BD37215MUV-E2 [ROHM]
Adjustable Negative LDO Regulator,;
| 型号： | BD37215MUV-E2 |
| 厂家： | 
ROHM |
| 描述： | Adjustable Negative LDO Regulator, 输出元件 调节器 |
| 文件： | 总27页 (文件大小：2055K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Power Supply IC for High Fidelity Audio
Negative Voltage Linear Regulator for
High Fidelity Audio
BD37215MUV
General Description
Key Specifications
BD37215MUV is a linear regulator of low noise
(5.1µVrms) which is most suitable to high quality audio
system. It operates at -16V to -3V and capable of
supplying a maximum load of 1000mA.
■
■
■
■
Input Voltage Range:
-16.0V to -3.0V
-15.0V to -1.0V
1.0A(Max)
Output Voltage Range:
Output Current:
Output Voltage Noise(Note 1)
:
5.1µVrms(10Hz to 100kHz, Typ)
In addition to the low noise, BD37215MUV has a high
PSRR and good input transient fluctuation
characteristic which makes it suitable for the
stabilization of DC/DC converter output, and an ideal
power supply to high precision analog circuits such as
operational amplifier and headphone amplifier for
audio.
■
■
■
■
PSRR(Note 2): 90dB(1kHz, Typ), 55dB(1MHz, Typ)
Input Transient Response:
Standby Current:
3mV(1.0V/µs, Typ)
9.2µA(Typ)
Operating Temperature Range: -40°C to +85°C
(Note 1) CBC=10µF, VOUT= -1.0V, IOUT=0.5A setting
(Note 2) COUT=47µF, VOUT= -1.0V, IOUT=0.5A setting
Package
VQFN020V4040
W(Typ) x D(Typ) x H(Max)
4.00mm x 4.00mm x 1.00mm
Furthermore, when BD37215MUV is placed in standby
mode, the supply current can be as small as
9.2µA(Typ) which can greatly reduce power consump-
tion.
Features
■
■
Ultra Low Noise, High PSRR
Standby Mode controlled by Enable Pin
using the positive voltage
■
■
Soft Start Function controlled by External
Capacitor
Under Voltage Lockout Protection, Over Current
Protection, Thermal Shutdown Protection
VQFN020V4040
Applications
■
■
High Quality Audio Equipment
Power Supply for Operational Amplifier and Head-
phone Amplifier
Typical Application Circuit
VIN= -6.0V
CIN
10µF
VOUT= -5.0V
Switching
Regulator
VIN
EN
VO
VS
COUT
10µF
VEN= +3.0V
Headphone
Amplifier
Amplifier
BAS
BAO
BC
CBC
1µF
R2
30kΩ
R1
120kΩ
GND
Figure 1. Basic Application Circuit Diagram (VOUT= -5.0V)
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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BD37215MUV
Pin Configuration
(TOP VIEW)
16.VIN
17.VIN
18.NC
19.VO
20.VO
10.NC
9.NC
8.EN
7.GND
6.NC
EXP-PAD
Figure 2. Pin Configuration
Output voltage
Pin Description
Pin No.
Pin Name
VO
Function
1
2
3
VS
Output voltage feedback
No connect (Note 3)
NC
4
NC
No connect (Note 3)
5
BC
Bypass capacitor pin connected to ground
No connect (Note 3)
Ground
6
NC
7
GND
EN
8
Enable
9
NC
No connect (Note 3)
No connect (Note 3)
Programmed voltage feedback
Programmed voltage output
No connect (Note 3)
No connect (Note 3)
Input voltage
10
11
12
13
14
15
16
17
18
19
20
NC
BAS
BAO
NC
NC
VIN
VIN
VIN
NC
Input voltage
Input voltage
No connect (Note 3)
VO
Output voltage
VO
Output voltage
The exposed pad should be connected to VIN
pattern.
-
EXP-PAD
(Note 3) The NC PINs should not be connected to any pattern or should be connected to GND.
