BD433M5FP2-C [ROHM]
BD433M5FP2-C是45V耐压、输出电压精度±2％、输出电流500mA、消耗电流38µA的低待机电流稳压器。本IC适合用来降低蓄电池直连系统的消耗电流。输出相位补偿电容器可使用陶瓷电容器。本IC内置防止因输出短路等发生IC破坏的过电流保护、以及防止因过负荷状态等使IC发生热破坏的过热保护电路。;
| 型号： | BD433M5FP2-C |
| 厂家： | 
ROHM |
| 描述： | BD433M5FP2-C是45V耐压、输出电压精度±2％、输出电流500mA、消耗电流38µA的低待机电流稳压器。本IC适合用来降低蓄电池直连系统的消耗电流。输出相位补偿电容器可使用陶瓷电容器。本IC内置防止因输出短路等发生IC破坏的过电流保护、以及防止因过负荷状态等使IC发生热破坏的过热保护电路。 电池 过电流保护 电容器 陶瓷电容器 稳压器 |
| 文件： | 总39页 (文件大小：1809K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
500-mA 3.3-V or 5.0-V Output
LDO Regulators
BD4xxM5-C Series
●General Description
●Features
The BD4xxM5 series are low quiescent regulators
featuring 45 V absolute maximum voltage, and output
voltage accuracy of ±2 % (3.3 V or 5 V: Typ.), 500 mA
output current and 38 μA (Typ.) current consumption.
These regulators are therefore ideal for applications
requiring a direct connection to the battery and a low
current consumption.
Qualified for Automotive Applications
Wide Temperature Range (Tj):
Wide Operating Input Range:
Low Quiescent Current:
Output Current:
-40 °C to +150 °C
3.0 V to 42 V
38 μA (Typ.)
500 mA
High Output Voltage Accuracy:
Output Voltage:
±2 %
3.3 V or 5.0 V (Typ.)
A logical “HIGH” at the CTL enables the device and
“LOW” at the CTL disables the device.
(Only W: Includes Enable Input).
Ceramic capacitors can be used for compensation of the
output capacitor phase. Furthermore, these ICs also
feature overcurrent protection to protect the device from
damage caused by short-circuiting and an integrated
thermal shutdown to protect the device from overheating
at overload conditions.
Enable Input (Only W)
Overload Current Protection (OCP)
Thermal Shutdown Protection (TSD)
AEC-Q100 Qualified (Note1)
(Note1:Grade1)
●Package
W (Typ.) × D (Typ.) × H (Max.)
■ FP2: TO263-5(Note3) 10.16 mm × 15.10 mm × 4.70 mm
■ FPJ: TO252-J5(Note2) 6.60 mm × 10.10 mm × 2.38 mm
(Note3: TO263-5 & TO263-5F)
(Note2: TO252-J5 & TO252-J5F)
■ FP2: TO263-3(Note4) 10.16 mm × 15.10 mm × 4.70 mm
■ FP: TO252-3
6.50 mm × 9.50 mm × 2.50 mm
(Note4: TO263-3 & TO263-3F)
Figure 1. Package Outlook
●Applications
■ Automotive (body, audio system, navigation system, etc.)
●Typical Application Circuits
■ Components Externally Connected: 0.1 µF ≤ CIN, 10 µF ≤ COUT (Typ.)
* Electrolytic, tantalum and ceramic capacitors can be used.
BD433 / 450M5WFPJ-C
BD433 / 450M5WFP2-C
BD433 / 450M5FP-C
BD433 / 450M5FP2-C
Figure 2. Typical Application Circuits
◯Product structure: Silicon Monolithic Integrated Circuit ◯This product is not designed protection against radioactive rays.
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BD4xxM5-C Series
●Ordering Information
B
D
4
x
x
M
5
W
F
P
J －
C Z E 2
Part
Number
Output Voltage
Output Current
5: 500 mA
Enable Input
Package
Packaging and Forming
Specification
33: 3.3 V
50: 5.0 V
W: Includes
Enable
FPJ: TO252-J5(F) Z: Manufacturing Code
FP : TO252-3
FP2: TO263-5(F)
TO263-3(F)
E2: Embossed Tape and Reel
Input
●Lineup
Output Current
Output Voltage
(Typ.)
Enable
Input (1)
Package Type
Orderable Part Number
Ability
TO252-J5(F)
TO263-5(F)
TO252-3
BD433M5WFPJ-CZE2
BD433M5WFP2-CZE2
BD433M5FP-CE2
○
－
○
－
3.3 V
TO263-3(F)
TO252-J5(F)
TO263-5(F)
TO252-3
BD433M5FP2-CZE2
BD450M5WFPJ-CZE2
BD450M5WFP2-CZE2
BD450M5FP-CE2
500 mA
5.0 V
TO263-3(F)
BD450M5FP2-CZE2
(1) ○: Includes Enable Input
– : Not includes Enable Input
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BD4xxM5-C Series
●Pin Configurations
TO252-J5(F)
(Top View)
TO263-5(F)
(Top View)
TO252-3
(Top View)
TO263-3(F)
(Top View)
FIN
FIN
1
2
3
3
1 2
4 5
1 2
4 5
1
2
3
3
Figure 3. Pin Configuration
●Pin Descriptions
■ BD433 / 450M5WFPJ-C
■BD433 / 450M5WFP2-C
Pin No.
Pin Name
VCC
Function
Supply Voltage Input Pin
Output Control Pin
Ground Pin
Pin No.
Pin Name
VCC
Function
1
1
Supply Voltage Input Pin
Output Control Pin
Ground Pin
2
CTL
2
CTL
3
GND
3
GND
4
5
N.C.
Not Connected
Output Pin
4
5
N.C.
