimum ON time (t_ONMIN1.5µs Typ). During this time, the

current detection is disabled after the output transistor is turned on. This allows for constant-current drive without the

need for an external filter.

(3) Internal Timer (Fixed in Internal Circuit)

Repeat charging and discharging between 0.4V to 0.9V internal voltage determined by IC internal circuit.

When internal voltage is changed charge from discharge, the output is then ON from the current decay mode.

Spike noise

Output current

RNF voltage

Current limit value

0mA

Current limit value

GND

0.9V

0.8V

Internal voltage

0.4V

GND

Discharge time : OFF time t_OFF

Noise cancel time t_N

Figure 6. Timing Chart of Internal Voltage, RNF Voltage and Output Current

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BD63130AFM

Power Dissipation

Confirm that the IC’s chip temperature Tj is not over 150°C in consideration of the IC’s power consumption (W), thermal

resistance (°C/W) and ambient temperature (Ta). When Tj=150°C is exceeded, the functions as a semiconductor do not

operate and problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration

and eventually destruction of the IC. Tjmax=150°C must be strictly obeyed under all circumstances.

(1) Thermal Calculation

The IC’s consumed power can be estimated roughly with the power supply voltage (V_CC), circuit current (I_CC), output

ON-Resistance (R_ONH, R_ONL) and motor output current value (I_OUT).

The calculation method during direct PWM drive, SLOW DECAY is shown here:

푊_푉퐶퐶= ꢂ_퐶퐶× 퐼_퐶퐶

[W]

where:

W_VCCis the consumed power of the V_CC

.

V_CC

I_CC

is the power supply voltage.

is the circuit current.

푊_퐷푀푂푆= 푊_푂ꢃ+ 푊_{퐷퐸퐶퐴푌}[W]

표푛_푑푢푡푦

100

2

(

)

푊_푂ꢃ= ꢀ_푂ꢃ퐻+ ꢀ_푂ꢃ퐿× 퐼_푂푈푇

×

[W]

100−표푛_푑푢푡푦

100

2

(

)

푊_{퐷퐸퐶퐴푌}= ꢄ × ꢀ_푂ꢃ퐿× 퐼_푂푈푇

×

[W]

where:

W_DMOS

W_ON

is the consumed power of the output DMOS.

is the consumed power during output ON.

W_DECAY

R_ONH

R_ONL

is the consumed power during current decay.

is the upper P-channel DMOS ON-resistance.

is the lower N-channel DMOS ON-resistance.

is the motor output current value

I_OUT

on_duty PWM on duty[%]

Model

Number

Upper P-Channel DMOS ON-Resistance

R_ONH[Ω] (Typ)

Lower N-Channel DMOS ON-Resistance

R_ONL[Ω] (Typ)

BD63130AFM

0.32

0.23

푊_ꢅꢆꢅ푎푙 = 푊_푉퐶퐶+ 푊_퐷푀푂푆

[W]

ꢇ푗 = ꢇ푎 + 휃푗푎 × 푊_ꢅꢆꢅ푎푙

[°C]

where:

W_total is the consumed total power of IC.

Tj

Ta

θja

is the junction temperature.

is the air temperature.

is the thermal resistance value.

However, the thermal resistance value θja [°C/W] differs greatly depending on circuit board conditions. The calculated

values above are only theoretical. For actual thermal design, perform sufficient thermal evaluation for the application

board used, and create the thermal design with enough margin to not exceed Tjmax=150°C. Although unnecessary

with normal use, if the IC is to be used under especially strict heat conditions, consider externally attaching a Schottky

diode between the motor output pin and GND to abate heat from the IC.

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Power Dissipation – continued

(2) Temperature Monitoring

There is a way to directly measure the approximate chip temperature by using the TEST pin. However, temperature

monitor using TEST pin is only for evaluation and experimenting, and must not be used in actual usage conditions.

TEST pin has a protection diode to prevent electrostatic discharge. The temperature can be monitored using this

protection diode.

(a) Measure the pin voltage when a current of I_DIODE=50μA flows from the TEST pin to the GND, without supplying VCC

to the IC. This measurement is the V_Fvoltage inside the diode.

(b) Measure the temperature characteristics of this pin voltage. (V_Fhas a linear negative temperature factor against

the temperature.) With the results of these temperature characteristics, chip temperature can be calibrated from the

TEST pin voltage.

(c) Supply VCC, confirm the TEST pin voltage while running the motor, and the chip temperature can be approximated

from the results of (b).

-V_F[mV]

TEST

Circuitry

I_DIODE

V

25

150

Chip temperature Tj [°C]

Figure 7. Model Diagram for Measuring Chip Temperature

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Application Circuit Diagram

(1)Constant Voltage Control or External PWM Control

Sets the voltage of (RNFS x3)

or more.

When using the abnormality detection

function

Input range: 1.0V to 2.0V

⇒Pull up resistor 5kΩ to 100kΩ.

When not using the abnormality

detection function

⇒Connect to GND.