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BD37215MUV
Block Diagram
EN
OCP , TSD , UVLO
8
2
1
VS
VO
VO
VO
BG
ERR
AMP
19
20
100kΩ
REF
AMP
BC
CHARGE
15
17
VIN VIN
12
16
11
5
7
GND
BAS
BAO
BC
VIN
Figure 3. Block Diagram
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BD37215MUV
Description of Block
1. Enable
Assuming EN is set to L, the IC can be set to standby state. In standby state, the output is OFF and since it will be in
static state, the power consumption can be reduced. It is unavailable to input the negative voltage to EN.
2. Rising, Falling, and EN Controlled Timing
0V
-0.9V(Typ)
VIN
-2.30V(Typ)
-2.30V(Typ)
-2.45V(Typ)
-2.45V(Typ)
+1.8V(Typ)
+1.6V(Typ)
EN
0V
UVLO
(internal
signal)
H
L
OUTPUT
DISABLE
(internal
signal)
H
L
0V
VOUT
85%
85%
85%
-1.0V
0V
BC
85%
-1.0V
9ms
9ms
EN ON
EN OFF
UVLO
detect
time
UVLO
release
UVLO
detect
UVLO
release
Figure 4. The Sequence Waveform During VIN/EN Rising and Falling
(When at Capacitance of CBC 1µF and Output -1.0V Settings)
It will operate if EN is H and UVLO (Under Voltage Lockout) is released. In addition, when EN is L or UVLO is detected,
the regulator operation stops.
VIN does not have the necessity to supply earlier than EN.
The maximum slew rate of input voltage has to be set 1.0V/µs or below.
3. Soft Start Function
In BD37215MUV, there exists a function that limits the rising speed of output when EN rises by the capacitor connected
to BC due to decrease of inrush current of output. The rising speed depends on the internal charging current
100µA(Typ), the capacitance value connected to BC and on the output programmed voltage. It is about 9ms (Typ) if
capacitance of CBC is 1µF and output programmed voltage is -1.0V, and almost 40ms (Typ) if output programmed
voltage is set to -5.0V. The above is an aim level, and soft start time may change depending on the input and output
voltage condition.
4. REFAMP
REFAMP sets its output voltage. Refer Selection of Components Externally Connected (Page 16) about setting of output
voltage.
5. BC
Noise at the output voltage of REFAMP is reduced because of the internal resistor 100kΩ and the external BC capacitor.
In addition to it, the external BC capacitor also has a soft start function so the rising speed can be adjusted by this value.
The higher value of capacitor will decrease the noise but the soft start time will be longer.
6. ERRAMP
The ERRAMP outputs the voltage set in REFAMP at 1 time of closed gain. VS must be connected to VO by all means. In
addition, VS can decrease a voltage drop by the pattern resistance on the VO course by returning the voltage from the
supply point.
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BD37215MUV
Absolute Maximum Rating (Ta = 25°C)
Parameter
Symbol
VIN
Rating
Unit
V
Power Supply Voltage
(PIN 15, 16, 17)
-17.5 to +0.3
EN Pin Voltage (PIN 8)
VEN
VPIN1
VPIN2
Tstg
-0.3 to +7.0
-7.0 to +0.3
-17.5 to +0.3
-55 to +150
150
V
V
Pin Voltage (PIN 11)
Pin Voltage (PIN 1, 2, 5, 12, 19, 20)
Storage Temperature Range
Maximum Junction Temperature
V
°C
°C
Tjmax
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the
maximum junction temperature rating.
Thermal Resistance (Note 4)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s (Note 6)
2s2p (Note 7)
VQFN020V4040
Junction to Ambient
Junction to Top Characterization Parameter(Note 5)
θJA
153.90
13.00
37.40
7.00
°C/W
°C/W
ΨJT
(Note 4) Based on JESD51-2A(Still-Air)
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 6) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
70µm
Footprints and Traces
(Note 7) Using a PCB board based on JESD51-5, 7.
Layer Number of
Material
Thermal Via (Note 8)
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Measurement Board
Pitch
Diameter
4 Layers
FR-4
1.20mm
Φ0.30mm
Top
Bottom
Copper Pattern
Thickness
70µm
Copper Pattern
Thickness
35µm
Copper Pattern
Thickness
70µm
Footprints and Traces
74.2mm (Square)
74.2mm (Square)
(Note 8) This thermal via connects with the copper pattern of all layers.