Not Connected
Output Pin
VOUT
GND
VOUT
GND
6 (FIN)
Ground Pin
6 (FIN)
Ground Pin
■ BD433 / 450M5FP-C
■BD433 / 450M5FP2-C
Pin No.
Pin Name
VCC
Function
Supply Voltage Input Pin
Not Connected
Output Pin
Pin No.
Pin Name
VCC
Function
Supply Voltage Input Pin
Ground Pin
1
1
2
3
N.C.
2
3
GND
VOUT
GND
VOUT
GND
Output Pin
4 (FIN)
Ground Pin
4 (FIN)
Ground Pin
* N.C. Pin is recommended to short with GND.
* N.C. Pin can be open because it isn’t connected it inside of IC.
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BD4xxM5-C Series
●Block Diagrams
■ BD433 / 450M5WFPJ-C
■ BD433 / 450M5WFP2-C
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BD4xxM5-C Series
■ BD433 / 450M5FP-C
GND (FIN)
PREREG
VREF
DRIVER
OCP
TSD
VCC (1PIN)
N.C. (2PIN)
VOUT (3PIN)
■ BD433 / 450M5FP2-C
Figure 4. Birams
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BD4xxM5-C Series
●Description of Blocks
Block Name
Function
Description of Blocks
A logical “HIGH” ( ≥ 2.8 V ) at the CTL enables the device
and “LOW” ( ≤ 0.8 V ) at the CTL disable the device.
CTL (1)
PREREG
TSD
Control Output Voltage ON/OFF
Internal Power Supply
Thermal Shutdown Protection
Reference Voltage
Power Supply for Internal Circuit
To protect the device from overheating.
If the chip temperature ( Tj ) reaches ca. 175 °C ( Typ. ),
the output is turned off.
VREF
Generate the Reference Voltage
Drive the Output MOS FET
DRIVER
OCP
Output MOS FET Driver
Over Current Protection
To protect the device from damage caused by over current.
If the output current reaches ca. 900 mA (Typ.),
the output is turned off.
(1) Applicable for product with Enable Input.
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BD4xxM5-C Series
●Absolute Maximum Ratings
Parameter
Symbol
VCC
Ratings
-0.3 to +45.0
-0.3 to +45.0
-0.3 to +8.0
-40 to +150
-55 to +150
150
Unit
V
(1)
(2)
Supply Voltage
Output Control Voltage
Output Voltage
CTL
V
VOUT
Tj
V
Junction Temperature Range
Storage Temperature Range
°C
°C
°C
V
Tstg
Maximum Junction Temperature
ESD withstand Voltage (HBM)
Tjmax
VESD, HBM
(3)
±2000
(1)
Do not exceed Pd.
(2) Applicable for product with Enable Input.
The start-up orders of power supply (VCC) and the CTL do not influence if the voltage is within the operation power supply voltage range.
(3) ESD susceptibility Human Body Model “HBM”.
●Operating Conditions (-40 °C ≤ Tj ≤ +150 °C)
Parameter
Supply Voltage ( IOUT ≤ 500 mA )
Symbol
VCC
VCC
VCC
VCC
CTL
Min.
5.9
5.5
4.6
4.0
0
Max.
42.0
42.0
42.0
42.0
42.0
–
Unit
V
(1)
(1)
(2)
(2)
(3)
(4)
Supply Voltage ( IOUT ≤ 250 mA )
Supply Voltage ( IOUT ≤ 500 mA )
Supply Voltage ( IOUT ≤ 250 mA )
Output Control Voltage
V
V
V
V
Start-Up Voltage
VCC
IOUT
Tj
3.0
0
V
Output Current
500
+150
mA
°C
Junction Temperature Range
-40
(1) BD450M5WFPJ-C / BD450M5WFP2-C / BD450M5FP-C / BD450M5FP2-C
(2) BD433M5WFPJ-C / BD433M5WFP2-C / BD433M5FP-C / BD433M5FP2-C
(3) Applicable for Product with Enable Input.
(4) When IOUT = 0 mA
Notice: Please consider that the output voltage would be dropped (Dropout voltage) according to the output current.
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BD4xxM5-C Series
●Thermal Impedance (1)
Parameter
Symbol
Typ.
Unit
Conditions
TO252-J5(F) / TO252-3
Junction to Ambient
(2)
136
23
17
3
°C / W
°C / W
°C / W
°C / W
1s
θJA
(3)
2s2p
(2)
1s
Junction to Top Center of Case (4)
TO263-5(F) / TO263-3(F)
Junction to Ambient
ΨJT
(3)
2s2p
(2)
81
21
8
°C / W
°C / W
°C / W
°C / W
1s
θJA
(3)
2s2p
(2)
1s
Junction to Top Center of Case (4)
ΨJT
(3)
2
2s2p
(1)
(2)
The thermal impedance is based on JESD51 - 2A (Still-Air) standard.
JESD51 - 3 standard FR4 114.3 mm × 76.2 mm × 1.57 mm 1-layer (1s)
(Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.)
(3)
(4)
JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mm 4-layer（2s2p）
(Top copper foil: ROHM recommended footprint + wiring to measure / 2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm,
copper (top & reverse side / inner layers) 2oz. / 1oz.)
TT : Top center of case’s (mold) temperature
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BD4xxM5-C Series
●Electrical Characteristics
Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V (1), IOUT = 0 mA
The typical value is defined at Tj = 25 °C.
Limit
Parameter
Symbol
Ishut (1)
Unit
Conditions
Min.
–
Typ.
Max.
