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BD52012HFV-TR [ROHM]

Unipolar Detection Hall ICs; 单极检测霍尔IC
BD52012HFV-TR
型号： BD52012HFV-TR
厂家： ROHM    ROHM
描述：

Unipolar Detection Hall ICs
单极检测霍尔IC
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Hall IC Series  
Unipolar Detection  
Hall ICs  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
No.10045EBT03  
●Description  
The unipolar Detection Hall IC detects only either the N pole or S pole. The output turns ON (active Low) upon detection.  
It is most suitable for strictly unipole detection and when lower power consumption is desired.  
●Features  
1) unipolar detection  
2) Micropower operation (small current using intermittent operation method)  
3) Ultra-compact CSP4 package (BU52002GUL,BU52003GUL)  
4) Small outline package (BU52012HFV,BU52013HFV)  
5) Line up of supply voltage  
For 1.8V Power supply voltage(BU52012HFV,BU52013HFV)  
For 3.0V Power supply voltage (BU52002GUL,BU52003GUL)  
6) High ESD resistance 8kV(HBM)  
●Applications  
Mobile phones, notebook computers, digital video camera, digital still camera, etc.  
●Product Lineup  
Supply voltage Operate point Hysteresis  
Period  
(ms)  
50  
50  
50  
Supply current  
(AVG.)(μA)  
Product name  
Output type  
Package  
(V)  
(mT)  
3.7※  
-3.7※  
3.0※  
-3.0※  
(mT)  
0.8  
0.8  
0.9  
0.9  
BU52002GUL  
BU52003GUL  
BU52012HFV  
BU52013HFV  
2.40～3.30  
2.40～3.30  
1.65～3.30  
1.65～3.30  
6.5  
6.5  
3.5  
3.5  
CMOS  
CMOS  
CMOS  
CMOS  
VCSP50L1  
VCSP50L1  
HVSOF5  
50  
HVSOF5  
※Plus is expressed on the S-pole; minus on the N-pole  
●Absolute Maximum Ratings  
BU52002GUL,BU52003GUL (Ta=25℃)  
Parameters  
Symbol  
Limit  
Unit  
1
Power Supply Voltage  
Output Current  
VDD  
IOUT  
Pd  
-0.1～+4.5※  
V
mA  
mW  
℃
±1  
420※  
2
Power Dissipation  
Operating Temperature Range  
Topr  
Tstg  
-40～+85  
Storage Temperature Range  
-40～+125  
℃
※1. Not to exceed Pd  
※2. Reduced by 4.20mW for each increase in Ta of 1℃over 25℃(mounted on 50mm×58mm Glass-epoxy PCB)  
BU52012HFV,BU52013HFV (Ta=25℃)  
Parameters  
Symbol  
Limit  
Unit  
3
Power Supply Voltage  
VDD  
IOUT  
Pd  
-0.1～+4.5※  
V
mA  
mW  
℃
Output Current  
±0.5  
4
Power Dissipation  
536※  
Operating Temperature Range  
Topr  
Tstg  
-40～+85  
Storage Temperature Range  
-40～+125  
℃
※3. Not to exceed Pd  
※4. Reduced by 5.36mW for each increase in Ta of 1℃over 25℃(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB)  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.01 - Rev.B  
1/13  
Technical Note  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
●Magnetic, Electrical Characteristics  
BU52002GUL (Unless otherwise specified, VDD＝3.0V, Ta＝25℃)  
Limit  
Typ  
Parameters  
Power Supply Voltage  
Symbol  
VDD  
Unit  
V
Conditions  
Min  
2.4  
Max  
3.3  
3.0  
Operate Point  
BopS  
-
3.7  
2.9  
0.8  
50  
-
5.5  
mT  
mT  
mT  
ms  
V
Release Point  
BrpS  
0.8  
-
Hysteresis  
BhysS  
TP  
-
-
100  
-
Period  
-
※
Output High Volｔage  
Output Low Voltage  
Supply Current  
VOH  
VDD-0.4  
B<BrpS 5 , IOUT=-1.0mA  
BopS<B※5 , IOUT =+1.0mA  
Average  
VOL  
-
-
-
-
-
0.4  
9
V
IDD(AVG)  
IDD(EN)  
IDD(DIS)  
6.5  
4.7  
3.8  
μA  
mA  
μA  
Supply Current During Startup Time  
Supply Current During Standby Time  
-
During Startup Time Value  
During Standby Time Value  
-
※5. B = Magnetic flux density  
1mT=10Gauss  
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.  