Recommended Operating Conditions
Parameter
Symbol
VIN
Min
Typ
Max
-3.0
-1.0
Unit
V
Power Supply Voltage
-16.0
-15.0
-
-
Output Voltage Setting is within a
Possible Range
Output Current (Note 9)
VOUT
V
IOUT
-
-
1.0
A
Operating Temperature
Topr
-40
+25
+85
°C
(Note 9) Tjmax should not be exceeded.
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BD37215MUV
Operating Condition
Parameter
Symbol
CIN
Min
2.2
1
Typ
10
10
1
Max
Unit
µF
Conditions
Film capacitors are
recommended
Film capacitors are
recommended
Film capacitors are
recommended
Input Capacitor (Note 10)
Output Capacitor (Note 10, 11)
BC Capacitor (Note 10, 11)
-
-
-
COUT
CBC
µF
0.01
µF
(Note 10) Set the capacity of the capacitor not to be less than the minimum in consideration of temperature or DC bias properties.
(Note 11) Refer the Selection of Components Externally Connected written in Page 16 and Page 17, and decide the value of each capacitor.
Electrical Characteristics
(Unless otherwise specified, VIN= VOUT-1.0V or -3.0V whichever is smaller VOUT= -1.0V Ta=25°C COUT=10µF CBC=1µF IOUT=5mA
VEN= +3V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Circuit Current (Note 12)
Standby Current (Note 12)
Reference Voltage
ICC
ISTB
VREF
DVI
-
-
2.0
9.2
-1.00
-1
4.0
22.5
-0.99
-
mA
µA
V
-
VIN= -16V, VEN=0V
BAO voltage
-1.01
-20
-20
Line Regulation
Load Regulation (Note 13)
mV
mV
VIN= -3V to -16V
IOUT=0A to 1000mA
DVL
-3
-
IOUT=1000mA,
VOUT= -3.3V
Dropout Voltage (Note 13)
VSAT
-0.5
-0.3
-
V
PSRR 1kHz
PSRR 1MHz
PSRR1kHz
PSRR1MHz
-
-
90
55
-
-
dB
dB
f=1kHz , COUT=47µF
f=1MHz, COUT=47µF
BW=10Hz to 100kHz,
CBC=10µF, IOUT=500mA
Output Noise Voltage (Note 13)
VNOISE
IOCP
-
5.1
-
-
-
µVrms
mA
Over Current Protection
Detect Current (Note 13)
1000
-
UVLO Detect Voltage
UVLO Release Voltage
EN Input H Level
VUVLOH
VUVLOL
VTHENH
VTHENL
IEN
-2.50
-2.65
2.5
-2.30
-2.45
-
-2.10
-2.25
5.5
V
V
-
-
-
-
-
V
EN Input L Level
0.0
-
0.8
V
EN Input Current
-
1.23
2.20
µA
(Note 12) The polarity of ICC and ISTB are defined that the direction of current flowing from VIN are positive.
(Note 13) The polarity of IOCP and IOUT are defined that the direction of current flowing to VO are positive.
.