5.0
CTL = 0 V
Shut Down Current
2.0
μA
μA
μA
V
Tj ≤ 125 °C
IOUT = 0 mA
Tj ≤ 125 °C
–
38
38
95
Circuit Current
Output Voltage
Dropout Voltage
Icc
IOUT ≤ 500 mA
Tj ≤ 150 °C
–
175
5.10
5.10
6 V ≤ VCC ≤ 42 V,
0 mA ≤ IOUT ≤ 400 mA
4.90
4.80
5.00
5.00
VOUT (2)
VOUT (3)
6 V ≤ VCC ≤ 42V
0 mA ≤ IOUT ≤ 500 mA
V
6 V ≤ VCC ≤ 42 V
3.23
3.20
3.30
3.30
3.37
3.37
V
V
0 mA ≤ IOUT ≤ 400 mA
6 V ≤ VCC ≤ 42 V
0 mA ≤ IOUT ≤ 500 mA
VCC = VOUT × 0.95 (Typ. 4.75 V)
IOUT = 300 mA
∆Vd (2)
∆Vd (3)
R.R.
–
–
0.20
0.25
60
0.50
0.75
–
V
V
VCC = VOUT × 0.95 (Typ. 3.135 V)
IOUT = 300 mA
f = 120 Hz, ein = 1 Vrms
IOUT = 100 mA
Ripple Rejection
Line Regulation
Load Regulation
Thermal Shut Down
55
–
dB
mV
mV
°C
Reg.I
Reg.L
TSD
10
30
30
–
8 V ≤ VCC ≤ 16 V
10 mA ≤ IOUT ≤ 400 mA
Tj at TSD ON
–
10
–
175
(1) Applicable for Product with Enable Input.
(2)
(3)
For BD450M5WFPJ-C / BD450M5WFP2-C / BD450M5FP-C / BD450M5FP2-C
For BD433M5WFPJ-C / BD433M5WFP2-C / BD433M5FP-C / BD433M5FP2-C
●Electrical Characteristics ( Enable function * Applicable for product with Enable Input. )
Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA. The typical value is defined at Tj = 25 °C.
Limit
Parameter
Symbol
Unit
Conditions
Min.
2.8
Typ.
–
Max.
–
CTL ON Mode Voltage
CTL OFF Mode Voltage
CTL Bias Current
VthH
VthL
ICTL
V
V
Active Mode
Off Mode
–
–
–
0.8
30
15
µA
CTL = 5 V
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BD4xxM5-C Series
●Typical Performance Curves
■BD433M5WFPJ-C / BD433M5WFP2-C / BD433M5FP-C / BD433M5FP2-C Reference Data
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V (1), IOUT = 0 mA.
(1) Applicable for Product with Enable Input.
100
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
Figure 6. Output Voltage vs. Power Supply Voltage
(IOUT = 0 mA)
Figure 5. Circuit Current vs. Power Supply Voltage
100
90
80
70
60
50
40
30
20
10
0
6
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
5
4
3
2
1
0
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
Supply Voltage:VCC [V]
Supply Voltage:VCC [V]
Figure 8. Output voltage vs. Power Supply Voltage
(IOUT = 0 mA)
Figure 7. Circuit Current vs. Power Supply Voltage
*Magnified Figure 5. at low supply voltage
* Magnified Figure 6. at Low Supply Voltage
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BD4xxM5-C Series
●Typical Performance Curves
■BD433M5WFPJ-C / BD433M5WFP2-C / BD433M5FP-C / BD433M5FP2-C Reference Data
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V (1), IOUT = 0 mA.
(1) Applicable for Product with Enable Input.
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
0
100 200 300 400 500 600 700 800 900 1000
Output Current: IOUT [mA]
Figure 10. Output Voltage vs. Load
(Over Current Protection)
Figure 9. Output Voltage vs. Power Supply Voltage
(IOUT = 10 mA)
90
80
70
60
50
40
30
20
10
0
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0.01
0.1
1
10
100
0
50 100 150 200 250 300 350 400 450 500
Output Current: IOUT [mA]
Frequency:f [kHz]
Figure 11. Dropout Voltage
(VCC = 3.135 V)
Figure 12. Ripple Rejection
(ein = 1 Vrms, IOUT = 100 mA)
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BD4xxM5-C Series
●Typical Performance Curves
■BD433M5WFPJ-C / BD433M5WFP2-C / BD433M5FP-C / BD433M5FP2-C Reference Data
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V (1), IOUT = 0 mA.
(1) Applicable for Product with Enable Input.
6
5
4
3
2
1
0
90
80
70
60
50
40
30
20
10
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
100
120
140
160
180
200
0
100
200
Output Current: IOUT [mA]
Figure 13. Circuit Current vs. Output Current
300
400
500
Junction Temperature:Tj [°C]
Figure 14. Output Voltage vs. Temperature
(Thermal Shut Down)
3.370
3.350
3.330
3.310
3.290
3.270
3.250
3.230
100
90
80
70
60
50
40
30
20
10
0
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature:Tj [°C]
-40
0
40
Junction Temperature:Tj [°C]
Figure 16. Circuit Current vs. Temperature
80
120
160
Figure 15. Output Voltage vs. Temperature
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BD4xxM5-C Series
●Typical Performance Curves
■BD433M5WFPJ-C / BD433M5WFP2-C Reference Data
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA
10
9
8
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
0
1
2
3
4
5
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
CTL Supply Voltage:CTL [V]
Figure 17. Shut Down Current vs. Power Supply Voltage
(CTL = 0 V)
Figure 18. CTL ON / OFF Mode Voltage
(Tj = -40 °C)
6
5
4
3
2
1
6
5
4
3
2
1
0
Tj = 25 °C
Tj = 125 °C
0
0
1
2
3
4
5
0
1
2
3
4
5
CTL Supply Voltage:CTL [V]
CTL Supply Voltage:CTL [V]
Figure 19. CTL ON / OFF Mode Voltage
(Tj = 25 °C)
Figure 20. CTL ON / OFF Mode Voltage
(Tj = 125 °C)
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BD4xxM5-C Series
●Typical Performance Curves
■BD433M5WFPJ-C / BD433M5WFP2-C Reference Data
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA
5
4
3
2
1
0
20
15
10
5
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
-40
0
40
80
120
160
0
1
2
3
4
5
Junction Temperature:Tj [°C]
CTL Supply Voltage:CTL [V]
Figure 21. Shut Down Current
(CTL = 0 V)
Figure 22. CTL Bias Current vs. CTL Supply Voltage
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BD4xxM5-C Series
●Typical Performance Curves
■BD450M5WFPJ-C / BD450M5WFP2-C / BD450M5FP-C/BD450M5FP2-C Reference Data
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5V (1), IOUT = 0 mA
(1) Applicable for Product with Enable Input.