After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.  
BU52003GUL (Unless otherwise specified, V ＝3.0V, Ta＝25℃)  
DD  
Limit  
Typ  
Parameters  
Power Supply Voltage  
Symbol  
VDD  
Unit  
V
Conditions  
Min  
2.4  
Max  
3.3  
3.0  
-3.7  
-2.9  
0.8  
50  
Operate Point  
BopN  
-5.5  
-
mT  
mT  
mT  
ms  
V
Release Point  
BrpN  
-
-0.8  
Hysteresis  
BhysN  
TP  
-
-
100  
-
Period  
-
Output High Volｔage  
Output Low Voltage  
Supply Current  
VOH  
VDD-0.4  
-
BrpN<B※6 , IOUT=-1.0mA  
B<BopN※6 , IOUT =+1.0mA  
Average  
VOL  
-
-
-
-
-
0.4  
9
V
IDD(AVG)  
IDD(EN)  
IDD(DIS)  
6.5  
4.7  
3.8  
μA  
mA  
μA  
Supply Current During Startup Time  
-
During Startup Time Value  
During Standby Time Value  
Supply Current During Standby Time  
-
※6. B = Magnetic flux density  
1mT=10Gauss  
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.  
After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.01 - Rev.B  
2/13  
Technical Note  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
BU52012HFV (Unless otherwise specified, V ＝1.80V, Ta＝25℃)  
DD  
Limit  
Typ  
Parameters  
Power Supply Voltage  
Symbol  
Unit  
Conditions  
Min  
Max  
3.30  
VDD  
BopS  
1.65  
1.80  
3.0  
2.1  
0.9  
50  
V
Operate Point  
-
5.0  
mT  
mT  
mT  
ms  
V
Release Point  
BrpS  
0.6  
-
Hysteresis  
BhysS  
-
-
Period  
TP  
-
100  
Output High Volｔage  
Output Low Voltage  
VOH  
VDD-0.2  
-
-
0.2  
5.5  
-
B<BrpS※6 , IOUT =-0.5mA  
BopS<B※6 , IOUT =+0.5mA  
VDD=1.8V, Average  
VOL  
-
-
-
-
-
-
-
-
V
Supply Current 1  
IDD1(AVG)  
IDD1(EN)  
IDD1(DIS)  
IDD2(AVG)  
IDD2(EN)  
IDD2(DIS)  
3.5  
2.8  
1.8  
6.5  
4.5  
4.0  
μA  
mA  
μA  
μA  
mA  
μA  
VDD=1.8V,  
During Startup Time Value  
VDD=1.8V,  
During Standby Time Value  
Supply Current During Startup Time 1  
Supply CurrentDuring Standby Time 1  
Supply Current 2  
-
9
VDD=2.7V, Average  
VDD=2.7V,  
During Startup Time Value  
VDD=2.7V,  
During Standby Time Value  
-
Supply Current During Startup Time 2  
-
Supply CurrentDuring Standby Time 2  
※6. B = Magnetic flux density  
1mT=10Gauss  
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.  
After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.  