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BD37215MUV
Typical Performance Curves
(Unless otherwise specified, VIN= VOUT-1.0V or -3.0V whichever is smaller VOUT= -1.0V Ta=25°C COUT=10µF CBC=1µF IOUT=5mA
VEN= +3V)
10.00
1.00
0.10
0.01
10.00
1.00
0.10
0.01
VOUT= -5.0V
IOUT=0.5A
COUT=10µF
VOUT= -1.0V
IOUT=0.5A
COUT=10µF
CBC=0.1µF
VNOISE=30.40µVrms
CBC=0.1µF
VNOISE=7.81µVrms
CBC=1µF
VNOISE=6.44µVrms
CBC=1µF
VNOISE=5.15µVrms
CBC=10µF
VNOISE=5.06µVrms
CBC=10µF
VNOISE=5.16µVrms
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
Frequency [Hz]
Frequency [Hz]
Figure 5. Noise Spectral Density vs Frequency
(VOUT= -1.0V)
Figure 6. Noise Spectral Density vs Frequency
(VOUT= -5.0V)
10.00
1.00
0.10
0.01
10.00
1.00
0.10
0.01
VOUT= -1.0V
CBC=1µF
COUT=10µF
VOUT= -5.0V
CBC=1µF
COUT=10µF
IOUT=1A
VNOISE=6.61µVrms
IOUT=1A
VNOISE=5.51µVrms
IOUT=500mA
VNOISE=6.44µVrms
IOUT=500mA
VNOISE=5.15µVrms
IOUT=50mA
VNOISE=6.05µVrms
IOUT=50mA
VNOISE=4.83µVrms
IOUT=5mA
VNOISE=6.01µVrms
IOUT=5mA
VNOISE=4.95µVrms
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
Frequency [Hz]
Frequency [Hz]
Figure 7. Noise Spectral Density vs Frequency
(VOUT= -1.0V)
Figure 8. Noise Spectral Density vs Frequency
(VOUT= -5.0V)
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BD37215MUV
Typical Performance Curves – continued
10.00
1.020
1.015
1.010
1.005
1.000
0.995
0.990
0.985
0.980
IOUT=0.5A
CBC=1µF
COUT=10µF
1.00
0.10
0.01
VOUT= -12.0V
VNOISE=11.22µVrms
VOUT= -5.0V
VNOISE=6.44µVrms
VOUT= -1.0V
VNOISE=5.15µVrms
10
100
1k
Frequency [Hz]
Figure 9. Noise Spectral Density vs Frequency
10k
100k
1M
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
Input Voltage:-VIN [V]
Figure 10. Line Regulation (DVI)
(VOUT= -1.0V)
5.10
5.08
5.06
5.04
5.02
5.00
4.98
4.96
4.94
4.92
4.90
1.020
1.015
1.010
1.005
1.000
0.995
0.990
0.985
0.980
5
6
7
8
9
10 11 12 13 14 15 16 17
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Output Current:IOUT [A]
Input Voltage:-VIN [V]
Figure 11. Line Regulation (DVI)
(VOUT= -5.0V)
Figure 12. Load Regulation (DVL)
(VOUT= -1.0V)
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BD37215MUV
Typical Performance Curves – continued
5.10
5.08
5.06
5.04
5.02
5.00
4.98
4.96
4.94
4.0
3.0
2.0
1.0
0.0
4.92
4.90
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Output Current:IOUT [A]
0
1
2
3
4
5
Input Voltage:-VIN [V]
Figure 13. Load Regulation (DVL)
(VOUT= -5.0V)
Figure 14. VOUT vs VIN
(VOUT= -3.3V)
6.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
5.0
4.0
3.0
2.0
1.0
0.0
0
1
2
3
4
5
6
0
2
4
6
8
10 12 14 16
Input Voltage:-VIN [V]
Input Voltage:-VIN [V]
Figure 16. ICC vs VIN
Figure 15. VOUT vs VIN
(VOUT= -5.0V)
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BD37215MUV
Typical Performance Curves – continued
10.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
0
2
4
6
8
10 12 14 16
0.0
0.5
1.0
1.5
2.0
2.5
Input Voltage:-VIN [V]
Figure 17. ISTB vs VIN
Output Current:IOUT [A]
Figure 18. VOUT vs IOUT
1.020
1.015
1.010
1.005
1.000
0.995
0.990
0.985
0.980
5.10
5.08
5.06
5.04
5.02
5.00
4.98
4.96
4.94
4.92
4.90
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
Temperature:Ta [°C]
Temperature:Ta [°C]
Figure 19. VOUT vs Ta
(VOUT= -1.0V)
Figure 20. VOUT vs Ta
(VOUT= -5.0V)
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BD37215MUV
Typical Performance Curves – continued
120
120
100
80
60
40
20
0
IOUT=500mA
VOUT= -1.0V
100
80
60
40
20
0
COUT=47µF
COUT=10µF
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
Frequency [Hz]
Frequency [Hz]
Figure 21. Power-Supply Rejection Ratio
(VOUT= -1.0V)
Figure 22. Power-Supply Rejection Ratio
(VOUT= -1.0V)
