BD2224G_11 [ROHM]
1ch Small Package High Side Switch ICs for USB Devices and Memory Cards; 对USB设备和存储卡1路小包装高端开关IC
| 型号： | BD2224G_11 |
| 厂家： | 
ROHM |
| 描述： | 1ch Small Package High Side Switch ICs for USB Devices and Memory Cards |
| 文件： | 总13页 (文件大小：351K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Power Management Switch ICs for PCs and Digital Consumer Products
1ch Small Package
High Side Switch ICs
for USB Devices and Memory Cards
BD2224G,BD2225G
No.11029EBT17
●Description
BD2224G and BD2225G are low on-resistance N-channel MOSFET high-side power switches, optimized for Universal
Serial Bus (USB) applications. BD2224G and BD2225G are equipped with the function of over-current detection, thermal
shutdown, under-voltage lockout and soft-start.
●Features
1) Low On-Resistance (Typ. 150mΩ) N-channel MOSFET Built-in
2) Over-Current Detection
3) Thermal Shutdown
4) Open-Drain Fault Flag Output
5) Under-Voltage Lockout
6) Soft-Start Circuit
7) Input Voltage Range: 2.7V ~ 5.5V
8) Control Input Logic Active-High (BD2224G), Active-Low (BD2225G)
9) SSOP5 Package
●Absolute Maximum Ratings (Ta=25℃)
Parameter
VIN Supply voltage
EN(/EN) input voltage
/OC Voltage
Symbol
VIN
Ratings
-0.3 ~ 6.0
-0.3 ~ 6.0
-0.3 ~ 6.0
5
Unit
V
VEN(/EN)
V/OC
I/OC
V
V
/OC Sink current
VOUT Voltage
mA
V
VOUT
TSTG
Pd
-0.3 ~ VIN + 0.3
-55 ~ 150
675 *1
Storage temperature
Power dissipation
℃
mW
*1 Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1℃ above 25℃.
This IC is not designed to be radiation-proof.
*
●Operating Conditions
Parameter
Ratings
Typ.
Symbol
VIN
Unit
V
Min.
2.7
Max.
5.5
VIN operating voltage
Operating temperature
5.0
-
TOPR
-40
85
℃
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.05 - Rev.B
1/12
Technical Note
BD2224G,BD2225G
●Electrical Characteristics
(VIN= 5V, Ta= 25℃, unless otherwise specified.)
DC Characteristics
Limits
Parameter
Operating current
Symbol
Unit
μA
Conditions
Min.
-
Typ.
Max.
160
VEN= 5V (BD2224G)
V/EN= 0V (BD2225G)
IDD
110
VOUT= open
VEN= 0V (BD2224G)
V/EN= 5V (BD2225G)
VOUT= open
Standby current
ISTB
-
0.01
5
μA
VEN(/EN)
VEN(/EN)
2.0
-
-
-
-
V
V
High input
Low input
EN(/EN) input voltage
EN(/EN) input leakage
On-resistance
0.8
IEN(/EN)
RON
ITH
-1
-
0.01
150
780
-
1
200
1000
-
μA
mΩ
mA
mA
V
VEN(/EN)= 0V or 5V
IOUT= 50mA
Over-current threshold
Short circuit output current
/OC output low voltage
UVLO threshold
550
350
-
ISC
VOUT= 0V, RMS
I/OC= 0.5mA
V/OC
VTUV
-
0.4
2.1
2.0
2.3
2.2
2.5
2.4
V
V
VIN increasing
VIN decreasing
AC Characteristics
Parameter
Limits
Typ.
Symbol
TON1
Unit
ms
ms
μs
Conditions
RL= 20Ω
Min.
-
Max.