100
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
Figure 23. Circuit Current vs. Power Supply Voltage
Figure 24. Output Voltage vs. Power Supply Voltage
(IOUT = 0 mA)
100
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
Supply Voltage:VCC [V]
Supply Voltage:VCC [V]
Figure 25. Circuit Current vs. Power Supply Voltage
*Magnified Figure 23. at low supply voltage
Figure 26. Output Voltage vs. Power Supply Voltage
(IOUT = 0 mA)
*Magnified Figure 24. at low supply voltage
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BD4xxM5-C Series
●Typical Performance Curves
■BD450M5WFPJ-C / BD450M5WFP2-C / BD450M5FP-C / BD450M5FP2-C Reference Data
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5V (1), IOUT = 0 mA
(1) Applicable for Product with Enable Switch.
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
0
100 200 300 400 500 600 700 800 900 1000
Output Current: IOUT [mA]
Figure 28. Output Voltage vs. Output Current
(Over Current Protection)
Figure 27. Output Voltage vs. Power Supply Voltage
(IOUT = 10 mA)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
90
80
70
60
50
40
30
20
10
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
50 100 150 200 250 300 350 400 450 500
Output Current: IOUT [mA]
0.01
0.1
1
10
100
Frequency:f [kHz]
Figure 29. Dropout Voltage
(VCC=4.75V)
Figure 30. Ripple Rejection
(ein = 1 Vrms, IOUT = 100 mA)
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BD4xxM5-C Series
●Typical Performance Curves
■BD450M5WFPJ-C / BD450M5WFP2-C / BD450M5WFP2-C / BD450M5FP-C / BD450M5FP2-C Reference Data
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5V (1), IOUT = 0 mA
(1) Applicable for Product with Enable Input.
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
100
200
300
400
500
100
120
140
160
180
200
Output Current: IOUT [mA]
Junction Temperature:Tj [°C]
Figure 32. Output Voltage vs. Temperature
(Thermal Shut Down)
Figure 31. Circuit Current vs. Output Current
5.100
5.080
5.060
5.040
5.020
5.000
4.980
4.960
4.940
4.920
4.900
100
90
80
70
60
50
40
30
20
10
0
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature:Tj [°C]
-40
0
40
80
120
160
Junction Temperature:Tj [°C]
Figure 33. Output Voltage vs. Temperature
Figure 34. Circuit Current vs. Temperature
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BD4xxM5-C Series
●Typical Performance Curves
■BD450M5WFPJ-C / BD450M5WFP2-C Reference Data
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA
10
9
8
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
0
1
2
3
4
5
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
CTL Supply Voltage:CTL [V]
Figure 35. Shut Down Current vs. Power Supply Voltage
(CTL = 0 V)
Figure 36. CTL ON / OFF Mode Voltage
(Tj = -40 °C)
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj = 25 °C
Tj = 125 °C
0
1
2
3
4
5
0
1
2
3
4
5
CTL Supply Voltage:CTL [V]
CTL Supply Voltage:CTL [V]
Figure 37. CTL ON / OFF Mode Voltage
(Tj = 25 °C)
Figure 38. CTL ON / OFF Mode Voltage
(Tj = 125 °C)
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BD4xxM5-C Series
●Typical Performance Curves
■BD450M5WFPJ-C / BD450M5WFP2-C Reference Data
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA
5
4
3
2
1
0
20
15
10
5
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
-40
0
40
80
120
160
0
1
2
3
4
5
Junction Temperature:Tj [°C]
CTL Supply Voltage:CTL [V]
Figure 39. Shut Down Current vs. Temperature
(CTL = 0 V)
Figure 40. CTL Bias Current vs. CTL Supply Voltage
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BD4xxM5-C Series
●Measurement Circuit for Typical Performance Curves (BD433 / 450M5WFPJ-C)
FIN
BD4xxM5WFPJ-C
2: CTL 4: N.C.
1: VCC 3: N.C. 5: VOUT
4.7μF
10μF
Measurement Setup for
Figure 6, 8, 14, 15,
Figure 24, 26, 32, 33
Measurement Setup for
Figure 5, 7, 16, 17, 21,
Figure 23, 25, 34, 35, 39
Measurement Setup for
Figure 9, 27
FIN
FIN
BD4xxM5WFPJ-C
BD4xxM5WFPJ-C
2: CTL 4: N.C.
2: CTL 4: N.C.
1: VCC 3: N.C. 5: VOUT
1: VCC 3: N.C. 5: VOUT
1Vrms
IOUT
10μF
4.7μF
10μF
IOUT
4.7μF
Measurement Setup for
Figure 11, 29
Measurement Setup for
Figure 10, 28
Measurement Setup for
Figure 12, 30
FIN
FIN
FIN
BD4xxM5WFPJ-C
BD4xxM5WFPJ-C
BD4xxM5WFPJ-C
2: CTL 4: N.C.
2: CTL 4: N.C.
2: CTL 4: N.C.