BU52013HFV (Unless otherwise specified, VDD＝1.80V, Ta＝25℃)  
Limit  
Typ  
Parameters  
Power Supply Voltage  
Symbol  
VDD  
Unit  
V
Conditions  
Min  
Max  
3.30  
1.65  
1.80  
BopN  
-5.0  
-3.0  
-2.1  
0.9  
50  
-
mT  
mT  
mT  
ms  
V
Operate Point  
BrpN  
-
-0.6  
Release Point  
BhysN  
-
-
Hysteresis  
TP  
-
100  
Period  
VOH  
VDD-0.2  
-
-
0.2  
5.5  
-
BrpN<B※7 , IOUT =-0.5mA  
Output High Voltage  
VOL  
-
-
-
-
-
-
-
-
V
B<BopN 7 , IOUT =+0.5mA  
※
Output Low Voltage  
IDD1(AVG)  
IDD1(EN)  
IDD1(DIS)  
IDD2(AVG)  
IDD2(EN)  
IDD2(DIS)  
3.5  
2.8  
1.8  
6.5  
4.5  
4.0  
μA  
mA  
μA  
μA  
mA  
μA  
VDD=1.8V, Average  
Supply Current 1  
VDD=1.8V,  
During Startup Time Value  
Supply Current During Startup Time 1  
Supply CurrentDuring Standby Time 1  
Supply Current 2  
VDD=1.8V,  
During Standby Time Value  
-
9
VDD=2.7V,Average  
VDD=2.7V,  
During Startup Time Value  
-
Supply Current During Startup Time 2  
Supply CurrentDuring Standby Time 2  
VDD=2.7V,  
During Standby Time Value  
-
※7 B = Magnetic flux density  
1mT=10Gauss  
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.  
After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.01 - Rev.B  
3/13  
Technical Note  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
●Figure of mesurement circuit  
Tp  
Bop/Brp  
200Ω  
VDD  
VDD  
GND  
VDD  
OUT  
VDD  
100μF  
OUT  
Oscilloscope  
GND  
V
Bop and Brp are measured with applying the magnetic field  
from the outside.  
The period is monitored by Oscilloscope.  
Fig.2 Tp mesurement circuit  
Fig.1 Bop,Brp mesurement circuit  
VOH  
Product Name  
IOUT  
BU52002GUL, BU52003GUL  
BU52012HFV, BU52013HFV  
1.0mA  
0.5mA  
VDD  
OUT  
VDD  
100μF  
GND  
IOUT  
V
Fig.3 VOH mesurement circuit  
VOL  
Product Name  
IOUT  
BU52002GUL, BU52003GUL  
BU52012HFV, BU52013HFV  
1.0mA  
0.5mA  
VDD  
VDD  
100μF  
OUT  
GND  
V
IOUT  
Fig.4 VOL mesurement circuit  
IDD  
A
VDD  
2200μF  
VDD  
OUT  
GND  
Fig.5 IDD mesurement circuit  
www.rohm.com  
2010.01 - Rev.B  
4/13  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
●Technical (Reference) Data  
BU52002GUL (VDD=2.4～3.3V type)  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
8.0  
6.0  
8.0  
6.0  
VDD=3.0V  
Ta = 25°C  
V
DD=3.0V  
Bop S  
Brp S  
Bop S  
Brp S  
4.0  
4.0  
2.0  
2.0  
0.0  
0.0  
-2.0  
-4.0  
-6.0  
-8.0  
-2.0  
-4.0  
-6.0  
-8.0  
-60 -40 -20  
0
20 40 60 80 100  
-60 -40 -20  
0
20 40 60 80 100  
2.0  
2.4  
2.8  
3.2  
3.6  
AMBIENT TEMPERATURE [  
]
℃
SUPPLY VOLTAGE  
V
［ ］  
AMBIENT TEMPERATURE [  
]
℃
Fig.8 TP –Ambient temperature  
Fig.6 Bop,Brp – Ambient temperature  
Fig.7 Bop,Brp – Supply voltage  
100  
90  
20.0  
18.0  
20.0  
18.0  
VDD=3.0V  
16.0  
Ta = 25°C  
80  
16.0  
Ta = 25°C  
14.0  
12.0  
10.0  
8.0  
70  
60  
50  
40  
30  
20  
10  
0
14.0  
12.0  
10.0  
8.0  
6.0  