6
Output rise time
Output turn-on time
Output fall time
1
1.5
1
TON2
-
-
10
20
40
20
RL= 20Ω
TOFF1
TOFF2
T/OC
RL= 20Ω
Output turn-off time
/OC delay time
-
3
μs
RL= 20Ω
10
15
ms
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.05 - Rev.B
2/12
Technical Note
BD2224G,BD2225G
●Measurement Circuit
VIN
VIN
A
A
VIN
VOUT
/OC
VIN
VOUT
/OC
L
R
1µF
1µF
GND
GND
EN(/EN)
V
EN(/EN)
V
EN(/EN)
EN(/EN)
EN,/EN Input voltage, Output rise/fall time
Operating current
VIN
VIN
A
10kΩ
A
OC
I
VIN
VOUT
/OC
VIN
VOUT
/OC
1µF
1µF
OUT
I
GND
GND
EN(/EN)
V
EN(/EN)
V
EN(/EN)
EN(/EN)
On-resistance, Over-current detection
/OC Output low voltage
Fig.1 Measurement circuit
●Timing Diagram
50%
50%
50%
50%
VEN
V/EN
TON2
TON2
TOFF2
TOFF2
90%
10%
90%
90%
10%
90%
10%
VOUT
VOUT
10%
TON1
TOFF1
TON1
TOFF1
Fig.2 Output rise/fall time
(BD2224G)
Fig.3 Output rise/fall time
(BD2225G)
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.05 - Rev.B
3/12
Technical Note
BD2224G,BD2225G
●Reference Data
140
140
120
100
80
1.0
0.8
0.6
0.4
0.2
0.0
Ta=25°C
VIN=5.0V
Ta=25°C
120
100
80
60
40
20
0
60
40
20
0
-50
0
50
100
2
-50
2
3
4
5
6
100
6
2
-50
2
3
4
5
6
AMBIENT TEMPERATURE : Ta[
]
SUPPLY VOLTAGE : VIN[V]
SUPPLY VOLTAGE : VIN[V]
℃
Fig.6 Standby current
EN,/EN disable
Fig.4 Operating current
EN,/EN enable
Fig.5 Operating current
EN,/EN enable
2.0
1.5
1.0
0.5
0.0
2.0
1.5
1.0
0.5
0.0
1.0
0.8
0.6
0.4
0.2
0.0
Ta=25°C
VIN=5.0V
VIN=5.0V
Low to High
High to Low
Low to High
High to Low
0
50
2
3
4
5
6
0
50
100
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
AMBIENT TEMPERATURE : Ta[
]
℃
Fig.7 Standby current
EN,/EN disable
Fig.8 EN,/EN input voltage
Fig.9 EN,/EN input voltage
200
150
100
50
200
150
100
50
1.0
0.9
0.8
0.7
0.6
0.5
Ta=25°C
Ta=25°C
VIN=5.0V
0
0
3
4
5
-50
0
50
100
3
4
5
6
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
SUPPLY VOLTAGE : VIN[V]
℃
Fig.10 On-resistance
Fig.11 On-resistance
Fig.12 Over-current threshold
1.0
0.9
0.8
0.7
0.6
0.5
100
80
60
40
20
0
100
80
60
40
20
0
VIN=5.0V
VIN=5.0V
Ta=25°C
-50
0
50
100
2
3
4
5
6
-50
0
50
AMBIENT TEMPERATURE : Ta[ ]
℃
100
AMBIENT TEMPERATURE : Ta[
]
SUPPLY VOLTAGE : VIN[V]
℃
Fig.13 Over-current threshold
Fig.14 /OC output low voltage
Fig.15 /OC output low voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.05 - Rev.B
4/12
Technical Note
BD2224G,BD2225G
2.5
1.0
0.8
0.6
0.4
0.2
0.0
5.0
4.0
3.0
2.0
1.0
0.0
VIN=5.0V
VIN=5.0V
Ta=25°C
2.4
2.3
VTUVH
2.2
VTUVL
2.1
2.0
-50
0
50
100
100
6
-50
0
50
100
2
3
4
5
6
AMBIENT TEMPERATURE : Ta[
AMBIENT TEMPERATURE : Ta[
]
℃
SUPPLY VOLTAGE : VIN[V]
℃]
Fig.16 UVLO threshold
Fig.17 UVLO hysteresis voltage
Fig.18 Output rise time
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VIN=5.0V
VIN=5.0V
-50
0
50
2
3
4
5
6
-50
0
50
AMBIENT TEMPERATURE : Ta[ ]
℃
100
AMBIENT TEMPERATURE : Ta[
]
SUPPLY VOLTAGE : VIN[V]
℃
Fig.19 Output rise time
Fig.20 Output turn-on time
Fig.21 Output turn-on time
5.0
5.0
4.0
3.0
2.0
1.0
0.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
VIN=5.0V
Ta=25°C
Ta=25°C
4.0
3.0
2.0
1.0
0.0
2
3
4
5
-50
0
50
100
2
3
4
5
6
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
SUPPLY VOLTAGE : VIN[V]
℃
Fig.22 Output fall time
Fig.23 Output fall time
Fig.24 Output turn-off time
6.0
20
18
16
14
12
10
20
18
16
14
12
10
VIN=5.0V
VIN=5.0V
Ta=25°C
5.0
4.0
3.0
2.0
1.0
0.0
-50
0
50
100
-50
0
50
100
2
3
4
5
6
AMBIENT TEMPERATURE : Ta[
]
AMBIENT TEMPERATURE : Ta[
]
℃
℃
SUPPLY VOLTAGE : VIN[V]
Fig.25 Output turn-off time
Fig.26 /OC delay time
Fig.27 /OC delay time
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.05 - Rev.B
5/12
Technical Note
BD2224G,BD2225G
●Waveform Data (BD2224G)
VEN
(5V/div.)
VEN
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
CL=147uF
CL=100uF
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
RL=20Ω
IOUT
(0.2A/div.)
VIN=5V
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
VIN=5V
RL=20Ω
RL=20Ω
CL=47uF
TIME(1ms/div.)
TIME(1us/div.)
TIME (2ms/div.)
Fig.28 Output rise characteristic
Fig.29 Output fall characteristic
Fig.30 Inrush current response
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
IOUT
(0.2A/div.)
VIN=5V
VIN=5V
VIN=5V
TIME (200ms/div.)
TIME (5ms/div.)
TIME (5ms/div.)
Fig.33 Over-current response
enable to shortcircuit
Fig.31 Over-current response
ramped load
Fig.32 Over-current response
enable to shortcircuit
V/OC
(5V/div.)