1: VCC 3: N.C. 5: VOUT
1: VCC 3: N.C. 5: VOUT
1: VCC 3: N.C. 5: VOUT
4.7μF
10μF
4.7μF
10μF
4.7μF
10μF
Measurement Setup for
Figure 13, 31
Measurement Setup for
Figure 22, 40
Measurement Setup for
Figure 18, 19, 20,
Figure 36, 37, 38
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BD4xxM5-C Series
●Measurement Circuit for Typical Performance Curves (BD433 / 450M5WFP2-C)
FIN
FIN
FIN
BD4xxM5WFP2-C
BD4xxM5WFP2-C
BD4xxM5WFP2-C
2: CTL
4: N.C.
2: CTL
4: N.C.
2: CTL
4: N.C.
1: VCC 3: GND 5: VOUT
1: VCC 3: GND 5: VOUT
1: VCC 3: GND 5: VOUT
4.7μF
10μF
4.7μF
10μF
IOUT
4.7μF
10μF
Measurement Setup for
Figure 6, 8, 14, 15,
Figure 24, 26, 32, 33
Measurement Setup for
Figure 5, 7, 16, 17, 21,
Figure 23, 25, 34, 35, 39
Measurement Setup for
Figure 9, 27
FIN
FIN
FIN
BD4xxM5WFP2-C
BD4xxM5WFP2-C
BD4xxM5WFP2-C
2: CTL
4: N.C.
2: CTL
4: N.C.
2: CTL
4: N.C.
1: VCC 3: GND 5: VOUT
1: VCC 3: GND 5: VOUT
1: VCC 3: GND 5: VOUT
1Vrms
IOUT
10μF
4.7μF
10μF
4.7μF
10μF
IOUT
4.7μF
Measurement Setup for
Figure 11, 29
Measurement Setup for
Figure 10, 28
Measurement Setup for
Figure 12, 30
FIN
FIN
FIN
BD4xxM5WFP2-C
BD4xxM5WFP2-C
BD4xxM5WFP2-C
2: CTL
4: N.C.
2: CTL
4: N.C.
2: CTL
4: N.C.
1: VCC 3: GND 5: VOUT
1: VCC 3: GND 5: VOUT
1: VCC 3: GND 5: VOUT
4.7μF
10μF
4.7μF
10μF
4.7μF
10μF
Measurement Setup for
Figure 13, 31
Measurement Setup for
Figure 22, 40
Measurement Setup for
Figure 18, 19, 20,
Figure 36, 37, 38
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BD4xxM5-C Series
●Measurement Circuit for Typical Performance Curves (BD433 / 450M5FP-C)
FIN
FIN
FIN
BD4xxM5FP-C
BD4xxM5FP-C
BD4xxM5FP-C
1: VCC 2: N.C. 3: VOUT
1: VCC 2: N.C. 3: VOUT
1: VCC 2: N.C. 3: VOUT
4.7 μF
10 μF
4.7 μF
10 μF
4.7 μF
10 μF IOUT
Measurement Setup for
Figure 6, 8, 14, 15,
Measurement Setup for
Figure 5, 7, 16,
Measurement Setup for
Figure 9, 27
Figure 24, 26, 32, 33
Figure 23, 25, 34
FIN
FIN
FIN
BD4xxM5FP-C
BD4xxM5FP-C
BD4xxM5FP-C
1: VCC 2: N.C. 3: VOUT
1: VCC 2: N.C. 3: VOUT
1: VCC 2: N.C. 3: VOUT
1Vrms
4.7 μF
10 μF
4.7 μF
10 μF
4.7 μF
10 μF
IOUT
Measurement Setup for
Figure 11, 29
Measurement Setup for
Figure 10, 28
Measurement Setup for
Figure 12, 30
FIN
BD4xxM5FP-C
1: VCC 2: N.C. 3: VOUT
4.7 μF
10 μF
IOUT
Measurement Setup for
Figure 13, 31
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BD4xxM5-C Series
●Measurement Circuit for Typical Performance Curves (BD433 / 450M5FP2-C)
FIN
FIN
BD4xxM5FP2-C
BD4xxM5FP2-C
1: VCC 2: GND 3: VOUT
1: VCC 2: GND 3: VOUT
4.7 μF
10 μF IOUT
4.7 μF
10 μF
Measurement Setup for
Figure 6, 8, 14, 15,
Measurement Setup for
Figure 5, 7, 16,
Measurement Setup for
Figure 9, 27
Figure 24, 26, 32, 33
Figure 23, 25, 34
FIN
FIN
BD4xxM5FP2-C
BD4xxM5FP2-C
1: VCC 2: GND 3: VOUT
1: VCC 2: GND 3: VOUT
1Vrms
4.7 μF
10 μF
IOUT
4.7 μF
10 μF
Measurement Setup for
Figure 11, 29
Measurement Setup for
Figure 10, 28
Measurement Setup for
Figure 12, 30
Measurement Setup for
Figure 13, 31
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BD4xxM5-C Series
●Selection of Components Externally Connected
・VCC
Insert capacitors with a capacitance of 0.1 μF or higher between the VCC and the GND. Choose the capacitance
according to the line between the power smoothing circuit and the VCC. Selection of the capacitance also depends
on the application. Verify the application and allow sufficient margins in the design. We recommend using a
capacitor with excellent voltage and temperature characteristics.
・Output Pin Capacitor
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND. We recommend
using a capacitor with a capacitance of 10 μF (Typ.) or higher. Electrolytic, tantalum and ceramic capacitors can be
used. When selecting the capacitor ensure that the capacitance of 6 μF or higher is maintained at the intended
applied voltage and temperature range. Due to changes in temperature the capacitor’s capacitance can fluctuate
possibly resulting in oscillation. For selection of the capacitor refer to the data of Figure 41.