Refer to page 6.

3.3V or 5.0V

10kΩ

3.3V or 5.0V

VREF

12.0kΩ

FAILA

＋

－

＋

1/3

Regulator

－

6.8kΩ

RNF1S

Bypass capacitor.

Setting range is

TSD

OCP

Blank time

100µF to 470µF (electrolytic)

0.01µF to 0.1µF(multilayer ceramic

etc.)

Control input terminal.

Input PWM signal (100kHz or less) at

external PWM control.

PWM control

UVLO

OVLO

Refer to page 5 for detail.

VCC must be short-cricuited before

use.

Refer to page 5 for detail.

OSC

VCC

OUT1

100µF

0.1µF

M

Forward

Reverse

BRAKE

Open

Power save terminal

Refer to page 5 for detail.

OUT2

RNF

IN1

IN2

RNFS

VCC

Terminal for testing

Connect to GND.

PS

TEST

GND

TEST1

Figure 8. Constant Voltage Control or External PWM Control

(a) Input/ Output table

Input

Output

State

OUT1

OPEN

H

OUT2

OPEN

L

PS

IN1

x

IN2

x

L

POWER SAVE (STANDBY)

STOP

H

L

H

L

FORWARD

H

L

H

REVERSE

H

L

BRAKE

x : H or L

(b) Example of external PWM control sequence

SLOW DECAY (forward rotation)

Input

Output

State

OUT1

OUT2

PS

H

IN1

H

IN2

L

H

L

ON

SLOW DECAY

ON

H

L

H

L

H

L

SLOW DECAY

ON

H

FAST DECAY (forward rotation)

Input

Output

State

OUT1

OUT2

PS

H

IN1

H

IN2

L

H

L

H

L

ON

FAST DECAY

ON

H

L

H

L

H

L

H

L

H

L

H

L

FAST DECAY

ON

H

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Application Circuit Diagram – continued

(2)PWM Constant Current Control

When using the fault abnormality

detection function

⇒Pull up resistor 5kΩ to 100kΩ.

When not using the fault abnormality

detection function

⇒Connect to GND.

Refer to page 6.

Sets the current limit

value.

Input range: 0V to 2V

Refer to page 6 for detail.

3.3V or 5.0V

10kΩ

3.3V or 5.0V

12.0kΩ

VREF

FAILA

＋

－

＋

－

1/3

Regulator

6.8kΩ

RNF1S

TSD

OCP

Blank time

Bypass capacitor.

Setting range is

PWM control

UVLO

OVLO

100µF to 470µF(electrolytic)

0.01µF to 0.1µF(multilayer ceramic etc.)

Refer to page 5 for detail.

VCC must be short-cricuited before use.

OSC

Control logic input terminal.

Refer to page 5.

VCC

OUT1

100µF

0.1µF

M

Forward

Reverse

BRAKE

Open

Power save terminal

Refer to page 5 for detail.

OUT2

RNF

IN1

IN2

0.1Ω

RNFS

GND

Current detection setting resistor

0.05Ω to 0.14Ω

Refer to page 5, 6 for detail.

Terminal for testing

Connect to GND.

PS

TEST

TEST1

Figure 9. PWM Constant Current Control

(a) Input/ Output table

Input

IN1

Output

State

OUT1

OPEN

H

OUT2

PS

L

IN2

x

L

OPEN

POWER SAVE (STANDBY)

STOP

H

L

OPEN

H

L

H

L

FORWARD

H

L

REVERSE

H

L

BRAKE

x : H or L

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I/ O Equivalent Circuits

5kΩ

10kΩ

RNFS

VREF

Control

input

100kΩ

VCC

OUT2

OUT1

5kΩ

FAILA

5kΩ

RNF

Circuitry

Figure 10. I/ O Equivalent Circuits

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7.

8.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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BD63130AFM

Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 11. Example of monolithic IC structure

12. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

13. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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BD63130AFM

Ordering Information

A

F M

B D 6

3

1

3

0

-

E 2

Part number

Package type

FM : HSOP-M36

Packaging and forming specification

E2: Reel-wound embossed taping

Marking Diagram

HSOP-M36 (TOP VIEW)

Part Number Marking

LOT Number

BD63130AFM

Pin 1 Mark

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BD63130AFM

Physical Dimension and Packing Information

Package Name

HSOP-M36

Max 18.75 (include. BURR)

1PIN MARK

(UNIT: mm)

PKG: HSOP-M36

Drawing: EX142-5001

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BD63130AFM

Revision History

Date

Revision

001

Changes

26.Dec.2017

New Release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BD63130AFM
厂家：	ROHM
描述：	本产品是能驱动1个DC有刷电机的H桥电机驱动器。通过直接PWM驱动或恒流PWM控制可实现高效率驱动。内置各种保护电路，可输出通知各种保护电路动作的支持Wired-Or的异常检出信号，有利于实现组件的高可靠性。电机驱动驱动器
文件：	总22页 (文件大小：1967K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD63130AFM [ROHM]

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