120
100
80
60
40
20
0
120
100
80
60
40
20
0
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
Frequency [Hz]
Frequency [Hz]
Figure 23. Power-Supply Rejection Ratio
(VOUT= -5.0V)
Figure 24. Power-Supply Rejection Ratio
(VOUT= -3.3V)
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BD37215MUV
Typical Performance Curves – continued
120
100
80
60
40
20
0
120
VOUT= -3.3V
IOUT=50mA
COUT=47µF
100
80
60
40
20
0
VSAT=0.3V
VSAT=0.5V
VSAT=0.7V
VSAT=1.0V
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
Frequency [Hz]
Frequency [Hz]
Figure 25. Power-Supply Rejection Ratio
(VOUT= -5.0V)
Figure 26. Power-Supply Rejection Ratio
(VOUT= -3.3V)
120
100
80
60
40
20
0
120
100
80
60
40
20
0
VOUT= -5.0V
IOUT=50mA
COUT=47µF
IOUT=500mA
COUT=47µF
VOUT= -12.0V
VOUT= -5.0V
VOUT= -3.3V
VOUT= -1.0V
VSAT=0.3V
VSAT=0.5V
VSAT=0.7V
VSAT=1.0V
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
Frequency [Hz]
Frequency [Hz]
Figure 27. Power-Supply Rejection Ratio
(VOUT= -5.0V)
Figure 28. Power-Supply Rejection Ratio
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BD37215MUV
Typical Performance Curves – continued
Figure 29. Soft Start
(VOUT= -1.0V)
Figure 30. Soft Start
(VOUT= -5.0V)
Figure 31. Line Transient
Figure 32. Line Transient
(IOUT=500mA Slew Rate=1.0V/µs VOUT= -1.0V COUT=2.2µF)
(IOUT=500mA Slew Rate=1.0V/µs VOUT= -5.0V COUT=2.2µF)
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Typical Performance Curves – continued
Figure 33. Line Transient
Figure 34. Line Transient
(IOUT=500mA Slew Rate=0.2V/µs VOUT= -1.0V COUT=2.2µF)
(IOUT=500mA Slew Rate=0.2V/µs VOUT= -5.0V COUT=2.2µF)
IOUT: 200mA/Div
VOUT: 50mV/Div (AC)
Figure 35. Load Transient
Figure 36. Load Transient
(IOUT=0mA ～ 500mA VOUT= -1.0V COUT=2.2µF)
(IOUT=0mA ～ 500mA VOUT= -5.0V COUT=2.2µF)
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BD37215MUV
Application Examples
VIN= -6.0V
VOUT= -5.0V
VIN
VO
VS
CIN
10µF
VEN= +3.0V
COUT
10µF
EN
BAS
BAO
BC
CBC
1µF
R2
30kΩ
R1
120kΩ
GND
Parts
R1
Maker
Value
Parts Number
ROHM
ROHM
120kΩ
30kΩ
10µF
10µF
1µF
MCR03EZPD1203
MCR03EZPD3002
16MU106M4532
16MU106M4532
16MU105M3216
R2
CIN
Rubycon
Rubycon
Rubycon
COUT
CBC
(Note) This application example is just one case. Actual setting will be decided after a thorough evaluation and verification in the set.
(Note) The value of R1 and R2 is set that R1 + R2 becomes 100kΩ or above.
The resistance for voltage setting is recommended the one that is 1% accuracy or below.
(Note) Set the capacity of the capacitor not to be less than the minimum in consideration of temperature or DC bias properties.
Figure 37. Application Circuit (VOUT= -5.0V)
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Selection of Components Externally Connected
VIN
VOUT
VIN
VO
VS
CIN
COUT
EN
VEN
BAS
BAO
BC
CBC
R2
R1
GND
Figure 38. External Components Connection
1. Output Voltage Setting
To set output voltage, connect resistance of R1 between BAO-BAS and connect resistance of R2 in between BAS-GND.
The value of R1 and R2 is set that R1 + R2 becomes 100kΩ or above. In addition, the resistance for voltage setting is
recommended the one that is 1% accuracy or below. In the case to use -1.0V setting, short BAS with BAO.
푅 +푅
1
2
푉푂푈푇 = 푉퐵퐴푆
×
[V]
푅
2
푉퐵퐴푆 = -1.0V (Typ)
2. Output Capacitor COUT
Output capacitor should be selected 1µF or above considering about the voltage modulation, thermal characteristics,
and distribution of the value. Installation of output capacitor in the position near the pin in between VO and GND is
recommended. In addition, the rated voltage of capacitor should be set with enough margins to output voltage.
