BD60910GU [ROHM]

Silicon Monolithic Integrated Circuit; 硅单片集成电路


型号：	BD60910GU
厂家：	ROHM
描述：	Silicon Monolithic Integrated Circuit 硅单片集成电路显示驱动器驱动程序和接口接口集成电路
文件：	总5页 (文件大小：140K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

1/4

Structure

Silicon Monolithic Integrated Circuit

Product Name

Compound LED Driver for cellular phone

Type

BD60910GU

Features

Boost DC/DC for LED back lighting

Constant current driver for LED back lighting

Auto Luminous Control (ALC)

●Absolute Maximum Ratings（Ta=25℃）

Parameter

Symbol

VMAX1

VMAX2

VMAX3

Limits

Unit

Pins

except for VLED, VOUT, SW

VLED

Maximum voltage 1

Maximum voltage 2

Maximum voltage 3

32.6

VOUT, SW

1250

^oC

Power Dissipation

Topr

-40 ~ +85

-55 ~ +150

Operating Temperature Range

Storage Temperature Range

Tstg

note）Power dissipation deleting is 10mW/ ^oC, when it’s used in over 25 ^oC.

(It’s deleting is on the board that is ROHM’s standard)

Dissipation by LSI should not exceed tolerance level.of Pd.

●Operating conditions（VBAT≧VIO, Ta=-40～85℃）

Parameter

VBAT input voltage

VIO pin voltage

Symbol

VBAT

VIO

Limits

Unit

2.7～5.5

1.65～3.3

* Radiation-proof is not designed.

REV. A

2/4

● Electrical Characteristics (Unless otherwise specified, Ta=25°C, VBAT=3.6V, VIO=1.8V)

Parameter

【Circuit Current】

Symbol

Min.

Typ.

Max.

Unit

Condition

VBAT Circuit current 1

VBAT Circuit current 2

IBAT1

IBAT2

0.1

0.5

1.0

3.0

μA

RESETB=0V, VIO=0V

RESETB=0V, VIO=1.8V

LED=ON, ILED=15mA setting

Vo=24V

VBAT Circuit current 3

IBAT3

2.5

5.0

Only ALC block ON

ADCYC=0.52s setting

Except sensor current

VBAT Circuit current 4

IBAT4

0.4

1.0

【LED Driver】

LED current Step (Setup)

LED current Step (At slope)

LED Maximum current

LED current accuracy

【DC/DC】

ILEDSTP1

ILEDSTP2

IMAXWLED

IWLED

128

256

25.6

Step

-7%

+7%

I_LED=15mA setting

VLED pin feedback voltage

Over current protection

Vfb

0.3

OCP

650

Oscillator frequency

Over Voltage Protection

detect voltage

fosc

0.8

1.0

1.2

MHz

OVP1

OVP2

OVP3

OVP4

OVP5

Mduty

Maximum Duty

92.5

VOUT open protection

【I²C input (SDA, SCL)】

OVO

0.7

1.4

0.25 ×

VIO

LOW level input voltage

HIGH level input voltage

VIL

VIH

-0.3

0.75 ×

VIO

VBAT

+0.3

Hysteresis of

0.05 ×

VIO

Vhys

Schmitt trigger input

LOW level output voltage

(SDA) at 3mA sink current

Input current

VOL

lin

0.3

-3

μA

Input voltage = 0.1×VIO~0.9×VIO

【RESETB】

0.25 ×

VIO

LOW level input voltage

HIGH level input voltage

VIL

-0.3

0.75 ×

VIO

-3

VBAT

+0.3

VIH

Iin

Input current

μA

【ALC】

2.850

2.470

3.0

2.6

3.150

2.730

Io=200μA < Initial value >

Io=200μA

SBIAS Output voltage

SBIAS Output current

SSENS Input range

VoS

IoS

Vo=3.0V

VoS x

255/256

1.5

VISS

SBIAS Discharge resister at OFF

ADC resolution

ROFFS

ADRES

ADINL

1.0

kΩ

bit

ADC non-linearity error

ADC differential

-3

-1

LSB

ADDNL

LSB

non-linearity error

SSENS Input impedance

RSSENS

MΩ

REV. A

3/4

● Electrical Characteristics (Unless otherwise specified, Ta=25°C, VBAT=3.6V, VIO=1.8V)

【WPWMIN】

L level input voltage

VILA

-0.3

1.4

0.3

VBAT

+0.3

H level input voltage

VIHA

Input current

IinA

3.6

μA

μs

Vin=1.8V

PWM input

PWpwm

minimum High pulse width

【GC1, GC2】

L level output voltage

VOLS

VOHS

0.2

IOL=1mA

IOH=1mA

VoS

-0.2

H level output voltage

●Outside size figure

D60910

LOT No.

VCSP85H3（24pin）（unit:mm）

REV. A

4/4

● Block Diagram

●Pin List

PIN NAME

VBAT1

WPWMIN

VIO

VBAT2

VIO

OCP

RESETB

SCL

VOUT

VLED

SBIAS

SSENS

GC1

GC2

I²C interface

DC/DC

Level

Shift

OVP

I/O

SDA

GND1

GND2

LEDGND

GNDP

Digital

Control

Feed Back

WPWMIN

VLED

External PWM

LEDGND

SBIAS

SSENS

SGND

GND1

GND2

GNDPS

TSD

Sensor

I/F

ALC

SGND

VREF

IREF

GC2

GC1

RESETB

SDA

SCL

● Cautions on use

(1) Absolute Maximum Ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making

impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed,

consideration should be given to take physical safety measures including the use of fuses, etc.

(2) Power supply and ground line

Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention to the interference by common

impedance of layout pattern when there are plural power supplies and ground lines. Especially, when there are ground pattern for small signal and

ground pattern for large current included the external circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount

a capacitor between the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the

capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.

(3) Ground voltage

Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no pins are at

a potential lower than the ground voltage including an actual electric transient.

(4) Short circuit between pins and erroneous mounting

In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs.

Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the pin and the power supply or the ground pin, the

ICs can break down.

(5) Operation in strong electromagnetic field

Be noted that using ICs in the strong electromagnetic field can malfunction them.

(6) Input pins

In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference

with circuit operation, thus resulting in a malfunction and then breakdown of the input pin. Therefore, pay thorough attention not to handle the input pins, such

as to apply to the input pins a voltage lower than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the

input pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input pins a voltage lower

than the power supply voltage or within the guaranteed value of electrical characteristics.

(7) External capacitor

In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due

to DC bias and changes in the capacitance due to temperature, etc.

(8) Thermal shutdown circuit (TSD)

This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher, the thermal shutdown

circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,

is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming

its operation.

(9) Thermal design

Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use.

(10) About the pin for the test, the un-use pin

Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a function manual and an

application notebook. And, as for the pin that doesn't specially have an explanation, ask our company person in charge.

(11) Rush Current

Rush current may flow in instant in the internal logic unfixed state by the power supply injection order and delay. Therefore, be careful of power

supply coupling capacity, a power supply and the width of grand pattern wiring, and leading about.

(12) DC/DC converter

Please select the low DCR inductors to decrease power loss for DC/DC converter.

REV. A

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,

fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of

any of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

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R0039

BD60910GU [ROHM]

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