The stable operation range given in the data of Figure 41 and Figure 42 is based on the standalone IC and resistive
load. For actual applications the stable operating range is influenced by the PCB impedance, input supply
impedance and load impedance. Therefore verification of the final operating environment is needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly fluctuation of input voltage and load current, select the capacitance in accordance with
verifying that the actual application meets with the required specification. Mount the capacitor as much as possible
near connected pin.
100
10
1000
○Condition:
VCC = 13.5 V
(CTL = 5 V)
○Condition:
VCC = 13.5 V
(CTL = 5 V)
Unstable OperationRange
Stable Operation Range
CIN = 0.1 μF
10 µF ≤ COUT (Typ.)
-40 °C ≤ Tj ≤ +150°C
CIN = 0.1 µF
-40 °C ≤ Tj ≤ +150 °C
100
10
1
1
0.1
Stable Operation Range
0.01
0.001
Unstable OperationRange
0
100
200 300
IOUT [mA]
400
500
0
100
200 300
IOUT [mA]
400
500
Figure 41. ESR vs. IOUT
Figure 42. COUT vs. IOUT
●Measurement setup
FIN
FIN
FIN
BD4xxM5FP2-C
BD4xxM5WFP2-C
BD4xxM5WFPJ-C
2: CTL
4: N.C.
2: CTL 4: N.C.
1: VCC 2: GND 3: VOUT
1: VCC 3: GND 5: VOUT
1: VCC 3: N.C. 5: VOUT
ESR
CIN
ESR
COUT
ESR
CIN
CIN
COUT
COUT
Figure 43. Measurement Setups for ESR Reference Data
(about Output Pin Capacitor)
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BD4xxM5-C Series
●Power Dissipation
■TO252-J5(F) / TO252-3
IC mounted on ROHM standard board based on JEDEC.
10
8
①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm × 0 mm)
Board material: FR4
Board size: 114.3mm × 76.2mm × 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.
②5.4 W
6
②: 4-layer PCB (Copper foil area on the reverse side of PCB: 74.2mm × 74.2mm)
Board material: FR4
Board size: 114.3mm × 76.2mm × 1.60 mmt
4
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.
2
2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm, 2 oz. copper.
①0.9 W
0
0
25
50
75
100
125
150 Condition①: θJA = 136 °C/W、ΨJT (top center) = 17 °C/W
Condition②: θJA = 23 °C/W、ΨJT (top center) = 3 °C/W
Ambient Temperature: Ta [°C]
Figure 44. Package Data
(TO252-J5 / TO252-3)
■TO263-5(F) / TO263-3(F)
IC mounted on ROHM standard board based on JEDEC.
10
①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm × 0 mm)
Board material: FR4
Board size: 114.3mm × 76.2mm × 1.57 mmt
8
6
4
2
0
Mount condition: PCB and exposed pad are soldered.
②5.9 W
①1.5 W
Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.
②: 4-layer PCB (Copper foil area on the reverse side of PCB: 74.2mm × 74.2mm)
Board material: FR4
Board size: 114.3mm × 76.2mm × 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm, 2 oz. copper.
Condition①: θJA = 81 °C/W、ΨJT (top center) = 8 °C/W
Condition②: θJA = 21 °C/W、ΨJT (top center) = 2 °C/W
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Figure 45. Package Data
(TO263-5 / TO263-3)
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BD4xxM5-C Series
●Thermal Design
This product exposes a frame on the back side of the package for thermal efficiency improvement.
Within this IC, the power consumption is decided by the dropout voltage condition, the load current and the circuit current.
Refer to power dissipation curves illustrated in Figure 44, 45 when using the IC in an environment of Ta ≥ 25 °C. Even if the
ambient temperature Ta is at 25 °C, depending on the input voltage and the load current, chip junction temperature can be
very high. Consider the design to be Tj ≤ Tjmax = 150 ℃ in all possible operating temperature range.
Should by any condition the maximum junction temperature Tjmax = 150℃ rating be exceeded by the temperature
increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is
based on recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient
margins in the thermal design by the following method is used to calculate the junction temperature Tj.
Tj can be calculated by either of the two following methods.
1. The following method is used to calculate the junction temperature Tj.
Tj = Ta + PC × θJA
Tj
: Junction Temperature
: Ambient Temperature
: Power Consumption
: Thermal Impedance
(Junction to Ambient)
Ta
PC
θJA
2. The following method is also used to calculate the junction temperature Tj.
Tj = TT + PC × ΨJT
Tj
: Junction Temperature
TT
PC
ΨJT
: Top Center of Case’s (mold) Temperature
: Power consumption
: Thermal Impedance
(Junction to Top Center of Case)
The following method is used to calculate the power consumption Pc (W).
Pc = (VCC - VOUT) × IOUT + VCC × Icc
PC
: Power Consumption
: Input Voltage
: Output Voltage
: Load Current
VCC
VOUT
IOUT
Icc
: Circuit Current
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BD4xxM5-C Series
・Calculation Example(TO252-J5(F) / TO252-3)
If VCC = 13.5 V, VOUT = 5.0 V, IOUT = 200 mA, Icc = 38 μA, the power consumption Pc can be calculated as follows:
PC = (VCC - VOUT) × IOUT + VCC × Icc
= (13.5 V – 5.0 V) × 200 mA + 13.5 V × 38 μA
= 1.7 W
At the ambient temperature Tamax = 85°C, the thermal Impedance ( Junction to Ambient )θJA = 23 °C / W( 4-layer PCB ),
Tj = Tamax + PC × θJA
= 85 °C + 1.7 W × 23 °C / W
= 124.1 °C
When operating the IC, the top center of case’s (mold) temperature TT = 100℃、ΨJT = 17 °C / W( 1-layer PCB ),
Tj = TT + PC × ΨJT
= 100 °C + 1.7 W × 17 °C / W
= 128.9 °C
For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and
thermal via between thermal land pad.