VIN
VIN
(5V/div.)
(5V/div.)
VOUT
(5V/div.)
VOUT
VOUT
(5V/div.)
(5V/div.)
VIN=5V
IOUT
(0.2A/div.)
IOUT
(0.5A/div.)
IOUT
(0.2A/div.)
RL=20Ω
RL=20Ω
TIME (10ms/div.)
Fig.35 UVLO response
increasing VIN
TIME (5ms/div.)
TIME (10ms/div.)
Fig.34 Over-current response
enable to shortcircuit
Fig.36 UVLO response
decreasing VIN
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.05 - Rev.B
6/12
Technical Note
BD2224G,BD2225G
●Block Diagram
/OC
Over-Current
Detection
Delay
Counter
Under-Voltage
Lockout
Charge
Pump
Thermal
Shutdown
VIN 1
GND 2
5 VOUT
Top View
GND
EN(/EN) 3
4 /OC
Fig.37 Block diagram
I/O
Fig.38 Pin configuration
●Pin Description
Pin No.
Symbol
Function
1
VIN
GND
-
-
Switch input and the supply voltage for the IC.
2
3
4
5
Ground.
Enable input.
EN: High level input turns on the switch. (BD2224G)
/EN: Low level input turns on the switch. (BD2225G)
EN, /EN
/OC
I
Over-current notification terminal.
Low level output during over-current or over-temperature condition.
Open-drain fault flag output.
O
O
VOUT
Switch output.
●I/O Circuit
Symbol
Pin No.
Equivalent Circuit
EN
(/EN)
EN
(/EN)
3
VOUT
5
VOUT
/OC
/OC
4
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.05 - Rev.B
7/12
Technical Note
BD2224G,BD2225G
●Functional Description
1. Switch Operation
VIN terminal and VOUT terminal are connected to the drain and the source of switch MOSFET respectively. And the VIN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN,/EN control input, VIN terminal and VOUT terminal are connected by a
150mΩ(Typ.) switch. In on status, the switch is bidirectional. Therefore, when the potential of VOUT terminal is higher
than that of VIN terminal, current flows from VOUT terminal to VIN terminal.
2. Thermal Shutdown Circuit (TSD)
If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 135°C(Typ.) in the condition of over-current detection, thermal shutdown circuit operates and makes power
switch turn off and outputs fault flag (/OC). Then, when the junction temperature decreases lower than 115°C(Typ.),
power switch is turned on and fault flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is
removed or the output of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active).
3. Over-Current Detection (OCD)
The over-current detection circuit limits current (ISC) and outputs fault flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status
soon.
3-2. When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under-Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.)
while the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV(Typ).
Under-voltage lockout circuit works when the switch is on (EN,/EN signal is active).
5. Fault Flag (/OC) Output
Fault flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output.
Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.05 - Rev.B
8/12
Technical Note
BD2224G,BD2225G
Over Current
Detection
Over Current
Load Removed
VOUT
IOUT
ITH
ISC
T/OC
V/OC
Fig.39 Over-current detection
EN
V
Output Shortcircuit
Thermal Shutdown
OUT
V
OUT
I
/OC
V
Delay
Fig.40 Over-current detection, Thermal shutdown timing (BD2224G)
/EN
V
Output Shortcircuit
Thermal Shutdown
OUT
V
OUT
I
/OC
V
Delay
Fig.41 Over-current detection, Thermal shutdown timing (BD2225G)
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.05 - Rev.B
9/12
Technical Note
BD2224G,BD2225G
●Typical Application Circuit
5V (Typ.)
10kΩ~
100kΩ
Ferrite
Beads
VIN
VOUT
/OC
IN
C
+
-
Controller
GND
L
C
EN(/EN)
Fig.42 Typical application circuit
●Application Information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC,
and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor CIN by VIN terminal
and GND terminal of IC. 1μF or higher is recommended.
Pull up /OC output by resistance 10kΩ ~ 100kΩ.
Set up value which satisfies the application as CL and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
●Power Dissipation Characteristic
(SSOP5 package)
700
600
500
400
300
200
100
0
0
25
50
75 85
100
125
150
AMBIENT TEMPERATURE : Ta [
]
℃
* 70mm x 70mm x 1.6mm Glass Epoxy Board
Fig.43 Power Dissipation Curve (Pd-Ta Curve)
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.05 - Rev.B
10/12
Technical Note
BD2224G,BD2225G
●Notes for Use
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Do not
continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.05 - Rev.B
11/12
Technical Note
BD2224G,BD2225G
●Ordering part number
B D
2
2
2
4
G
-
T R
Part No.
Part No.
2224
2225
Package
G: SSOP5
Packaging and forming specification
TR: Embossed tape and reel
SSOP5
<Tape and Reel information>
°
−4
+
2.9 0.2
6
°
4
°
Tape
Embossed carrier tape
3000pcs
5
4
Quantity
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
1pin
+0.05
0.13
−0.03
S
+0.05
−0.04
0.42
0.95
0.1
S
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
Reel
(Unit : mm)
∗
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.05 - Rev.B
12/12
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-
controller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
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