The ESR of Output Capacitor effect the stability of IC operation. Refer the stable operation range for the selection of
Output Capacitor which is given in the reference data of Figure 39. This reference data is measured in combination of
the ceramic capacitor of 2.2µF and resistance in series to Output. The Stable operation range of this graph is given by
only the IC and load resistance. For actual applications the stable operating range is influenced by the wiring impedance
of the PCB panel, input supply impedance and load impedance. Therefore verification of the final operating environment
is needed.
10.00
Unstable Operation Range
1.00
0.10
Stable Operation Range
VIN= -6.0V
VOUT= -5.0V
-40°C≤Ta≤85°C
0.01
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Output Current:IOUT [A]
Figure 39. ESR of COUT vs IOUT
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BD37215MUV
Selection of Components Externally Connected – continued
3. Input Capacitor CIN
Input capacitor should be selected 2.2µF or above considering about the voltage modulation, thermal characteristics,
and distribution of the value. Installation of input capacitor in the position close to the pin in between VIN and GND is
recommended also. In addition, the rated voltage of capacitor shall be set with enough margins with respect to input
voltage.
4. Filter Capacitor CBC
Filter capacitor CBC and built-in resistance formed a low pass filter that reduces the noise that appears in output voltage.
In addition, the filter capacitor CBC also has a soft start function because it limits the rush current of output when it starts.
The rising speed depends on the internal charging current 100µA (Typ), the capacitance value connected to BC and on
the output programmed voltage. The time of the soft start is about 9ms (Typ) if capacitance is 1µF and output
programmed voltage is -1.0V, and almost 40ms (Typ) if output programmed voltage is set to -5.0V.
Because the higher value of capacitor will decrease the noise but the soft start time will be longer, it should be decided
that the proper value of the capacitance.
Refer the following calculation for CBC capacitance. Depending on the output capacitor, there is a possibility not to
operate properly.
ꢀ
ꢁꢂꢃ
퐶퐵ꢀ
≥
[F]
ꢄ000
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I/O Equivalence Circuits
VIN (PIN 15,16,17) / VO (PIN 1,19,20)
EN (PIN 8)
BAO (PIN 12)
100kΩ
EN
VO
(PIN 8)
BAO
(PIN 12)
(PIN 1, 19, 20)
VIN
(PIN 15, 16, 17)
VIN
BAS (PIN 11)
BC (PIN 5)
VS (PIN 2)
VS
(PIN 2)
BC
(PIN 5)
BAS
(PIN 11)
VIN
Figure 40. I/O Equivalence Circuits
VIN
PCB Layout Example
TOP
BOTTOM
(Board Size 60mm x 60mm, Board Thickness 1.6mm, Material FR-4)
Figure 41. Circuit Diagram of Evaluation Board (Typical Application Circuit setting)
(Note) This PCB Layout example includes the other device pattern also. This IC position is U1.
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BD37215MUV
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Except for EN pin, ensure that no pins are at a voltage above that of the ground pin at any time, even during transient
condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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BD37215MUV
Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When VIN > Pin A and VIN > Pin B, the P-N junction operates as a parasitic diode.
When VIN > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the VIN voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
P Substrate
VIN
VIN
VIN
VIN
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 42. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD37215MUV
Ordering Information
B D 3
7
2
1
5 M U V -
E 2
Part Number
Package
MUV:VQFN020V4040
Packaging and forming specification
E2: Embossed tape and reel
(VQFN020V4040)
Marking Diagram
VQFN020V4040 (TOP VIEW)
Part Number Marking
3 7 2 1 5
LOT Number
1PIN MARK
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BD37215MUV
Physical Dimension, Tape and Reel Information
Package Name
VQFN020V4040
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BD37215MUV
Revision History
Date
Revision
Changes
02.May.2017
16.Feb.2018
001
002
New Release
Renewed the title
Renewed Typical Performance Curves
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet
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BD37215MUV - Web Page
Distribution Inventory
Part Number
Package
Unit Quantity
BD37215MUV
VQFN020V4040
2500
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
2500
Taping
inquiry
Yes
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