・Calculation Example (TO263-5(F) / TO263-3(F))
If VCC = 13.5 V, VOUT = 5.0 V, IOUT = 200 mA, Icc = 38 μA, the power consumption Pc can be calculated as follows:
PC = (VCC - VOUT) × IOUT + VCC × Icc
= (13.5 V – 5.0 V) × 200 mA + 13.5 V × 38 μA
= 1.7 W
At the ambient temperature Tamax = 85°C, the thermal impedance ( Junction to Ambient )θJA = 21 °C / W( 4-layer PCB ),
Tj = Tamax + PC × θJA
= 85 °C + 1.7 W × 21 °C / W
= 120.7 °C
When operating the IC, the top center of case’s (mold) temperature TT = 100℃、ΨJT = 8 °C / W( 1-layer PCB ),
Tj = TT + PC × ΨJT
= 100 °C + 1.7 W × 8 °C / W
= 113.6 °C
For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and
thermal via between thermal land pad.
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BD4xxM5-C Series
●Application Examples
・Applying positive surge to the VCC
If the possibility exists that surges higher than 45 V will be applied to the VCC, a Zener Diode should be placed between
the VCC and the GND as shown in the figure below.
FIN
FIN
FIN
BD4xxM5FP2-C
BD4xxM5WFP2-C
BD4xxM5FP-C
2:CTL
4:N.C.
1:VCC 2:GND 3:VOUT
1:VCC 3:GND 5:VOUT
1: VCC 2: N.C. 3: VOUT
Battery
VOUT
Battery
VOUT
Battery
VOUT
Input
switch
Zener
Diode
CIN
COUT IOUT
Zener
Diode
Zener
Diode
CIN
COUT
IOUT
CIN
COUT IOUT
Figure 46. Sample Application Circuit 1
・Applying negative surge to the VCC
If the possibility exists that negative surges lower than the GND are applied to the VCC, a Schottky Diode should
be place between the VCC and the pin as shown in the figure below.
FIN
FIN
FIN
BD4xxM5FP2-C
BD4xxM5WFP2-C
BD4xxM5FP-C
2:CTL
4:N.C.
1:VCC 2:GND 3:VOUT
1:VCC 3:GND 5:VOUT
1: VCC 2: N.C. 3: VOUT
Battery
VOUT
Battery
VOUT
Battery
VOUT
Input
switch
Shottky
Diode
Shottky
Diode
CIN
COUT IOUT
CIN
Shottky
Diode
COUT IOUT
CIN
COUT IOUT
Figure 47. Sample Application Circuit 2
・Implementing a Protection Diode
If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of
startup and shutdown, a protection diode should be placed as shown in the figure below.
Figure 48. Sample Application Circuit 3
●I/O Equivalence Circuit
Figue 49. Input / Output Equivalence Circuit
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●Operational Notes
1) Absolute Maximum Ratings
Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in
damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage
(e.g. short circuit, open circuit, etc.). Therefore, if any special mode is being considered with values expected to exceed
the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered.
2) The electrical characteristics given in this specification may be influenced by conditions such as temperature, supply
voltage and external components. Transient characteristics should be sufficiently verified.
3) GND Electric Potential
Keep the GND potential at the lowest (minimum) level under any operating condition. Furthermore, ensure that,
including the transient, none of the pin’s voltage is less than the GND voltage.
4) GND Wiring Pattern
When both a small-signal GND and a high current GND are present, single-point grounding (at the set standard point) is
recommended. This in order to separate the small-signal and high current patterns and to ensure that voltage changes
stemming from the wiring resistance and high current do not cause any voltage change in the small-signal GND.
Similarly, care must be taken to avoid wiring pattern fluctuations in any connected external component GND.
5) CTL
Do not make voltage level of chip enable keep floating level, or in between VthH and VthL. Otherwise, the output voltage
would be unstable or indefinite.
6) Inter-pin Shorting and Mounting Errors
Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in
damaging the IC. Also, shorts caused by dust entering between the output, input and the GND may result in damaging
the IC.
7) Inspection Using the Set Board
The IC needs to be discharged after each inspection process as, while using the set board for inspection, connecting a
capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the
assembly setup is grounded and take sufficient caution with transportation and storage. Also, make sure to turn off the
power supply when connecting and disconnecting the inspection equipment.
8) Thermal Design
The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin
should be allowed for in the thermal design. On the reverse side of the package this product has an exposed heat pad
for improving the heat dissipation. Use both the front and reverse side of the PCB to increase the heat dissipation
pattern as far as possible. The amount of heat generated depends on the voltage difference across the input and output,
load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat does not exceed
the Pd rating.
Should by any condition the maximum junction temperature Tjmax = 150℃ rating be exceeded by the temperature
increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this
specification is based on recommended PCB and measurement condition by JEDEC standard. Verify the application
and allow sufficient margins in the thermal design.
9) Overcurrent Protection Circuit
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not
be used in applications characterized by continuous operation or transitioning of the protection circuit.
10) Thermal Shut Down (TSD)
This IC incorporates and integrated thermal shutdown circuit to prevent heat damage to the IC. Normal operation should
be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature
(Tj) will rise and the TSD circuit will be activated and turn all output pins OFF. After the Tj falls below the TSD threshold
the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
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BD4xxM5-C Series
11) In some applications, the VCC and the VOUT potential might be reversed, possibly resulting in circuit internal damage
or damage to the elements. For example, the accumulated charge in the output pin capacitor flowing backward from the
VOUT to the VCC when the VCC shorts to the GND. In order to minimize the damage in such case, use a capacitor with
a capacitance less than 1000 μF. Also by inserting a reverse polarity diode in series to the VCC, it can prevent reverse
current from reverse battery connection or the case. When the point A is short-circuited GND, if there may be any
possible case point B is short-circuited to GND, we also recommend using a bypass diode between the VCC and the
VOUT.