6.0  
4.0  
4.0  
2.0  
2.0  
0.0  
0.0  
-60 -40 -20  
0
20 40 60 80 100  
2.0  
2.4  
2.8  
3.2  
3.6  
2.0  
2.4  
2.8  
3.2  
3.6  
SUPPLY VOLTAGE [V]  
SUPPLY VOLTAGE [V]  
AMBIENT TEMPERATURE [  
]
℃
Fig.11  
I
DD – Supply voltage  
Fig.9 TP – Supply voltage  
Fig.10 IDD – Ambient temperature  
BU52003GUL (VDD=2.4～3.3V type)  
8.0  
6.0  
8.0  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
6.0  
Ta = 25°C  
VDD=3.0V  
VDD=3.0V  
4.0  
4.0  
2.0  
0.0  
2.0  
0.0  
Brp N  
Bop N  
Brp N  
-2.0  
-2.0  
-4.0  
-6.0  
-8.0  
-4.0  
Bop N  
-6.0  
-8.0  
-60 -40 -20  
0
20 40 60 80 100  
-60 -40 -20  
0
20 40 60 80 100  
2.0  
2.4  
2.8  
3.2  
3.6  
AMBIENT TEMPERATURE [  
]
℃
SUPPLY VOLTAGE  
V
］
［
AMBIENT TEMPERATURE [  
]
℃
Fig.14 TP – Ambient temperature  
Fig.13 Bop,Brp – Supply voltage  
Fig.12 Bop,Brp – Ambient temperature  
100  
20.0  
18.0  
20.0  
18.0  
90  
Ta = 25°C  
80  
VDD=3.0V  
Ta = 25°C  
16.0  
16.0  
14.0  
12.0  
10.0  
8.0  
70  
60  
50  
40  
30  
20  
10  
0
14.0  
12.0  
10.0  
8.0  
6.0  
6.0  
4.0  
4.0  
2.0  
2.0  
0.0  
0.0  
-60 -40 -20  
0
20 40 60 80 100  
2.0  
2.4  
2.8  
3.2  
3.6  
2.0  
2.4  
2.8  
3.2  
3.6  
SUPPLY VOLTAGE [V]  
SUPPLY VOLTAGE [V]  
AMBIENT TEMPERATURE [  
]
℃
Fig.17  
I
DD – Supply voltage  
Fig.16  
IDD – Ambient temperature  
Fig.15 TP –Supply voltage  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.01 - Rev.B  
5/13  
Technical Note  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
BU52012HFV (VDD=1.65V～3.3V type)  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
8.0  
6.0  
8.0  
6.0  
Ta = 25°C  
VDD=1.8V  
Bop S  
Brp S  
VDD=1.8V  
Bop S  
Brp S  
4.0  
4.0  
2.0  
2.0  
0.0  
0.0  
-2.0  
-4.0  
-6.0  
-8.0  
-2.0  
-4.0  
-6.0  
-8.0  
-60 -40 -20  
0
20 40 60 80 100  
-60 -40 -20  
0
20 40 60 80 100  
1.4 1.8 2.2 2.6 3.0 3.4 3.8  
SUPPLY VOLTAGE  
AMBIENT TEMPERATURE [  
]
℃
V
［
］
AMBIENT TEMPERATURE [  
]
℃
Fig.19 Bop,Brp – Supply voltage  
Fig.18 Bop,Brp – Ambient temperature  
Fig.20 TP – Ambient temperature  
20.0  
18.0  
100  
90  
20.0  
18.0  
VDD=1.8V  
Ta = 25°C  
80  
16.0  
Ta = 25°C  
16.0  
14.0  
12.0  
10.0  
8.0  
14.0  
12.0  
10.0  
8.0  
70  
60  
50  
40  
30  
20  
10  
0
6.0  
6.0  
4.0  
4.0  
2.0  
2.0  
0.0  
0.0  
-60 -40 -20  
0
20 40 60 80 100  
1.4 1.8 2.2 2.6 3.0 3.4 3.8  
SUPPLY VOLTAGE [V]  
1.4  
1.8 2.2  
2.6 3.0  
3.4 3.8  
SUPPLY VOLTAGE [V]  
AMBIENT TEMPERATURE [  
]
℃
Fig.23 IDD – Supply voltage  
Fig.21 TP – Supply voltage  
Fig.22 IDD – Ambient temperature  
BU52013HFV (VDD=1.65V～3.3V type)  
8.0  
8.0  
100  
90  
6.0  
4.0  
6.0  
Ta = 25°C  
VDD=1.8V  
VDD=1.8V  
80  
4.0  
2.0  
70  
60  
50  
40  
30  
20  
10  
0
2.0  
0.0  
0.0  
Brp N  
Brp N  
Bop N  
-2.0  
-4.0  
-6.0  
-8.0  
-2.0  
-4.0  
Bop N  
-6.0  
-8.0  
-60 -40 -20  
0
20 40 60 80 100  
-60 -40 -20  
0
20 40 60 80 100  
1.4 1.8 2.2 2.6 3.0 3.4 3.8  
SUPPLY VOLTAGE  
AMBIENT TEMPERATURE [  
]
℃
V
［
］
AMBIENT TEMPERATURE [  
]
℃
Fig.26 TP – Ambient temperature  
Fig.24 Bop,Brp – Ambient temperature  
Fig.25 Bop,Brp – Supply voltage  
20.0  
18.0  
100  
90  
20.0  
18.0  
VDD=1.8V  
Ta = 25°C  
Ta = 25°C  
16.0  
16.0  
14.0  
12.0  
10.0  
8.0  
80  
70  
60  
50  
40  
30  
20  
10  
14.0  
12.0  
10.0  
8.0  
6.0  
6.0  
4.0  
4.0  
2.0  
2.0  
0
0.0  
0.0  
1.4 1.8 2.2 2.6 3.0 3.4 3.8  
-60 -40 -20  
0
20 40 60 80 100  
1.4 1.8 2.2 2.6 3.0 3.4 3.8  
SUPPLY VOLTAGE [V]  
SUPPLY VOLTAGE [V]  
AMBIENT TEMPERATURE [  
]
℃
Fig.29 IDD – Supply voltage  
Fig.27 TP – Supply voltage  
Fig.28 IDD – Ambient temperature  
www.rohm.com  
2010.01 - Rev.B  
6/13  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
●Block Diagram  
BU52002GUL, BU52003GUL  
0.1μF  
VDD  
A1  
Adjust the bypass capacitor  
value as necessary, according  
to voltage noise conditions, etc.  
TIMING LOGIC  
HALL  
ELEMENT  
The CMOS output terminals enable  
direct connection to the PC, with no  
external pull-up resistor required.  
B1  
A2  
×
OUT  
GND  
Fig.30  
PIN No. PIN Name  
Function  
POWER SUPPLY  
GROUND  
Comment  
A2  
B2  
A1  
B1  
A1  
B1  
A2  
A1  
A2  
B1  
B2  
VDD  
GND  
OUT  
N.C.  
OUTPUT  
B2  
OPEN or Short to GND.  
Surface  
Reverse  
BU52012HFV, BU52013HFV  
0.1µF  
ＶDD  
4
Adjust the bypass capacitor  
value as necessary, according  
to voltage noise conditions, etc.  
TIMING LOGIC  
The CMOS output terminals enable direct  
connection to the PC, with no external pull-up  
resistor required  
HALL  
ELEMENT  
5
2
×
OUT  
GND  
Fig.31  
4
4
3
5
1
5
PIN No.  
PIN NAME  
N.C.  
FUNCTION  
COMMENT  
1
2
3
4
5
OPEN or Short to GND.  
GND  
GROUND  
N.C.  
OPEN or Short to GND.  
2
3
2
1
VDD  
POWER SUPPLY  
OUTPUT  
Surface  
Reverse  
OUT  
www.rohm.com  
2010.01 - Rev.B  
7/13  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
●Description of Operations  
(Micropower Operation)  
The unipolar detection Hall IC adopts an intermittent  
operation method to save energy. At startup, the Hall  
IDD  
elements, amp, comparator and other detection circuits  
power ON and magnetic detection begins. During standby,  
the detection circuits power OFF, thereby reducing current  
consumption. The detection results are held while standby  
is active, and then output.  
Period  
Startup time  
Standby  
Reference period: 50ms (MAX100ms)  
Reference startup time: 24μs  
t
Fig.32  
(Offset Cancelation)  
VDD  
The Hall elements form an equivalent Wheatstone (resistor)  
bridge circuit. Offset voltage may be generated by a  
differential in this bridge resistance, or can arise from changes  
in resistance due to package or bonding stress. A dynamic  
offset cancellation circuit is employed to cancel this offset  
voltage.  