Bypass Diode
Reverse Polarity Diode
A
VCC
VO
B
GND
Figure 50. Recommend Example of Using Diodes
12) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a
variety of parasitic elements.
For example, in case a resistor and a transistor are connected to the pins as shown in the figure below then:
○ The P/N junction functions as a parasitic diode when the GND > pin A for the resistor, or the GND > pin B for the
transistor.
○ Also, when the GND > pin B for the transistor (NPN), the parasitic diode described above combines with the N layer
of the other adjacent elements to operate as a parasitic NPN transistor.
Parasitic diodes inevitably occur in the structure of the IC. Their operation can result in mutual interference between
circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. Therefore do not
employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than
the (P substrate) GND.
Figure 51. Example of parasitic element device
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BD4xxM5-C Series
●Physical Dimension, Tape and Reel Information
Package Name
TO252-J5(F)
(F)
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BD4xxM5-C Series
Package Name
TO263-5(F)
(F)
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BD4xxM5-C Series
Package Name
TO252-3
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Package Name
TO263-3(F)
(F)
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BD4xxM5-C Series
●Marking Diagrams (Top View)
TO252-J5(F) (Top View)
TO263-5(F) (Top View)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
1Pin
1Pin
Part Number
Marking
Output
Voltage [V]
Enable
Part Number
Marking
Output
Voltage [V]
Enable
Input (1)
Input (1)
433M5W
450M5W
3.3
5.0
433M5W
450M5W
3.3
5.0
◯
◯
◯
◯
(1)
○: Includes Enable Input
(1)
○: Includes Enable Input
– : Not includes Enable Input
– : Not includes Enable Input
TO263-3(F) (Top View)
TO252-3
(Top View)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1Pin
Part Number
Marking
Output
Voltage [V]
Enable
Part Number
Marking
Output
Voltage [V]
Enable
Input (1)
Input (1)
433M5
450M5
3.3
5.0
433M5
450M5
3.3
5.0
–
–
–
–
(1)
○: Includes Enable Input
(1)
○: Includes Enable Input
– : Not includes Enable Input
– : Not includes Enable Input
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BD4xxM5-C Series
●Revision History
Date
Revision
Changes
New Release
5.Apr.2013
001
General description and key specifications revised.
Figure 1. FP2: TO263-5F H (Max.) revised.
Pin No. Fin of BD433 / 450M5WFPJ-C and BD433 / 450M5WFP2-C revised.
Figure 4. Block Diagrams (BD433 / 450M5WFPJ-C, BD433 / 450M5WFP2-C,
BD433 / 450M5FP-C, BD433 / 450M5FP2-C) revised.
Physical Dimension(TO252-J5F),
18.Oct.2013
002
Tape and Reel Information (TO263-5F, TO263-3F) revised.
Key specifications is revised to Features.
Calculation Example Figure No. of output current max.
about TO252-3, TO263-5F, TO263-3F revised.
Tape and Reel Information (TO263-5F, TO263-3F) revised.
01.Oct.2014
04.Feb.2015
003
004
Names of PKG revised.
Description of Thermal impedance (TO252-J5, TO252-3, TO263-5, TO263-3) revised.
Names of Ordering Information revised.
Title of Figure 45 revised.
Copper foil area on the reverse side of PCB revised.
AEC-Q100 (Note1:Grade1) appended.
23.May.2016
22.Feb.2017
005
006
Names of Ordering Information revised.
Improve the description, TO252-J5 to To252-J5(F), TO263-5 to TO263-5(F),
TO263-3 to TO263-3(F).
Measurement Figure revised.
TO252-J5(F), TO263-5(F), TO263-3(F)’s PKG information revised.
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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The BD4xxS2-C series are low quiescent regulators featuring 45V absolute maximum voltage, and output voltage accuracy of ±2% (3.3V or 5.0V: Typ), 200mA output current and 40µA (Typ) current consumption. These regulators are therefore ideal for applications requiring a direct connection to the battery and a low current consumption. A logical “HIGH” at the CTL pin enables the device and “LOW” at the CTL pin not enables the device. (Only W: Includes switch) Ceramic capacitors can be used for compensation of the output capacitor phase. Furthermore, these ICs also feature overcurrent protection to protect the device from damage caused by short-circuiting and an integrated thermal shutdown to protect the device from overheating at overload conditions.
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BD433S2FP3-C (新产品)
The BD4xxS2-C series are low quiescent regulators featuring 45V absolute maximum voltage, and output voltage accuracy of ±2% (3.3V or 5.0V: Typ), 200mA output current and 40µA (Typ) current consumption. These regulators are therefore ideal for applications requiring a direct connection to the battery and a low current consumption. A logical “HIGH” at the CTL pin enables the device and “LOW” at the CTL pin not enables the device. (Only W: Includes switch) Ceramic capacitors can be used for compensation of the output capacitor phase. Furthermore, these ICs also feature overcurrent protection to protect the device from damage caused by short-circuiting and an integrated thermal shutdown to protect the device from overheating at overload conditions.
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BD433S2WEFJ-C (新产品)
The BD4xxS2-C series are low quiescent regulators featuring 45V absolute maximum voltage, and output voltage accuracy of ±2% (3.3V or 5.0V: Typ), 200mA output current and 40µA (Typ) current consumption. These regulators are therefore ideal for applications requiring a direct connection to the battery and a low current consumption. A logical “HIGH” at the CTL pin enables the device and “LOW” at the CTL pin not enables the device. (Only W: Includes switch) Ceramic capacitors can be used for compensation of the output capacitor phase. Furthermore, these ICs also feature overcurrent protection to protect the device from damage caused by short-circuiting and an integrated thermal shutdown to protect the device from overheating at overload conditions.
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