When Hall elements are connected as shown in Fig. 33 and a  
magnetic field is applied perpendicular to the Hall elements,  
voltage is generated at the mid-point terminal of the bridge.  
This is known as Hall voltage.  
I
＋
B
×
Hall Voltage  
Dynamic cancellation switches the wiring (shown in the figure)  
to redirect the current flow to a 90˚ angle from its original path,  
and thereby cancels the Hall voltage.  
－
The magnetic signal (only) is maintained in the sample/hold  
circuit during the offset cancellation process and then  
released.  
GND  
Fig.33  
(Magnetic Field Detection Mechanism)  
S
N
S
S
N
S
N
Flux  
Flux  
Fig.34  
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.  
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.  
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© 2010 ROHM Co., Ltd. All rights reserved.  
2010.01 - Rev.B  
8/13  
Technical Note  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
BU52002GUL,BU52012HFV  
S-Pole  
N
S
N
S
S
N
OUT [V]  
Flux  
Flux  
High  
High  
High  
Low  
B
Brp S  
Bop S  
0
Magnetic flux density [mT]  
Fig.35 S-Pole Detection  
N-Pole  
S-Pole  
BU52002GUL,BU52012HFV detects and outputs for the S-pole only. Since it is unipolar, it does not recognize the N-pole.  
BU52003GUL,BU52013HFV  
N-Pole  
N
S
N
S
S
N
OUT [V]  
Flux  
Flux  
High  
High  
B
High  
Low  
Bop N Brp N  
0
N-Pole  
S-Pole  
Magnetic flux density [mT]  
Fig.36 N-Pole Detection  
BU52003GUL,BU52013HFV detects and outputs for the N-pole only. Since it is unipolar, it does not recognize the S-pole.  
The unipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an  
inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance  
increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets  
closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the  
distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output  
returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This  
detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.  
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© 2010 ROHM Co., Ltd. All rights reserved.  
2010.01 - Rev.B  
9/13  
Technical Note  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
●Intermittent Operation at Power ON  
Power ON  
VDD  
Startup time  
Indefinite  
Standby time  
High  
Startup time  
Standby time  
Supply current  
(Intermittentaction)  
OUT  
(No magnetic  
field present)  
Indefinite  
OUT  
(Magnetic  
field present)  
Low  
Fig.37  
The unipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as  
shown in Fig. 37. It outputs to the appropriate terminal based on the detection result and maintains the output condition  
during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it  
cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be  
programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.  
●Magnet Selection  
Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume  
than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment  
applications. Fig. 38 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The  
graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet  
(1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 39 shows Hall IC detection distance – a good guide for  
determining the proper size and detection distance of the magnet. Based on the BU52012HFV,BU52013HFV operating point  
max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm,  
respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area.  
10  
9
t=3mm  
8
7
6
5
4
3
2
1
0
t=1mm  
t=2mm  
7.6mm 9.2mm  
10.4mm  
0
2
4
6
8
10  
12  
14  
16  
18  
20  
Distance between magnet and Hall IC [mm]  
Fig.38  
X
Magnet material: NEOMAX-44H (material)  
Maker: NEOMAX CO.,LTD.  
Magnet  
t
t
Y
X=Y=4mm  
t=1mm,2mm,3mm  
L: Variable  
…Flux density measuring point  
Magnet size  
Fig.39 Magnet Dimensions and Flux Density Measuring Point  
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© 2010 ROHM Co., Ltd. All rights reserved.  
2010.01 - Rev.B  
10/13  
Technical Note  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
●Position of the Hall Effect IC(Reference)  
HVSOF5  
VCSP50L1  
0.55  
0.6  
0.55  
0.35  
0.8  
0.2  
(UNIT：mm)  
●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)  
HVSOF5  
VCSP50L1  
(UNIT：mm)  
Strings  
Size(Typ.)  
0.50  
e
b3  
SD  
SE  
0.25  
0.25  
0.25  
●Terminal Equivalent Circuit Diagram  
Because they are configured for CMOS (inverter) output, the output pins require no external resistance and allow direct  
connection to the PC. This, in turn, enables reduction of the current that would otherwise flow to the external resistor during  
magnetic field detection, and supports overall low current (micropower) operation.  
OUT  
VDD  
GND  
Fig.40  
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© 2010 ROHM Co., Ltd. All rights reserved.  
2010.01 - Rev.B  
11/13  
Technical Note  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
●Notes for use  
1)Absolute maximum ratings  
Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or  
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this  
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in  
excess of absolute rating limits.  
2)GND voltage  
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower  
than the potential of all other pins.  
3)Thermal design  
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.  
4)Pin shorts and mounting errors  
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning  
or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted  
together, or if shorts occur between the output pin and supply pin or GND.  
5)Positioning components in proximity to the Hall IC and magnet  
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore  
the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in  
the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and  
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.  
6)Operation in strong electromagnetic fields  
Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause  
the IC to malfunction.  
7)Common impedance  
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,  
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or  
capacitor.  
8)GND wiring pattern  
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set  
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes  
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same  
way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.  
9)Exposure to strong light  
Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such  
exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and  
fluorescent light sources was shown to have no significant effect on the IC.  
10)Power source design  
Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under  
examine adequate evaluations when designing the power source.  
www.rohm.com  
2010.01 - Rev.B  
12/13  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV  
●Ordering part number  
B
U
5
2
0
0
2
G U  
L
-
E
2
Part No  
Part No  
52002,52003,  
52012,52013  
Package  
GUL : VSCP50L1  
HFV : HVSOF5  
Packaging and forming specification  
E2: Embossed tape and reel  
(VSCP50L1)  
TR: Embossed tape and reel  
(HVSOF5)  
VCSP50L1 (BU52002GUL,BU52003GUL)  
<Tape and Reel information>  
Tape  
Embossed carrier tape  
3000pcs  
Quantity  
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
Direction of feed  
1pin  
(Unit:mm)  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
∗
HVSOF5  
<Tape and Reel information>  
1.6 0.05  
1.0 0.05  
(0.8)  
(0.3)  
Tape  
Embossed carrier tape  
Quantity  
3000pcs  
TR  
Direction  
of feed  
5
1
4
3
4
5
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
3
2 1  
2
1pin  
0.13 0.05  
S
0.1  
0.22 0.05  
S
0.5  
M
Direction of feed  
Order quantity needs to be multiple of the minimum quantity.  
0.08  
Reel  
(Unit : mm)  
∗
www.rohm.com  
2010.01 - Rev.B  
13/13  
© 2010 ROHM Co., Ltd. All rights reserved.  
Notice  
N o t e s  
No copying or reproduction of this document, in part or in whole, is permitted without the  
consent of ROHM Co.,Ltd.  
The content specified herein is subject to change for improvement without notice.  
The content specified herein is for the purpose of introducing ROHM's products (hereinafter  
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,  
which can be obtained from ROHM upon request.  
Examples of application circuits, circuit constants and any other information contained herein  
illustrate the standard usage and operations of the Products. The peripheral conditions must  
be taken into account when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document.  
However, should you incur any damage arising from any inaccuracy or misprint of such  
information, ROHM shall bear no responsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and  
examples of application circuits for the Products. ROHM does not grant you, explicitly or  
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and  
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the  
use of such technical information.  
The Products specified in this document are intended to be used with general-use electronic  
equipment or devices (such as audio visual equipment, office-automation equipment, commu-  
nication devices, electronic appliances and amusement devices).  
The Products specified in this document are not designed to be radiation tolerant.  
While ROHM always makes efforts to enhance the quality and reliability of its Products, a  
Product may fail or malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard  
against the possibility of physical injury, fire or any other damage caused in the event of the  
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM  
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scope or not in accordance with the instruction manual.  
The Products are not designed or manufactured to be used with any equipment, device or  
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may result in a direct threat to human life or create a risk of human injury (such as a medical  
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-  
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If you intend to export or ship overseas any Product or technology specified herein that may  
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More detail product informations and catalogs are available, please contact us.  
ROHM Customer Support System  
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A

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